Heat dissipation device and electronic device

Abstract

The present disclosure provides a heat dissipation device and an electronic device. The heat dissipation device is applied to an electronic device, which comprises a heat source, a mainboard, a bracket and a heat dissipation component. The mainboard comprises a mounting surface, the bracket is assembled to the mounting surface and encloses the mainboard to form a heat dissipation space, and the heat source and the heat dissipation component are mounted on the mounting surface and located in the heat dissipation space. The mainboard is provided with a power supply interface and a conductive wire. The conductive wire connects the heat dissipation component and the power supply interface. The heat dissipation device provided by the present disclosure forms a heat dissipation space by using the mainboard and the bracket, and sets the heat source and the heat dissipation component in the heat dissipation space, without occupying additional space of the electronic device, thereby improving the space utilization. At the same time, since the heat dissipation component and the heat source are both located in the heat dissipation space, the distance between them is short, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] With the increasing charging power, screen resolution, and workload of smartphones and other electronic devices, manufacturers are paying more and more attention to device heat dissipation, and consumers are using the level of heat dissipation as one of the criteria for purchasing decisions. Currently, taking smartphones as an example, the heat dissipation device is usually located on the outside of the back cover, requiring a considerable amount of additional space. At the same time, because heat sources such as chips are separated from the heat dissipation device by the back cover, the heat dissipation effect of the device is relatively poor. Utility Model Content

[0003] This disclosure provides a heat dissipation device and electronic device to solve related technical problems.

[0004] This disclosure provides a heat dissipation device for use in electronic devices, including: a heat source, a motherboard, a bracket, and a heat dissipation component; the motherboard includes a mounting surface, the bracket is assembled to the mounting surface and surrounds the motherboard to form a heat dissipation space, the heat source and the heat dissipation component are mounted on the mounting surface and located within the heat dissipation space; the motherboard is provided with a power interface and a conductive wire; the conductive wire connects the heat dissipation component and the power interface.

[0005] Furthermore, the conductive wire is attached to the motherboard.

[0006] Furthermore, the number of heat dissipation components is set to multiple, and the multiple heat dissipation components are arranged around the heat source.

[0007] Furthermore, the bracket is provided with a vent that connects to the heat dissipation space; the heat dissipation assembly includes a vibrating element and an air-cooling fin, one side of the vibrating element is fixed to the motherboard and electrically connected to the conductive wire, and the air-cooling fin is fixed to the side of the vibrating element away from the motherboard.

[0008] Furthermore, the air-cooled plate includes a fixed part and an extension part, the fixed part is fixed to the vibrating member, and the extension part extends from the fixed part to be disposed opposite to the heat source.

[0009] Furthermore, in the extending direction away from the extension portion, the fixing portion does not extend beyond the vibrating member.

[0010] Furthermore, the ventilation opening includes a first ventilation opening and a second ventilation opening; the axis of the first ventilation opening is perpendicular to the mounting surface, and the axis of the second ventilation opening is parallel to the mounting surface.

[0011] Furthermore, the bracket includes a top plate and a pair of side plates, the top plate being disposed opposite to the heat source, and the pair of side plates being disposed opposite to each other; the pair of side plates extending from the top plate to the main plate; a first vent being disposed on the top plate; and a pair of second vents being disposed on the pair of side plates respectively.

[0012] Furthermore, the vibrating element is made of piezoelectric ceramic.

[0013] Furthermore, it also includes a processing module and a temperature detection module, wherein the temperature detection module is used to detect the temperature of the electronic device; both the temperature detection module and the heat dissipation component are electrically connected to the processing module and are used to adjust the power of the heat dissipation component according to the temperature of the electronic device.

[0014] An electronic device includes the aforementioned heat dissipation device.

[0015] The heat dissipation device disclosed herein utilizes the motherboard and bracket to form a heat dissipation space, and places the heat source and heat dissipation components within the heat dissipation space, without occupying additional space in the electronic device, thus improving space utilization. At the same time, since both the heat dissipation components and the heat source are located within the heat dissipation space, their proximity enhances the heat dissipation effect.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0018] Figure 1 This is one of the structural schematic diagrams of a heat dissipation device in an exemplary embodiment of this disclosure;

[0019] Figure 2 This is a second schematic diagram of the structure of a heat dissipation device in an exemplary embodiment of this disclosure;

[0020] Figure 3 yes Figure 2 A schematic diagram of the structure of the heat dissipation device with the air-cooled fins removed;

[0021] Figure 4 yes Figure 1 Schematic diagram of the mid-support structure;

[0022] Figure 5 This is a connection block diagram of a heat dissipation device according to an exemplary embodiment of the present disclosure;

[0023] Figure 6This is a flowchart of a control method for a heat dissipation device according to an exemplary embodiment of the present disclosure;

[0024] Figure 7 This is a structural diagram of an electronic device according to an exemplary embodiment of the present disclosure.

[0025] Reference numerals: Heat dissipation device-1; Heat source-10; Main board-20; Mounting surface-200; Power interface-21; Conductive wire-22; Bracket-30; Heat dissipation space-300; Ventilation vent-301; First ventilation vent-3011; Second ventilation vent-3012; Top plate-31; Side plate-32; Heat dissipation assembly-40; Vibration component-41; Air-cooled fin-42; Fixing part-421; Extension part-422; Processing module-50; Temperature detection module-60; Electronic equipment-70; Back panel-71; First external ventilation vent-711; Side panel-72; Second external ventilation vent-721. Detailed Implementation

[0026] The technical solutions in the embodiments (or "implementations") of this disclosure will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0027] If this disclosure uses terms relating to directional indications or positional relationships (e.g., up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, terms such as "first" and "second" in this disclosure are used only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0028] Currently, taking smartphones as an example, heat dissipation devices are usually located outside the back cover, requiring a significant amount of additional space. Furthermore, because heat sources such as chips are separated from the heat dissipation device by the back cover, the heat dissipation effect of the device is poor. This disclosure provides a heat dissipation device 1 and an electronic device to solve these related technical problems.

[0029] like Figure 1 As shown, this application provides a heat dissipation device 1, applied to electronic devices. The heat dissipation device 1 includes a heat source 10, a motherboard 20, a bracket 30, and a heat dissipation assembly 40. The motherboard 20 includes a mounting surface 200, and the bracket 30 is assembled to the mounting surface 200 and surrounds the motherboard 20 to form a heat dissipation space 300. The heat source 10 and the heat dissipation assembly 40 are mounted on the mounting surface 200 and located within the heat dissipation space 300. Please refer to the accompanying documentation. Figure 2 As shown, the motherboard 20 is equipped with a power interface 21 and a conductive wire 22. The conductive wire 22 connects the heat dissipation component 40 and the power interface 21.

[0030] The heat dissipation device 1 provided in this disclosure utilizes the motherboard 20 and the bracket 30 to form a heat dissipation space 300, and places the heat source 10 and the heat dissipation component 40 within the heat dissipation space 300, without occupying additional space in the electronic device, thus improving space utilization. At the same time, since the heat dissipation component 40 and the heat source 10 are both located within the heat dissipation space 300, their close proximity improves the heat dissipation effect.

[0031] Specifically, the bracket 30 can be a backplate structure of an electronic device, or it can be a structural component between the motherboard 20 and the backplate of the electronic device. The specific type of bracket 30 is not limited, as long as it can form a heat dissipation space 300 with the motherboard 20.

[0032] Please refer to the following: Figure 3 As shown, in one embodiment, the conductive line 22 can be attached to the motherboard 20. This arrangement further reduces the space occupied by the heat dissipation device 1 and improves space utilization. The specific structure of the conductive line 22 is not limited; for example, the conductive line 22 can be a copper plate trace structure integrated into the motherboard 20.

[0033] Please refer to the following: Figure 4 As shown, in one embodiment, the bracket 30 is provided with a vent 301. The vent 301 communicates with the heat dissipation space 300. The heat dissipation assembly 40 includes a vibrating element 41 and an air-cooling fin 42. One side of the vibrating element 41 is fixed to the motherboard 20 and electrically connected to the conductive wire 22. The air-cooling fin 42 is fixed to the side of the vibrating element 41 opposite to the motherboard 20.

[0034] The vibration of the vibrating element 41 causes the air-cooling fin 42 to vibrate, generating airflow to dissipate heat from the heat source, and airflow exchange is achieved through the vent 301. The heat dissipation assembly 40 is an air-cooled structure, which can maintain the dryness inside the heat dissipation space 300 while cooling. In other embodiments, the specific type of heat dissipation assembly is not limited.

[0035] In one embodiment, the vent 301 includes a first vent 3011 and a second vent 3012. The axis of the first vent 3011 is perpendicular to the mounting surface 200. The axis of the second vent 3012 is parallel to the mounting surface 200. By providing vents 301 in multiple directions, the heat dissipation space 300 can exchange airflow from multiple directions, improving the heat dissipation effect on the heat source 10. In other embodiments, the specific structure of the vent 301 is not limited.

[0036] In one embodiment, the bracket 30 includes a top plate 31 and a pair of side plates 32. The top plate 31 is disposed opposite to the heat source 10, and the pair of side plates 32 are disposed opposite to each other. The pair of side plates 32 extend from the top plate 31 to the main plate 20. A first vent 3011 is disposed on the top plate 31. A pair of second vents 3012 are provided, with each pair of second vents 3012 disposed on one pair of side plates 32. The heat dissipation space 300 is capable of airflow exchange from three directions of the heat source 10, i.e. Figure 1 The X, Y1, and Y2 directions shown further improve the heat dissipation effect on heat source 10.

[0037] In this embodiment, the first vent 3011 serves as an air inlet, and the two second vents 3012 serve as air outlets. In other embodiments, the first vent 3011 and the second vent 3012 are not limited to serving as air inlets or outlets, and the air flow direction can be changed by adjusting the installation position of the vibrating element 41 and the air-cooling fin 42.

[0038] In one embodiment, the air-cooled fin 42 includes a fixing portion 421 and an extension portion 422. The fixing portion 421 is fixed to the vibrating member 41. The extension portion 422 extends from the fixing portion 421 and is disposed opposite to the heat source 10. Since the extension portion 422 is disposed opposite to the heat source 10, when the extension portion 422 vibrates under the drive of the vibrating member 41, the airflow generated by the extension portion 422 flows directly to the heat source 10, thereby further improving the heat dissipation effect of the heat source.

[0039] In one embodiment, the fixing portion 421 does not extend beyond the vibrating member 41 in the extending direction opposite to the extension portion 422. This arrangement reduces the volume occupied by the air-cooling fin 42, further improving the overall space utilization of the heat dissipation device 1. In other embodiments, the specific structure of the air-cooling fin 42 is not limited.

[0040] In one embodiment, the vibrating element 41 may be made of piezoelectric ceramic. Using piezoelectric ceramic for vibration eliminates the need for a complex mechanical structure, reducing the size of the vibrating element 41 and further optimizing the space utilization of the heat dissipation device 1. In other embodiments, the specific structure and material of the vibrating element 41 are not limited.

[0041] In one embodiment, multiple heat dissipation components 40 are arranged around the heat source 10. By arranging the heat dissipation components 40 around the heat source 10, heat dissipation can be achieved from all sides of the heat source 10, thereby improving the heat dissipation efficiency of the heat source 10. In other embodiments, the number and position of the heat dissipation components 40 are not limited.

[0042] In one embodiment, please refer to the following: Figure 5As shown, the heat dissipation device 1 also includes a processing module 50 and a temperature detection module 60. The temperature detection module 60 is used to detect the temperature of the electronic device. Both the temperature detection module 60 and the heat dissipation component 40 are electrically connected to the processing module 50 and are used to adjust the power of the heat dissipation component 40 according to the temperature of the electronic device. The heat dissipation component 40 can adjust its power according to the temperature of the electronic device to save energy consumption of the heat dissipation device 1 and improve the battery life of the electronic device.

[0043] Specifically, the temperature detection module 60 can be used to detect the housing of electronic devices. For example... Figure 6 As shown, when the casing temperature of the electronic device is less than 39°C, the heat dissipation component 40 remains in the off state. When the casing temperature of the electronic device is greater than or equal to 39°C but less than 41°C, the heat dissipation component 40 starts to work, and the vibrating element 41 drives the air-cooling fin 42 to vibrate, causing airflow movement, and the airflow reaches 1 / 2 of the upper limit of the flow rate. If the casing temperature of the electronic device is greater than or equal to 41°C, the airflow reaches the upper limit of the flow rate to enhance the heat dissipation effect.

[0044] This disclosure also provides an electronic device, including the aforementioned heat dissipation device 1. Because the heat dissipation device 1 has good space utilization and heat dissipation efficiency, the electronic device of this application has good structural compactness and performance stability.

[0045] like Figure 7 As shown, the electronic device 70 includes a back panel 71 and a side panel 72. The back panel 71 is provided with a first external vent 711, and the side panel 72 is provided with a second external vent 721. Taking a smartphone as an example, the first external vent 711 can be provided on the back cover of the phone or on the decorative part of the phone's camera; the specific location is not limited. The first external vent 711 is used to communicate with the first vent 3011. The second external vent 721 is used to communicate with the second vent 3012.

[0046] It should be noted that the technical solutions or features described in the above embodiments can be combined or complemented by each other without conflict. The scope of protection of this disclosure is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A heat dissipation device, characterized in that, Used in electronic devices, including: heat sources, motherboards, brackets, and heat dissipation components; The motherboard includes a mounting surface, the bracket is assembled to the mounting surface and surrounds the motherboard to form a heat dissipation space, and the heat source and the heat dissipation component are mounted on the mounting surface and located within the heat dissipation space; The motherboard is provided with a power interface and conductive wires; the conductive wires connect the heat dissipation component and the power interface.

2. The heat dissipation device according to claim 1, characterized in that, The conductive wire is attached to the motherboard.

3. The heat dissipation device according to claim 1, characterized in that, The number of heat dissipation components is set to multiple, and the multiple heat dissipation components are arranged around the heat source.

4. The heat dissipation device according to claim 1, characterized in that, The bracket is provided with a ventilation opening that connects to the heat dissipation space; The heat dissipation assembly includes a vibrating element and an air-cooling plate. One side of the vibrating element is fixed to the motherboard and electrically connected to the conductive wire. The air-cooling plate is fixed to the side of the vibrating element opposite to the motherboard.

5. The heat dissipation device according to claim 4, characterized in that, The air-cooled plate includes a fixed part and an extension part. The fixed part is fixed to the vibrating member, and the extension part extends from the fixed part to be disposed opposite to the heat source.

6. The heat dissipation device according to claim 5, characterized in that, In the extending direction away from the extension portion, the fixing portion does not extend beyond the vibrating member.

7. The heat dissipation device according to claim 4, characterized in that, The ventilation opening includes a first ventilation opening and a second ventilation opening; the axis of the first ventilation opening is perpendicular to the mounting surface, and the axis of the second ventilation opening is parallel to the mounting surface.

8. The heat dissipation device according to claim 7, characterized in that, The support includes a top plate and a pair of side plates, the top plate being disposed opposite to the heat source and the pair of side plates being disposed opposite to each other; The pair of side panels extend from the top plate to the main plate; the first vent is disposed on the top plate; the number of the second vents is set to a pair, and the pair of second vents are respectively disposed on the pair of side panels.

9. The heat dissipation device according to claim 1, characterized in that, It also includes a processing module and a temperature detection module. The temperature detection module is used to detect the temperature of the electronic device. The temperature detection module and the heat dissipation component are both electrically connected to the processing module and are used to adjust the power of the heat dissipation component according to the temperature of the electronic device.

10. An electronic device, characterized in that, include: The heat dissipation device as described in any one of claims 1-9.

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