A hermetically sealed chip for internet of things

Abstract

The utility model discloses a kind of combined sealing chips for Internet of Things, belong to Internet of Things chip technical field.A kind of combined sealing chips for Internet of Things, including chip main body, the MCU built-in chip main body, power management module, the power management module is connected with the power supply pin of chip main body, external storage expansion module, the external storage expansion module is connected with chip main body by serial peripheral interface, wireless communication module, with the ANT pin connection of chip main body, for receiving and transmitting wireless signal, crystal oscillator, level conversion module, the power management module includes P-MOS pipe;The utility model, by MCU, power management module, external storage expansion module, wireless communication module and crystal oscillator are packaged in a chip main body, to reach the purpose of waterproof and moisture-proof, to solve the problem that the circuit board for remote meter reading in prior art is prone to being corroded by water vapor humidity gas and causing electric leakage.

Description

Technical Field

[0001] This utility model relates to the field of Internet of Things (IoT) chip technology, and in particular to a packaged chip for IoT applications. Background Technology

[0002] With the rapid development of IoT technology, the demand for low-power smart terminal devices (such as wireless sensors, smart water / electricity meters, and portable wearable devices) is increasing. These devices typically need to meet core requirements such as long battery life, small size, flexible storage expansion, strong peripheral compatibility, and stable wireless communication.

[0003] In the field of remote meter reading of smart water meters, the control circuit board used for data transmission and data acquisition is generally on a PCB board. That is, the MCU and some other necessary modules are directly mounted on the PCB board. Since the environment in which it is used is relatively humid (usually installed on the PCB board), the PCB board is often corroded by moisture and water during use, causing damage to the circuit board and leakage. In order to solve this problem, this application proposes a packaged chip for Internet of Things. Utility Model Content

[0004] The purpose of this invention is to solve the problem that circuit boards used for remote meter reading in the prior art are easily corroded by moisture and humidity, leading to leakage, and to propose a packaged chip for the Internet of Things.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A packaged chip for the Internet of Things includes a chip body, wherein the chip body has a built-in MCU; A power management module, wherein the power management module is connected to the power pins of the chip body; An external storage expansion module, which is connected to the chip body via a serial peripheral interface; The wireless communication module is connected to the ANT pin of the chip body and is used to transmit and receive wireless signals; Crystal oscillators enhance the accuracy and stability of the real-time clock unit built into the MCU; Level conversion module, used for level matching with external devices; The power management module includes P-MOS transistors, which constitute a zoned power supply control circuit. The MCU, power management module, external storage expansion module, wireless communication module, and crystal oscillator are all encapsulated within the chip body.

[0006] Preferably, the chip body is packaged using SiP packaging.

[0007] Preferably, the MCU is an MCU using a RISC-V architecture and integrates a wireless communication module supporting BLE-V5.4, a storage unit of at least 512K-Flash and 128K-RAM, a 12-bit analog-to-digital converter, a multi-channel universal asynchronous transceiver, and a pulse width modulation unit.

[0008] Preferably, the MCU also has a built-in PLL, a 16MHz built-in clock, and a 32KHz built-in clock, integrated into the real-time clock unit of the RISC-V architecture MCU.

[0009] Preferably, there are two crystal oscillators, one of which is a low-speed clock crystal of 32.768KHz and the other is a high-speed clock crystal of 32MHz. Both the low-speed clock crystal and the high-speed clock crystal are connected to the real-time clock unit.

[0010] Preferably, the external storage expansion module is a Flash chip with a capacity of not less than 16 Mbit, which is used to expand the storage capacity of the chip.

[0011] Preferably, the power management module further includes a DC-DC conversion circuit and a filter capacitor bank.

[0012] Preferably, the filter capacitor bank includes ceramic capacitors connected in parallel.

[0013] Compared with the prior art, the present invention provides a packaged chip for the Internet of Things, which has the following beneficial effects.

[0014] 1. This utility model achieves waterproof and moisture-proof properties by encapsulating the MCU, power management module, external storage expansion module, wireless communication module and crystal oscillator in a single chip body, thereby solving the problem of leakage caused by water vapor and moisture corrosion of the circuit board used for remote meter reading in the prior art.

[0015] 2. This utility model, through the collaborative design of high-efficiency DC-DC power conversion, P-MOS partitioned power supply, RTC timed wake-up, and BLE-V5.4 low power consumption, can greatly reduce power consumption.

[0016] 3. In this utility model, the 16Mbit external Flash can store a large amount of historical data (such as the water consumption record of a smart water meter for the past year). Combined with the 512K Flash built into the MCU, it can meet the storage needs of different scenarios without the need for additional complex storage circuit design.

[0017] 4. This utility model has a compact hardware architecture and can adjust the sensor type and external modules according to the needs (such as adding a 4G-Gat1 communication module to achieve long-distance transmission). It is compatible with multiple scenarios such as IoT sensor nodes, smart wearable devices, and smart meter reading devices, with low development cost and short cycle.

[0018] Other advantages, objectives and features of this invention will be set forth in part in the description which follows; and in part will be apparent to those skilled in the art upon examination of the following description; or may be taught from practice of this invention. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the basic block structure of the chip of this utility model.

[0020] Figure 2 This is a schematic diagram showing the location distribution of the chip components of this utility model.

[0021] Figure 3 This is a schematic diagram of the pin structure of the chip body of this utility model.

[0022] Figure 4 This is a schematic diagram of the chip wiring structure of this utility model. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0024] Please refer to Figures 1-4 A type of encapsulated chip for the Internet of Things (IoT) includes a chip body with a built-in MCU. The power management module is connected to the power pins of the chip body; An external storage expansion module is connected to the main chip via a serial peripheral interface. The wireless communication module is connected to the ANT pin of the chip body and is used to transmit and receive wireless signals; Crystal oscillators enhance the accuracy and stability of the real-time clock unit built into the MCU; Level conversion module, used for level matching with external devices; The power management module includes P-MOS transistors, which form a zoned power supply control circuit; The MCU, power management module, external storage expansion module, wireless communication module, and crystal oscillator are all packaged within the chip body.

[0025] In the appendix Figure 2In the diagram, C1-C8 are capacitors; L1 is an inductor; U1 is the MCU; U2 is the external storage expansion module chip; X1 and X2 are crystal oscillators; Q1 is a P-MOS transistor; Q2 is a level conversion module; and R1 and R2 are resistors.

[0026] In a specific embodiment of this utility model: the V3.6 pin of the chip body is connected to a 3.6V / 2000mAh lithium battery, the VCC pin is connected to the lithium battery through a DC-DC conversion circuit, and the DC-DC output voltage is set to 3.3V.

[0027] The P-MOS transistors form the partitioned power supply control circuit, which is composed of P-type MOS transistors (rated current ≤ 5A, rated voltage ≤ 3.6V) and is controlled by the GPIO pins of the chip body. When the device enters sleep mode, the MOS transistors turn off the power supply to non-critical circuits (such as external storage expansion modules and sensors), and only retain the minimum power supply for RTC and BLE broadcast circuits. The standby current can be reduced to ≤ 10μA.

[0028] Level conversion modules are mainly used to solve signal compatibility issues between logic circuits with different voltages and to achieve communication interface matching with components such as low-level communication interfaces (e.g., 1.8V), such as external 4G-Gat1 modules and debuggers. Their core functions include voltage adaptation, impedance matching, and signal protection.

[0029] The chip body is packaged using SiP packaging, which achieves waterproof and moisture-proof properties, simplifies the product manufacturing process, and improves product reliability.

[0030] The MCU adopts the RISC-V architecture and integrates a wireless communication module supporting BLE-V5.4, a storage unit of at least 512K-Flash and 128K-RAM, a 12-bit analog-to-digital converter, a multi-channel universal asynchronous transceiver and a pulse width modulation unit.

[0031] RISC-V architecture MCUs adopt a reduced instruction set, balancing computing power and low power consumption, supporting multi-task scheduling, and can realize core logic such as sensor data processing, peripheral control, and wireless communication protocol parsing.

[0032] BLE-V5.4 wireless communication module: integrates Bluetooth V5.4 protocol, supports low power broadcast, long distance transmission (maximum communication distance ≤50 meters), its anti-interference capability is better than the traditional BLE-V4.2, and it is suitable for IoT scenarios of "intermittent communication + long battery life".

[0033] The wireless communication module can be used with an antenna. The antenna body can be a built-in antenna on the PCB or an external ceramic antenna (selected according to the size requirements of the device). The PCB antenna needs to be designed with 50Ω impedance matching to reduce RF signal reflection. The external ceramic antenna has a gain of ≥2dBi, which can increase the BLE communication distance to 50 meters (in an open environment).

[0034] Wireless transmission logic, BLE mode: When the BLE gateway / mobile APP is connected, data such as "cumulative water consumption and battery level" will be sent via BLE; when there is no connection, it will enter low-power sleep mode.

[0035] The built-in 512K Flash (used to store firmware and applications) and 128K RAM (used to temporarily cache runtime data) meet the basic program loading and data processing requirements.

[0036] A 12-bit analog-to-digital converter (ADC) is used for analog-to-digital conversion with an accuracy of up to 4096 levels, capable of acquiring analog sensor signals; three independent UARTs (Universal Asynchronous Receivers and Transceivers for debugging or connecting external serial devices), with an 8-level FIFO, a 23-bit counter, and a communication baud rate of up to 9Mbps. UART0 supports some modems, supports hardware automatic flow control, and supports automatic slave address matching during multi-machine communication.

[0037] In scenarios where water meters are read remotely, Hall effect sensors can be used to collect water volume information. The data acquisition logic is as follows: capture Hall effect sensor pulses through GPIO interrupt (or ADC sampling), accumulate the number of pulses and convert them into water consumption. For example, every 10 pulses correspond to 1 liter of water. Actual calibration is required.

[0038] A pulse width modulation (PWM) unit is used to control LEDs, motors, etc.

[0039] It also includes a Serial Peripheral Interface (SPI), which can be used to connect external storage expansion modules.

[0040] The MCU also has a built-in PLL, a 16MHz built-in clock, and a 32kHz built-in clock, integrated into the real-time clock unit of the RISC-V architecture MCU.

[0041] Real-time clocks (RTCs) support both timing and trigger modes to reduce power consumption.

[0042] There are two crystal oscillators: one is a low-speed 32.768kHz crystal, and the other is a high-speed 32MHz crystal. Both the low-speed and high-speed crystals are connected to the real-time clock unit.

[0043] The RTC unit prioritizes the use of a 32kHz built-in clock as the basic timing clock, and can be connected to an external 32.768kHz low-speed clock crystal to improve timing accuracy; the main clock of the RISC-V architecture MCU can be adapted based on the 16MHz built-in clock through PLL frequency multiplication, or connected to an external 32MHz high-speed clock crystal. The external 32MHz high-speed clock crystal can be further optimized for clock stability through PLL to adapt to the operating requirements of high-speed peripherals.

[0044] The external storage expansion module is a Flash chip with a capacity of not less than 16Mbit, which is used to expand the chip's storage capacity.

[0045] The external Flash chip can be W25Q128JV (16Mbit), with its CS pin connected to PB16 (NCS) of the chip body, SCK pin connected to FCK, DI pin connected to FDI, and DO pin connected to FDO to realize SPI communication.

[0046] The power management module also includes a DC-DC conversion circuit and a filter capacitor bank; it adopts a high-efficiency DC-DC converter, with an input voltage adapted to a 3.6V lithium battery (a common power source for IoT devices), and an output voltage converted to 2.5V-3.6V adapted to the chip body, with a conversion efficiency of ≥85% (far higher than the 60% of traditional LDOs), significantly reducing power loss.

[0047] The filter capacitor bank includes parallel ceramic capacitors; specifically, in this solution, it consists of multiple 2.2μF ceramic capacitors connected in parallel to filter out power supply noise (such as lithium battery discharge fluctuations and external electromagnetic interference) and ensure the stability of the chip's power supply.

[0048] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

[0049] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A packaged chip for the Internet of Things, characterized in that, Includes a chip body, which has a built-in MCU; A power management module, wherein the power management module is connected to the power pins of the chip body; An external storage expansion module, which is connected to the chip body via a serial peripheral interface; The wireless communication module is connected to the ANT pin of the chip body and is used to transmit and receive wireless signals; Crystal oscillators enhance the accuracy and stability of the real-time clock unit built into the MCU; Level conversion module, used for level matching with external devices; The power management module includes P-MOS transistors, which constitute a zoned power supply control circuit. The MCU, power management module, external storage expansion module, wireless communication module, and crystal oscillator are all encapsulated within the chip body.

2. The IoT-compatible packaged chip according to claim 1, characterized in that, The chip body is packaged using SiP packaging.

3. The IoT-compatible packaged chip according to claim 1, characterized in that, The MCU is a RISC-V architecture MCU, and integrates a wireless communication module supporting BLE-V5.4, a storage unit of at least 512K-Flash and 128K-RAM, a 12-bit analog-to-digital converter, a multi-channel universal asynchronous transceiver and a pulse width modulation unit.

4. The IoT-compatible chip according to claim 3, characterized in that, The MCU also has a built-in PLL, a 16MHz built-in clock, and a 32KHz built-in clock, which are integrated into the real-time clock unit of the RISC-V architecture MCU.

5. A packaged chip for the Internet of Things according to claim 1, characterized in that, Two crystal oscillators are provided, one of which is a low-speed clock crystal of 32.768KHz and the other is a high-speed clock crystal of 32MHz. Both the low-speed clock crystal and the high-speed clock crystal are connected to the real-time clock unit.

6. The IoT-compatible packaged chip according to claim 1, characterized in that, The external storage expansion module is a Flash chip with a capacity of not less than 16Mbit, which is used to expand the chip's storage capacity.

7. A packaged chip for the Internet of Things according to claim 1, characterized in that, The power management module also includes a DC-DC conversion circuit and a filter capacitor bank.

8. A packaged chip for the Internet of Things according to claim 7, characterized in that, The filter capacitor bank includes ceramic capacitors connected in parallel.

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