A sandwiched double-sided welded FPC

Abstract

The utility model discloses a kind of double-sided welding FPC of sandwich type, including PCB board and FPC layer, PCB board has front and back, and front and back are provided with several pads;FPC layer can be bent and cover the front and back of PCB board, and the pad of FPC layer surface corresponding PCB board front and back is all set with welding hole, and welding hole is welded with pad;FPC layer is still attached with heat conduction layer in the area of contact with PCB board, and heat conduction layer at least extends to form radiating part in one side of FPC layer.The utility model technical scheme aims at solving the problem of heat accumulation when FPC and PCB board double-sided welding.

Description

Technical Field

[0001] This utility model relates to the field of FPC technology, and in particular to a sandwich-type double-sided welded FPC. Background Technology

[0002] Flexible and foldable FPCs are widely used to connect two rigid components, such as motherboards and screens, or motherboards and cameras. In the context of highly integrated electronic devices, to achieve more complex circuit connections within limited space, some manufacturers solder FPCs to both sides of a PCB, increasing assembly density and saving internal space. However, when high-power components are densely packed on both sides of the PCB, the heat generated during operation is insulated by the bonded FPC, causing heat to accumulate inside the PCB and become difficult to dissipate. This not only affects the stability of circuit performance but also directly threatens the lifespan of the components. Utility Model Content

[0003] The main purpose of this invention is to provide a sandwich-type double-sided welded FPC, which aims to solve the heat accumulation problem when FPC is welded to PCB board on both sides.

[0004] To achieve the above objectives, this utility model proposes a sandwich-type double-sided welded FPC, comprising:

[0005] A PCB board having a front and a back side, and both the front and the back side having a number of pads.

[0006] The FPC layer is bendable and covers the front and back of the PCB board. The surface of the FPC layer has solder holes on the pads corresponding to the front and back of the PCB board, and the solder holes are soldered to the pads. The FPC layer also has a thermal conductive layer attached to the area in contact with the PCB board, and the thermal conductive layer extends at least on one side of the FPC layer to form a heat dissipation part.

[0007] In one possible implementation, the heat dissipation section is formed by a plurality of spaced-apart heat dissipation fins.

[0008] In one possible implementation, the surface of the thermally conductive layer has through holes corresponding to the solder holes of the FPC layer.

[0009] In one possible implementation, the thermal conductive layer consists of two pieces, which are respectively attached to the FPC layer in the areas corresponding to the front and back sides of the PCB board.

[0010] This utility model's technical solution achieves high-density component layout by setting independent thermal conductive layers and FPC layers on both sides of the PCB. The double-sided coverage and soldering of the FPC enable the heat from both sides of the PCB to be directed to the heat dissipation fins on the sides through the two independent thermal conductive layers, thus solving the problem of heat accumulation on the PCB in a compact space and ensuring the stable operation of high-performance components. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of a structure of an embodiment of the sandwich-type double-sided welded FPC of this utility model;

[0013] Figure 2 This is a cross-sectional view of an embodiment of the sandwich-type double-sided welded FPC of this utility model;

[0014] Figure 3 This is an exploded view of an embodiment of the sandwich-type double-sided welded FPC of this utility model.

[0015] Explanation of icon numbers:

[0016] 1. PCB board; 11. Pads; 2. FPC layer; 21. Solder hole; 3. Thermal conductive layer; 31. Heat dissipation part; 311. Heat dissipation fins; 32. Through hole.

[0017] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0019] Reference Figures 1 to 3This utility model proposes a sandwich-type double-sided soldering FPC, including a PCB board 1 and an FPC layer 2. The PCB board 1 has a front and a back, and both the front and the back are provided with a number of solder pads 11. The FPC layer 2 can be bent to cover the front and the back of the PCB board 1, and the surface of the FPC layer 2 is provided with solder holes 21 corresponding to the solder pads 11 on the front and the back of the PCB board 1. The solder holes 21 are soldered to the solder pads 11. A heat-conducting layer 3 is also attached to the area of ​​the FPC layer 2 in contact with the PCB board 1, and the heat-conducting layer 3 extends at least on one side of the FPC layer 2 to form a heat dissipation part 31.

[0020] Understandably, PCB 1 is a relatively rigid circuit board, while FPC layer 2 is a flexible circuit board that can be bent and folded. In this example, it acts like two thin films covering both sides of the PCB, contacting the components on the PCB. Pads 11 are metal areas on the PCB surface used for soldering the pins or wires of electronic components. Both sides of PCB 1 can be soldered. The circuitry on FPC layer 2 needs to be connected to the pads 11 on PCB 1 through solder holes 21. After soldering, current and signals can flow between the PCB and the FPC. Through soldering, FPC layer 2 is firmly attached to PCB 1, forming a stable sandwich structure.

[0021] The thermally conductive layer 3 is a sheet-like structure made of a material with good thermal conductivity, such as thermally conductive silicone sheet, graphene, or metal foil, which is attached to the surface of the FPC layer 2 and in contact with the PCB board 1. Since the components on the PCB board 1, especially power devices, generate heat during operation, the thermally conductive layer 3 can quickly absorb this heat from the PCB board 1. The thermally conductive layer 3 is not completely sandwiched in the middle; it extends from at least one edge of the FPC layer 2, exposing itself to the air to form a heat dissipation section 31, which can more effectively dissipate heat to the surrounding environment.

[0022] This embodiment utilizes double-sided PCB and flexible FPC wiring to arrange more circuits and components in a limited space. The built-in heat-conducting layer 3 solves the heat dissipation problem of FPC and PCB components in a compact space, improving the reliability and lifespan of the product.

[0023] Reference Figures 1 to 3 In one embodiment of the present invention, the heat dissipation part 31 is formed by a plurality of heat dissipation fins 311 arranged at intervals.

[0024] Understandably, the heat dissipation fins 311 resemble the fin structure on the sides of a fish's body, increasing heat dissipation efficiency by increasing the surface area in contact with air. Heat generated by components on the PCB board 1 is absorbed by the thermally conductive layer 3, and the heat is conducted horizontally along the thermally conductive layer 3 to the heat dissipation section 31, which consists of several spaced-apart heat dissipation fins 311. The spacing between the fins creates channels for airflow. Through natural airflow or a cooling fan, cool air flows through the gaps between the fins, carrying away the heat from each fin.

[0025] Reference Figure 3 In one embodiment of this utility model, a through hole 32 is provided on the surface of the heat-conducting layer 3 corresponding to the solder hole 21 of the FPC layer 2.

[0026] Understandably, the function of the through hole 32 is to avoid interfering with the soldering of the FPC and PCB. The solder can pass through the FPC solder hole 21 and the through hole 32 of the heat-conducting layer 3, and reach the PCB pad 11 to complete the electrical connection, thus avoiding short circuits caused by the heat-conducting layer 3. At the same time, the rest of the heat-conducting layer 3 can still be tightly attached to the non-soldering area of ​​the FPC and PCB, and conduct the heat generated during the operation of the circuit laterally to the external heat sink fins 311.

[0027] Reference Figures 1 to 3 In one embodiment of this utility model, the thermal conductive layer 3 is provided with two pieces, which are respectively attached to the areas on the front and back of the PCB board 1 on the FPC layer 2.

[0028] Understandably, two independent thermal conductive layers 3 are attached to the FPC layer 2, which are in contact with the front and back sides of the PCB board 1 respectively. The two thermal conductive layers 3 can absorb the heat generated by the components on the front and back sides of the PCB respectively, and dissipate the heat quickly through the heat dissipation parts 31 formed by their respective side extensions, thereby maximizing the heat dissipation area and efficiency.

[0029] This utility model's technical solution employs independent thermal conductive layers 3 and FPC layers 2 on both sides of the PCB. By utilizing the double-sided coverage and soldering of the FPC, a high-density layout of components is achieved. The two independent thermal conductive layers 3 direct the heat from both sides of the PCB to the side heat dissipation fins 311, solving the problem of heat accumulation on the PCB in a compact space and ensuring the stable operation of high-performance components.

[0030] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0031] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A sandwich-type double-sided welded FPC, characterized in that, include: A PCB board having a front and a back side, and both the front and the back side having a number of pads. The FPC layer is bendable and covers the front and back of the PCB board. The surface of the FPC layer has solder holes on the pads corresponding to the front and back of the PCB board, and the solder holes are soldered to the pads. The FPC layer also has a thermal conductive layer attached to the area in contact with the PCB board, and the thermal conductive layer extends at least on one side of the FPC layer to form a heat dissipation part.

2. The sandwich-type double-sided welded FPC according to claim 1, characterized in that, The heat dissipation section is formed by a number of spaced-apart heat dissipation fins.

3. The sandwich-type double-sided welded FPC according to claim 2, characterized in that, The surface of the thermally conductive layer has through holes corresponding to the solder holes of the FPC layer.

4. The sandwich-type double-sided welded FPC according to claim 3, characterized in that, The thermal conductive layer consists of two pieces, which are respectively attached to the FPC layer in the areas corresponding to the front and back of the PCB board.

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