An ethernet-based digital and analog quantity bus structure

CN224790656UActive Publication Date: 2026-09-22TIANJIN GENEUO TECH CO LTD
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Patent Information

Application Number
CN202522301207.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-30
Publication Date
2026-09-22
Estimated Expiration
2035-10-30

AI Technical Summary

Technical Problem

目前在很多应用中都既需要处理数字量信号又需要模拟量信号,在混合处理数字量信号和模拟量信号时,若单独使用只支持数字量及只支持模拟量的现场总线模块时,既增加了使用产品的类型,又给电气人员的调试和设计增加了麻烦

Benefits of technology

[0015]本实用新型所述的一种基于以太网的数字量模拟量式总线结构,本申请的数字量模拟量式混合模块可以同步处理数字量信号和模拟量信号,使用时更具灵活性;本总线结构当处理大量的数字量信号和模拟量信号时,可以使电气设计人员更方便、更快捷的完成设计,也可以降低设计成本。

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Abstract

The utility model provides a kind of digital quantity analog quantity type bus structure based on ethernet, including shell, printed circuit board, M12 D-Code ethernet interface, M12's IO interface, label plate, network LINK indicator, communication state indicator, signal digital signal indicator, analog signal indicator, power indicator and 7 / 8 power supply interface.The utility model has beneficial effects: the digital quantity analog quantity type hybrid module of the application can process digital quantity signal and analog quantity signal synchronously, more flexible when using;When the bus structure of the application processes a large number of digital quantity signal and analog quantity signal, it can make electrical designer more convenient and faster to complete design, and can also reduce design cost.
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Description

Technical Field

[0001] This utility model belongs to the field of fieldbus module technology, and in particular relates to a digital-analog bus structure based on Ethernet. Background Technology

[0002] With the rapid development of modern industry, Profinet fieldbus has been widely used in actual production. Currently, many applications require the processing of both digital and analog signals. When processing mixed digital and analog signals, using fieldbus modules that only support digital or analog signals increases the types of products used and adds complexity to the debugging and design work for electrical engineers. Utility Model Content

[0003] In view of this, the present invention aims to propose a digital-to-analog bus structure based on Ethernet to solve at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows: It includes a housing, within which a printed circuit board is installed. Left and right mounting holes are provided on the left and right sides of the housing. An external PE hole is provided on the housing below the left mounting hole. Two M12 D-Code Ethernet interfaces are installed on the left side of the upper surface of the housing. Eight M12 IO interfaces are installed in the middle of the upper surface of the housing, with the upper four M12 IO interfaces being digital interfaces and the lower four M12 IO interfaces being analog interfaces. A label plate is also installed between the M12 IO interfaces. Two sets of network LINK indicator lights are installed on the upper surface of the housing. Two sets of communication status indicator lights are installed to the right of the network LINK indicator lights, located to the left of the eight M12 IO interfaces. A digital signal indicator light and an analog signal indicator light are respectively installed on one side of each M12 IO interface. A power indicator light is installed on the right side of the upper surface of the housing. A pair of 7 / 8 power supply interfaces are also installed on the right side of the upper surface of the housing.

[0005] Furthermore, the printed circuit board has a rectangular shape.

[0006] Furthermore, the printed circuit board is a four-layer circuit board, and the printed circuit board is provided with eight M12 digital and analog signal interfaces, which are four digital interfaces and four analog interfaces for field use. The four digital interfaces and four analog interfaces of the printed circuit board correspond to the four digital interfaces and four analog interfaces of the eight M12 IO interfaces, respectively.

[0007] Furthermore, each of the four digital interfaces on the printed circuit board outputs a 24V voltage between pins 1 and 3 to power an external sensor, and pins 2 and 4 of each of the four digital interfaces on the printed circuit board can process digital input and output signals.

[0008] Furthermore, a 24V output or thermocouple / resistance device is provided between pins 1 and 3 of the four analog interfaces of the printed circuit board, and pins 2 and 4 of each of the four analog interfaces of the printed circuit board can handle current, voltage, or resistance temperature detectors / thermocouples.

[0009] Furthermore, the printed circuit board includes a power module, a temperature acquisition module, a switch quantity drive module, and a temperature calculation and control module.

[0010] The switching quantity drive module includes an adaptive switching quantity input / output circuit, which is connected to the temperature calculation and control module through optocoupler isolation.

[0011] The temperature acquisition module includes a measurement channel switching circuit and an ADC analog-to-digital conversion circuit. The temperature acquisition module is connected to the temperature calculation and control module through an isolated data bus.

[0012] The temperature calculation and control module includes a high-performance ARM microprocessor, which interacts with the fieldbus protocol communication module through an internal high-speed serial bus to achieve data exchange.

[0013] Furthermore, the fieldbus protocol communication module includes an industrial bus protocol parsing and processing section, and the fieldbus protocol communication module communicates with devices with external bus interfaces through the bus physical interface.

[0014] Compared with existing technologies, the Ethernet-based digital-to-analog bus structure described in this utility model has the following advantages:

[0015] The present invention discloses a digital-analog bus structure based on Ethernet. The digital-analog hybrid module of this application can process digital signals and analog signals simultaneously, making it more flexible in use. When processing a large number of digital and analog signals, this bus structure can make it easier and faster for electrical designers to complete the design, and can also reduce the design cost. Attached Figure Description

[0016] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0017] Figure 1 This is a front view schematic diagram of the overall structure described in the embodiment of this utility model;

[0018] Figure 2 This is a three-dimensional schematic diagram of the overall structure described in the embodiment of this utility model;

[0019] Figure 3 This is a side view of the overall structure according to an embodiment of the present utility model;

[0020] Figure 4 This is a schematic diagram of the adaptive switching input / output circuit described in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the measurement channel switching circuit described in an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the ADC analog-to-digital conversion circuit described in an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Right mounting hole; 2. Left mounting hole; 3. M12 D-Code Ethernet interface; 4. 7 / 8 power supply interface; 5. M12 IO interface; 6. Digital signal indicator; 7. Analog signal indicator; 8. Network LINK indicator; 9. Communication status indicator; 10. Label plate; 11. External PE hole; 12. Housing; 13. Printed circuit board; 14. Power indicator. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] like Figures 1 to 6 As shown, a digital-to-analog bus structure based on Ethernet includes a housing 12, within which a printed circuit board 13 is mounted. The housing 12 has a left mounting hole 2 and a right mounting hole 1 on its left and right sides. An external PE hole 11 is provided on the housing below the left mounting hole 2. Two M12 connectors are mounted on the left side of the upper surface of the housing 12. The D-Code Ethernet interface 3 has eight M12 IO interfaces 5 installed in the middle of the upper surface of the housing 12. The upper four M12 IO interfaces 5 are digital interfaces, and the lower four M12 IO interfaces 5 are analog interfaces. A label plate 10 is also installed between the M12 IO interfaces 5. Two sets of network LINK indicator lights 8 are installed on the upper surface of the housing 12. Two sets of communication status indicator lights 9 are installed to the right of the network LINK indicator lights 8. The two sets of communication status indicator lights 9 are located to the left of the eight M12 IO interfaces 5. A digital signal indicator light 6 and an analog signal indicator light 7 are installed on one side of each M12 IO interface 5. A power indicator light 14 is installed on the right side of the upper surface of the housing 12. A pair of 7 / 8 power supply interfaces 4 are also installed on the right side of the upper surface of the housing 12. The printed circuit board 13 has a rectangular structure.

[0030] This bus architecture provides greater flexibility for electrical engineers when using mixed digital and analog modules, thereby simplifying system design and reducing the number of modules required. In addition, the mixed modules support mixed input and output signal types and various analog signal types, making them more adaptable to different application needs.

[0031] In a preferred embodiment of this utility model, the printed circuit board 13 is a four-layer circuit board. The printed circuit board 13 has eight M12 digital and analog signal interfaces, four digital interfaces and four analog interfaces for field use. The four digital interfaces and four analog interfaces of the printed circuit board 13 correspond to the four digital interfaces and four analog interfaces of the eight M12 IO interfaces 5, respectively. Each of the four digital interfaces of the printed circuit board 13 outputs a 24V signal between pins 1 and 3 for powering external sensors. Pins 2 and 4 of each of the four digital interfaces of the printed circuit board 13 can process digital input / output signals. Each of the four analog interfaces of the printed circuit board 13 outputs a 24V signal or a thermocouple / resistance temperature detector (RTD) signal between pins 1 and 3. Pins 2 and 4 of each of the four digital interfaces of the printed circuit board 13 can process current, voltage, or RTD / thermocouple signals. The printed circuit board 13 includes a power supply module, a temperature acquisition module, a digital input / output (DIO) module, and a temperature calculation and control module. The DIO module includes an adaptive DIO circuit, which is connected to the temperature calculation and control module via optocoupler isolation. The temperature acquisition module includes a measurement channel switching circuit and an ADC (Analog-to-Digital Converter) circuit, and is connected to the temperature calculation and control module via an isolated data bus. The temperature calculation and control module includes a high-performance ARM microprocessor, which interacts with a fieldbus protocol communication module via an internal high-speed serial bus. This bus structure uses a hybrid digital and analog module, offering greater flexibility in field applications, simplifying system design, and reducing the number of required modules.

[0032] Example 1

[0033] A digital-to-analog bus structure based on Ethernet includes a housing 12. A rectangular printed circuit board 13 is fixedly installed inside the housing 12. A left mounting hole 2 and a right mounting hole 1 are fixedly connected to the left and right sides of the housing 12. Two M12 D-Code Ethernet interfaces 3 are fixedly installed on the left side of the upper surface of the housing 12. Two sets of network LINK indicator lights 8, communication status indicator lights 9, digital signal indicator lights 6, analog signal indicator lights 7, and power indicator lights 14 are fixedly installed on the upper surface of the housing 12. An external PE hole 11 is opened on the housing below the left mounting hole 2. A pair of 7 / 8 power supply interfaces 4 are installed on the right side of the upper surface of the housing 12. Eight M12 IO interfaces 5 are fixedly installed in the middle of the upper surface of the housing 12, of which the upper four are digital interfaces and the lower four are analog interfaces. A label plate 10 is fixedly installed between the M12 IO interfaces 5.

[0034] In this embodiment, the printed circuit board 13 is a four-layer circuit board, including a top layer, a bottom layer, an intermediate layer one, and an intermediate layer two. The top layer of the printed circuit board 13 has eight M12 digital and analog signal interfaces, namely four digital interfaces and four analog interfaces for field use. The four digital interfaces and four analog interfaces on the top layer of the printed circuit board 13 correspond to the four digital interfaces and four analog interfaces of the eight M12 IO interfaces 5. Each of the four digital interfaces outputs a 24V signal between pins 1 and 3 to power external sensors; pins 2 and 4 of the interface can adaptively process digital input / output signals. The four analog interfaces output a 24V signal between pins 1 and 3, or a thermocouple or RTD; pins 2 and 4 of the interface can process current, voltage, or RTD / thermocouple signals. The printed circuit board 13 is functionally divided into a power supply module, a temperature acquisition module, a switch drive module, and a temperature calculation and control module. The switch drive module includes an adaptive switch input / output circuit, which is as follows: Figure 4 As shown, the temperature acquisition module is connected to the temperature calculation and control module via optical isolation. The temperature acquisition module includes a measurement channel switching circuit and an ADC analog-to-digital conversion circuit. The measurement channel switching circuit is as follows: Figure 5 As shown, the ADC analog-to-digital converter circuit is as follows: Figure 6 As shown, the temperature calculation and control module is connected via an isolated data bus, and a fieldbus protocol communication module is also provided. The fieldbus protocol communication module includes an industrial bus protocol parsing and processing part, which communicates with devices with external bus interfaces through the bus physical interface.

[0035] The digital-analog hybrid module of this application can process digital and analog signals simultaneously, making it more flexible in use. When processing a large number of digital and analog signals, this bus structure can make it easier and faster for electrical designers to complete the design, and can also reduce the design cost.

[0036] It should be noted that this application only improves the hardware structure of the bus structure and does not improve the control program. The control program and electrical components involved are all existing technologies.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A digital-to-analog bus structure based on Ethernet, characterized in that: The device includes a housing (12), in which a printed circuit board (13) is installed. The housing (12) has a left mounting hole (2) and a right mounting hole (1) on its left and right sides. An external PE hole (11) is provided on the housing (12) below the left mounting hole (2). Two M12 connectors are installed on the left side of the upper surface of the housing (12). The D-Code Ethernet interface (3) has eight M12 IO interfaces (5) installed in the middle of the upper surface of the housing (12). The four upper M12 IO interfaces (5) are digital interfaces, and the four lower M12 IO interfaces (5) are analog interfaces. A label plate (10) is also installed between the M12 IO interfaces (5). Two sets of network LINK indicator lights (8) are installed on the upper surface of the housing (12). Two sets of communication status indicator lights (9) are installed on the right side of the network LINK indicator lights (8). The two sets of communication status indicator lights (9) are located on the left side of the eight M12 IO interfaces (5). A digital signal indicator light (6) and an analog signal indicator light (7) are installed on one side of each M12 IO interface (5). A power indicator light (14) is installed on the right side of the upper surface of the housing (12). A pair of 7 / 8 power supply interfaces (4) are also installed on the right side of the upper surface of the housing (12).

2. The Ethernet-based digital-to-analog bus structure according to claim 1, characterized in that: The printed circuit board (13) has a rectangular shape.

3. The Ethernet-based digital-to-analog bus structure according to claim 1, characterized in that: The printed circuit board (13) is a four-layer circuit board. The printed circuit board (13) is provided with eight M12 digital and analog signal interfaces, which are four digital interfaces and four analog interfaces for field use. The four digital interfaces and four analog interfaces of the printed circuit board (13) correspond to the four digital interfaces and four analog interfaces of the eight M12 IO interfaces (5).

4. The Ethernet-based digital-to-analog bus structure according to claim 3, characterized in that: The printed circuit board (13) outputs a 24V voltage between pin 1 and pin 3 of each of its four digital interfaces to power an external sensor. Pins 2 and 4 of each of its four digital interfaces can process digital input and output signals.

5. The Ethernet-based digital-to-analog bus structure according to claim 3, characterized in that: The printed circuit board (13) outputs a 24V or thermocouple / resistance device between pins 1 and 3 of the four analog interfaces. Pins 2 and 4 of each of the four analog interfaces of the printed circuit board (13) can handle current, voltage or resistance temperature detectors / thermocouples.

6. The Ethernet-based digital-to-analog bus structure according to claim 1, characterized in that: The printed circuit board (13) includes a power module, a temperature acquisition module, a switch quantity drive module, and a temperature calculation and control module. The switching quantity drive module includes an adaptive switching quantity input / output circuit, which is connected to the temperature calculation and control module through optocoupler isolation. The temperature acquisition module includes a measurement channel switching circuit and an ADC analog-to-digital conversion circuit. The temperature acquisition module is connected to the temperature calculation and control module through an isolated data bus. The temperature calculation and control module includes a high-performance ARM microprocessor, which interacts with the fieldbus protocol communication module through an internal high-speed serial bus to achieve data exchange.

7. The Ethernet-based digital-to-analog bus structure according to claim 6, characterized in that: The fieldbus protocol communication module includes an industrial bus protocol parsing and processing part, and the fieldbus protocol communication module communicates with devices with external bus interfaces through the bus physical interface.