Power amplifier circuit and device

CN224790770UActive Publication Date: 2026-09-22广州市迪士普音响科技有限公司
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Patent Information

Application Number
CN202522314552.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-31
Publication Date
2026-09-22
Estimated Expiration
2035-10-31

AI Technical Summary

Technical Problem

[0005]基于此,本申请的目的旨在至少能解决上述的技术缺陷之一,特别是现有技术中系统集成度低的技术缺陷,本申请提供了一种功放电路及设备

Benefits of technology

[0043]本申请提供的功放电路及设备,通过立体音输入模块,用于接收多路音源;麦克风输入模块,用于接收多路麦克风音源;数字音频输入模块,用于接收多路数字音源,能够实现多种音源的同时接入与切换,并通过主控芯片模块独立调节不同类型的多路音源的输出音量,能够满足不同场景下的音量个性化需求,从而可以提高功放设备的系统集成度。

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Abstract

The application relates to a power amplifier circuit and equipment, which comprises a stereo input module for receiving multiple sound sources, a microphone input module for receiving multiple microphone sound sources, a digital audio input module for receiving multiple digital sound sources, a master control chip module connected with the stereo input module, the microphone input module and the digital audio input module respectively, and used for independently adjusting the output volume of different types of multiple sound sources, and a power amplifier module used for being connected with a loudspeaker and outputting the sound source after the output volume is adjusted. Thus, the system integration of the power amplifier equipment can be improved.
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Description

Technical Field

[0001] This application relates to the field of audio processing technology, and in particular to a power amplifier circuit and device. Background Technology

[0002] In the field of audio equipment technology, applications such as public address systems, educational technology systems, and entertainment projects are placing increasingly higher demands on the performance of power amplifiers. Traditional power amplifier systems typically employ a discrete architecture, consisting of independent audio source devices, preamplifiers, power amplifiers, and speakers. They achieve the merging and amplification of multiple signals through analog amplification circuits and potentiometer adjustments.

[0003] However, with the continuous expansion of application scenarios and the increasing diversification of user needs, the limitations of traditional power amplifiers in terms of system integration, noise suppression capabilities, and user experience are gradually becoming apparent. In particular, existing technical solutions are struggling to meet the high standards required by modern audio applications in areas such as multi-functional integration, signal processing accuracy, and intelligent control.

[0004] In summary, existing power amplifier devices have significant shortcomings in terms of system integration. Utility Model Content

[0005] Based on this, the purpose of this application is to at least solve one of the above-mentioned technical defects, especially the technical defect of low system integration in the prior art. This application provides a power amplifier circuit and device.

[0006] In a first aspect, this application provides a power amplifier circuit, the circuit comprising:

[0007] Stereo input module for receiving multiple audio sources;

[0008] Microphone input module, used to receive audio from multiple microphone sources;

[0009] Digital audio input module, used to receive multiple digital audio sources;

[0010] The main control chip module is connected to the stereo input module, microphone input module, and digital audio input module respectively, and is used to independently adjust the output volume of different types of multi-channel audio sources;

[0011] The power amplifier module is used to connect to the speakers and output the volume-adjusted audio source.

[0012] In one embodiment, the main control chip module includes:

[0013] The left channel mixing module has its input terminals connected to the stereo input module, microphone input module, and digital audio input module, respectively.

[0014] The right channel mixing module has its input terminals connected to the stereo input module, microphone input module, and digital audio input module, respectively.

[0015] The volume control module has its left channel input connected to the output of the left channel mixing module, and its right channel input connected to the output of the right channel mixing module. This volume control module is used to independently adjust the left and right channels of multiple audio sources of different types.

[0016] In one embodiment, the main control chip module further includes:

[0017] The stereo tuning module has its input connected to the output of the stereo input module, and its output connected to the left channel mixing module and the right channel mixing module respectively.

[0018] The microphone tone calibration module has its input connected to the output of the microphone input module, and its output connected to the left channel mixing module and the right channel mixing module respectively.

[0019] The digital audio calibration module has its input connected to the output of the digital audio input module, and its output connected to the left channel mixing module and the right channel mixing module, respectively.

[0020] In one embodiment, the preprocessing and calibration module includes:

[0021] Noise gate unit is used to suppress background noise in the input audio source;

[0022] Multi-band equalizer unit, used to adjust the gain of audio signals in different frequency bands;

[0023] The audio DRC limiting unit is used to compress the dynamic range of the audio signal to prevent overload.

[0024] The preprocessing and calibration module can be any one of the following modules: stereo calibration module, microphone calibration module, or digital audio calibration module.

[0025] In one embodiment, the microphone tone calibration module includes:

[0026] The feedback suppression unit is used to detect and suppress feedback frequencies in the microphone audio source;

[0027] A microphone priority unit is used to automatically reduce the output volume of other audio sources when microphone audio is input;

[0028] The reverb unit is used to add preset spatial reverb effects to the microphone audio source.

[0029] In one embodiment, the digital audio input module includes:

[0030] Bluetooth module, used for Bluetooth connection to external audio devices;

[0031] Plug-in storage modules are used to connect plug-in storage devices.

[0032] In one embodiment, the circuit further includes:

[0033] The display module, connected to the main control chip module, is used to display the output information of different types of multi-channel audio sources.

[0034] In one embodiment, the circuit further includes:

[0035] The button module, connected to the main control chip module, is used to receive user button operation commands so that the main control chip module can independently adjust the output volume of different types of multi-channel audio sources according to the button operation commands;

[0036] The shuttle module, connected to the main control chip module, is used to continuously adjust the volume and sound effect parameters and navigate menu options through rotation.

[0037] In one embodiment, the circuit further includes:

[0038] The wireless remote control module connects to the main control chip module and is also used to connect to external remote control devices to receive control commands sent by the external remote control devices, so as to remotely operate the power amplifier circuit.

[0039] Secondly, this application also provides a power amplifier device, including:

[0040] As shown in the power amplifier circuit above;

[0041] The speaker is connected to the power amplifier circuit.

[0042] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0043] The power amplifier circuit and device provided in this application, through a stereo input module for receiving multiple audio sources; a microphone input module for receiving multiple microphone audio sources; and a digital audio input module for receiving multiple digital audio sources, can realize the simultaneous access and switching of multiple audio sources, and independently adjust the output volume of different types of multi-channel audio sources through the main control chip module, which can meet the personalized volume requirements in different scenarios, thereby improving the system integration of the power amplifier device. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of a power amplifier circuit provided in an embodiment of this application;

[0046] Figure 2 A schematic diagram of an optional structure of a main control chip module provided in an embodiment of this application;

[0047] Figure 3 This application provides a schematic diagram of the system framework of a power amplifier device;

[0048] Figure 4 This is a schematic diagram of the audio processing structure of a main control chip module provided in an embodiment of this application.

[0049] Figure label:

[0050] 10 - Power amplifier circuit; 110 - Stereo input module; 120 - Microphone input module; 130 - Digital audio input module; 140 - Main control chip module; 150 - Power amplifier module; 141 - Left channel mixing module; 142 - Right channel mixing module; 143 - Volume adjustment module; 144 - Stereo tuning module; 145 - Microphone tuning module; 146 - Digital audio tuning block. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0053] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0054] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0055] It is understandable that "at least one" can refer to one or more, while "multiple" can refer to two or more. "At least a part of an element" can refer to part or all of an element.

[0056] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0057] With the development of the audio-visual industry, the audio requirements in scenarios such as public address systems, educational technology, and entertainment projects are constantly increasing, and the functions of power amplifier equipment also need to be continuously expanded. Traditional power amplifier equipment typically consists of a source device, preamplifier, power amplifier, and speakers, which suffers from complex structure, numerous components, high cost, and complex wiring, increasing the difficulty of daily maintenance and management. Currently, most multi-signal input integrated power amplifiers use analog amplification circuits and potentiometer volume adjustment methods. This solution has drawbacks such as complex hardware circuitry, large circuit board size, high cost, and susceptibility to interference, leading to increased overall equipment noise and affecting user experience. Specific drawbacks include:

[0058] Traditional multi-signal input combined power amplifiers mostly use analog amplification circuits and potentiometer volume adjustment methods, resulting in complex hardware circuits that are susceptible to interference and increased noise, which in turn affects sound quality and user experience.

[0059] Existing power amplifiers are limited in function and cannot meet the diverse audio signal processing needs. They cannot achieve independent volume adjustment for multiple audio signals and cannot effectively avoid mutual interference between signals. At the same time, they lack multi-functional integrated design and cannot be compatible with various MP3 playback functions such as USB flash drives, TF cards, and Bluetooth, making it difficult to adapt to the usage needs of different scenarios.

[0060] Existing power amplifier equipment generally does not support remote operation, which limits the user's usage scenarios and ease of operation, making it difficult to meet the needs of intelligent control.

[0061] Although existing high-end power amplifier equipment is equipped with network DSP processors, it still requires post-processing via the network, resulting in high costs.

[0062] To address the aforementioned issues, this application proposes a power amplifier circuit and device. Based on a stereo input module, a microphone input module, a digital audio input module, and a main control chip module, a novel power amplifier solution can be implemented. This solution enables simultaneous input and switching of multiple audio sources, and allows independent adjustment of the output volume of different types of multi-channel audio sources via the main control chip module. This satisfies personalized volume requirements in various scenarios, thereby improving the system integration of the power amplifier device.

[0063] In one exemplary embodiment, Figure 1 This is a schematic diagram of the structure of a power amplifier circuit 10 provided in an embodiment of this application, as shown below. Figure 1 As shown, the power amplifier circuit 10 includes a stereo input module 110, a microphone input module 120, a digital audio input module 130, a main control chip module 140, and a power amplifier module 150, wherein:

[0064] The stereo input module 110 is used to receive multiple audio sources;

[0065] Microphone input module 120 is used to receive audio from multiple microphone sources;

[0066] The digital audio input module 130 is used to receive multiple digital audio sources;

[0067] The main control chip module 140 is connected to the stereo input module 110, the microphone input module 120, and the digital audio input module 130 respectively, and is used to independently adjust the output volume of different types of multi-channel audio sources;

[0068] The power amplifier module 150 is used to connect to the speaker and output the volume-adjusted audio source.

[0069] The stereo input module 110 refers to an interface circuit that receives multi-channel stereo audio signals from external analog audio devices (such as CD players or mobile phone audio outputs), and may include RCA terminals or a 3.5mm audio jack, used to transmit analog audio signals to the main control chip module 140. The microphone input module 120 refers to a circuit that receives audio signals from microphone devices, such as XLR or 6.35mm microphone interfaces, supporting simultaneous input from multiple microphones for capturing human voices or instrument sounds. The digital audio input module 130 refers to an interface that receives digital format audio data, such as an S / PDIF or USB interface, used to process high-quality audio streams from digital devices. The main control chip module 140 refers to a microcontroller or dedicated audio processing chip with integrated digital signal processing (DSP) functions, responsible for mixing, volume adjustment, and sound effect tuning of multiple audio sources. The power amplifier module 150 refers to a power amplifier circuit, such as a Class-D or Class AB amplifier, used to amplify the processed audio signals to drive speakers.

[0070] For example, the output of the stereo input module 110 can be connected to the analog input pin of the main control chip module 140 via an analog signal line; the output of the microphone input module 120 can be connected to the microphone input pin of the main control chip module 140 via a preamplifier circuit; and the output of the digital audio input module 130 can be connected to the digital input pin of the main control chip module 140 via a digital bus. The main control chip module 140 can independently process multiple audio sources. The output of the main control chip module 140 can be connected to the input of the power amplifier module 150 via an audio bus. The output of the power amplifier module 150 can be directly connected to the speaker terminals, thus realizing a complete audio signal link.

[0071] In this embodiment, by integrating stereo input, microphone input, and digital audio input modules 130 under the control of the same main control chip module 140, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices require multiple independent circuit boards and processing units, resulting in complex structures and signal delays. This embodiment centralizes the processing of multiple audio sources, reducing the number of external components, improving the space utilization of the circuit board and signal consistency, thereby achieving a highly integrated audio processing system and reducing production costs and maintenance difficulty.

[0072] In one exemplary embodiment, such as Figure 2 As shown, Figure 2 This is a schematic diagram of an optional structure of a main control chip module provided in an embodiment of this application. The main control chip module 140 includes:

[0073] The left channel mixing module 141 has its input terminals connected to the stereo input module 110, the microphone input module 120, and the digital audio input module 130, respectively.

[0074] The right channel mixing module 142 has its input terminals connected to the stereo input module 110, the microphone input module 120, and the digital audio input module 130, respectively.

[0075] The volume adjustment module 143 has its left channel input connected to the output of the left channel mixing module 141, and its right channel input connected to the output of the right channel mixing module 142. The volume adjustment module 143 is used to independently adjust the left and right channels of multiple audio sources of different types.

[0076] The left channel mixing module 141 can refer to the digital mixer unit inside the main control chip, responsible for weighted mixing of the left channel audio signals from stereo input, microphone input, and digital audio input, outputting a single left channel signal. The right channel mixing module 142 can refer to a mixer unit symmetrical to the left channel mixing module 141, used for mixing the right channel audio signal. The volume adjustment module 143 can refer to a digital volume controller, such as one based on gain adjustment circuitry, supporting independent setting of the left and right channel volumes for each audio source to avoid inter-channel interference.

[0077] For example, the input terminals of the left channel mixing module 141 and the right channel mixing module 142 can be connected to each input module via a multiplexer or a switch, and the mixed signals are output to the corresponding channel input terminals of the volume adjustment module 143. The volume adjustment module 143 uses a digital potentiometer or DSP algorithm to independently adjust the gain value of each audio source according to user settings, and its output terminal is connected to the power amplifier module 150 to achieve precise channel balance and volume control.

[0078] In this embodiment, by integrating left / right channel mixing and independent volume control functions within the main control chip module 140, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices require external separate mixers and volume controllers, leading to circuit redundancy and debugging difficulties. This embodiment integrates mixing and volume control into a single chip, simplifying the audio signal path, improving processing efficiency and system reliability, and is suitable for compact audio devices.

[0079] In one exemplary embodiment, such as Figure 2 As shown, the main control chip module 140 also includes:

[0080] The stereo tone adjustment module 144 has its input terminal connected to the output terminal of the stereo tone input module 110, and its output terminal connected to the left channel mixing module 141 and the right channel mixing module 142 respectively.

[0081] The microphone tone adjustment module 145 has its input end connected to the output end of the microphone input module 120, and its output end connected to the left channel mixing module 141 and the right channel mixing module 142 respectively.

[0082] The digital audio calibration module has its input terminal connected to the output terminal of the digital audio input module 130, and its output terminal connected to the left channel mixing module 141 and the right channel mixing module 142, respectively.

[0083] The stereo tuning module 144 refers to the audio processing unit within the main control chip used to process analog stereo sound sources, such as an equalizer or dynamic range controller, to optimize audio quality. The microphone tuning module 145 refers to a dedicated processing unit for microphone signals, supporting noise reduction, echo cancellation, and other functions to improve vocal clarity. The digital audio tuning module refers to a decoding and enhancement unit that processes digital audio sources, such as a sampling rate conversion or bit depth adjustment circuit, to ensure high-fidelity digital audio output.

[0084] For example, the stereo tone calibration module 144 receives the analog signal from the stereo input module 110 at its input terminal, and then processes it through ADC conversion and DSP. The output terminal of the stereo tone calibration module 144 is connected to the left and right channel mixing modules 142 respectively. The microphone tone calibration module 145 receives the microphone input signal at its input terminal, performs pre-amplification and digital filtering, and its output terminal is connected to the mixing module. The digital audio calibration module directly processes digital bus data at its input terminal, and its output terminal is integrated into the mixing module. Each calibration module works in coordination through the internal bus of the main control chip to achieve specific processing of the sound source.

[0085] In this embodiment, by integrating multiple audio source tuning modules within the main control chip module 140, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices require external sound effect boards or discrete processors, resulting in system bloat and compatibility issues. This embodiment integrates the tuning function, achieving multi-source optimization under a unified platform, improving the consistency and efficiency of audio processing, and reducing external dependencies.

[0086] In one exemplary embodiment, the preprocessing tuning module includes:

[0087] Noise gate unit is used to suppress background noise in the input audio source;

[0088] Multi-band equalizer unit, used to adjust the gain of audio signals in different frequency bands;

[0089] The audio DRC limiting unit is used to compress the dynamic range of the audio signal to prevent overload.

[0090] The preprocessing and calibration module can be any one of the following modules: stereo calibration module, microphone calibration module, or digital audio calibration module.

[0091] Among these, the noise gate unit can refer to a threshold-based circuit or algorithm that automatically mutes the input audio signal when it falls below a set level, thus eliminating background noise. The multi-band equalizer unit can refer to a parametric equalizer or graphic equalizer that divides the audio frequency band into multiple sub-bands and independently adjusts the gain of each band to optimize timbre. The audio DRC limiting unit can refer to a dynamic range compressor that limits signal peak values ​​through automatic gain control, preventing amplifier overload and distortion. The pre-processing tuning module can refer to a combination of the above units, serving as the core of the tuning module and applied to specific audio source types.

[0092] For example, the input of the noise gate unit is connected to the audio source signal, and the output of the noise gate unit is connected to the input of the multi-band equalizer unit. After the multi-band equalizer unit processes the signal through a filter bank, its output is connected to the input of the audio DRC limiting unit. The output of the DRC limiting unit is finally connected to the mixing module. This structure is implemented through the DSP core of the main control chip, and users can configure parameters to adapt to different audio sources.

[0093] In this embodiment, by integrating a noise gate, multi-band equalizer, and DRC limiting unit into the pre-processing tuning module, the significant shortcomings in system integration of power amplifier equipment are addressed. For example, traditional equipment requires external noise suppressors and equalizers, leading to system complexity and increased costs. This embodiment integrates multiple pre-processing functions, providing comprehensive audio optimization, reducing external components, and improving overall system performance and user experience.

[0094] In one exemplary embodiment, the microphone tone calibration module includes:

[0095] The feedback suppression unit is used to detect and suppress feedback frequencies in the microphone audio source;

[0096] A microphone priority unit is used to automatically reduce the output volume of other audio sources when microphone audio is input;

[0097] The reverb unit is used to add preset spatial reverb effects to the microphone audio source.

[0098] The feedback suppression unit can refer to feedback cancellation circuitry or algorithms that detect and attenuate resonant frequencies that may cause feedback through frequency scanning and notch filtering. The microphone priority unit can refer to an automatic mixing controller that dynamically reduces the volume of background music or other audio sources when a microphone signal is activated, ensuring vocals stand out. The reverb unit can refer to a digital signal processing unit that simulates room acoustics, adding echo or reverb effects to the microphone signal to enhance the sense of audio space.

[0099] For example, the input of the feedback suppression unit is connected to the microphone input signal. Feedback points can be identified through FFT analysis and a filter applied. The output is connected to the microphone priority unit. The microphone priority unit monitors the microphone activity and adjusts the volume of other sound sources through gain control circuitry. Its output is connected to the reverb unit. The reverb unit processes the signal according to preset parameters, and its output is finally connected to the mixing module. The entire process can be processed in real time within the main control chip.

[0100] In this embodiment, feedback suppression, priority control, and reverb functions are integrated into the microphone tone tuning module, addressing the significant shortcomings in system integration of power amplifier devices. For example, traditional systems require external feedback suppressors and reverb units, resulting in device clutter and signal delay. This embodiment integrates microphone processing into the main control chip, achieving compact and efficient audio management, improving system reliability and user ease of operation.

[0101] In one exemplary embodiment, the digital audio input module includes:

[0102] Bluetooth module, used for Bluetooth connection to external audio devices;

[0103] Plug-in storage modules are used to connect plug-in storage devices.

[0104] The Bluetooth module refers to a wireless communication circuit based on the Bluetooth protocol (such as Bluetooth 5.0), supporting A2DP or APT-X codecs, used to receive audio streams from devices such as mobile phones and tablets. The pluggable storage module refers to a USB interface or SD card slot circuit, used to read audio files from USB flash drives or memory cards, supporting MP3, WAV, and other format decoding.

[0105] For example, the Bluetooth module receives wireless signals through an antenna, processes and decodes them via baseband, and then outputs a digital audio stream to the digital input pins of the main control chip module; the pluggable storage module connects to a storage device via a USB host controller or SDIO interface, reads files, and transmits them to the main control chip module via a data bus. Both are integrated on the same circuit board and share the resources of the main control chip.

[0106] In this embodiment, Bluetooth and pluggable storage functions are integrated into the digital audio input module, addressing the significant shortcomings in system integration of power amplifier devices. For example, traditional devices require additional adapters or card readers, resulting in fragmented interfaces and poor compatibility. This embodiment integrates multiple digital input methods, providing seamless audio source switching, reducing reliance on external devices, and enhancing the system's versatility and compactness.

[0107] In one exemplary embodiment, the circuit further includes:

[0108] The display module, connected to the main control chip module, is used to display the output information of different types of multi-channel audio sources.

[0109] The display module can refer to a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display circuit, used to display information such as sound source type, volume level, and sound effect settings in real time, providing users with visual feedback.

[0110] For example, the display module can connect to the main control chip module via an SPI or I2C interface. The main control chip sends the processed audio status data (such as the currently active audio source and volume value) to the display driver, driving the display screen to update its content. The display module can be integrated into the front panel of the device, supporting menu navigation and status indication.

[0111] In this embodiment, by directly connecting the integrated display module to the main control chip module, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices require a separate display controller and complex wiring, increasing system complexity and cost. This embodiment achieves information display under unified control, improving user interaction efficiency and system integrity.

[0112] In one exemplary embodiment, the circuit further includes:

[0113] The button module, connected to the main control chip module, is used to receive user button operation commands so that the main control chip module can independently adjust the output volume of different types of multi-channel audio sources according to the button operation commands;

[0114] The shuttle module, connected to the main control chip module, is used to continuously adjust the volume and sound effect parameters and navigate menu options through rotation.

[0115] The button module refers to physical buttons or touch switch arrays used to send discrete control signals, such as power switching, audio source selection, or preset mode switching. The shuttle module refers to a rotary encoder or knob switch that generates pulse signals through rotation for precise volume adjustment or browsing menu options, supporting rapid and continuous adjustments.

[0116] For example, the output of the button module is connected to the main control chip module via a GPIO interface. After detecting the button status, the main control chip executes the corresponding volume adjustment command. The shuttle module outputs quadrature signals to the main control chip through the encoder circuit. The main control chip interprets the rotation direction and speed to achieve continuous parameter adjustment. Both modules share the interrupt resources of the main control chip to achieve low-latency response.

[0117] In this embodiment, by integrating a button module and a shuttle module to directly interact with the main control chip, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices use discrete control panels and complex interface circuits, resulting in bloated systems and inconvenient operation. This embodiment highly integrates user input functions, providing an intuitive and efficient control method, enhancing system compactness and user experience.

[0118] In one exemplary embodiment, the circuit further includes:

[0119] The wireless remote control module connects to the main control chip module and is also used to connect to external remote control devices to receive control commands sent by the external remote control devices, so as to remotely operate the power amplifier circuit.

[0120] The wireless remote control module can refer to an infrared (IR) receiver or a radio frequency (RF) transceiver circuit, such as a remote control interface based on Wi-Fi or Bluetooth, used to receive control signals from a remote control or mobile app to achieve functions such as remote volume adjustment and audio source switching.

[0121] For example, the wireless remote control module can receive signals via an infrared sensor or RF antenna, process them through a decoding circuit, and then transmit them to the main control chip module via a UART or SPI interface. The main control chip parses the instructions and executes the corresponding operations, such as adjusting the volume or switching the audio source. This module is integrated into the main circuit board and shares power management with the main control chip.

[0122] In this embodiment, by seamlessly integrating the wireless remote control module with the main control chip module, the significant shortcomings in system integration of power amplifier devices are addressed. For example, traditional devices require external receivers and additional processing units, leading to system fragmentation and signal interference. This embodiment achieves internal integration of remote control, improving system flexibility and integrity, and reducing reliance on external components.

[0123] In one exemplary embodiment, this application also provides a power amplifier device, including:

[0124] As shown in the power amplifier circuit above;

[0125] The speaker is connected to the power amplifier circuit.

[0126] The term "amplifier" refers to a complete audio playback system that integrates the aforementioned amplifier circuitry, such as a home theater amplifier or professional audio equipment, used to drive speakers to output audio. The term "speaker" refers to a moving or electrostatic speaker unit that converts electrical signals into sound and supports multi-channel output.

[0127] For example, the output of the power amplifier module in the power amplifier circuit is connected to the voice coil of the speaker through the speaker terminal. The main control chip module controls the audio signal processing, and the speaker emits sound based on the amplified signal. The entire device has a compact structure, with the power amplifier circuit and speaker designed as an integrated or separate unit to adapt to different application scenarios.

[0128] In this embodiment, by integrating the power amplifier circuit and the speaker into a single device, the significant shortcomings in system integration of existing power amplifier devices are addressed. For example, traditional systems require multiple independent components (such as preamplifiers, power amplifiers, and speakers), resulting in complex connections and large space occupation. This design achieves a highly integrated audio solution, improving device portability and ease of use, while reducing overall costs through modular design.

[0129] In some exemplary embodiments, Figure 3 This is a schematic diagram of the system framework of a power amplifier device provided in this application. Figure 3 As shown, the power amplifier device includes:

[0130] The main control chip module 140 integrates MCU and DSP processing functions, with high integration, few and simple peripheral hardware circuits, and low cost. It can easily realize multi-functional MP3 playback such as USB flash drive / TF card / Bluetooth by simply adding the corresponding interface.

[0131] The FM radio module inputs to the main control chip module 140 for digital audio processing. The display screen is connected to the MCU of the main control chip module 140 via UART. The MCU performs ADC sampling on the rotary dial and buttons. The rotary dial works in conjunction with the display screen for main operations. Each audio source has an independent volume button for convenient volume control, and the display interface is simple and elegant. The main control chip module 140 connects to a multi-channel electronic volume IC via IIC serial communication to adjust the volume of each audio source. When the main control chip module 140 detects no audio input, it controls the power amplifier module 150 to enter standby mode and turn off the display screen via GPIO, achieving a low-power mode. When the heatsink temperature of the power amplifier module 150 is high, the main control chip module 140 controls the fan via GPIO to assist in heat dissipation and protect the power amplifier module 150. The main control chip module 140 can switch between constant impedance and constant voltage power amplifier functions by adjusting the digital gain, voltage limit threshold, and frequency response to meet the needs of different application scenarios. The main control chip module 140 has a variety of built-in commonly used sound effects that can be switched with one button.

[0132] In addition, the volume adjustment, EQ equalization adjustment, and one-click mute functions of the whole machine can be controlled through infrared remote control, Bluetooth APP, remote RS485 and other methods.

[0133] In this embodiment, through the above specific implementation method, a highly integrated design of the power amplifier device can be achieved, reducing hardware costs, improving audio processing accuracy and functional diversity, while supporting multi-scenario applications and intelligent control, and significantly optimizing the user experience.

[0134] In some specific implementations of embodiments, such as Figure 4 As shown, Figure 4 This application provides a schematic diagram of the audio processing structure of a main control chip module 140 according to an embodiment of the present application; wherein,

[0135] The stereo input module 110 can input three AUX stereo sound sources; the microphone input module 120 can input four MIC sound sources.

[0136] The three AUX stereo sources pass through a multi-channel electronic volume IC, then through an operational amplifier for addition and amplification before being input to the L and R channels (left channel mixing module 141, right channel mixing module 142) of the main control chip module 140 for digital-to-analog conversion and audio processing including noise gate (noise gate unit), 7-band EQ (multi-band equalizer unit), and digital DRC limiting (audio DRC limiting unit). The four MIC sources pass through a multi-channel electronic volume IC, then through an operational amplifier for addition and amplification before being input to the MIC channel of the main control chip module 140 for digital-to-analog conversion and audio processing including noise gate, 7-band EQ, and digital DRC limiting. The MIC channel has functions such as howling suppression, priority, and reverb. MP3 inputs such as USB flash drives and Bluetooth undergo internal audio processing. After mixing the AUX, MIC, and MP3, a rotary encoder, in conjunction with the main control chip module 140, adjusts the internal digital gain. After digital DRC limiting, the L and R channels are output to the power amplifier module 150 for signal amplification.

[0137] In this embodiment, through the above specific implementation method, independent volume adjustment and precise audio processing of multiple audio sources can be achieved, improving the signal-to-noise ratio and dynamic range of audio signals, while supporting mixing control and sound effect optimization, meeting the sound quality requirements and intelligent operation effects in multiple scenarios.

[0138] In this application, a single main control chip module 140 is used to control the functions of the whole machine. It can integrate MCU and DSP audio processing functions, with high integration, few peripheral hardware circuits, simplicity, and low cost.

[0139] The main control chip module 140 integrates multiple analog audio inputs, converting analog signals into digital signals. After being processed by the chip's internal DSP audio processing, the signals are sent to the output of the power amplifier. This enables the effective processing and merging of multiple audio signals, meeting the processing needs of multiple audio signals. At the same time, it effectively avoids the problem of mutual interference between multiple signals, significantly reduces the overall noise, and improves sound quality and user experience.

[0140] The IIC serial port control of the main control chip module 140 can be used to easily realize multi-channel audio volume adjustment, realizing independent volume control of multiple audio signals, effectively avoiding the interference caused by traditional analog amplifier circuits and potentiometer volume adjustment methods, as well as the noise problem caused by the poor durability of potentiometers.

[0141] It integrates multiple control methods such as infrared remote control, Bluetooth APP, and remote RS485, enabling remote control of volume adjustment and EQ equalization of all audio sources on the device, thus improving the convenience and practicality of the equipment.

[0142] The main control chip module 140 can directly adjust the preset digital gain, voltage limit threshold and frequency response to realize the constant impedance and constant voltage power amplifier switching function without the need for external analog circuits, which improves the system's flexibility and adaptability and meets the needs of different application scenarios.

[0143] It should be noted that, Figures 1 to 4 The diagram shows some ports and connections for each module / unit. However, in practical applications, other connections for the ports of each module / unit can be configured according to actual needs. Other pins or ports not shown can be configured according to actual conditions. Figures 1 to 4 The examples shown are not intended to limit this application.

[0144] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "specific implementation," and "another implementation" refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0145] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes said element.

[0146] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0147] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power amplifier circuit, characterized in that, The circuit includes: Stereo input module for receiving multiple audio sources; Microphone input module, used to receive audio from multiple microphone sources; Digital audio input module, used to receive multiple digital audio sources; The main control chip module is connected to the stereo input module, the microphone input module, and the digital audio input module respectively, and is used to independently adjust the output volume of different types of multi-channel audio sources; The power amplifier module is used to connect to the speakers and output the volume-adjusted audio source.

2. The power amplifier circuit according to claim 1, characterized in that, The main control chip module includes: The left channel mixing module has its input terminals connected to the stereo input module, the microphone input module, and the digital audio input module, respectively. The right channel mixing module has its input terminals connected to the stereo input module, the microphone input module, and the digital audio input module, respectively. The volume control module has its left channel input connected to the output of the left channel mixing module and its right channel input connected to the output of the right channel mixing module. This volume control module is used to independently adjust the left and right channels of multiple audio sources of different types.

3. The power amplifier circuit according to claim 2, characterized in that, The main control chip module also includes: A stereo tone calibration module, wherein the input terminal of the stereo tone calibration module is connected to the output terminal of the stereo tone input module, and the output terminal of the stereo tone calibration module is respectively connected to the left channel mixing module and the right channel mixing module; A microphone tone calibration module, wherein the input end of the microphone tone calibration module is connected to the output end of the microphone input module, and the output end of the microphone tone calibration module is connected to the left channel mixing module and the right channel mixing module respectively; A digital audio tuning module, wherein the input terminal of the digital audio tuning module is connected to the output terminal of the digital audio input module, and the output terminal of the digital audio tuning module is connected to the left channel mixing module and the right channel mixing module respectively.

4. The power amplifier circuit according to claim 3, characterized in that, The preprocessing and calibration module includes: Noise gate unit is used to suppress background noise in the input audio source; Multi-band equalizer unit, used to adjust the gain of audio signals in different frequency bands; The audio DRC limiting unit is used to compress the dynamic range of the audio signal to prevent overload. The preprocessing and calibration module can be any one of the stereo calibration module, the microphone calibration module, and the digital audio calibration module.

5. The power amplifier circuit according to claim 3, characterized in that, The microphone tone adjustment module includes: The feedback suppression unit is used to detect and suppress feedback frequencies in the microphone audio source; A microphone priority unit is used to automatically reduce the output volume of other audio sources when microphone audio is input; The reverb unit is used to add preset spatial reverb effects to the microphone audio source.

6. The power amplifier circuit according to claim 1, characterized in that, The digital audio input module includes: Bluetooth module, used for Bluetooth connection to external audio devices; Plug-in storage modules are used to connect plug-in storage devices.

7. The power amplifier circuit according to claim 1, characterized in that, The circuit also includes: The display module, connected to the main control chip module, is used to display the output information of different types of multi-channel audio sources.

8. The power amplifier circuit according to claim 1, characterized in that, The circuit also includes: A button module, connected to the main control chip module, is used to receive button operation commands from the user, so that the main control chip module can independently adjust the output volume of different types of multi-channel audio sources according to the button operation commands; The shuttle module, connected to the main control chip module, is used to continuously adjust the volume and sound effect parameters and navigate menu options through rotation.

9. The power amplifier circuit according to claim 1, characterized in that, The circuit also includes: The wireless remote control module is connected to the main control chip module and is also used to connect to an external remote control device to receive control commands sent by the external remote control device so as to remotely operate the power amplifier circuit.

10. A power amplifier device, characterized in that, include: The power amplifier circuit as described in any one of claims 1-9; The speaker is connected to the power amplifier circuit.