Circuit board assembly and electronic device

Abstract

This application discloses a circuit board assembly and an electronic device, belonging to the field of electronic devices. The circuit board assembly includes: a first circuit board, a first heat sink, and a plurality of first thermal pads. The first circuit board has a plurality of first heat-generating devices on the side facing the first heat sink. The first heat sink has a plurality of shielding frames on the side facing the first circuit board. The plurality of shielding frames correspond to the plurality of first heat-generating devices, and the first heat-generating devices are located within the shielding space enclosed by the corresponding shielding frames. The plurality of first thermal pads are distributed correspondingly to the plurality of shielding frames, and the first thermal pads are located within the shielding space enclosed by the corresponding shielding frames. One side of the first thermal pad is attached to the first heat sink, and the other side is attached to the first heat-generating device within the shielding space. Since the shielding structure is the shielding frame, the first thermal pads can be directly located between the first heat sink and the first heat-generating devices, reducing the thermal resistance of heat transfer between the first heat-generating devices and the first heat sink.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a circuit board assembly and an electronic device. Background Technology

[0002] Circuit boards are the core carriers that support and fix electronic components, and realize the electrical connection between components through printed circuits, thus forming a specific circuit function. Circuit boards usually have some heat-generating devices that require magnetic shielding and heat dissipation.

[0003] In related technologies, a shielding cover is provided at the heat-generating device on the circuit board that requires shielding and heat dissipation treatment. Heat-conducting structures are provided on the inner and outer sides of the shielding cover, thereby achieving shielding and heat dissipation of the heat-generating device at that location.

[0004] However, this structure has a large thermal resistance during heat conduction, resulting in poor heat dissipation. Utility Model Content

[0005] This application provides a circuit board assembly and an electronic device. It solves the problem of poor heat dissipation of heat-generating devices on circuit boards in the prior art. The technical solution is as follows:

[0006] In a first aspect, a circuit board assembly is provided, comprising: a first circuit board, a first heat sink, and a plurality of first thermal pads;

[0007] The first circuit board has a plurality of first heat-generating devices on the side facing the first heat sink;

[0008] The first heat sink has multiple shielding frames on the side facing the first circuit board; the multiple shielding frames correspond to the multiple first heating devices, and the first heating devices are located within the shielding space enclosed by the corresponding shielding frames;

[0009] The plurality of first thermal pads are distributed correspondingly to the plurality of shielding frames. The first thermal pad is located within the shielding space enclosed by the corresponding shielding frame, and one side of the first thermal pad is attached to the first heat sink, and the other side is attached to the first heat-generating device within the shielding space.

[0010] The shielding space enclosed by the shielding frame can shield the first heat-generating device within the frame. A first thermally conductive pad located within this shielding space, and in contact with both the first heat sink and the first heat-generating device, allows heat to be conducted from the first heat-generating device to the first heat sink, which then dissipates the heat, reducing the temperature of the heat-generating device. Furthermore, since the shielding structure is the shielding frame, the first thermally conductive pad can be directly positioned between the first heat sink and the first heat-generating device, allowing heat from the device to be directly transferred to the heat sink. This reduces the thermal resistance between the heat-generating device and the heat sink, improving heat dissipation and efficiency.

[0011] In some possible implementations, the first heat sink has a plurality of protrusions on the side facing the first circuit board; the plurality of protrusions are distributed corresponding to the plurality of shielding frames, and the protrusions are located within the shielding space enclosed by the corresponding shielding frames;

[0012] Within the shielded space, one side of the first thermal pad is attached to the convex bulge, and the other side is attached to the first heating device.

[0013] Because the first heat sink has a protrusion on the side facing the first circuit board, and this protrusion is located within the shielding space enclosed by the corresponding shielding frame, the size of the first thermal pad that can be placed in the direction perpendicular to the first circuit board can be reduced by the protrusion, which means the thickness of the first thermal pad can be reduced. When the thickness of the first thermal pad is reduced, its thermal resistance decreases, and the heat on the first heat-generating device can be transferred to the protrusion side at a faster speed, and then transferred to the first heat sink through the protrusion, thereby achieving a better heat dissipation effect.

[0014] In some possible implementations, the shielding frame has a conductive adhesive layer on the side facing the first circuit board; the conductive adhesive layer is distributed around the shielding frame;

[0015] In the direction perpendicular to the first circuit board, one side of the conductive adhesive layer is connected to the shielding frame, and the other side is connected to the first circuit board.

[0016] By having a conductive adhesive layer on the side of the shielding frame facing the first circuit board, and having one side of the conductive adhesive layer connected to the shielding frame and the other side connected to the first circuit board in a direction perpendicular to the first circuit board, the shielding frame and the conductive adhesive layer are in close contact, and the conductive adhesive layer and the first circuit board are in close contact. This increases the airtightness of the shielding space enclosed by the shielding frame, thereby improving the shielding effect.

[0017] In some possible implementations, the circuit board assembly further includes a fan; the fan is fixed to the side of the first heat sink away from the first circuit board.

[0018] By fixing a fan to the side of the first heat sink away from the first circuit board, the heat on the first heat sink can be actively dissipated, improving heat dissipation efficiency and effect, and thus also improving the heat dissipation efficiency and effect on the first circuit board.

[0019] In some possible implementations, the first heat sink has an assembly area on the side opposite to the first circuit board, and an air duct area distributed around the assembly area;

[0020] The fan is installed in the assembly area; the air duct area has multiple fins, which are distributed around the fan.

[0021] An airflow channel is provided between two adjacent fins distributed circumferentially in the fan.

[0022] Multiple fins increase the heat dissipation area of ​​the first heat sink, thereby improving its heat dissipation effect. Furthermore, an airflow channel exists between two adjacent fins distributed circumferentially around the fan, allowing the airflow generated by the fan to be quickly exhausted, thus ensuring effective heat dissipation.

[0023] In some possible implementations, at least some of the plurality of fins are arc-shaped fins.

[0024] By having at least some of the fins extend in an arc shape, the direction of the airflow channel formed between two adjacent fins in the circumferential direction of the fan is consistent with or similar to the direction of the air blown out by the fan. This reduces the wind resistance in the airflow channel, increases the air volume, and thus improves the heat dissipation effect.

[0025] In some possible implementations, the plurality of fins includes a plurality of first fins and a plurality of second fins; the first fins are arc-shaped fins curved in a counterclockwise direction, and the second fins are arc-shaped fins curved in a clockwise direction; the airflow channel located between two adjacent first fins is a first airflow channel, and the airflow channel located between two adjacent second fins is a second airflow channel;

[0026] Wherein, at least a portion of the first airflow channel is away from the air outlet of the fan, and at least a portion of the second airflow channel is away from the air outlet of the fan, both facing the same side of the first heat sink.

[0027] By using multiple first fins that bend counterclockwise and multiple second fins that bend clockwise, at least a portion of the first airflow channel between two first fins is positioned away from the fan's outlet, and at least a portion of the second airflow channel between two second fins, with its outlet facing away from the fan, is positioned towards the same side of the first heat sink. When at least a portion of the first airflow channel is positioned away from the fan's outlet, and at least a portion of the second airflow channel is positioned away from the fan's outlet, with its outlet facing away from the fan, directional airflow can be achieved. This means that the outlets of both the first and second airflow channels can direct airflow towards the same area of ​​the first heat sink. This facilitates efficient use of space in the circuit board assembly and makes the circuit board assembly design easier.

[0028] In some possible implementations, the first heat sink has a first side and a second side that are relatively distributed in a first direction, and a third side and a fourth side that are relatively distributed in a second direction; the first direction is perpendicular to the second direction and both are parallel to the first circuit board.

[0029] At least a portion of the plurality of first fins are distributed in the region of the assembly area facing the third side, and at least a portion of the plurality of second fins are distributed in the region of the assembly area facing the fourth side.

[0030] Among them, a portion of the first airflow channels are away from the air outlet of the fan and face the first side, while another portion of the first airflow channels are away from the air outlet of the fan and face the third side; a portion of the second airflow channels are away from the air outlet of the fan and face the first side, while another portion of the second airflow channels are away from the air outlet of the fan and face the fourth side.

[0031] Since the first heat sink has air outlets on the first, second, and third sides, the heat sink can dissipate heat from the first, second, and third sides, thus ensuring the heat dissipation effect.

[0032] Furthermore, since the first fin is an arc-shaped fin that bends counterclockwise, even if some of the first airflow channels corresponding to the multiple first fins are away from the fan's outlet and face the third side, the airflow blown from the outlet of the first airflow channel on the third side will still tend to flow towards the first side. Similarly, since the second fin is an arc-shaped fin that bends clockwise, even if some of the second airflow channels corresponding to the multiple second fins are away from the fan's outlet and face the fourth side, the airflow blown from the outlet of the first airflow channel on the fourth side will still tend to flow towards the first side.

[0033] Therefore, the air outlets of the airflow channels on the first, second, and third sides of the first heat sink can ultimately blow air towards the first side of the first heat sink, which facilitates the rational use of space in the circuit board assembly and makes the design of the circuit board assembly easier.

[0034] In some possible implementations, the plurality of fins further includes a plurality of third fins distributed in the assembly area facing the second side, and the airflow channel between two adjacent third fins is a third airflow channel; the air outlet end of the third airflow channel away from the fan faces the second side;

[0035] The air outlet of the third airflow channel is used to blow air onto the auxiliary circuit board, which is distributed close to the second side in the first direction.

[0036] Through multiple third fins and multiple third airflow channels corresponding to the multiple third fins, air can be blown towards the auxiliary circuit board distributed close to the second side in the first direction. In this way, the auxiliary circuit board can be cooled, and the utilization rate of the air blown out by the fan can be improved.

[0037] In some possible implementations, the circuit board assembly further includes: a second circuit board, a second heat sink, and a third heat sink;

[0038] The second circuit board is located on the side of the first circuit board that is away from the first heat sink.

[0039] The second heat sink is fixed between the first circuit board and the second circuit board;

[0040] The third heat sink is fixed to the side of the second circuit board away from the first circuit board.

[0041] This application uses a first circuit board and a second circuit board stacked together, with a first heat sink on the side of the first circuit board away from the second circuit board, a second heat sink between the first and second circuit boards, and a third heat sink on the side of the second circuit board away from the first circuit board. This solves both the fixing problem between the parts in the circuit board assembly and the heat dissipation problem, and also has high reliability.

[0042] In addition, a fan is provided on the side of the first heat sink away from the first circuit board. The fan can accelerate heat dissipation and thus improve the heat dissipation effect of the circuit board assembly.

[0043] In a second aspect, an electronic device is provided, comprising: a bracket, and a circuit board assembly as described in any of the above;

[0044] The bracket has a first mounting cavity inside, and the circuit board assembly is fixed inside the first mounting cavity.

[0045] In some possible implementations, the bracket has a first plate and a first mounting opening disposed opposite each other in a third direction, the first mounting opening communicating with a first mounting cavity, the circuit board assembly being mounted in the first mounting cavity through the first mounting opening, and the first heat sink in the circuit board assembly being fixedly connected to the first plate.

[0046] The third party is perpendicular to the first circuit board in the circuit board assembly.

[0047] The bracket can both support the circuit board assembly and allow for connection and fixation with the circuit board assembly.

[0048] In some possible implementations, the circuit board assembly further includes a fan; the fan is fixed to the side of the first heat sink opposite to the first circuit board;

[0049] The first plate has a vent that communicates with the first mounting cavity, and the air intake side of the fan faces the vent.

[0050] By fixing a fan to the side of the first heat sink away from the first circuit board, the heat on the first heat sink can be actively dissipated, and the heat inside the circuit board assembly can be quickly carried out, thereby improving the heat dissipation efficiency and effect of the circuit board assembly.

[0051] In some possible implementations, the electronic device further includes: a housing; the bracket is fixed inside the housing, and the bottom of the housing has an air inlet;

[0052] The first plate has an air duct on the side opposite to the circuit board assembly that communicates with the vent; one end of the air duct in a first direction communicates with the vent, and the other end of the air duct in the first direction faces the bottom of the housing to communicate with the air inlet.

[0053] The dimension of the end of the air duct that connects to the vent is smaller than the dimension of the end of the air duct that faces the bottom of the housing.

[0054] By opening an air inlet at the bottom of the casing of an electronic device, the air inlet is located in a position that is not easily noticed or seen, which helps to ensure the integrity and aesthetics of the electronic device's appearance.

[0055] The first board has an air duct connected to a vent on the side opposite to the circuit board assembly. One end of the air duct in a first direction is connected to the vent, and the other end of the air duct in the first direction faces the bottom of the housing to connect to the air inlet. The air duct guides the airflow towards the vent, allowing the external airflow to flow quickly and concentratedly towards the fan's air inlet side under the action of the fan, thereby ensuring the fan's heat dissipation effect.

[0056] In some possible implementations, the bracket further has a second mounting cavity; the electronic device also includes: a functional component fixed within the second mounting cavity;

[0057] The first mounting cavity and the second mounting cavity are connected in a first direction; the first heat sink has a first side and a second side that are relatively distributed in the first direction, and the first side is closer to the second mounting cavity than the second side.

[0058] The airflow generated by the fan passes through at least the first side outlet to blow air into the second mounting cavity.

[0059] By blowing airflow generated by the fan into the second mounting cavity through at least the first side outlet, heat on the circuit board assembly in the first mounting cavity can be quickly transferred and reduced, thereby reducing the heat on the circuit board assembly.

[0060] In some possible implementations, the bracket has a second plate disposed toward the second side in the first direction; in the first direction, the second plate is located on the side of the first mounting cavity opposite to the second mounting cavity; and the electronic device further includes: an auxiliary circuit board fixed to the side of the second plate opposite to the first mounting cavity;

[0061] The second plate has an auxiliary air vent that communicates with the first mounting cavity; the airflow generated by the fan also passes through the second side air outlet to blow air onto the auxiliary circuit board through the auxiliary air vent.

[0062] The airflow generated by the fan also passes through the second side air outlet and blows air onto the auxiliary circuit board through the auxiliary air vent. This not only dissipates heat from the auxiliary circuit board but also improves the utilization rate of the air blown out by the fan.

[0063] In some possible implementations, the first heat sink has a third side and a fourth side that are relatively distributed in the second direction;

[0064] The electronic device further includes: an interface assembly fixed to the circuit board assembly; the interface assembly is located near the fourth side;

[0065] The airflow generated by the fan is also directed to the interface assembly via the fourth side air outlet.

[0066] The airflow generated by the fan is also vented through the fourth side to blow air onto the interface components, which can both dissipate heat from the interface components and improve the utilization rate of the air blown out by the fan. Attached Figure Description

[0067] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0068] Figure 1 This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application;

[0069] Figure 2 yes Figure 1 A schematic diagram of the circuit board assembly from another perspective;

[0070] Figure 3 This is a schematic diagram of the structure of a first heat sink provided in an embodiment of this application;

[0071] Figure 4 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0072] Figure 5 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0073] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0074] Figure 7 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0075] Figure 8 This is a schematic diagram of the structure of a shell provided in an embodiment of this application;

[0076] Figure 9 This is a schematic diagram of the structure of another electronic device provided in the embodiments of this application. Detailed Implementation

[0077] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0078] In related technologies, a shielding cover is usually provided at the first heat-generating device on the circuit board that requires shielding and heat dissipation treatment. Heat-conducting structures are respectively provided on the inner and outer sides of the shielding cover, so as to achieve shielding and heat dissipation of the first heat-generating device at that location.

[0079] The example of a radio frequency printed circuit board (RF board) illustrates the problems of the first heat-generating device that requires shielding and heat dissipation in related technologies.

[0080] In an RF board, a shielding cover is placed outside the first heat-generating device requiring shielding and heat dissipation. A first thermal pad is placed inside the shielding cover, with both the inner and outer thermal pads in contact with the first heat-generating device and the inner wall of the shielding cover. Conversely, a first thermal pad is placed outside the shielding cover, in contact with the outer wall of the shielding cover. This means that heat from the first heat-generating device must pass through three layers—the inner thermal pad, the shielding cover, and the outer thermal pad—resulting in significant thermal resistance, affecting heat dissipation efficiency, and consequently impacting the normal operation or lifespan of the first heat-generating device.

[0081] Based on this, this application provides a circuit board assembly and an electronic device containing the circuit board assembly, which can shield the first heat-generating device while improving the heat dissipation effect of the first heat-generating device.

[0082] Figure 1 This is a schematic diagram of a circuit board assembly provided in an embodiment of this application. Please refer to it. Figure 1 In one embodiment of this application, a circuit board assembly 000 is provided, including: a first circuit board 010, a first heat sink 020 and a plurality of first thermal pads 030.

[0083] The first circuit board 010 has a plurality of first heat-generating devices 011 on the side facing the first heat sink 020.

[0084] The first heat sink 020 has multiple shielding frames 021 on the side facing the first circuit board 010. The multiple shielding frames 021 correspond to multiple first heat-generating devices 011, and the first heat-generating devices 011 are located within the shielding space enclosed by the corresponding shielding frames 021.

[0085] Multiple first thermal pads 030 are distributed correspondingly to multiple shielding frames 021. The first thermal pads 030 are located within the shielding space enclosed by the corresponding shielding frames 021, and one side of the first thermal pads 030 is attached to the first heat sink 020, and the other side is attached to the first heat-generating device 011 in the shielding space.

[0086] The first heating element 011 and the first thermal pad 030 can be referenced. Figure 2 , Figure 2 yes Figure 1 A schematic diagram of the circuit board assembly from another perspective.

[0087] It should be noted that the multiple shielding frames 021 and the multiple first heating elements 011 can have a one-to-one correspondence or a one-to-many relationship. Similarly, the multiple shielding frames 021 and the multiple first thermal pads 030 can have a one-to-one correspondence or a one-to-many relationship. Furthermore, the multiple first heating elements 011 and the multiple first thermal pads 030 can have a one-to-one correspondence, a one-to-many relationship, or a many-to-one relationship.

[0088] For example, in the embodiments of this application, the shielding frame 021, the first heating device 011 and the first thermal pad 030 are in a one-to-one correspondence.

[0089] It is understood that the shielding frame 021 is set up to provide electromagnetic shielding for the first heating device 011 inside the shielding frame 021. Therefore, the material of the shielding frame 021 is a material that can provide shielding and conduct electricity. For example, the material of the shielding frame 021 is a metal material that can provide shielding and conduct electricity, such as copper, aluminum, steel, nickel, etc.

[0090] In summary, the shielding space enclosed by the shielding frame can shield the first heat-generating device within the frame. A first thermally conductive pad located within this shielding space, and which is in contact with both the first heat sink and the first heat-generating device, allows heat to be conducted from the first heat-generating device to the first heat sink, which then dissipates the heat, reducing the temperature of the heat-generating device. Furthermore, since the shielding structure is the shielding frame, the first thermally conductive pad can be directly positioned between the first heat sink and the first heat-generating device, allowing heat from the device to be directly transferred to the heat sink. This reduces the thermal resistance between the heat-generating device and the heat sink, improving heat dissipation and efficiency.

[0091] Figure 3 This is a schematic diagram of the structure of a first heat sink provided in an embodiment of this application. Please refer to it. Figure 3 In some possible implementations, the first heat sink 020 has a plurality of protrusions 022 on the side facing the first circuit board 010. The plurality of protrusions 022 are distributed correspondingly to the plurality of shielding frames 021, and the protrusions 022 are located within the shielding space enclosed by the corresponding shielding frames 021.

[0092] Within the shielded space, one side of the first thermal pad 030 is attached to the convex bulge 022, and the other side is attached to the first heating device 011.

[0093] For example, the convex hull 022 can be distributed in a one-to-one correspondence with the shielding frame 021. And the convex hull 022 and the first heat sink 020 are an integral structure.

[0094] Since the first heat sink 020 has a protrusion 022 on the side facing the first circuit board 010, and the protrusion 022 is located within the shielding space enclosed by the corresponding shielding frame 021, the size of the first thermal pad 030 that can be placed in the direction perpendicular to the first circuit board 010 can be reduced by the protrusion 022, that is, the thickness of the first thermal pad 030 can be reduced. When the thickness of the first thermal pad 030 is reduced, the thermal resistance of the first thermal pad 030 is reduced, and the heat on the first heat-generating device 011 can be transferred to the protrusion 022 side at a faster speed, and then transferred to the first heat sink 020 through the protrusion 022, thereby achieving a better heat dissipation effect.

[0095] Please refer to Figure 3 In some possible implementations, the shielding frame 021 has a conductive adhesive layer 023 on the side facing the first circuit board 010. The conductive adhesive layer 023 is distributed around the shielding frame 021.

[0096] In the direction perpendicular to the first circuit board 010, one side of the conductive adhesive layer 023 is connected to the shielding frame 021, and the other side is connected to the first circuit board 010.

[0097] The shielding frame 021 resembles a metal rib. Located on the side away from the first heat sink 020, i.e., the side closest to the first circuit board 010, it's difficult to achieve a tight contact with the first circuit board 010. There will inevitably be some gaps between the shielding frame 021 and the first circuit board 010. The presence of these gaps will affect the shielding effect of the shielding frame 021.

[0098] By having a conductive adhesive layer 023 on the side of the shielding frame 021 facing the first circuit board 010, and having one side of the conductive adhesive layer 023 connected to the shielding frame 021 and the other side connected to the first circuit board 010 in a direction perpendicular to the first circuit board 010, the shielding frame 021 and the conductive adhesive layer 023 are in close contact, and the conductive adhesive layer 023 and the first circuit board 010 are in close contact. This increases the sealing of the shielding space enclosed by the shielding frame 021, thereby improving the shielding effect.

[0099] For example, the conductive adhesive layer 023 can contact the copper-clad area on the first circuit board 010 to achieve a conductive connection.

[0100] Please refer to Figure 2In some possible implementations, the circuit board assembly 000 further includes a fan 040. The fan 040 is fixed to the side of the first heat sink 020 away from the first circuit board 010.

[0101] By fixing a fan 040 to the side of the first heat sink 020 away from the first circuit board 010, the heat on the first heat sink 020 can be actively dissipated, improving the heat dissipation efficiency and effect, and thus also improving the heat dissipation efficiency and effect of the first circuit board 010.

[0102] Figure 4 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application. Please refer to it. Figure 2 and Figure 4 In some possible implementations, the first heat sink 020 has an assembly area Q1 on the side opposite to the first circuit board 010, and an air duct area Q2 distributed around the assembly area Q1.

[0103] Fan 040 is installed in assembly area Q1. Multiple fins 024 are located in air duct area Q2, and the multiple fins 024 are distributed around fan 040.

[0104] Among them, there is an airflow channel T between two adjacent fins 024 distributed in the circumferential direction of the fan 040.

[0105] Multiple fins 024 increase the heat dissipation area of ​​the first heat sink 020, thereby improving its heat dissipation effect. An airflow channel T is located between two adjacent fins 024 in the circumferential direction of the fan 040. This airflow channel T allows the airflow generated by the fan 040 to be quickly drawn out, ensuring the fan 040's heat dissipation performance.

[0106] Please refer to Figure 4 In some possible implementations, at least some of the fins 024 are arc-shaped fins 024.

[0107] For example, fan 040 is a centrifugal fan. At least a portion of the fins 024 near the fan 040 are arc-shaped fins 024. For example, the side of the fins 024 near the fan 040 is tangential to the direction of the airflow blown out from the exhaust side of the fan 040.

[0108] By having at least some of the fins 024 extend in an arc shape, the airflow channel T formed between two adjacent fins 024 distributed in the circumferential direction of the fan 040 can extend in the same or similar direction as the airflow blown out by the fan 040, thereby reducing the wind resistance in the airflow channel T, increasing the air volume, and thus improving the heat dissipation effect.

[0109] Please refer to Figure 4 In some possible implementations, the multiple fins 024 include multiple first fins 0241 and multiple second fins 0242. The first fins 0241 are arc-shaped fins 024 curved in a counter-clockwise direction, and the second fins 0242 are arc-shaped fins 024 curved in a clockwise direction. An airflow channel T located between two adjacent first fins 0241 is called a first airflow channel T1, and an airflow channel T located between two adjacent second fins 0242 is called a second airflow channel T2.

[0110] At least a portion of the first airflow channel T1 is away from the air outlet of the fan 040, and at least a portion of the second airflow channel T2 is away from the air outlet of the fan 040, both facing the same side of the first heat sink 020.

[0111] By using multiple first fins 0241 that bend counterclockwise and multiple second fins 0242 that bend clockwise, at least a portion of the first airflow channel T1 between two first fins 0241 is positioned away from the exhaust end of the fan 040, and at least a portion of the second airflow channel T2 between two second fins 0242 is positioned away from the exhaust end of the fan 040, both facing the same side of the first heat sink 020. When at least a portion of the first airflow channel T1 is positioned away from the exhaust end of the fan 040, and at least a portion of the second airflow channel T2 is positioned away from the exhaust end of the fan 040, both facing the same side of the first heat sink 020, directional airflow can be achieved. This means that the exhaust ends of the first airflow channel T1 and the second airflow channel T2 can both exhaust air towards the same area of ​​the first heat sink 020. This facilitates the efficient use of space in the circuit board assembly 000 and makes the design of the circuit board assembly 000 easier.

[0112] Please refer to Figure 4 In some possible implementations, the first heat sink 020 has a first side C1 and a second side C2 that are relatively distributed in a first direction, and a third side C3 and a fourth side C4 that are relatively distributed in a second direction. The first direction is perpendicular to the second direction and both are parallel to the first circuit board 010.

[0113] At least a portion of the first fins 0241 are distributed in the region of the assembly area Q1 facing the third side C3, and at least a portion of the second fins 0242 are distributed in the region of the assembly area Q1 facing the fourth side C4.

[0114] Among them, a portion of the multiple first airflow channels T1 have their outlet ends away from the fan 040 facing the first side C1, while another portion of the first airflow channels T1 have their outlet ends away from the fan 040 facing the third side C3. Similarly, a portion of the multiple second airflow channels T2 have their outlet ends away from the fan 040 facing the first side C1, while another portion of the second airflow channels T2 have their outlet ends away from the fan 040 facing the fourth side C4.

[0115] Since the first heat sink 020 has air outlets for airflow channels T on the first side C1, the second side C2, and the third side C3, the first heat sink 020 can dissipate air at the first side C1, the second side C2, and the third side C3, thereby dissipating heat and ensuring heat dissipation effect.

[0116] Furthermore, since the first fin 0241 is an arc-shaped fin 024 that bends counterclockwise, even if some of the first airflow channels T1 corresponding to the multiple first fins 0241 have their outlet ends facing away from the fan 040 and towards the third side C3, the air blown out from the outlet end of the first airflow channel T1 on the third side C3 will still tend to flow towards the first side C1. Similarly, since the second fin 0242 is an arc-shaped fin 024 that bends clockwise, even if some of the second airflow channels T2 corresponding to the multiple second fins 0242 have their outlet ends facing away from the fan 040 and towards the fourth side C4, the air blown out from the outlet end of the first airflow channel T1 on the fourth side C4 will still tend to flow towards the first side C1.

[0117] Therefore, the air outlet of the airflow channel T of the first side C1, the second side C2 and the third side C3 of the first heat sink 020 can ultimately blow air to the first side C1 of the first heat sink 020. This makes it easier for the circuit board assembly 000 to make reasonable use of space and makes it easier to design the circuit board assembly 000.

[0118] Please refer to Figure 4 In some possible implementations, the multiple fins 024 also include multiple third fins 0243, which are distributed in the assembly area Q1 facing the second side C2. The airflow channel T between two adjacent third fins 0243 is a third airflow channel T3. The outlet end of the third airflow channel T3 away from the fan 040 faces the second side C2.

[0119] The air outlet of the third airflow channel T3 is used to blow air onto the auxiliary circuit board, which is distributed close to the second side C2 in the first direction.

[0120] For example, the auxiliary circuit board can be a solid state drive printed circuit board (SSD board).

[0121] Through multiple third fins 0243 and multiple third airflow channels T3 corresponding to the multiple third fins 0243, air can be blown onto the auxiliary circuit board distributed close to the second side C2 in the first direction. In this way, the auxiliary circuit board can be cooled, and the utilization rate of the air blown out by the fan 040 can be improved.

[0122] Figure 5 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application. Please refer to it. Figure 5 In some possible implementations, the circuit board assembly 000 may also include: a second circuit board 050, a second heat sink 060, and a third heat sink 070.

[0123] The second circuit board 050 is located on the side of the first circuit board 010 that is away from the first heat sink 020.

[0124] The second heat sink 060 is fixed between the first circuit board 010 and the second circuit board 050.

[0125] The third heat sink 070 is fixed to the side of the second circuit board 050 away from the first circuit board 010.

[0126] Due to its diverse functions, the circuit board assembly 000 has a compact internal space. As its functions increase, so do the heat-generating components within it, leading to higher power consumption and temperatures. This can negatively impact the performance of the circuit board assembly 000 and other surrounding electrical components. Therefore, it is necessary to dissipate heat from these high-power components to prevent the performance of the circuit board assembly 000 and other surrounding electrical components from being affected by high temperatures.

[0127] This application uses a first circuit board 010 and a second circuit board 050 stacked together. A first heat sink 020 is provided on the side of the first circuit board 010 away from the second circuit board 050, a second heat sink 060 is provided between the first circuit board 010 and the second circuit board 050, and a third heat sink 070 is provided on the side of the second circuit board 050 away from the first circuit board 010. This can solve both the fixing problem between the parts in the circuit board assembly 000 and the heat dissipation problem, and also has high reliability.

[0128] In addition, a fan 040 is provided on the side of the first heat sink 020 away from the first circuit board 010. The fan 040 can accelerate heat dissipation and thus improve the heat dissipation effect of the circuit board assembly 000.

[0129] For example, the first circuit board 010 is a radio frequency printed circuit board (RF board) and the second circuit board 050 is a motherboard.

[0130] Please refer to Figure 5 In one possible implementation, the third heat sink 070 has multiple heat sinks 071 on the side opposite to the second circuit board 050. The multiple heat sinks 071 can increase the heat dissipation area of ​​the third heat sink 070, thereby improving the heat dissipation effect.

[0131] Furthermore, the outer surface of the heat sink 071 has a heat dissipation layer to increase the difference in thermal radiation coefficient between the inner and outer surfaces of the third heat sink 070, thereby accelerating heat conduction. For example, the heat dissipation layer is a nano-carbon coating.

[0132] In this case, a shielding cover 081 and a second thermal pad 082 can be provided between the inner surfaces of the second circuit board 050 and the third heat sink 070, thereby accelerating the heat conduction speed between the second circuit board 050 and the third heat sink 070.

[0133] In summary, the shielding space enclosed by the shielding frame can shield the first heat-generating device within the frame. A first thermally conductive pad located within this shielding space, and which is in contact with both the first heat sink and the first heat-generating device, allows heat to be conducted from the first heat-generating device to the first heat sink, which then dissipates the heat, reducing the temperature of the heat-generating device. Furthermore, since the shielding structure is the shielding frame, the first thermally conductive pad can be directly positioned between the first heat sink and the first heat-generating device, allowing heat from the device to be directly transferred to the heat sink. This reduces the thermal resistance between the heat-generating device and the heat sink, improving heat dissipation and efficiency.

[0134] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Please refer to it. Figure 6 In another embodiment of this application, an electronic device 100 is provided, including: a bracket 110, and a circuit board assembly 000 as described in any of the above embodiments.

[0135] The bracket 110 has a first mounting cavity Q3 inside, and the circuit board assembly 000 is fixed inside the first mounting cavity Q3.

[0136] For example, electronic device 100 can be an electronic product such as a router or computer host.

[0137] In some possible implementations, the bracket 110 has a first plate 111 and a first mounting opening K1 arranged opposite each other in a third direction. The first mounting opening K1 communicates with a first mounting cavity Q3. The circuit board assembly 000 is mounted in the first mounting cavity Q3 through the first mounting opening K1, that is, the first mounting cavity Q3 is located at the position of the first plate 111 and the first mounting opening K1. Furthermore, the first heat sink 020 in the circuit board assembly 000 is fixedly connected to the first plate 111.

[0138] Among them, the third party is perpendicular to the first circuit board 010 in the circuit board assembly 000.

[0139] The bracket 110 can both provide support for the circuit board assembly 000 and connect and fix it to the circuit board assembly 000.

[0140] Figure 7 This is a schematic diagram of another electronic device provided in an embodiment of this application. Please refer to it. Figure 5 and Figure 7 In some possible implementations, the circuit board assembly 000 further includes a fan 040. The fan 040 is fixed to the side of the first heat sink 020 away from the first circuit board 010, that is, the fan 040 is fixed to the side of the first heat sink 020 facing the first board body 111.

[0141] The first plate 111 has a vent K2 that communicates with the first mounting cavity Q3. The air inlet side of the fan 040 faces the vent K2, and the air outlet side of the fan 040 faces the space inside the first mounting cavity Q3 where the fan 040 is disposed.

[0142] By fixing a fan 040 to the side of the first heat sink 020 away from the first circuit board 010, the heat on the first heat sink 020 can be actively dissipated, and the heat inside the circuit board assembly 000 can be quickly carried out, thereby improving the heat dissipation efficiency and effect of the circuit board assembly 000.

[0143] Figure 8 This is a schematic diagram of the structure of a shell provided in an embodiment of this application. Please refer to it. Figures 7-8 In some possible implementations, the electronic device 100 also includes a housing 120. A bracket 110 is fixed inside the housing 120, and the bottom of the housing 120 has an air inlet K3.

[0144] The first plate 111 has an air duct D on the side opposite to the circuit board assembly 000, which communicates with the vent K2. One end of the air duct D in the first direction communicates with the vent K2, and the other end of the air duct D in the first direction faces the bottom of the housing 120 to communicate with the air inlet K3.

[0145] The dimension of the end of the air duct D that connects to the vent K2 is smaller than the dimension of the end of the air duct D that faces the bottom of the housing 120.

[0146] For example, in the first direction, the size of the air duct D continuously decreases from the air inlet K3 side to the air outlet K2 side.

[0147] By opening an air inlet K3 at the bottom of the housing 120 in the electronic device 100, the air inlet K3 is located in a position that is not easily noticed or seen, which helps to ensure the integrity and aesthetics of the appearance of the electronic device 100.

[0148] The first plate 111 has an air duct D on the side opposite to the circuit board assembly 000, which communicates with the vent K2. One end of the air duct D in a first direction is connected to the vent K2, and the other end of the air duct D in the first direction faces the bottom of the housing 120 to communicate with the air inlet K3. The air duct D guides the airflow towards the vent K2, so that the airflow from the outside can flow quickly and concentratedly to the air inlet side of the fan 040 under the action of the fan 040, thereby ensuring the heat dissipation effect of the fan 040.

[0149] Figure 9 This is a schematic diagram of the structure of another electronic device provided in the embodiments of this application. Please refer to it. Figures 8-9 In one possible implementation, the electronic device 100 further includes a front cover and a rear cover 130.

[0150] The outer casing 120 is an annular cylindrical interface. In the second direction, the outer casing 120 has a front opening on the front side and a rear opening on the outer rear side. The front cover plate is fixed to the outer casing 120 on the front opening side, and the rear cover plate 130 is fixed to the outer casing 120 on the rear opening side. An air outlet K4 is provided on the rear cover plate 130.

[0151] The bracket 110 and the circuit board assembly 000 are fixed inside the housing 120. A decorative film can also be fixed to the side of the front cover away from the rear cover 130.

[0152] Please refer to Figure 6 In some possible implementations, the bracket 110 also has a second mounting cavity Q4 inside. The electronic device 100 also includes a functional component 140 fixed within the second mounting cavity Q4.

[0153] The first mounting cavity Q3 and the second mounting cavity Q4 are connected in a first direction. The first heat sink 020 has a first side C1 and a second side C2 that are relatively distributed in the first direction, with the first side C1 being closer to the second mounting cavity Q4 than the second side C2.

[0154] The airflow generated by the fan 040 is at least discharged through the first side C1 to blow air into the second mounting cavity Q4.

[0155] For example, functional components 140 may include spaced-apart WIFI antennas, NFC antennas, etc. The air vent K4 on the rear cover 130 may be located near the second mounting cavity Q4.

[0156] By blowing the airflow generated by the fan 040 through at least the first side C1 into the second mounting cavity Q4, the heat on the circuit board assembly 000 at the first mounting cavity Q3 can be quickly transferred and reduced, thereby reducing the heat on the circuit board assembly 000.

[0157] Please refer to Figure 4 In some possible implementations, the multiple fins 024 include multiple first fins 0241 and multiple second fins 0242. The first fins 0241 are arc-shaped fins 024 curved in a counter-clockwise direction, and the second fins 0242 are arc-shaped fins 024 curved in a clockwise direction. An airflow channel T located between two adjacent first fins 0241 is called a first airflow channel T1, and an airflow channel T located between two adjacent second fins 0242 is called a second airflow channel T2.

[0158] The first heat sink 020 has a first side C1 and a second side C2 that are oppositely distributed in a first direction, and a third side C3 and a fourth side C4 that are oppositely distributed in a second direction. The first direction is perpendicular to the second direction and both are parallel to the first circuit board 010.

[0159] At least a portion of the first fins 0241 are distributed in the region of the assembly area Q1 facing the third side C3, and at least a portion of the second fins 0242 are distributed in the region of the assembly area Q1 facing the fourth side C4.

[0160] Among them, a portion of the multiple first airflow channels T1 have their outlet ends away from the fan 040 facing the first side C1, while another portion of the first airflow channels T1 have their outlet ends away from the fan 040 facing the third side C3. Similarly, a portion of the multiple second airflow channels T2 have their outlet ends away from the fan 040 facing the first side C1, while another portion of the second airflow channels T2 have their outlet ends away from the fan 040 facing the fourth side C4.

[0161] In this way, air can be vented from the first side C1, the second side C2, and the third side C3 where the first heat sink 020 is located, which facilitates the dissipation of heat from the first mounting cavity Q3 and ensures the heat dissipation effect. At the same time, the air blown out from the first side C1, the second side C2, and the third side C3 where the first heat sink 020 is located can also dissipate heat from surrounding components, such as the aforementioned functional component 140.

[0162] Please refer to Figure 6In some possible implementations, the bracket 110 has a second plate 112 disposed toward the second side C2 in a first direction. In the first direction, the second plate 112 is located on the side of the first mounting cavity Q3 opposite to the second mounting cavity Q4. The electronic device 100 also includes an auxiliary circuit board 150 fixed to the side of the second plate 112 opposite to the first mounting cavity Q3.

[0163] The second plate 112 has an auxiliary air vent K5 that communicates with the first mounting cavity Q3. The airflow generated by the fan 040 also exits through the second side C2, so as to blow air through the auxiliary air vent K5 to the auxiliary circuit board 150.

[0164] For example, auxiliary circuit board 150 is an SSD board.

[0165] The airflow generated by fan 040 also exits through the second side C2, and blows air through the auxiliary air vent K5 onto the auxiliary circuit board 150. This not only dissipates heat from the auxiliary circuit board 150, but also improves the utilization rate of the air blown out by fan 040.

[0166] Please refer to Figure 4 and Figure 7 In some possible implementations, the first heat sink 020 has a third side C3 and a fourth side C4 that are relatively distributed in the second direction.

[0167] The electronic device 100 also includes an interface assembly 160 fixed to the circuit board assembly 000. The interface assembly 160 is located near the fourth side C4.

[0168] The airflow generated by fan 040 also exits through the fourth side C4 to blow air onto interface component 160. Interface component 160 is used to connect to external devices.

[0169] The airflow generated by fan 040 also exits through the fourth side C4 to blow air onto interface component 160, which can both dissipate heat from interface component 160 and improve the utilization rate of the air blown out by fan 040.

[0170] For example, the interface assembly 160 is fixed to the second circuit board 050 in the circuit board assembly 000. The number of first fins 0241 distributed in the region facing the third side C3 is less than the number of second fins 0242 distributed in the region facing the fourth side C4. In this way, the air volume at the interface assembly 160 is guaranteed, and the air blown out by the first fins 0241 corresponding to the air outlet of the first airflow channel T1 flows as far as possible toward the second mounting cavity Q4 at the first side C1.

[0171] For example, the assembly process of the electronic device 100 of this application is as follows:

[0172] like Figure 5 and Figure 7 As shown, the fan 040 is fixed to the first heat sink 020. The first heat sink 020, the first circuit board 010, and the second heat sink 060 are stacked together and fixed to the bracket 110. For example, multiple screws are used to pass through the first heat sink 020, the first circuit board 010, and the second heat sink 060 simultaneously and then fix them to the bracket 110.

[0173] like Figure 5 and Figure 7 As shown, after the first heat sink 020, the first circuit board 010, and the second heat sink 060 are fixed on the bracket 110, the second circuit board 050 is fixedly connected to the side of the second heat sink 060 away from the first circuit board 010, and the second circuit board 050 is also fixedly connected to the bracket 110. The third heat sink 070 is fixed to the side of the second circuit board 050 away from the second heat sink 060.

[0174] like Figure 6 As shown, in Figure 5 After the circuit board assembly 000 is fixed on the bracket 110, the auxiliary circuit board 150 is fixedly connected to the second circuit board 050 on the side of the second plate 112 away from the first mounting cavity Q3 by screws.

[0175] A fourth heat sink is sandwiched between the auxiliary circuit board 150 and the second board 112. The auxiliary circuit board 150 achieves hardware functional connection by inserting gold fingers into the 22-pin connector in the second circuit board 050.

[0176] Please refer to Figure 7 In some possible implementations, the first plate 111 has a baffle 113 on the side facing away from the fan 040 in a third-direction direction. The baffle 113 is distributed around the first plate 111 on both sides in a second direction and on the side facing away from the second plate 112 in a first direction. In the third-direction direction, the baffle 113 is located between the first plate 111 and the housing 120, and the baffle 113 abuts against the inner wall of the housing 120.

[0177] The baffle 113, the first plate 111, and the outer shell 120 enclose an air passage cavity. The air duct D is located within the air passage cavity.

[0178] by Figures 7-9 The heat dissipation principle of the electronic device 100 in this application embodiment is illustrated by an example.

[0179] Under the action of fan 040, the outside airflow enters the housing 120 through the air inlet K3 at the bottom of the housing 120, and then flows along the air inlet K3, the air duct D, and the ventilation opening K2 in sequence to reach the air inlet side of fan 040.

[0180] Under the rotation of fan 040, the air volume is blown out from the air outlet side of fan 040 and blown into the first airflow channel T1 and the second airflow channel T2.

[0181] A portion of the air outlet of the first airflow channel T1 exits through the first side C1, while another portion of the air outlet of the first airflow channel T1 exits through the third side C3. A portion of the air outlet of the second airflow channel T2 exits through the first side C1, while another portion of the air outlet of the second airflow channel T2 exits through the fourth side C4.

[0182] The air blown out by the first heat sink 020 from the first side C1, the third side C3, and the fourth side C4 can continue to flow to the second mounting cavity Q4 and flow out through the air outlet K4 on the rear cover plate 130, thereby carrying away the heat inside the electronic device 100 and cooling the internal components of the electronic device 100.

[0183] It should be noted that multiple holes are made in each part of the bracket 110, which can reduce weight without affecting the airflow inside the electronic device 100.

[0184] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0185] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board assembly, characterized in that, include: The circuit board (010), the heat sink (020), and the multiple heat-conducting pads (030) are all components. The first circuit board (010) has a plurality of first heat-generating devices (011) on the side facing the first heat sink (020); The first heat sink (020) has a plurality of shielding frames (021) on the side facing the first circuit board (010); the plurality of shielding frames (021) correspond to the plurality of first heating devices (011), and the first heating devices (011) are located within the shielding space enclosed by the corresponding shielding frames (021); The plurality of first thermal pads (030) are distributed correspondingly to the plurality of shielding frames (021). The first thermal pad (030) is located within the shielding space enclosed by the corresponding shielding frame (021), and one side of the first thermal pad (030) is attached to the first heat sink (020), and the other side is attached to the first heat-generating device (011) in the shielding space.

2. The circuit board assembly according to claim 1, characterized in that, The first heat sink (020) has a plurality of protrusions (022) on the side facing the first circuit board (010); the plurality of protrusions (022) are distributed correspondingly to the plurality of shielding frames (021), and the protrusions (022) are located within the shielding space enclosed by the corresponding shielding frames (021); Within the shielded space, one side of the first thermal pad (030) is attached to the convex bulge (022), and the other side is attached to the first heating device (011).

3. The circuit board assembly according to claim 1, characterized in that, The shielding frame (021) has a conductive adhesive layer (023) on the side facing the first circuit board (010); the conductive adhesive layer (023) is distributed around the shielding frame (021); In the direction perpendicular to the first circuit board (010), one side of the conductive adhesive layer (023) is connected to the shielding frame (021), and the other side is connected to the first circuit board (010).

4. The circuit board assembly according to any one of claims 1-3, characterized in that, The circuit board assembly further includes a fan (040); the fan (040) is fixed to the side of the first heat sink (020) away from the first circuit board (010).

5. The circuit board assembly according to claim 4, characterized in that, The first heat sink (020) has an assembly area (Q1) on the side opposite to the first circuit board (010) and an air duct area (Q2) distributed around the assembly area (Q1); The fan (040) is installed in the assembly area (Q1); the air duct area (Q2) has a plurality of fins (024) distributed around the fan (040); There is an airflow channel (T) between two adjacent fins (024) distributed in the circumferential direction of the fan (040).

6. The circuit board assembly according to claim 5, characterized in that, At least some of the plurality of fins (024) are arc-shaped fins (024).

7. The circuit board assembly according to claim 6, characterized in that, The plurality of fins (024) includes a plurality of first fins (0241) and a plurality of second fins (0242); the first fins (0241) are arc-shaped fins (024) that are curved in a counterclockwise direction, and the second fins (0242) are arc-shaped fins (024) that are curved in a clockwise direction; the airflow channel (T) located between two adjacent first fins (0241) is a first airflow channel (T1), and the airflow channel (T) located between two adjacent second fins (0242) is a second airflow channel (T2); At least a portion of the first airflow channel (T1) is away from the air outlet of the fan (040), and at least a portion of the second airflow channel (T2) is away from the air outlet of the fan (040) and both face the same side of the first heat sink (020).

8. The circuit board assembly according to claim 7, characterized in that, The first heat sink (020) has a first side (C1) and a second side (C2) that are oppositely distributed in a first direction, and a third side (C3) and a fourth side (C4) that are oppositely distributed in a second direction; the first direction is perpendicular to the second direction and both are parallel to the first circuit board (010); At least a portion of the plurality of first fins (0241) are distributed in the region of the assembly area (Q1) facing the third side (C3), and at least a portion of the plurality of second fins (0242) are distributed in the region of the assembly area (Q1) facing the fourth side (C4). Among them, a portion of the first airflow channels (T1) are located away from the air outlet of the fan (040) and face the first side (C1), while another portion of the first airflow channels (T1) are located away from the air outlet of the fan (040) and face the third side (C3); a portion of the second airflow channels (T2) are located away from the air outlet of the fan (040) and face the first side (C1), while another portion of the second airflow channels (T2) are located away from the air outlet of the fan (040) and face the fourth side (C4).

9. The circuit board assembly according to claim 8, characterized in that, The plurality of fins (024) further includes a plurality of third fins (0243), which are distributed in the assembly area (Q1) facing the second side (C2). The airflow channel (T) between two adjacent third fins (0243) is a third airflow channel (T3). The air outlet end of the third airflow channel (T3) away from the fan (040) faces the second side (C2). The outlet of the third airflow channel (T3) is used to blow air onto the auxiliary circuit board (150), which is distributed in the first direction close to the second side (C2).

10. The circuit board assembly according to any one of claims 1-3 and 5-9, characterized in that, The circuit board assembly further includes: a second circuit board (050), a second heat sink (060), and a third heat sink (070); The second circuit board (050) is located on the side of the first circuit board (010) away from the first heat sink (020); The second heat sink (060) is fixed between the first circuit board (010) and the second circuit board (050); The third heat sink (070) is fixed to the side of the second circuit board (050) away from the first circuit board (010).

11. An electronic device, characterized in that, include: The bracket (110) and the circuit board assembly according to any one of claims 1-10; The bracket (110) has a first mounting cavity (Q3) inside, and the circuit board assembly is fixed in the first mounting cavity (Q3).

12. The electronic device according to claim 11, characterized in that, The bracket (110) has a first plate (111) and a first mounting opening (K1) arranged opposite to each other in the third direction. The first mounting opening (K1) communicates with the first mounting cavity (Q3). The circuit board assembly is installed in the first mounting cavity (Q3) through the first mounting opening (K1), and the first heat sink (020) in the circuit board assembly is fixedly connected to the first plate (111). The third direction is perpendicular to the first circuit board (010) in the circuit board assembly.

13. The electronic device according to claim 12, characterized in that, The circuit board assembly further includes: a fan (040); the fan (040) is fixed to the side of the first heat sink (020) away from the first circuit board (010); The first plate (111) has a vent (K2) communicating with the first mounting cavity (Q3), and the air intake side of the fan (040) faces the vent (K2).

14. The electronic device according to claim 13, characterized in that, The electronic device further includes: a housing (120); the bracket (110) is fixed inside the housing (120), and the bottom of the housing (120) has an air inlet (K3); The first plate (111) has an air duct (D) communicating with the vent (K2) on the side opposite to the circuit board assembly; one end of the air duct (D) in a first direction is connected to the vent (K2), and the other end of the air duct (D) in the first direction faces the bottom of the housing (120) to communicate with the air inlet (K3). The dimension of the end of the air duct (D) that connects to the vent (K2) is smaller than the dimension of the end of the air duct (D) that faces the bottom of the outer casing (120).

15. The electronic device according to claim 13, characterized in that, The bracket (110) also has a second mounting cavity (Q4) inside; the electronic device further includes a functional component (140) fixed in the second mounting cavity (Q4); The first mounting cavity (Q3) and the second mounting cavity (Q4) are connected in a first direction; the first heat sink (020) has a first side (C1) and a second side (C2) that are relatively distributed in the first direction, and the first side (C1) is closer to the second mounting cavity (Q4) than the second side (C2); The airflow generated by the fan (040) is discharged through at least the first side (C1) to blow air into the second mounting cavity (Q4).

16. The electronic device according to claim 15, characterized in that, The bracket (110) has a second plate (112) facing the second side (C2) in the first direction; in the first direction, the second plate (112) is located on the side of the first mounting cavity (Q3) away from the second mounting cavity (Q4); and the electronic device further includes: an auxiliary circuit board (150) fixed on the side of the second plate (112) away from the first mounting cavity (Q3); The second plate (112) has an auxiliary air vent (K5) that communicates with the first mounting cavity (Q3); the airflow generated by the fan (040) also exits through the second side (C2) to blow air through the auxiliary air vent (K5) onto the auxiliary circuit board (150).

17. The electronic device according to claim 15 or 16, characterized in that, The first heat sink (020) has a third side (C3) and a fourth side (C4) that are oppositely distributed in a second direction; The electronic device further includes: an interface assembly (160) fixed to the circuit board assembly; the interface assembly (160) is located near the fourth side (C4); The airflow generated by the fan (040) is also discharged through the fourth side (C4) to blow air onto the interface assembly (160).

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