Foldable electronic device circuit board

Abstract

The utility model discloses a kind of foldable electronic equipment circuit board, including flexible circuit board main body, graphene film layer, heat-conducting silica gel shell and heat dissipation sheet, graphene film layer is fixedly bonded on the upper and lower sides of flexible circuit board main body, the quantity of heat-conducting silica gel shell and is two, each heat-conducting silica gel shell is fixedly bonded with a graphene film layer, phase-change material is stored in heat-conducting silica gel shell, phase-change material is made of polyethylene glycol, a plurality of heat dissipation sheets are fixed on each heat-conducting silica gel shell.The utility model has good foldability and heat dissipation, graphene layer is evenly heated, polyethylene glycol phase-change endothermic in heat-conducting silica gel shell, heat dissipation sheet accelerates heat dissipation, and the heat dissipation sheet with 5mm interval is folded to leave space and prevent excessive bending damage.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a foldable electronic device circuit board. Background Technology

[0002] Circuit boards are a crucial component of electronic devices. Depending on the requirements, some electronic devices utilize foldable flexible circuit boards. A flexible circuit board is a highly flexible printed circuit board made with polyimide or polyester film as the substrate. It forms circuits by etching conductive copper foil onto a flexible substrate, enabling dynamic deformations such as bending, folding, and twisting while maintaining stable electrical connectivity.

[0003] Existing flexible circuit boards have poor heat dissipation performance during use, failing to effectively dissipate heat from the heat-generating parts of the circuit board in a timely manner. This can easily lead to localized high temperatures that affect the performance and lifespan of the equipment. Therefore, in view of the above situation, there is an urgent need to develop a foldable electronic device circuit board that combines good foldability and heat dissipation, with a graphene layer for uniform heat dissipation, a polyethylene glycol phase change heat absorption shell inside the thermally conductive silicone shell, and a heat dissipation sheet to accelerate heat dissipation. This would overcome the shortcomings in current practical applications and meet current needs. Summary of the Invention

[0004] The purpose of this invention is to provide a foldable electronic device circuit board to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A foldable electronic device circuit board includes a flexible circuit board body, a graphene film layer, a thermally conductive silicone shell, and heat dissipation sheets. The graphene film layer is adhered and fixed to both the upper and lower sides of the flexible circuit board body. There are two thermally conductive silicone shells, each of which is adhered and fixed to one graphene film layer. The thermally conductive silicone shell stores a phase change material made of polyethylene glycol. Multiple heat dissipation sheets are fixed on each thermally conductive silicone shell.

[0006] Preferably, the heat dissipation fin is made of copper.

[0007] Preferably, the distance between any two adjacent heat dissipation fins is 5mm.

[0008] Preferably, the flexible circuit board body includes a bottom layer, an intermediate layer and a top layer, wherein the intermediate layer is bonded and fixed to the upper side of the bottom layer, and the top layer is bonded and fixed to the upper side of the intermediate layer.

[0009] Preferably, the bottom layer is made of an ultra-thin polyimide-based film, the middle layer is made of rolled copper foil, and the top layer is made of a polyimide cover film.

[0010] The beneficial effects of this utility model are as follows: The flexible circuit board of this foldable electronic device is flexible and foldable. The graphene film layers on the upper and lower sides of the flexible circuit board body concentrate and quickly and evenly distribute the heat of the heat-generating parts of the flexible circuit board body to other areas, thereby reducing the temperature of the heat-generating parts. At the same time, the thermally conductive silicone shell and the phase change material are flexible and adaptable. The thermally conductive silicone shell absorbs heat. After reaching the phase change temperature of the phase change material, the polyethylene glycol changes from solid to liquid and absorbs a large amount of heat, thereby cooling the flexible circuit board body. In addition, the heat dissipation fins increase the contact between the thermally conductive silicone shell and the air, thereby increasing the heat dissipation rate of the thermally conductive silicone shell. The distance between any two adjacent heat dissipation fins is mm. This distance can provide space for the bending and folding of the flexible circuit board body. Moreover, the limited distance between adjacent heat dissipation fins can also prevent the flexible circuit board body from being excessively bent and causing irreversible damage. In summary, this utility model combines good foldability and heat dissipation. The graphene layer provides uniform heat distribution, the polyethylene glycol inside the thermally conductive silicone shell absorbs heat through phase change, the heat dissipation sheet accelerates heat dissipation, and the 5mm spacing of the heat dissipation sheet provides space for folding and prevents damage from excessive bending. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0012] Figure 2 This is an exploded view of the present invention.

[0013] Figure 3 This is the front view of the present invention.

[0014] Figure 4 This is a top view of the present invention.

[0015] Figure 5 This utility model Figure 4 Sectional view along the AA direction.

[0016] Legend: 1. Flexible circuit board body; 101. Bottom layer; 102. Middle layer; 103. Top layer; 2. Graphene film layer; 3. Thermally conductive silicone shell; 301. Phase change material; 4. Heat dissipation sheet. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0018] Specific implementation examples are given below.

[0019] See Figures 1-5 In this embodiment of the invention, a foldable electronic device circuit board includes a flexible circuit board body 1, a graphene film layer 2, a thermally conductive silicone shell 3, and a heat dissipation sheet 4. The graphene film layer 2 is adhered and fixed to both the upper and lower sides of the flexible circuit board body 1. The graphene film layer 2 has good thermal conductivity and thermal uniformity, which can concentrate and quickly and evenly distribute the heat from the heat-generating parts of the flexible circuit board body 1 to other areas, thereby reducing the temperature of the heat-generating parts. There are two thermally conductive silicone shells 3, each adhered and fixed to one graphene film layer 2. A phase change material 301 is stored inside each thermally conductive silicone shell 3. The phase change material 301 is made of polyethylene glycol. The thermally conductive silicone shell 3 has good thermal conductivity and is flexible and malleable, and polyethylene glycol is also relatively soft and malleable. The denaturation does not affect the normal folding effect of the flexible circuit board body 1. The phase transition temperature of polyethylene glycol is 30℃~65℃. At room temperature, polyethylene glycol is solid. After reaching the phase transition temperature, polyethylene glycol changes from solid to liquid and absorbs a large amount of heat, thereby cooling the flexible circuit board body 1. Each of the thermally conductive silicone shells 3 is fixed with multiple heat dissipation fins 4. The heat dissipation fins 4 are made of copper, which gives them good thermal conductivity. The heat dissipation fins 4 increase the contact between the thermally conductive silicone shell 3 and the air, thereby increasing the heat dissipation rate of the thermally conductive silicone shell 3. The distance between any two adjacent heat dissipation fins 4 is 5mm. This distance can provide space for the bending and folding of the flexible circuit board body 1. The limited distance between adjacent heat dissipation fins 4 can also prevent the flexible circuit board body 1 from being excessively bent and causing irreversible damage.

[0020] The flexible circuit board body 1 includes a bottom layer 101, an intermediate layer 102, and a top layer 103. The bottom layer 101 is made of an ultra-thin polyimide film with a thickness of 12.5 μm, serving as the basic framework of the circuit board and providing both flexible support and lateral heat dissipation. The intermediate layer 102 is bonded and fixed to the upper side of the bottom layer 101. The intermediate layer 102 is made of rolled copper foil with a thickness of 18 μm and is used to carry conductive lines. The top layer 103 is bonded and fixed to the upper side of the intermediate layer 102. The top layer 103 is made of a polyimide cover film with a thickness of 25 μm, providing protection for the intermediate layer 102.

[0021] Working principle: The flexible circuit board body 1 of this foldable electronic device is flexible and foldable. The graphene film layer 2 on the upper and lower sides of the flexible circuit board body 1 concentrates and quickly and evenly distributes the heat of the heat-generating parts of the flexible circuit board body 1 to other areas, thereby reducing the temperature of the heat-generating parts. At the same time, the thermally conductive silicone shell 3 and the phase change material 301 are flexible and variable. The thermally conductive silicone shell 3 absorbs heat. After reaching the phase change temperature of the phase change material 301, polyethylene glycol changes from solid to liquid and absorbs a large amount of heat, thereby cooling the flexible circuit board body 1. In addition, the heat dissipation sheet 4 increases the contact between the thermally conductive silicone shell 3 and the air, improving the heat dissipation rate of the thermally conductive silicone shell 3. The distance between any two adjacent heat dissipation sheets 4 is 5mm. This distance provides space for the bending and folding of the flexible circuit board body 1, and the limited distance between adjacent heat dissipation sheets 4 can also prevent the flexible circuit board body 1 from being bent too much and causing irreversible damage.

[0022] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A foldable electronic device circuit board, characterized in that, The system includes a flexible circuit board body (1), a graphene film layer (2), a thermally conductive silicone shell (3), and heat dissipation sheets (4). The upper and lower sides of the flexible circuit board body (1) are both bonded with graphene film layers (2). There are two thermally conductive silicone shells (3), and each thermally conductive silicone shell (3) is bonded with one graphene film layer (2). The thermally conductive silicone shell (3) stores a phase change material (301), which is made of polyethylene glycol. Each thermally conductive silicone shell (3) has multiple heat dissipation sheets (4) fixed on it.

2. The foldable electronic device circuit board according to claim 1, characterized in that, The heat dissipation sheet (4) is made of copper.

3. The foldable electronic device circuit board according to claim 2, characterized in that, The distance between any two adjacent heat dissipation fins (4) is 5 mm.

4. The foldable electronic device circuit board according to claim 1, characterized in that, The flexible circuit board body (1) includes: a bottom layer (101), a middle layer (102) and a top layer (103). The middle layer (102) is bonded and fixed to the upper side of the bottom layer (101), and the top layer (103) is bonded and fixed to the upper side of the middle layer (102).

5. The foldable electronic device circuit board according to claim 4, characterized in that, The bottom layer (101) is made of an ultra-thin polyimide film, the middle layer (102) is made of rolled copper foil, and the top layer (103) is made of a polyimide cover film.

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