Passive component housing for network filter

Abstract

The utility model relates to electrical element container technical field, concretely is applied to network filter's passive component shell applied to network filter's passive component shell, including the circuit board and top cap of cooperation use, the top surface of circuit board is equipped with a plurality of top surface weld spots, the bottom surface of circuit board is equipped with a plurality of bottom surface weld spots, and the top surface weld spot is electrically connected with the bottom surface weld spot, the bottom surface of top cap is equipped with the component slot, and the circuit board is equipped with component hole, and the component slot and component hole are opposite and set, the bottom surface of top cap still is equipped with two glue containing grooves for accommodating the anti-oxidant, and two glue containing grooves are located component slot both sides, and the slot mouth of glue containing groove all with the slot mouth of component slot intercommunication, and glue containing groove is opposite top surface weld spot, adopt this scheme, can effectively reduce the production cost of product.

Description

Technical Field

[0001] This utility model relates to the field of electrical component container technology, specifically to a passive component housing used in network filters. Background Technology

[0002] Electronic components are the hardware foundation of modern society's intelligence and automation. They mainly consist of an internal circuit structure and an external housing. The housing includes a circuit board and a top cover. The internal circuit structure is connected to the solder points on the top surface of the circuit board, and the top cover is fastened to the circuit board to protect the internal circuit structure. The internal circuit structure of a network filter is a coil assembly, which includes a magnetic ring and a coil wound on the magnetic ring. The coil uses enameled wire, and the enameled wire is soldered to the solder points on the top surface of the circuit board using resistance welding. The solder points on the top and bottom surfaces of the circuit board are electrically connected. In application, the solder points on the bottom surface of the circuit board are directly electrically connected to the external circuit. With the development of automation and intelligence, the production volume of electronic components such as network filters has surged. If their structure and production can be improved, their production costs can be effectively controlled. Therefore, there is an urgent need for a passive component housing for network filters that can effectively reduce the production cost of the product. Utility Model Content

[0003] The present invention aims to provide a housing for passive components used in network filters, which can effectively reduce the production cost of the product.

[0004] This utility model provides the following basic solution: A passive component housing for use in network filters includes a circuit board and a top cover. The top surface of the circuit board has multiple top surface solder points, and the bottom surface of the circuit board has multiple bottom surface solder points. The top surface solder points are electrically connected to the bottom surface solder points. The bottom surface of the top cover has a component slot, and the circuit board has a component hole. The component slot and the component hole are arranged opposite to each other. The bottom surface of the top cover also has two adhesive grooves for accommodating anti-oxides. The two adhesive grooves are located on both sides of the component slot, and the openings of the adhesive grooves are connected to the openings of the component slots. The adhesive grooves are directly opposite the top surface solder points.

[0005] Furthermore, a connecting groove is provided on the bottom surface of the top cover, and the two sides of the connecting groove are respectively connected to the side walls of the component groove and the adhesive groove.

[0006] Furthermore, the distance from the bottom of the component slot, adhesive slot, and connection slot to the top surface of the circuit board gradually decreases.

[0007] Furthermore, the top surface solder joints are covered with anti-oxide coating.

[0008] Furthermore, the circuit board has copper plating vias that connect the top solder joints and the bottom solder joints. The walls of the copper plating vias are provided with a first conductive layer that electrically connects the top solder joints and the bottom solder joints.

[0009] Furthermore, multiple observation slots are provided on both sides of the circuit board. The walls of the observation slots are provided with a second conductive layer. The second conductive layer is electrically connected to the bottom solder joints. The second conductive layer is separated from the top solder joints.

[0010] Furthermore, a notch is provided on the circuit board, and a locking block is provided on the bottom surface of the top cover. The locking block is positioned opposite to the notch and works in conjunction with it.

[0011] Furthermore, a guide section is provided at the end of the card block away from the top cover.

[0012] Furthermore, the anti-oxidant is used as an adhesive.

[0013] Beneficial effects: 1. When applying this solution, an internal circuit structure is required. Taking a network filter as an example, the internal circuit structure includes a coil assembly, which consists of a magnetic ring and a coil wound around the magnetic ring. The coil is soldered to the top surface of the circuit board using resistance welding. Existing technologies only create slots in the top cover to accommodate the coil assembly. This solution creates component holes in the circuit board; the cavity formed by the component slots and holes accommodates the coil assembly. Compared to existing technologies, this transfers the space for the coil assembly to the circuit board, thereby reducing the thickness of the top cover, which in turn reduces the overall thickness of the network filter, lowers production costs, and effectively reduces the size of the electronic components, expanding their application scenarios.

[0014] 2. In practical applications of network filters, it has been found that during long-term use, the solder joints where enameled wires are bonded to the circuit board tend to oxidize, leading to functional failure and reduced lifespan. The inventors discovered that resistance welding of the enameled wires to the solder joints leaves the joints exposed, making them prone to oxidation during use. This solution incorporates a glue tank. During production, anti-oxidants are added to the glue tank, covering the top solder joints and thus delaying oxidation, reducing the probability of network filter failure. Furthermore, the connection between the glue tank and the component slot allows anti-oxidants to overflow into the component slot when there is excessive anti-oxidant, preventing glue overflow from affecting the appearance of the electronic components, thereby improving the production yield and reducing production costs.

[0015] 3. In existing technologies, the coils of network filters use enameled wire, which is resistance-welded to the solder joints. However, in actual production, the enameled wire may come into contact with the solder joints in multiple places. Because resistance welding is used, the weld extension causes the wire to connect to the solder joint at all contact points. After cutting off the excess wire ends, the ends may still stick to the solder joints and cannot be removed. Using brute force to pull out the ends may cause the solder joints to be pulled out, rendering the entire electronic component unusable. Therefore, in this solution, the top solder joints and the second conductive layer of the observation slot are separated. This separation reduces the number of solder joints between the enameled wire and the solder joints, as well as the number of solder joints between the enameled wire and the copper sheet. This reduces the number of wire ends soldered to the solder joints, effectively removing wire ends while avoiding damage to the circuit board, reducing the product defect rate, lowering production costs, and improving the overall quality of electronic components. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the passive component housing of the present invention applied to a network filter; Figure 2 This is a bottom view of an embodiment of the passive component housing of the present invention applied to a network filter; Figure 3 This utility model relates to a passive component housing for network filters. Figure 2 AA cross-section view; Figure 4 This is a schematic diagram of the top cover of an embodiment of the passive component housing of a network filter according to the present invention; Figure 5 This is a schematic diagram of the circuit board structure of an embodiment of the passive component housing of a network filter according to the present invention. Detailed Implementation

[0017] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: circuit board 1, top cover 2, first copper hole section 301, first transition section 302, first connecting section 302, bottom solder joint 4, copper plating hole 5, component groove 6, adhesive groove 7, component hole 8, second conductive layer 9, notch 10, locking block 11, guide part 12.

[0018] Example Housings for passive components used in network filters, as shown in the attached image. Figure 1 As shown, it includes a circuit board 1 and a top cover 2 for use together. The top surface of the circuit board 1 has multiple top surface solder points, as shown in the attached diagram. Figure 2As shown, the bottom surface of the circuit board 1 has multiple bottom surface solder points 4, and the top surface solder points are located on both sides of the top surface of the circuit board 1, with the bottom surface solder points 4 and the top surface solder points arranged opposite each other. In this embodiment, there are twenty-four top surface solder points, with twelve on each side, and the top surface solder points on each side are evenly distributed. The top surface solder points and bottom surface solder points 4 are fixedly connected to the circuit board 1 using the copper-clad laminate etching process commonly used in the prior art for circuit boards 1. The material of the top surface solder points and bottom surface solder points 4 is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0019] As attached Figure 3 As shown, the top solder joint and the bottom solder joint 4 are electrically connected. Specifically, a copper plating hole 5 is provided on the circuit board 1, which connects the top solder joint and the bottom solder joint 4. The hole wall of the copper plating hole 5 is provided with a first conductive layer, which electrically connects the top solder joint and the bottom solder joint 4. The first conductive layer is fixed on the hole wall of the copper plating hole 5 using the copper plating process commonly used in circuit boards 1 in the prior art. The first conductive layer formed during copper plating connects the top solder joint and the bottom solder joint 4. The material of the first conductive layer is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0020] As attached Figure 4 As shown, the bottom surface of the top cover 2 has a component groove 6, and the bottom surface of the top cover 2 also has two adhesive grooves 7 for accommodating anti-oxide. The two adhesive grooves 7 are located on both sides of the component groove 6, and the adhesive grooves 7 are directly opposite the solder joints on the top surface. Anti-oxide covers the solder joints on the top surface (anti-oxide is not shown in the figure). In this embodiment, the anti-oxide is glue. The edges of the adjacent sidewalls of the adhesive grooves 7 are all rounded. In this design, the rounded edges of the adhesive grooves 7 make it easier for the glue to fill the adhesive grooves 7 compared to right angles.

[0021] The openings of the adhesive groove 7 are all connected to the openings of the component groove 6. Specifically, the bottom surface of the top cover 2 is also provided with two connecting grooves. The two sides of the connecting grooves are respectively connected to the side walls of the component groove 6 and the adhesive groove 7. The distance from the bottom of the component groove 6, the adhesive groove 7 and the connecting groove to the top surface of the circuit board 1 gradually decreases.

[0022] The circuit board 1 has a component hole 8, which connects the top and bottom surfaces of the circuit board 1. The component slot 6 and the component hole 8 are positioned opposite each other. The edges of the adjacent sidewalls of the component slot 6 and the adjacent sidewalls of the component hole 8 are rounded. Compared with right angles, the rounded edges reduce the damage caused by collisions with the coil assembly.

[0023] This solution is applied to network filters. During assembly, the top cover 2 is inverted, with the component slot 6 facing upwards. Adhesive is applied to the adhesive groove 7 on the top cover 2. The coil assembly is placed at the component hole 8 on the circuit board 1. The enameled wire in the coil assembly is resistance-welded to the top surface solder joint on the circuit board 1. After welding, the circuit board 1 is snapped onto the top cover 2, with the coil assembly simultaneously positioned in both the component slot 6 and the component hole 8. At this point, the bottom surface of the top cover 2 abuts against the top surface of the circuit board 1, and adhesive fills the adhesive groove 7, covering the top surface solder joint. After curing, the adhesive forms an anti-oxidant layer. In this solution, the adhesive groove 7 faces the top surface solder joint. The enameled wire passes through the connecting groove and is welded to the top surface solder joint. After covering the solder joint, the adhesive overflows into the component slot 6 under the guidance of the connecting groove and the enameled wire. This adhesive coverage of the solder joint prevents oxidation of the enameled wire solder joint, thereby improving the lifespan of the electronic components. Simultaneously, this avoids adhesive overflow affecting the appearance of the electronic components, thus improving the production qualification rate and reducing production costs.

[0024] Compared with existing technologies, this solution is applied to network filters. The network filter has a simple structure, and the circuit board 1 has no circuit design; it only needs to realize the electrical connection between the coil assembly and the external circuit. Therefore, this solution creates a cavity on the circuit board 1 with component holes 8, component slots 6, and component holes 8 to accommodate the coil assembly. By transferring the space for accommodating the coil assembly to the circuit board 1, the thickness of the top cover 2 is reduced, thereby reducing the overall thickness of the network filter, shrinking its size, and lowering production costs.

[0025] Multiple observation slots are provided on both sides of the circuit board 1. A second conductive layer 9 is provided on the wall of each observation slot. The second conductive layer 9 is electrically connected to the bottom solder joint 4, and is separate from the top solder joint. Specifically, the observation slots connect the top and bottom surfaces of the circuit board 1. The observation slots are arc-shaped, and the number of solder joints in the observation slots is the same as that in the top surface, with their positions corresponding one-to-one. The bottom of the second conductive layer 9 is electrically connected to the bottom solder joint 4, while the top of the second conductive layer 9 is separate from the top solder joint. The observation slots facilitate observation of the soldering status when electronic components are soldered to external circuits, thereby determining whether the soldering of electronic components to external circuits is stable.

[0026] By separating the components, two advantages are achieved: first, the area of ​​the top surface solder joints is reduced, thereby reducing the contact points between the enameled wire and the solder joints, and thus reducing the number of solder joints between the enameled wire and the top surface solder joints during resistance welding; second, the welding extension during resistance welding is avoided, thereby reducing the welding situation between the enameled wire and the top surface solder joints during resistance welding. By reducing the number of solder joints between the enameled wire and the top surface solder joints, and reducing the welding situation between the enameled wire end and the top surface solder joint, the welding of the enameled wire end is reduced, thus effectively removing the enameled wire end while avoiding damage to circuit board 1, and improving the product quality of electronic components.

[0027] As attached Figure 5As shown, the top surface solder joint includes a first copper hole segment 301, a first transition segment 302, and a first connecting segment 302 connected in sequence. The distribution direction of the first copper hole segment 301, the first transition segment 302, and the first connecting segment 302 is perpendicular to the direction in which the top surface solder joints are evenly distributed. Along the direction in which the top surface solder joints are evenly distributed, i.e., parallel to the side of the circuit board 1 where the observation groove is located, the size of the first connecting segment 302 is larger than the size of the first copper hole segment 301. The first connecting segment 302 is separated from the top of the second conductive layer 9, i.e., the two are not connected. In this solution, during automated soldering of the enameled wire, the enameled wire is pulled from the coil assembly to the side of the circuit board 1. The top surface solder joint is separated from the top of the second conductive layer 9, and the size of the first connecting segment 302 is larger than the size of the first copper hole segment 301, thereby increasing the width of the top surface solder joint. This reduces the number of solder joints between the enameled wire and the solder joint while ensuring the soldering effect between the enameled wire and the top surface solder joint.

[0028] The second conductive layer 9 is fixed to the wall of the observation tank using the plating copper process commonly used in the prior art for circuit boards 1. The second conductive layer 9 formed during plating copper is connected to the bottom solder joint 4. The material of the second conductive layer 9 is copper. This application does not involve any improvement to the process, so it will not be described in detail here.

[0029] The circuit board 1 has a notch 10, and the bottom surface of the top cover 2 has a locking block 11. The locking block 11 is positioned opposite to the notch 10 and works in conjunction with it. The end of the locking block 11 away from the top cover 2 has a guide portion 12. In this embodiment, the locking block 11 and the top cover 2 are integrally formed. There are four notches 10, which are located at the intersection of adjacent sides of the circuit board 1. The notches 10 connect adjacent sides of the circuit board 1. The guide portion 12 is located in the notch 10. The guide portion 12 has inclined surfaces on both sides facing the notch 10. The inclined surfaces are inclined from the side wall of the notch 10 toward the guide portion 12 along the direction from the top cover 2 toward the circuit board 1.

[0030] In this design, the notch 10 and the locking block 11 facilitate the locking block 11's positioning via the notch 10 during engagement, enabling quick and accurate engagement of the top cover 2 and the circuit board 1. The guide portion 12 guides the locking block 11 during engagement. Its beveled shape makes the guide portion 12 smoother, reducing impact damage during engagement and facilitating the sliding of the locking block 11 into the notch 10.

[0031] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A passive component housing for use in network filters, comprising a circuit board and a top cover, wherein the top surface of the circuit board has multiple top surface solder points, and the bottom surface of the circuit board has multiple bottom surface solder points, the top surface solder points and the bottom surface solder points being electrically connected, characterized in that: The bottom surface of the top cover has a component slot, and the circuit board has a component hole. The component slot and the component hole are arranged opposite each other. The bottom surface of the top cover also has two adhesive slots for containing anti-oxide. The two adhesive slots are located on both sides of the component slot, and the opening of the adhesive slot is connected to the opening of the component slot. The adhesive slot is directly opposite the solder joint on the top surface.

2. The passive component housing for a network filter according to claim 1, characterized in that: The bottom surface of the top cover is also provided with a connecting groove, and the two sides of the connecting groove are respectively connected to the side walls of the component groove and the adhesive groove.

3. The passive component housing for a network filter according to claim 2, characterized in that: The distance from the bottom of the component slot, adhesive slot, and connector slot to the top surface of the circuit board gradually decreases.

4. The passive component housing for a network filter according to claim 3, characterized in that: Anti-oxide coating on top surface solder joints.

5. The passive component housing for a network filter according to claim 4, characterized in that: The circuit board has copper plating vias that connect the top and bottom solder joints. The walls of the copper plating vias are provided with a first conductive layer that electrically connects the top and bottom solder joints.

6. The passive component housing for a network filter according to claim 5, characterized in that: Multiple observation slots are provided on both sides of the circuit board. The walls of the observation slots are provided with a second conductive layer. The second conductive layer is electrically connected to the bottom solder joints. The second conductive layer is separated from the top solder joints.

7. The passive component housing for a network filter according to claim 6, characterized in that: The circuit board has a notch, and the bottom of the top cover has a locking block. The locking block is positioned opposite to the notch and works together.

8. The passive component housing for a network filter according to claim 7, characterized in that: The end of the card block furthest from the top cover has a guide section.

9. The passive component housing for a network filter according to claim 8, characterized in that: Antioxidants are used in adhesives.

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