High-voltage-resistant isolated battery management structure

Abstract

The utility model discloses a kind of high-voltage-resistant isolated battery management structures, including protection plate, the bottom of the protection plate is equipped with power board, the middle of the top of power board is equipped with multiple diodes, the side of the top of power board is equipped with transient voltage suppression diode, the bottom of the power board is equipped with control panel, the bottom of the control panel is equipped with insulating film;The utility model can dissipate heat by multiple diodes, avoid single MOSFET to be damaged due to overheating, so as to prolong the service life of system. Multiple diodes in parallel can further reduce equivalent on-resistance, reduce conduction loss, so as to improve the overall efficiency of system, and can share short-circuit current by series connection mode, reduce the burden of single diode, so as to improve short-circuit protection capability, and multiple diodes can provide stronger overcurrent protection function, ensure that circuit can be quickly cut off under overcurrent condition, protect battery and system.

Description

Technical Field

[0001] This utility model relates to the field of battery management technology, specifically a high-voltage isolation battery management structure. Background Technology

[0002] An isolated battery management structure is a key design feature in a battery management system (BMS) to ensure safety, reliability, and immunity to interference. It typically involves electrical isolation, communication isolation, and functional isolation. Existing battery management structures have the following shortcomings; 1. The BMS uses a single MOSFET topology, but the body diode still allows reverse current to pass through, failing to completely isolate bidirectional current. This may damage the battery or cause the load to overheat.

[0003] 2. The lack of isolation in the BMS circuit makes it easier for heat to be conducted and accumulated in the circuit. The operating temperature is only about 0℃ to 60℃, which may cause damage to the MCU or protection chip and exacerbate the heat. Utility Model Content

[0004] The purpose of this invention is to provide a high-voltage-resistant isolated battery management structure to solve the existing problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-voltage isolation battery management structure, including a protection board, a power board at the bottom of the protection board, multiple sets of diodes at the center of the top of the power board, a transient voltage suppression diode on one side of the top of the power board, a control board at the bottom of the power board, an insulating film at the bottom of the control board, an optocoupler at the top of the insulating film, screws at the four corners of the insulating film, and hexagonal copper pillars at the top of the screws.

[0006] Preferably, the protection board, power board, control board and insulating film are provided with connection holes at the four corners of their tops, and the hexagonal copper pillars are located inside the connection holes to improve the accuracy of their position during assembly.

[0007] Preferably, the top of the protective plate is provided with a heat dissipation copper plate, and the top of the heat dissipation copper plate is provided with multiple sets of heat dissipation support plates evenly distributed. Fixing bolts are provided at the four corners of the top of the optocoupler to facilitate heat dissipation of the device and improve the heat dissipation effect.

[0008] Preferably, threaded holes are provided at the middle of one end of the protective plate and at the four corners of one end of the heat dissipation copper plate, and the fixing bolts are located inside the threaded holes for easy connection.

[0009] Preferably, the diode is a MOSFET diode, and the transient voltage suppression diode is a TVS transient voltage suppression diode, which effectively protects the circuit.

[0010] Preferably, a thermal pad is provided between the protection board and the power board, and the thermal pad is attached to the top of the multiple diodes to facilitate heat dissipation.

[0011] Preferably, a connecting bolt is provided in the middle of the top of the protective plate, and the heat-conducting pad is connected to the protective plate through the connecting bolt to improve the stability of the connection.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the high-voltage isolation battery management structure; 1. Using multiple diodes can distribute heat, preventing individual MOSFETs from being damaged by overheating and thus extending the system's lifespan. Parallel connection of multiple diodes can further reduce equivalent on-resistance and conduction losses, thereby improving the overall system efficiency. Simultaneously, series connection can share short-circuit current, reducing the burden on individual diodes and improving short-circuit protection. Furthermore, multiple diode groups can provide stronger overcurrent protection, ensuring rapid circuit disconnection in overcurrent conditions to protect the battery and system.

[0013] 2. Transient voltage suppressor diodes (TVS) can quickly respond to transient overvoltages, clamping the voltage within a safe range and protecting sensitive components in the circuit. Optocouplers achieve electrical isolation between the input and output terminals through optical signal transmission, preventing high voltage from being conducted to the low-voltage side and protecting low-voltage devices. The combination of TVS and optocouplers provides dual protection for the circuit: the TVS suppresses transient overvoltages, while the optocoupler isolates high-voltage and low-voltage circuits. Their coordinated operation significantly improves system reliability. Furthermore, the TVS generates heat when suppressing overvoltages, and the optocoupler's isolation prevents heat from being conducted to the low-voltage side, optimizing system thermal management. In the event of overvoltage or short circuit, the combination of TVS and optocouplers can achieve controlled disconnection, ensuring system safety. Attached Figure Description

[0014] Figure 1 This is an exploded view of the present invention; Figure 2 This is a perspective view of the present utility model; Figure 3 This is a perspective view of the protective plate of this utility model.

[0015] In the diagram: 1. Protection board; 2. Thermal pad; 3. Power board; 4. Screw; 5. Insulating film; 6. Control board; 7. Hexagonal copper pillar; 8. Diode; 9. Connecting hole; 10. Transient voltage suppression diode; 11. Optocoupler; 12. Heat dissipation copper plate; 13. Fixing bolt; 14. Heat dissipation support plate. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-3 The present invention provides an embodiment of a high-voltage isolation battery management structure, comprising a protection board 1, a power board 3 at the bottom of the protection board 1, multiple sets of diodes 8 at the top center of the power board 3, and a transient voltage suppression diode 10 on one side of the top of the power board 3. The diodes 8 are specifically MOSFET diodes, and the transient voltage suppression diode 10 is specifically TVS transient voltage suppression diodes, effectively protecting the circuit. A control board 6 is provided at the bottom of the power board 3, an insulating film 5 is provided at the bottom of the control board 6, an optocoupler 11 is provided at the top of the insulating film 5, and a heat dissipation copper plate 12 is provided at the top of the protection board 1. Threaded holes are provided at the middle of one end of the protection board 1 and at the four corners of one end of the heat dissipation copper plate 12. Fixing bolts 13 are located inside the threaded holes for easy connection. Multiple sets of heat dissipation support plates 14 are evenly provided on the top of the heat dissipation copper plate 12. Fixing bolts 13 are provided at the four corners of the top of the optocoupler 11 to facilitate heat dissipation and improve the heat dissipation effect. Screws 4 are provided at the four corners of the insulating film 5, and hexagonal copper pillars 7 are provided on the top of the screws 4. Connection holes 9 are provided at the four corners of the top of the protection plate 1, power plate 3, control plate 6 and insulating film 5. The hexagonal copper pillars 7 are located inside the connection holes 9 to improve the accuracy of the position during assembly. A thermal pad 2 is provided between the protection plate 1 and the power plate 3, and the thermal pad 2 is attached to the top of the multiple sets of diodes 8 to facilitate heat dissipation. A connecting bolt is provided in the middle of the top of the protection plate 1, and the thermal pad 2 is connected to the protection plate 1 through the connecting bolt to improve the stability of the connection.

[0018] Working principle: During the assembly process, the optocoupler 11 is first soldered to the control board 6, the transient voltage suppression diode 10 is soldered to the power board 3, the thermal pad 2 is placed on the resistor of the power board 3 to enhance the heat conduction efficiency, the protection board 1 and the power board 3 are placed overlapping and fixed in the appropriate position by the hexagonal copper pillar 7, the control board 6 is fixed to the power board 3 by the pin header, the thermal pad 2 is placed on the control board 6 and fixed by the screw 4, and finally the heat dissipation copper plate 12 is placed on one end of the protection board 1 and locked with the fixing bolt 13, thereby completing the assembly of the device.

[0019] During operation, voltage grading is achieved through series diode 8. The AFE on power board 3 is responsible for monitoring parameters such as battery voltage, current and temperature, and transmitting this information to the microcontroller unit. Based on the data provided by the AFE on power board 3, the switching state of diode 8 is controlled to realize charge and discharge management, protection and equalization functions. Diode 8, as an actuator, performs switching operations according to the control signal to realize current control and switching. Optocoupler 11 is used to achieve electrical isolation between high and low voltage domains and block common-mode noise. Transient voltage suppression diodes 10 are configured on the input and output sides of optocoupler 11 to form multi-level protection. The transient voltage suppression diode 10 on the input side protects the low-voltage control terminal from ESD and surge damage, while suppressing transient overvoltage on the high-voltage side to protect optocoupler 11 and subsequent circuits. When working together, the optocoupler 11 transmits signals, the transient voltage suppression diode 10 is in a high-impedance state, and when a transient overvoltage occurs, the transient voltage suppression diode 10 quickly clamps the voltage, the optocoupler 11 isolates the fault current path, the transient voltage suppression diode 10 suppresses the transient voltage, and the optocoupler 11 blocks the current loop, thus improving the anti-interference capability in a coordinated manner.

[0020] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0021] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A high-voltage isolation battery management structure, comprising a protection board (1), characterized in that: The bottom of the protection board (1) is provided with a power board (3), the top of the power board (3) is provided with multiple sets of diodes (8), the top of the power board (3) is provided with a transient voltage suppression diode (10) on one side, the bottom of the power board (3) is provided with a control board (6), the bottom of the control board (6) is provided with an insulating film (5), the top of the insulating film (5) is provided with an optocoupler (11), the four corners of the insulating film (5) are provided with screws (4), and the top of the screws (4) is provided with a hexagonal copper pillar (7).

2. The high-voltage isolation battery management structure according to claim 1, characterized in that: The protection board (1), power board (3), control board (6) and insulating film (5) are all provided with connection holes (9) at the four corners of the top, and the hexagonal copper pillar (7) is located inside the connection hole (9).

3. The high-voltage isolation battery management structure according to claim 1, characterized in that: The top of the protective plate (1) is provided with a heat dissipation copper plate (12), and the top of the heat dissipation copper plate (12) is provided with multiple sets of heat dissipation support plates (14) evenly, and the four corners of the top of the optocoupler (11) are respectively provided with fixing bolts (13).

4. The high-voltage isolation battery management structure according to claim 3, characterized in that: Threaded holes are provided at the middle of one end of the protective plate (1) and at the four corners of one end of the heat dissipation copper plate (12), and the fixing bolt (13) is located inside the threaded hole.

5. The high-voltage isolation battery management structure according to claim 1, characterized in that: The diode (8) is specifically a MOSFET diode, and the transient voltage suppression diode (10) is specifically a TVS transient voltage suppression diode.

6. The high-voltage isolation battery management structure according to claim 1, characterized in that: A thermal pad (2) is provided between the protection plate (1) and the power plate (3), and the thermal pad (2) is attached to the top of the multiple diodes (8).

7. The high-voltage isolation battery management structure according to claim 6, characterized in that: The protective plate (1) has a connecting bolt in the middle of its top, and the heat-conducting pad (2) is connected to the protective plate (1) by the connecting bolt.

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