Circuit board structure and electric device

Abstract

The application discloses a circuit board structure and an electric device, and belongs to the technical field of circuit boards. The circuit board structure comprises a board body and two solder pad groups. The solder pad group comprises a plurality of solder pad portions arranged at intervals along a first direction. Each solder pad portion in the solder pad group is arranged correspondingly to each solder pad portion in the other solder pad group and is arranged at intervals along a second direction. The solder pad portion has a soldering hole, a first region and a second region connected with each other. In the two solder pad portions arranged along the second direction, the two first regions are arranged adjacently, and the soldering hole is arranged on the first region. The soldering hole is arranged on the first region, so that the distance between the soldering holes on the two solder pad portions is short, the insertion of two pins on a component is facilitated, and when the pins and the solder pad portions are welded through soldering tin, the excess soldering tin at the welding position can be moved, guided or naturally flowed to the second region, so that the amount of the soldering tin in the first region is reduced, and the risk of tin connection between the two solder pad portions arranged adjacently along the second direction is reduced.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a circuit board structure and an electrical device. Background Technology

[0002] As the components connected to the circuit board become smaller and smaller, the spacing between the two pins on the components also becomes smaller and smaller. When the two pins on the component are connected to the corresponding double-row pads, the solder on the two pins may connect due to the close distance between the two pins, which poses a greater risk of solder bridging. Utility Model Content

[0003] This application provides a circuit board structure to solve the technical problem of solder bridging that easily occurs when soldering two pins on components.

[0004] To achieve the above objectives, according to a first aspect of this application, a circuit board structure is provided, comprising: plate body; Two pad groups, each pad group comprising a plurality of pad portions arranged at intervals along a first direction, each pad portion in the pad group corresponding to each pad portion in the other pad group and arranged at intervals along a second direction, each pad portion having a solder hole and a first region and a second region connected thereto, in the two pad portions arranged in the second direction, the two first regions are arranged adjacent to each other, and the solder hole is disposed in the first region.

[0005] Optionally, at least a portion of the first and second regions of the pad portions are arranged along the second direction, and in two pad portions arranged in the second direction, the second region of one of the pad portions is located on the side of the first region away from the other pad portion.

[0006] Optionally, at least a portion of the first region and the second region in the pad portion are arranged along the first direction.

[0007] Optionally, the angle between the direction from the second region to the first region and the second direction is α, satisfying: 0° < α < 90°.

[0008] Optionally, the circuit board structure further includes: A first blocking member is connected to the plate and is disposed around each of the solder pads. The first blocking member is used to block the molten solder.

[0009] Optionally, the circuit board structure further includes: The second blocking member is disposed on the side of the first blocking member away from the plate body. The second blocking member is disposed between the two pad groups and is used to block the molten solder on the pads.

[0010] Optionally, the circuit board structure further includes: A connector comprising two pins, the distance between the two pins being equal to the distance between two adjacent welding holes in the second direction, the two pins being respectively embedded into two adjacent welding holes in the second direction and welded to the pad portion.

[0011] Optionally, the length of the pin is L, satisfying: 1mm≤L≤1.2mm.

[0012] Optionally, the distance between two adjacent weld holes in the first direction is greater than the distance between two adjacent weld holes in the second direction.

[0013] According to a second aspect of this application, an electrical device is provided, comprising the circuit board structure described in any one of the above-described embodiments.

[0014] The circuit board structure of this application embodiment includes a board body and two pad groups. Each pad group includes multiple pad portions spaced apart along a first direction. Each pad portion in one pad group corresponds to each pad portion in the other pad group and is spaced apart along a second direction. Each pad portion has a solder hole and a first region and a second region connected to it. In the two pad portions arranged in the second direction, the two first regions are arranged adjacently, and the solder hole is located in the first region. By placing the solder hole in the first region, the distance between the solder holes on the two pads is closer, facilitating the insertion of two pins on components. When the pins are soldered to the pad portions, excess solder can be moved, guided, or allowed to flow naturally to the second region, thereby reducing the amount of solder in the first region and lowering the risk of solder bridging between adjacent pad portions in the second direction. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0017] Figure 1This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of the present disclosure, wherein the pad portion extends along a second direction; Figure 2 This is provided in the exemplary embodiments of this disclosure. Figure 1 A schematic diagram of the structure of two adjacent pads along the second direction in the middle; Figure 3 This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of the present disclosure, wherein the pad portion extends along a first direction; Figure 4 This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of the present disclosure, wherein a portion of the pads extends along a first direction and a portion of the pads extends along a second direction. Figure 5 This is provided in the exemplary embodiments of this disclosure. Figure 4 A schematic diagram of the structure of the first blocking component; Figure 6 This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of the present disclosure, wherein the pads are inclined. Figure 7 This is provided in the exemplary embodiments of this disclosure. Figure 6 Enlarged view of a portion of area A in the middle; Figure 8 This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of the present disclosure, wherein some pads extend along the second direction and some pads are inclined. Figure 9 This is a schematic diagram of a circuit board structure provided in an exemplary embodiment of this disclosure, wherein a connector is connected to the pad portion; Figure 10 This is a schematic diagram of the structure of the connector provided in an exemplary embodiment of this disclosure.

[0018] Explanation of reference numerals in the attached figures: 10-Board body; 20-Pad group; 21-Pad section; 211-Solder hole; 212-First region; 213-Second region; 30-First blocking member; 40-Second blocking member; 50-Connector; 51-Pin section; X-First direction; Y-Second direction. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0020] As product designs increasingly prioritize lightweight, miniaturization, and precision, electronic components are becoming smaller, with increasingly smaller pin spacing. For example, a small component might have a pin center-to-pin distance of 1.5mm and a pin spacing of only 0.3mm. This significantly increases the difficulty of soldering the component onto the circuit board. When the two pins are soldered to their corresponding pads, the close proximity of the pins can cause solder bridging, posing a significant risk of solder joint failure.

[0021] Please see Figure 1 and Figure 2 This application provides a circuit board structure, including a board body 10 and two pad groups 20. Each pad group 20 includes a plurality of pad portions 21 spaced apart along a first direction X. Each pad portion 21 in the pad group 20 is correspondingly disposed to each pad portion 21 in the other pad group 20, and spaced apart along a second direction Y. Each pad portion 21 has a solder hole 211 and a connected first region 212 and a second region 213. In the two pad portions 21 arranged along the second direction Y, two first regions 212 are arranged adjacently, and the solder hole 211 is disposed in the first region 212. The first direction X and the second direction Y intersect, preferably perpendicular to each other.

[0022] It is understandable that double rows of pads 21 are provided on the same side of the board 10. Multiple pads 21 in each row form a pad group 20, and each pad 21 in the two pad groups 20 is provided in a one-to-one correspondence. Corresponding pads 21 in the two pad groups 20 are arranged at intervals along the second direction Y to facilitate connection with components. Each pad 21 has a first region 212 and a second region 213, such as... Figure 2 As shown, for the two corresponding pad portions 21 in the two pad groups 20, the first regions 212 in the two pad portions 21 are arranged adjacently, that is, close to each other. There are no other regions on the pad portions 21 separating the two first regions 212. At this time, the two first regions 212 are close to each other. The soldering hole 211 is set in the corresponding first region 212, so that the soldering holes 211 on the two pad portions 21 are also close to each other. This makes it convenient for the two pins on the small component to be embedded into the corresponding soldering hole 211 and soldered to the corresponding pad portion 21.

[0023] The pins on the component are soldered to the corresponding pads 21. Since the distance between the two pins is relatively short, during soldering, some solder at the pin's solder joint may flow to the other pin's solder joint due to excessive amount, causing the solder to connect to each other. To avoid this, when soldering the component pins to the pads 21, the solder hole 211 is located within the first area 212. Therefore, the solder at the connection point between the pin and the pad 21 is also located within the first area 212. When there is excessive solder at the solder joint, or if it tends to flow to other locations, some solder can be guided to the second area 213 on the pad 21 using a tool, or the solder can flow naturally to the second area 213, reducing the amount of solder in the first area 212 and preventing solder from flowing to the other pin's solder joint, thus reducing the risk of solder bridging at the two pins' solder joints. This structure solves the problem of solder bridging caused by component miniaturization. It not only reduces the size of components, but also provides a favorable guarantee for product miniaturization design, reduces the difficulty of circuit board assembly production, improves production efficiency, and reduces the failure rate.

[0024] The pad portion 21 can be an elliptical structure, a rectangular structure, or an irregular structure, which facilitates the setting of solder holes 211 in the first region 212, while the second region 213 also has a certain bearing area, which facilitates the guidance of solder in the first region 212 to the second region 213.

[0025] Please see Figure 1 In conjunction with the above embodiments, in some embodiments, at least a portion of the first region 212 and the second region 213 in the pad portion 21 are arranged along the second direction Y. In the two pad portions 21 arranged in the second direction Y, the second region 213 in one of the pad portions 21 is disposed on the side of the first region 212 away from the other pad portion 21.

[0026] It is understandable that the first region 212 and the second region 213 in a portion or all of the pad portions 21 are arranged along the second direction Y. For example... Figure 1As shown, the first region 212 and the second region 213 in all pad portions 21 are arranged along the second direction Y. For two pad portions 21 corresponding to each other in two pad groups 20, the second region 213 in one pad portion 21 is located on the side of the first region 212 away from the other pad portion 21. That is, both pad portions 21 are horizontally arranged, with the first regions 212 on the two pad portions 21 close to each other and the second regions 213 on the two pad portions 21 far apart. This arrangement allows a large portion of the two corresponding pad portions 21 in the second direction Y to be far apart, further reducing the risk of solder connection on the corresponding two pad portions 21. At the same time, each pad portion 21 extends along the second direction Y, that is, the length direction of each pad portion 21 is in the second direction Y, thereby reducing the space occupied by the pad portion 21 in the first direction X, so as to reduce the size of the board body 10 in the first direction X, which is suitable for some circuit board structures that require a smaller size in the first direction X.

[0027] Please see Figure 3 In conjunction with the above embodiments, in some embodiments, at least a portion of the pad portion 21 has a first region 212 and a second region 213 arranged along a first direction X.

[0028] It is understandable that the first region 212 and the second region 213 in a portion or all of the pad portions 21 can also be arranged along the first direction X. For example... Figure 3 As shown, the first region 212 and the second region 213 in all pad portions 21 are arranged along the first direction X. For two corresponding pad portions 21 in two pad groups 20, they are arranged vertically, with the first region 212 and the second region 213 close to each other. In this arrangement, the length direction of each pad portion 21 is in the first direction X, thereby reducing the space occupied by the pad portion 21 in the second direction Y, thus reducing the size of the board body 10 in the second direction Y, which is suitable for some circuit board structures that require a smaller size in the second direction Y.

[0029] like Figure 4 As shown, in the two pad groups 20, some corresponding pad portions 21 can extend along the first direction X, while other corresponding pad portions 21 can extend along the second direction Y. This arrangement can reduce the size of the circuit board structure in the first direction X to a certain extent, making it easier for the circuit board structure to adapt to the corresponding installation environment. On the other hand, it can further reduce the risk of solder bridging in most of the pad portions 21. The number of pad portions 21 extending along the first direction X or along the second direction Y can be set as needed.

[0030] Please see Figure 6 and Figure 7In conjunction with the above embodiments, in some embodiments, the angle between the direction of the second region 213 to the first region 212 and the second direction Y is α, which satisfies: 0° < α < 90°.

[0031] It is understandable that the extension direction of the pad portion 21 can be inclined relative to the first direction X, or inclined relative to the second direction Y, with an inclination angle between 0° and 90°. Figure 6 As can be seen, for the two corresponding pad portions 21 in the two pad groups 20, the first regions 212 of the two are close to each other, while the second regions 213 are far apart from each other, which can greatly reduce the risk of solder bridging on these two pad portions 21. At the same time, by setting the pad portions 21 at an angle, the size of the circuit board structure in the first direction X and the second direction Y can be reduced to a certain extent, making it easier for the circuit board structure to adapt to some mounting environments.

[0032] like Figure 8 As shown, two corresponding pad portions 21 can be tilted, while two corresponding pad portions 21 of the other portion extend along the second direction Y; or, two corresponding pad portions 21 can be tilted, while two corresponding pad portions 21 of the other portion extend along the first direction X (not shown in the figure). This can be configured according to the actual dimensions of the board 10 to meet the needs of more board 10 applications.

[0033] Please see Figure 4 and Figure 5 In conjunction with the above embodiments, in some embodiments, the circuit board structure further includes a first blocking member 30. The first blocking member 30 is connected to the board body 10 and is disposed around each pad portion 21. The first blocking member 30 is used to block the molten solder.

[0034] Understandably, a first blocking element 30 is also provided on the board body 10, and the first blocking element 30 and the pad group 20 are located on the same side of the board body 10. On this side of the board body 10, except for the location of the pad portion 21, the other locations are covered with the first blocking element 30. When soldering the pins to the pad portion 21, the first blocking element 30 can be used to block the molten solder, which can, to a certain extent, confine the molten solder to the surface of the pad portion 21, preventing it from flowing freely and reducing the risk of solder connecting between two adjacent pad portions 21 in the first direction X, and also reducing the risk of solder connecting between two adjacent pad portions 21 in the second direction Y. The first blocking element 30 can be a solder resist, generally epoxy resin or ultraviolet (UV) curable resin. White pigments such as titanium dioxide can be added to make the first blocking element 30 white, or green pigments such as chrome green (chromium oxide green) or phthalocyanine green can be added to make the first blocking element 30 green, both of which can achieve the effect of blocking solder.

[0035] Please see Figure 4 and Figure 5 In conjunction with the above embodiments, in some embodiments, the circuit board structure further includes a second blocking member 40. The second blocking member 40 is disposed on the side of the first blocking member 30 away from the board body 10, and the second blocking member 40 is disposed between the two pad groups 20, for blocking the molten solder on the pad portion 21.

[0036] Understandably, a second blocking element 40 is also provided on the first blocking element 30. The second blocking element 40 is positioned between the two pad groups 20, separating the corresponding two pad portions 21 in the two pad groups 20, further blocking the solder on the two pad portions 21, and further reducing the risk of solder bridging when soldering the two pins on the component. The second blocking element 40 can also be a solder resist, made of the same material as the first blocking element 30, such as epoxy resin or ultraviolet (UV) curable resin, and can be used in conjunction with the first blocking element 30 to improve the solder blocking effect.

[0037] Please see Figure 9 and Figure 10 In conjunction with the above embodiments, in some embodiments, the circuit board structure further includes a connector 50, which includes two pins 51. The distance between the two pins 51 is equal to the distance between two adjacent solder holes 211 in the second direction Y. The two pins 51 are respectively embedded in two adjacent solder holes 211 in the second direction Y and soldered to the pads 21.

[0038] It is understood that the connector 50 is a component structure on a circuit board, and its two pins 51 correspond to two adjacent solder holes 211 in the second direction Y, respectively, and are embedded into these two solder holes 211. The spacing between these two solder holes 211 is the same as the spacing between the two pins 51, which facilitates the direct embedding of the two pins 51 on the connector 50 into the corresponding solder holes 211 without deformation or bending, reducing the risk of damage to the pins 51.

[0039] Please see Figure 9 and Figure 10 In conjunction with the above embodiments, in some embodiments, the length of the pin 51 is L, which satisfies: 1mm≤L≤1.2mm.

[0040] It is understood that the length of the pin portion 51 in this application is in the range of 1mm to 1.2mm, and can be any value among 1mm, 1.05mm, 1.1mm, 1.15mm, and 1.2mm, or a range between two values. Typically, the length of the pin portion 51 is around 2.5mm. A longer pin portion 51 may have more molten solder adhering to it when connected to the pad portion 21, resulting in a larger area covered by the solder and thus increasing the risk of solder joints on the corresponding two pad portions 21. This application reduces the length of the pin portion 51 while facilitating connection. When the pin portion 51 is connected to the pad portion 21, the shorter pin portion 51 has less molten solder adhering to it, and the area covered by the solder is smaller, thereby reducing the risk of solder joints on the corresponding two pad portions 21.

[0041] Please see Figure 1 In conjunction with the above embodiments, in some embodiments, the distance between two adjacent welding holes 211 in the first direction X is greater than the distance between two adjacent welding holes 211 in the second direction Y.

[0042] Understandably, since the two pins 51 on the connector 50 are connected to two adjacent solder holes 211 in the second direction Y, the distance between the two adjacent solder holes 211 in the second direction Y is relatively close to accommodate the insertion of the two pins 51. Since the two adjacent solder holes 211 in the first direction X do not need to be connected to the same connector 50, the distance between these two solder holes 211 can be increased, making the distance between the two adjacent solder holes 211 in the first direction X greater than the distance between the two adjacent solder holes 211 in the second direction Y. Setting a larger distance between the two adjacent solder holes 211 in the first direction X can prevent the solder on the two adjacent pads 21 in that direction from connecting, ensuring product processing quality and reducing the failure rate.

[0043] This application also provides an electrical device, including the circuit board structure described above. The electrical device can be a remote control, mobile phone, computer, various control devices, etc. This electrical device includes all the technical features and beneficial effects of the circuit board structure, which will not be elaborated further here.

[0044] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0045] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0046] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0047] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A circuit board structure, characterized in that, include: Plate(10); Two pad groups (20) are provided, each pad group (20) comprising a plurality of pad portions (21) spaced apart along a first direction (X). Each pad portion (21) in the pad group (20) is correspondingly provided with each pad portion (21) in the other pad group (20) and spaced apart along a second direction (Y). Each pad portion (21) has a solder hole (211) and a first region (212) and a second region (213) connected to each other. In the two pad portions (21) arranged in the second direction (Y), the two first regions (212) are arranged adjacent to each other, and the solder hole (211) is provided in the first region (212).

2. The circuit board structure according to claim 1, characterized in that, At least a portion of the first region (212) and the second region (213) in the pad portion (21) are arranged along the second direction (Y). In the two pad portions (21) arranged in the second direction (Y), the second region (213) in one of the pad portions (21) is located on the side of the first region (212) away from the other pad portion (21).

3. The circuit board structure according to claim 1, characterized in that, At least a portion of the first region (212) and the second region (213) in the pad portion (21) are arranged along the first direction (X).

4. The circuit board structure according to claim 1, characterized in that, The angle between the direction from the second region (213) to the first region (212) and the second direction (Y) is α, which satisfies: 0° < α < 90°.

5. The circuit board structure according to claim 1, characterized in that, The circuit board structure also includes: A first blocking member (30) is connected to the plate body (10) and is disposed around each of the solder pad portions (21). The first blocking member (30) is used to block the molten solder.

6. The circuit board structure according to claim 5, characterized in that, The circuit board structure also includes: The second blocking member (40) is disposed on the side of the first blocking member (30) away from the plate body (10). The second blocking member (40) is disposed between the two pad groups (20) and is used to block the molten solder on the pad part (21).

7. The circuit board structure according to claim 1, characterized in that, The circuit board structure also includes: The connector (50) includes two pins (51), the distance between the two pins (51) is equal to the distance between two adjacent welding holes (211) in the second direction (Y), the two pins (51) are respectively embedded in the two adjacent welding holes (211) in the second direction (Y) and welded to the pad (21).

8. The circuit board structure according to claim 7, characterized in that, The length of the pin portion (51) is L, which satisfies: 1mm≤L≤1.2mm.

9. The circuit board structure according to claim 1, characterized in that, The distance between two adjacent weld holes (211) in the first direction (X) is greater than the distance between two adjacent weld holes (211) in the second direction (Y).

10. An electrical appliance, characterized in that, The circuit board structure includes any one of claims 1 to 9.

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