PCB coil board facilitating SMT soldering process

Abstract

The utility model discloses a convenient PCB coil board of SMT welding process, including PCB coil board and can eliminate piece of automatic removal when passing through SMT reflow soldering furnace, PCB coil board has the front and back of opposite side setting, PCB coil board has the center hole of through PCB coil board's front and back, the piece of elimination covers in the front or back of PCB coil board to make piece of elimination can cover in the center hole of PCB coil board, the center hole of PCB coil board is plugged through piece of elimination, forms absolute horizontal plane structure, so that its PCB coil board can be sucked by the suction nozzle of chip mounter, so as to carry out the chip assembly of facilitating, improves SMT surface mount technology efficiency, and piece of elimination can be automatically removed under the temperature effect of SMT reflow soldering furnace, need not additional additional manual removal process, adapts the automatic process of SMT welding, simplifies production process, shortens production cycle, and the overall production efficiency is improved significantly.

Description

Technical Field

[0001] This utility model relates to the field of PCB stator winding technology, and in particular to a PCB coil board that facilitates SMT soldering processes. Background Technology

[0002] As smart devices such as laptops, tablets, and mobile phones become increasingly thinner and lighter, the fans used for cooling these devices are also becoming thinner. Further reducing the size of these miniature fans presents a significant challenge to the fan industry. One solution is to use miniature fans with PCB stator windings.

[0003] As a core electromagnetic component, the PCB stator winding needs to be electrically connected to the external circuit through a flexible printed circuit board (FPC) to transmit current and ensure the normal operation of the motor. Therefore, the reliable electrical connection between the PCB stator winding and the FPC is a key process in the mass production of the product. Currently, the mainstream technology in the industry is to use welding to achieve electrical connection between the two. However, due to the structural characteristics of the PCB stator winding, it is generally designed as a hollow ring structure (with a through mounting hole in the center) to meet the assembly requirements of the motor rotor. This structure is inconsistent with the conventional SMT (Surface Mount Technology) process. The conventional SMT process relies on the production line track to stably support the substrate, automatically position it, and transfer it for reflow soldering. However, because the PCB stator winding has a hollow ring structure in the center, the vacuum nozzle of the pick-and-place machine cannot pick up the PCB stator winding, so automatic placement cannot be achieved, which makes it impossible to integrate into the continuous SMT placement and soldering process. Therefore, existing technologies can only use a special fixture welding process: the PCB stator winding and FPC need to be fixed on a custom fixture by manual or semi-automatic equipment, the welding points need to be manually calibrated and then single-point or partial welding is performed. After welding, the fixture needs to be manually disassembled and transferred to the next process. This process has significant drawbacks: firstly, the process continuity is poor, the clamping, calibration and disassembly of the fixture all need to be operated independently, and it cannot be connected with the front and back production lines, forming a production breakpoint. Secondly, there is a large loss of time, as a single fixture can only process a small number of workpieces at a time, and there are many manual intervention steps, resulting in low productivity per unit time. Thirdly, there are high risks to cost and accuracy, as special fixtures need to be customized according to different specifications of toroidal windings, which increases equipment investment costs. At the same time, manual calibration is prone to problems such as welding point misalignment and incomplete welding, which affect the reliability of electrical connection and thus increase subsequent rework costs. Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a PCB coil board that facilitates the SMT soldering process. By using a removable component to block the center hole of the PCB coil board, an absolutely horizontal structure is formed, allowing the PCB coil board to be picked up by the nozzle of the pick-and-place machine, thus facilitating surface mount assembly and improving the efficiency of SMT surface mount technology. Furthermore, the removable component can be automatically removed under the temperature of the SMT reflow oven, eliminating the need for additional manual removal steps. This adapts to the automated process of SMT soldering, simplifies the production process, shortens the production cycle, and significantly improves overall production efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A PCB coil board that facilitates SMT soldering processes includes a PCB coil board and removable components that can be automatically removed during SMT reflow soldering. The PCB coil board has a front and a back side arranged on opposite sides, and the PCB coil board has a central hole that passes through the front and back sides of the PCB coil board; the removable element is disposed on the front or back side of the PCB coil board so that the removable element can cover the central hole of the PCB coil board.

[0006] As a preferred option, the removable component is a pyrolytic film. On the one hand, the thermal response characteristics of the pyrolytic film allow it to precisely adapt to the temperature environment of the SMT reflow oven. It can be completely pyrolyzed during the soldering process without any solid residue (such as adhesive residue, fiber debris, etc.), thus avoiding residual impurities from contaminating the center hole of the PCB coil board or affecting the assembly accuracy of the subsequent motor rotor shaft. On the other hand, the pyrolytic film has good physical stability (such as temperature resistance and tear resistance) before the SMT process, which can effectively prevent solder paste overflow, dust and other contaminants from entering the center hole. Compared with traditional temporary sealing materials (such as high-temperature resistant tape and peelable adhesive), it does not require manual removal, reduces the number of processes and avoids damage to the PCB surface circuitry when tearing, significantly improving the reliability of protection and process adaptability.

[0007] As a preferred embodiment, the thickness of the pyrolysis film is 0.01-0.5 mm.

[0008] As a preferred embodiment, the PCB coil board has a main body, and the outer spacing of the main body is provided with a number of crescent-shaped pads for cooperating with FPC pads. The number of crescent-shaped pads with a certain spacing can form a multi-point collaborative positioning with multiple sets of positioning bosses of the tooling fixture, so as to avoid the PCB coil board from rotating and shifting during the SMT assembly process.

[0009] As a preferred embodiment, the crescent-shaped pad is recessed inward along the circumference of the board body.

[0010] As a preferred embodiment, the inner side of the central hole is recessed outward to form a first positioning notch for engaging with a tooling fixture. The recessed notch on the inner side of the central hole can precisely engage with the positioning key of the motor rotor shaft or the positioning pin of the central tooling, directly constraining the radial displacement of the PCB coil board, ensuring the coaxiality of the PCB coil board and the motor rotor, and avoiding problems such as abnormal noise, jamming, or coil-rotor friction during motor operation due to insufficient coaxiality.

[0011] As a preferred embodiment, the planar dimensions of the PCB coil board are 3mm×3mm-40mm×40mm.

[0012] As a preferred embodiment, the thickness of the PCB coil board is 0.3-1.0 mm.

[0013] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly uses an eliminable component to block the center hole of the PCB coil board, forming an absolutely horizontal structure, so that the PCB coil board can be picked up by the nozzle of the pick-and-place machine, which facilitates the surface mount assembly and improves the efficiency of SMT surface mount technology. Moreover, the eliminable component can be automatically removed under the temperature of the SMT reflow oven, without the need for additional manual removal process, which is compatible with the automated process of SMT soldering, simplifies the production process, shortens the production cycle, and significantly improves the overall production efficiency. Secondly, the ability to block the center hole of the PCB coil board can effectively prevent solder paste, solder slag and various impurities from entering the center hole during SMT reflow soldering, thus avoiding the contamination problem of the center hole from the source, ensuring the assembly accuracy of the PCB coil board and components such as the motor rotor shaft, and improving the stability and reliability of motor operation.

[0014] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0015] Figure 1 This is a top view of an embodiment of the present utility model; Figure 2 This is a cross-sectional view of an embodiment of the present invention.

[0016] Icon descriptions included 1. PCB coil board 2. Eliminable component 11. Center hole; 12. Main body of the plate 121. Crescent-shaped pad; 122. First positioning notch. Detailed Implementation

[0017] Please refer to Figures 1 to 2 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0018] In the description of this utility model, it should be noted that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] A PCB coil board that facilitates SMT soldering processes includes a PCB coil board 1 and an eliminable component 2.

[0020] The PCB coil board 1 has a front side and a back side arranged on opposite sides, and the PCB coil board 1 has a central hole 11 that passes through the front side and the back side of the PCB coil board 1; Preferably, the planar dimensions of the PCB coil board are 3mm×3mm-40mm×40mm, which ensures that the PCB coil board, as the core driving component, can be stably embedded inside the micro fan (such as the fan frame or stator area).

[0021] The thickness of the PCB coil board is 0.3-1.0mm. The thin design of the PCB coil board can reduce the overall height occupied by the micro fan. Combined with the micro fan's height of as low as 2mm, the entire fan assembly can be adapted to the installation space of ultra-thin devices (such as micro fans), meeting the structural requirements of miniaturization and flattening. When this PCB coil board is used in a miniature fan, the size of the miniature fan is 6mm×6mm-80mm×80mm, and the height of the miniature fan is 2-8mm.

[0022] The removable element 2 is applied to the front or back of the PCB coil board 1 so that the removable element 2 can cover the center hole 11 of the PCB coil board 1.

[0023] The removable component 2 can be automatically removed when passing through the SMT reflow oven. Preferably, the removable component 2 is a pyrolytic film with a pyrolysis temperature below 250 degrees Celsius, which can be removed during the SMT soldering oven process. Since the pyrolytic film can be pyrolyzed, it can be automatically removed during the SMT soldering oven process, thereby saving the cost of subsequent manual removal of the pyrolytic film.

[0024] On the one hand, by utilizing the thermal response characteristics of the pyrolytic film, it can be precisely adapted to the temperature environment of the SMT reflow oven. It can be completely pyrolyzed during the soldering process without any solid residue (such as adhesive residue, fiber debris, etc.), thus avoiding residual impurities from contaminating the center hole 11 of the PCB coil board 1 or affecting the assembly accuracy of the subsequent motor rotor shaft. On the other hand, the pyrolytic film has good physical stability (such as temperature resistance and tear resistance) before the SMT process, which can effectively prevent solder paste overflow, dust and other contaminants from entering the center hole 11. Compared with traditional temporary sealing materials (such as high temperature resistant tape and peelable adhesive), it does not require manual removal, reduces the number of processes and avoids damage to the PCB surface circuitry when tearing, significantly improving the reliability of protection and process adaptability.

[0025] Preferably, the thickness of the pyrolysis film is 0.01-0.5 mm.

[0026] Preferably, the PCB coil board 1 has a board body 12, and the outer spacing of the board body 12 is provided with a plurality of crescent-shaped pads 121 for electrical connection with FPC pads. The plurality of crescent-shaped pads with a plurality of spacing can form multi-point collaborative positioning with the FPC pads, so as to avoid the PCB coil board 1 from rotating and shifting during the SMT assembly process.

[0027] Preferably, the crescent-shaped pad 121 is recessed inward along the circumference of the board body 12. Preferably, the inner side of the central hole 11 is recessed outward for cooperating with the tooling fixture. The recessed notch on the inner side of the central hole 11 can precisely cooperate with the positioning key of the motor rotor shaft or the positioning pin of the central tooling, directly constraining the radial displacement of the PCB coil board 1, ensuring the coaxiality of the PCB coil board and the motor rotor, and avoiding problems such as abnormal noise, jamming or coil-rotor friction during motor operation due to insufficient coaxiality.

[0028] The key design feature of this invention is that it uses a removable component to block the center hole of the PCB coil board, forming an absolutely horizontal structure. This allows the PCB coil board to be picked up by the nozzle of the pick-and-place machine, facilitating surface mount assembly and improving the efficiency of SMT surface mount technology. Furthermore, the removable component can be automatically removed under the temperature of the SMT reflow oven, eliminating the need for additional manual removal steps. This adapts to the automated process of SMT soldering, simplifies the production process, shortens the production cycle, and significantly improves overall production efficiency. Secondly, the ability to block the center hole of the PCB coil board can effectively prevent solder paste, solder slag and various impurities from entering the center hole during SMT reflow soldering, thus avoiding the contamination problem of the center hole from the source, ensuring the assembly accuracy of the PCB coil board and components such as the motor rotor shaft, and improving the stability and reliability of motor operation.

[0029] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A PCB coil board that facilitates SMT soldering processes, characterized in that, Includes PCB coil boards and removable components that can be automatically removed during SMT reflow soldering; The PCB coil board has a front and a back side arranged on opposite sides, and the PCB coil board has a central hole that passes through the front and back sides of the PCB coil board; the removable element is disposed on the front or back side of the PCB coil board so that the removable element can cover the central hole of the PCB coil board.

2. The PCB coil board for convenient SMT soldering process according to claim 1, characterized in that: The removable component is a pyrolytic film.

3. A PCB coil board for convenient SMT soldering process according to claim 2, characterized in that: The thickness of the pyrolysis film is 0.01-0.5 mm.

4. A PCB coil board for convenient SMT soldering process according to claim 1, characterized in that: The PCB coil board has a board body, and the outer spacing of the board body is provided with a number of crescent-shaped pads for mating with FPC pads.

5. A PCB coil board for convenient SMT soldering process according to claim 4, characterized in that: The crescent-shaped pads are recessed inward along the circumference of the board body.

6. A PCB coil board for convenient SMT soldering process according to claim 1, characterized in that: The inner side of the central hole is recessed outward to form a first positioning notch for engaging with a tooling fixture.

7. A PCB coil board for convenient SMT soldering process according to claim 1, characterized in that: The planar dimensions of the PCB coil board are 3mm×3mm-40mm×40mm.

8. A PCB coil board for convenient SMT soldering process according to claim 7, characterized in that: The thickness of the PCB coil board is 0.3mm-1.0mm.

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