camera

Abstract

The application discloses a camera. The camera comprises a main board, a power board and a front end board. The main board comprises a first area and a second area connected with each other, and the power board is stacked on the first area. The front end board is located on the side of the power board and is stacked on the second area and forms an angle with the main board. Thus, the main board, the power board and the front end board are stacked in the horizontal direction (at least one of X and Y directions) and the vertical direction (Z direction) of the main board. The main board, the power board and the front end board are main components of the camera, and the above stacking manner is adopted to make the camera have high integration and small volume.

Description

Technical Field

[0001] This application relates to the field of camera technology, and more particularly to camera cameras. Background Technology

[0002] With the development of camera technology, various industries have a need to replace human eyes for monitoring. For example, in the welding field, using cameras (called molten pool cameras or weld pool cameras) can replace human eyes and avoid the following problems: manually observing the quality of welds requires wearing protective goggles and other equipment, and some high-temperature welding is extremely dangerous and not suitable for manual observation and inspection.

[0003] In practical use, people expect cameras to have high integration and small size. For example, a small weld pool camera is easy to install, or it is not easy to interfere with other components. This is because in the welding field, the space around the welding torch is limited, and a large weld pool camera cannot be installed. It may also interfere with the workpiece or fixture during movement. Utility Model Content

[0004] The purpose of this application is to disclose a camera that is highly integrated and small in size.

[0005] This application discloses a camera. The camera includes a motherboard, a power board, and a front-end board. The motherboard includes a first region and a second region connected together. The power board is stacked in the first region. The front-end board is located on the side of the power board and is stacked in the second region, forming an angle with the motherboard.

[0006] In some embodiments, the camera includes a housing; the housing includes a receiving cavity; the motherboard, the power board, and the front-end board are all located within the receiving cavity. The camera includes a motherboard bracket, the motherboard being in thermally conductive contact with the motherboard bracket; the motherboard bracket being in thermally conductive contact with the housing for heat dissipation through the housing, and the motherboard also being in thermally conductive contact with the housing through a motherboard heat-conducting element.

[0007] In some embodiments, the camera includes a liquid cooling module that is in contact with the housing, and the heat from the housing exchanges with the medium within the liquid cooling module.

[0008] In some embodiments, the housing includes a front shell and a rear shell that form the receiving cavity. Each of the front shell and the rear shell is at least partially made of a thermally conductive material. The front shell is in thermally conductive contact with the motherboard bracket, and the rear shell is in contact with the motherboard thermally conductive component.

[0009] In some implementations, the camera includes an interface board that is in thermal contact with the motherboard bracket.

[0010] In some embodiments, the camera includes a front-end board bracket, the front-end board being in thermal contact with the front-end board bracket, and the front-end board bracket being in thermal contact with the motherboard bracket.

[0011] In some embodiments, the camera includes an interface board; the interface board is stacked between the power board and the first region; or, the interface board is integrated with the power board.

[0012] In some implementations, the motherboard and the power board are parallel, the front-end board is perpendicular to the motherboard, and / or the camera is a fused pool camera.

[0013] In some embodiments, the camera includes a motherboard bracket and a front-end board bracket, the front-end board bracket being connected to the front-end board and the motherboard bracket and located on the same side of the motherboard bracket as the power board and the front-end board; the projection of the front-end board bracket on the motherboard and the projection of the front-end board on the motherboard are both located in the second region, and the motherboard is opposite to the front-end board, the front-end board bracket and the power board.

[0014] In some embodiments, the camera includes a lens, and the front-end plate bracket includes a front-end plate bracket body; the front-end plate bracket body and the front-end plate are parallel to each other and both are perpendicular to the optical axis of the lens; the camera includes at least one of the following features: a) A front-end board positioning structure is provided between the front-end board bracket and the motherboard bracket, and the front-end board positioning structure positions the front-end board in a direction parallel to the optical axis of the camera lens; b) The motherboard and the motherboard bracket are connected by a motherboard positioning structure for positioning the motherboard; c) The camera includes an interface board, and the interface board is connected to the motherboard bracket through an interface board positioning structure for positioning the interface board; d) The camera includes a lens and a front housing for the lens to be exposed, and the motherboard bracket is connected to the front housing through a front housing positioning structure.

[0015] In some embodiments, the camera includes an interface board, at least one of which, along with the motherboard, is connected to the power board via a board-to-board connector; the front-end board is connected to the motherboard via an FPC.

[0016] In some embodiments, the camera includes a front shell, a rear shell, and a motherboard bracket; the front shell and the rear shell form a receiving cavity; the motherboard, the power board, and the front end plate are all located within the receiving cavity; the inner wall of the rear shell includes a limiting groove; at least one of the edges of the motherboard, the motherboard bracket, and the power board is located within the corresponding limiting groove.

[0017] In some embodiments, the camera includes a front housing and a fill light assembled with the front housing. The fill light includes a fill light board and a first cable and a second cable, both connected to the fill light board. The first cable and the second cable converge on the side of the fill light board and then pass through the front housing to connect to the motherboard.

[0018] In some embodiments, the camera includes a lens, and the normal of the fill light panel intersects the optical axis of the lens at an angle α, where 30 degrees ≤ α < 90 degrees.

[0019] For the camera, since the power board is stacked in the first region and the front-end board is stacked in the second region and located on the side of the power board, the motherboard, the power board, and the front-end board are stacked in the horizontal direction (at least one of the X and Y directions) and the vertical direction (Z direction) of the motherboard. They are the main components of the camera. The stacking method described above makes the integration high and the size small. Therefore, the camera has a high integration and a small size. Attached Figure Description

[0020] Figure 1 This is a stereoscopic view of the first type of camera in this application; Figure 2 yes Figure 1 An exploded view of the first type of camera shown; Figure 3 yes Figure 1 A further exploded view of the first type of camera shown; Figure 4 This is a perspective view of the assembly formed by the PCBA components and the front shell of this application; Figure 5 yes Figure 4 Exploded view; Figure 6 yes Figure 4 A schematic diagram with the front cover removed; Figure 7 yes Figure 4 The main view; Figure 8 This is a front view of the supplementary lighting unit assembled on the front housing according to this application; Figure 9 This is a schematic diagram showing the angle formed between the normal of the lamp panel of the fill light in this application and the optical axis of the lens; Figure 10 This is a stereoscopic view of the second type of camera in this application; Figure 11 yes Figure 10 An exploded view of the second type of camera shown; Figure 12 yes Figure 10A further exploded view of the second type of camera shown; Figure 13 yes Figure 10 The diagram shows a liquid cooling module for the second type of camera. Detailed Implementation

[0021] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0022] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0023] See Figures 1 to 3 This application discloses a camera, which can be a molten pool camera or a non-molten pool camera. The camera includes a front shell 1, a rear shell 2, and a rear cover 3. The assembly formed by the front shell 1, rear shell 2, and rear cover 3 is the outer shell of the camera, and its interior is used to house the camera components. Therefore, the outer shell of the camera in this application is not limited to the aforementioned three parts: front shell 1, rear shell 2, and rear cover 3. The rear cover 3 is assembled with the rear shell 2, and the assembly method is not limited. For example, it can be assembled together using rear cover mounting screws 31. The front shell 1 includes a front cover 111, a front shell body 112, and a light panel mounting component 113, which are assembled together. The lens 12 can protrude from the front shell 1 to receive light. A viewing window 114 and a fill light 4 are mounted on the front shell 1. The structure of the fill light 4 is not limited to the structure shown in the figure.

[0024] See Figures 2 to 7 The camera includes a motherboard 6, a power board 8, and a front-end board 10. The motherboard 6 includes a first area 61 and a second area 62 connected together, as shown below. Figure 3 , Figure 5 and Figure 6 As shown. The power supply board 8 is stacked in the first region 61, as... Figures 4 to 7As shown, the power board 8 is located above the first region 61. There may be no component between the power board 8 and the first region 61, or, as shown, an interface board 7 may be provided between the power board 8 and the first region 61. The front-end board 10 includes an image sensor, etc. The image sensor senses light from the lens 12 and transmits the data to the motherboard 6. The front-end board 10 is located on the side of the power board 8, forming an angle with the motherboard 6, such as... Figures 4 to 7 As shown, the front-end board 10 is stacked on the second region 62. This stacking can be direct or indirect. Direct stacking includes, for example, the power board 8 being directly assembled on the first region 61, and the front-end board 10 being directly assembled on the second region 62. Indirect stacking includes, for example, other components between the power board 8 and the first region of the motherboard 6, and other components between the front-end board 10 and the second region 62. For instance, the camera includes a motherboard bracket 5, which includes a motherboard bracket body 51. The front-end board 10 and the power board 8 are assembled on the motherboard bracket body 51, with a portion of the motherboard bracket body 51 located on the first region 61 and another portion located on the second region 62, thus achieving indirect stacking. Regardless of whether it is direct or indirect stacking, the front-end board 10 and the motherboard 6 form a right angle. In other cases, the front-end board 10 and the motherboard 6 may also form an acute or obtuse angle.

[0025] As described above, since the power board 8 is stacked in the first region 61 and the front-end board 10 is stacked in the second region and located on the side of the power board 8, the motherboard 6, the power board 8, and the front-end board 10 are stacked in the horizontal direction (at least one of the X and Y directions) and the vertical direction (Z direction) of the motherboard 6. These are the main components of the camera. The stacking method described above makes the integration high and the size small. Therefore, the camera has a high integration and a small size.

[0026] Smaller size inevitably places higher demands on heat dissipation, especially for cameras that need to operate in high-temperature environments, such as fused pool cameras. One heat dissipation method is described below: See Figures 4 to 6The camera includes a housing, the structure of which is not limited, for example, it may include a front housing 1 and a rear housing 2. In some cases, the housing may also include a rear cover 3. The housing includes a receiving cavity, for example, the front housing 1 and the rear housing 2 enclose the receiving cavity. The motherboard 6, the power board 8, and the front-end board 10 are all located within the receiving cavity. For heat dissipation, the housing is at least partially made of a thermally conductive material, for example, at least a portion of each of the front housing 1 and the rear housing 2 is made of a thermally conductive material, such as aluminum, iron, etc. The camera includes a motherboard bracket 5. At least a portion of the motherboard bracket 5 is made of a thermally conductive material; of course, the structure of the motherboard bracket 5 is not limited, as long as it can achieve heat conduction. The motherboard 6 is in thermally conductive contact with the motherboard bracket 5; the motherboard bracket 5 is in thermally conductive contact with the housing, and may be in thermally conductive contact with at least one of the front housing 1 and the rear housing 2 to achieve heat dissipation through the housing. The manner in which the motherboard bracket 5 makes thermal contact with the front shell 1 is not limited, as long as the heat from the motherboard 6 is transferred to the motherboard bracket 5, and then to the front shell 1, where it is dissipated. In this application, the camera includes a motherboard bracket 5, which includes a motherboard bracket body 51 and a front shell connecting part 52 connected to the motherboard bracket body 51. The motherboard 6 makes thermal contact with the motherboard bracket body 51 via a thermal pad (not shown in the figure); the front shell connecting part 52 makes thermal contact with the front shell 1 by being in contact with it. The motherboard 6 also makes thermal contact with the rear shell 2. In this embodiment, see [link to relevant documentation]. Figure 7 The motherboard 6 makes thermal contact with the rear shell 2 through the motherboard heat-conducting component 63. The structure of the motherboard heat-conducting component 63 is not limited; for example, it can be a sheet or other structures.

[0027] As described above, the IC on the motherboard 6 is the main heat-generating component of the camera. The heat from the motherboard 6 is transferred to the housing via the motherboard bracket 5, and further transferred to the housing via the motherboard heat-conducting component 63. This results in a large heat dissipation area and good heat dissipation effect. With the heat from the motherboard 6 transferred to the front shell 1 via the motherboard bracket 5 and to the rear shell 2 via the motherboard heat-conducting component 63, both the front shell 1 and the rear shell 2 have large surface areas. Therefore, the camera, while maintaining high integration and small size, achieves good heat dissipation, meeting the heat dissipation requirements of the camera in high-temperature environments.

[0028] For heat dissipation, see Figures 10 to 13This application discloses a second type of camera. Compared with the first type of camera, the second type of camera adds a liquid cooling module 100. This can also be understood as the heat dissipation through the housing including two methods: the first method is as described above, heat dissipation only through the housing; the second method is that the housing also transfers heat to a heat dissipation module (such as the liquid cooling module 100), where heat is dissipated. The liquid cooling module 100 is in contact with the housing; in this embodiment, the liquid cooling module 100 is in contact with the rear shell 2. The heat from the housing exchanges heat with the medium inside the liquid cooling module; how this heat exchange is achieved is not limited. For example, the liquid cooling module 100 can contact the housing through a liquid cooling substrate, and the liquid cooling substrate exchanges heat with the coolant inside the liquid cooling module 100. Figure 13 The coolant channel 1001 of the liquid cooling module 100 is shown, but the structure of the coolant channel 1001 is not limited to this.

[0029] As described above, in the second type of camera, the heat of the camera (at least the motherboard) is dissipated through the liquid cooling module 100. For example, part of the heat from the motherboard can be dissipated through the housing, and another part can be dissipated through heat exchange between the housing and the coolant, and then through the liquid cooling module. Compared to the first type of camera, which only dissipates heat through the housing, the coolant carries away the heat, resulting in faster and better heat dissipation. When the liquid cooling module 100 is located at the bottom of the housing, the liquid cooling module 100 carries away heat through the coolant, and the bottom of the liquid cooling module will not get hot, making it easier to contact other components and facilitating the placement of the camera.

[0030] See Figures 2 to 7 The camera includes an interface board 7. For a camera, such as a fused pool camera, the motherboard 6, power board 8, front-end board 10, interface board 7, and other components are referred to as a PCBA assembly. The interface board 7 makes thermally conductive contact with the motherboard bracket 5. For example, the interface board 7 makes thermally conductive contact with the portion of the motherboard bracket 5 corresponding to the first region 61 via a thermal pad (not shown in the figure). The interface board 7 provides an interface to facilitate connection between internal components of the camera or with external components. In some embodiments, the camera may not have an interface board 7; in this case, the corresponding components or the camera and external components are connected via connectors or other interfaces. Considering only heat dissipation, the stacking position of the interface board 7 in the camera is not limited to... Figures 4 to 7 The location shown.

[0031] As described above, the IC on the interface board 7 is the main heat-generating component of the camera. Through this method, the heat from the IC can be transferred to the front housing 1 via the motherboard bracket 5, and then dissipated through the front housing 1. Therefore, while ensuring high integration and small size of the camera, the heat dissipation effect is good. In some cases, some of the heat from the interface board 7 can also be transferred to the motherboard 6 via the motherboard bracket 5, and together with the heat from the motherboard 6, dissipated through the rear housing 2.

[0032] See Figures 2 to 7 The camera includes a front-end board bracket 9, with the front-end board 10 in thermally conductive contact with the front-end board bracket 9. The front-end board bracket 9 then in thermally conductive contact with the motherboard bracket 5. The method of thermal contact is not limited; for example, the front-end board 10 can be in thermally conductive contact with the front-end board bracket 9 via a thermal pad and a thermally conductive metal sheet 101. The thermal pad is located between the front-end board 10 and the thermally conductive metal sheet 101.

[0033] As described above, the heat from the front panel 10 is also transferred to the front shell 1 through the motherboard bracket 5, and the heat is dissipated through the front shell 1, resulting in good heat dissipation.

[0034] See Figure 4 and Figure 6 The camera includes an interface board 7. The interface board 7 is stacked between the power board and the first region 61. The figure illustrates that the interface board 7, the first region 61 of the main board 6, and the power board 8 are parallel to each other, but this is not a limitation; for example, in some embodiments, they may be inclined. In other embodiments, the interface board 7 and the power board 8 are integrated into one unit.

[0035] As described above, the interface board 7 is stacked between the power board 8 and the first region 61. Compared with integrating the interface board 7 and the power board 8 into one unit, this reduces the width of the camera in the horizontal direction. Therefore, the above configuration enables the camera to have high integration and small size.

[0036] See Figures 4 to 7 The motherboard 6 and the power board 8 are parallel, and the front end board 10 forms a right angle with the motherboard 6.

[0037] As described above, the motherboard 6, power board 8, and front-end board 10 are stacked in the horizontal and vertical directions, resulting in a highly integrated and small-sized camera.

[0038] See Figure 4 , Figure 6 and Figure 7 The front-end board bracket 9 is connected to the front-end board 10 and the motherboard bracket 5, and is located on the same side of the motherboard bracket 5 as the power board 8 and the front-end board 10, as shown below. Figures 4 to 6 As shown, they are located on the upper side of the motherboard bracket body 51 of the motherboard bracket 5. The projections of the front-end board bracket 9 and the front-end board 10 on the motherboard 6 are both located within the second region 62, and the motherboard 6 is opposite to the front-end board 10, the front-end board bracket 9, and the power board 8. Figures 4 to 6In this embodiment, the interface board 7 can be located between the motherboard 6 and the motherboard bracket body 51 of the motherboard bracket 5. As a variation of this embodiment, the interface board can also be located between the motherboard 6 and the shell wall of the rear shell 2.

[0039] As described above, the motherboard 6, along with the front-end board 10, the front-end board bracket 9, and the power board 8, are located on the opposite side of the motherboard bracket body 51, and are stacked in the first area 61 in conjunction with the power board 8; the front-end board 10 is located on the side of the power board 8, and is stacked in the second area 62, forming an angle with the motherboard 6, resulting in a higher degree of integration and a smaller size for the camera.

[0040] See Figure 3 , Figure 4 and Figure 6 The camera includes a lens 12, and the front-end plate bracket 9 includes a front-end plate bracket body 91; the front-end plate bracket body 91 and the front-end plate 10 are parallel and opposite to each other, and both are perpendicular to the optical axis of the lens 12. The front-end plate bracket 9 also includes a front-end plate bracket connecting portion 92 located on the side of the front-end plate bracket body 91. As described above, the front-end board bracket body 91 is parallel to the front-end board 10 and both are perpendicular to the optical axis of the lens 12. On the one hand, the camera has a high degree of integration and a small size. On the other hand, the light travels in a straight line, which is also conducive to the light received by the lens 12 being received by the image sensor on the front-end board 10.

[0041] See Figures 4 to 6 The camera includes at least one of the following features: a) A front-end board positioning structure is provided between the front-end board bracket 9 and the main board bracket 5. The front-end board positioning structure positions the front-end board 10 in a direction parallel to the optical axis of the camera lens. In this embodiment, the front-end board bracket 9 includes a front-end board bracket body 91 parallel to the front-end board 10 and a front-end board connecting portion 92 connected to the front-end board bracket body 91. The main board bracket 5 includes a front shell connecting portion 52 connected to the main board bracket body 51. The front-end board positioning structure includes a positioning post 521 located on the front shell connecting portion 52. The front-end board connecting portion 92 includes a positioning hole 921. Both the positioning hole 921 and the positioning post 521 extend in a direction parallel to the optical axis of the camera lens. The front-end board positioning structure includes the positioning post and the positioning hole. As described above, by setting the front-end board positioning structure, firstly, it facilitates the assembly of the front-end board bracket and ensures the stacking relationship between the front-end board bracket 9 and related components, because the front-end board bracket has high requirements for positional accuracy; secondly, through positioning, it is more conducive to the front-end board bracket body 91 being parallel to the front-end board 10, and thus, the optical axis is perpendicular to the image sensor on the front-end board 10, ensuring imaging effect.

[0042] b) The motherboard 6 and the motherboard bracket 5 are connected by a motherboard positioning structure positioned by the motherboard 6. The motherboard positioning structure is not limited and can be a positioning post (for ease of distinction, this positioning post is referred to as motherboard positioning post 54, see [link]). Figure 5 The structure of the positioning holes. Figure 5 The positioning holes are not marked, but their shape and position can be inferred from the shape and position of the motherboard positioning post 54. As described above, this positioning structure facilitates the assembly of the motherboard 6 and the motherboard bracket 5, improves assembly efficiency, and ensures the stacking relationship between the motherboard 6, the motherboard bracket 5, and other components.

[0043] c) The camera includes an interface board 7. In this case, the relationship between the interface board 7 and components such as the motherboard 6 is not limited to the relationship shown in the figure. The interface board 7 and the motherboard bracket 5 are connected via an interface board positioning structure for positioning the interface board. The interface board positioning structure is also not limited and can be a positioning post (for ease of distinction, this positioning post is referred to as interface board positioning post 55, see [reference]). Figure 5 The structure of the positioning holes. Figure 5 The positioning holes are not marked, but their shape and position can be inferred from the shape and position of the positioning posts 55 on the interface board. As described above, this positioning structure facilitates the assembly of the interface board 7 and the motherboard bracket 5, improves assembly efficiency, and ensures the stacking relationship between the interface board 7 and the motherboard bracket 5 and other components.

[0044] d) The camera includes a lens 12 and a front housing 1 through which the lens 12 is exposed. The motherboard bracket 5 is connected to the front housing 1 via a front housing positioning structure. The front housing positioning structure is not limited and can be a positioning post or a positioning hole. For ease of distinction, this positioning hole is referred to as the front housing positioning hole 56. As described above, the front housing positioning structure facilitates the assembly between the front housing 1 and the motherboard bracket 5, improves assembly efficiency, and ensures the stacking relationship between the front housing 1, the motherboard bracket 5, and other components.

[0045] The aforementioned front-end board positioning structure, motherboard positioning structure, interface board positioning structure, and front shell positioning structure are all positioning structures. They are distinguished as positioning structures for different components; therefore, a prefix is ​​added before "positioning structure." Their structures may be the same or different.

[0046] See Figure 5 At least one of the interface board 7 and the motherboard 6 is connected to the power board 8 via a board-to-board connector 71; the front-end board 10 is connected to the motherboard 6 via an FPC.

[0047] As described above, the connection method described above, compared with the corresponding wire connection of interface board 7, motherboard 6, power board 8 and front-end board 10, does not require reserving space for placing wires. Therefore, the above method can make the camera smaller in size.

[0048] See Figure 2 , Figure 3 and Figure 7 The camera includes a front housing 1 and a rear housing 2; the front housing 1 and the rear housing 2 form a receiving cavity; the motherboard 6, the power board 8, and the front-end board 10 are all located within the receiving cavity. If the camera includes an interface board 7, the interface board 7 is also located within the receiving cavity. The inner wall of the rear housing 2 includes a limiting groove 21. The limiting groove 21 can be a continuous limiting groove or composed of several spaced-apart limiting grooves. Figure 2 and Figure 3 The four limiting grooves 21 are shown. Figure 7 The diagram illustrates that the edges on both sides of the power board 8 are respectively located within the limiting groove 21, and the edges on both sides of the motherboard bracket body 51 of the motherboard bracket 5 are respectively located within the limiting groove 21. Those skilled in the art will understand that as long as at least one of the edges of the motherboard 6, the motherboard bracket 5, and the power board 8 (and in some cases, the edge of the interface board 7) is located within the corresponding limiting groove 21.

[0049] like Figure 4 and Figure 6As shown, the motherboard 6, power board 8, and front-end board 10 are stacked in the aforementioned manner and then assembled with the front shell 1. The rear end of this entire assembly (sometimes referred to as a PCBA assembly, which also includes the interface board 7) is in a cantilever state. By ensuring that at least one of the multiple edges is located within the limiting groove 21, the assembly is positioned to prevent unsafe conditions and improve overall stability. Furthermore, the edges and the limiting groove 21 can be fitted together using a sliding method, saving mounting screws and improving the positional accuracy of the interface.

[0050] See Figure 8 , Figure 2 and Figure 3 The camera includes a front housing 1 and a fill light 4 assembled with the front housing 1. The fill light 4 includes a fill light board 41, a first wiring 42, and a second wiring 43. The first wiring 42 and the second wiring 43 converge at the side of the fill light board 41, and both pass through the front housing 1 to connect to the main board 6, as shown below. Figure 7 As shown, the front cover 1 includes a wiring hole 110, through which the first wiring 42 and the second wiring 43 each pass and are connected to the motherboard 6.

[0051] As described above, after the first trace 42 and the second trace 43 converge, they pass through the front shell 1 and connect to the motherboard 6. The wiring is simple and easy to connect to the motherboard 6.

[0052] See Figure 9 The camera includes a lens 12, and the normal of the fill light panel 41 and the optical axis of the lens 12 form an intersection angle α, where 30 degrees ≤ α < 90 degrees, for example, 30 degrees, 35 degrees, 38 degrees, 40 degrees, 45 degrees, 48 ​​degrees, 50 degrees, 55 degrees, 60 degrees, 62 degrees, 65 degrees, 68 degrees, 70 degrees, 75 degrees, 78 degrees, 80 degrees, 83 degrees, 85 degrees, or 88 degrees.

[0053] As set above, with 30 degrees ≤ a < 90 degrees, the fill light range of fill light 4 can better match the lens field of view, making the fill light more uniform and the camera image clearer.

[0054] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A camera, characterized in that, The camera includes a motherboard, a power board, and a front-end board. The motherboard includes a first region and a second region connected together. The power board is stacked in the first region. The front-end board is located on the side of the power board, stacked in the second region, and forms an angle with the motherboard.

2. The camera according to claim 1, characterized in that, The camera includes a housing, and the housing includes a receiving cavity; the motherboard, the power board, and the front-end board are all located within the receiving cavity; The camera includes a motherboard bracket, the motherboard is in thermal contact with the motherboard bracket; the motherboard bracket is in thermal contact with the housing to dissipate heat through the housing; the motherboard is in thermal contact with the housing through a motherboard heat-conducting component.

3. The camera according to claim 2, characterized in that, The camera includes a liquid cooling module that is in contact with the housing, and the heat from the housing exchanges heat with the medium inside the liquid cooling module.

4. The camera according to claim 2, characterized in that, The housing includes a front shell and a rear shell, which together form the receiving cavity. Each of the front shell and the rear shell is at least partially made of a thermally conductive material. The front shell is in thermally conductive contact with the motherboard bracket, and the rear shell is in contact with the motherboard's thermally conductive components.

5. The camera according to claim 2, characterized in that, The camera includes an interface board, which is in thermal contact with the motherboard bracket. And / or, the camera includes a front-end board bracket, the front-end board being in thermal contact with the front-end board bracket, and the front-end board bracket being in thermal contact with the motherboard bracket.

6. The camera according to claim 1, characterized in that, The camera includes an interface board; the interface board is stacked between the power board and the first region; or, the interface board is integrated with the power board.

7. The camera according to claim 1, characterized in that, The motherboard and the power board are parallel, the front-end board is perpendicular to the motherboard, and / or the camera is a fused pool camera.

8. The camera according to claim 1, characterized in that, The camera includes a motherboard bracket and a front-end board bracket. The front-end board bracket is connected to the front-end board and the motherboard bracket, and is located on the same side of the motherboard bracket as the power board and the front-end board. The projection of the front-end board bracket on the motherboard and the projection of the front-end board on the motherboard are both located in the second area. The motherboard is opposite to the front-end board, the front-end board bracket and the power board.

9. The camera according to claim 8, characterized in that, The camera includes a lens, and the front panel bracket includes a front panel bracket body; the front panel bracket body and the front panel are parallel to each other and both are perpendicular to the optical axis of the lens; The camera includes at least one of the following features: a) A front-end board positioning structure is provided between the front-end board bracket and the motherboard bracket, and the front-end board positioning structure positions the front-end board in a direction parallel to the optical axis of the camera lens; b) The motherboard and the motherboard bracket are connected by a motherboard positioning structure for positioning the motherboard; c) The camera includes an interface board, and the interface board is connected to the motherboard bracket through an interface board positioning structure for positioning the interface board; d) The camera includes a lens and a front housing for the lens to be exposed, and the motherboard bracket is connected to the front housing through a front housing positioning structure.

10. The camera according to claim 1, characterized in that, The camera includes a front housing and a fill light assembled with the front housing. The fill light includes a fill light board and a first wiring and a second wiring, both connected to the fill light board. The first wiring and the second wiring converge on the side of the fill light board and then pass through the front housing to connect to the motherboard. And / or, the camera includes a lens, and the normal of the fill light panel forms an intersection angle α with the optical axis of the lens, where 30 degrees ≤ α < 90 degrees.

Images