Circuit board warpage correction device

Abstract

The utility model discloses a circuit board warping correction device, including work table, pressure sensor, heating mechanism, flexible pressure correction mechanism and PLC controller, pressure sensor fixed mounting is in work table, heating mechanism fixed connection is in the upside of pressure sensor, and flexible pressure correction mechanism installs work table and extends to the top of heating mechanism, and PLC controller fixed mounting is in work table. The utility model discloses to circuit board heating even, through the flexible and even pressure of elastic correction air bag to adapt complex shape circuit board, reduce stress concentration and surface damage, realize efficient and low damage's correction, and adjust the convenience of extrusion correction strength, and it is convenient to adapt to different circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board warping correction technology, and in particular to a circuit board warping correction device. Background Technology

[0002] Circuit board warping is a common occurrence during circuit board production, requiring external force for correction. Currently, the most common method is a combination of heating and mechanical extrusion. However, traditional devices often employ rigid extrusion, which can lead to uneven stress distribution, causing localized stress concentration and surface damage. Furthermore, uneven heat conduction during heating affects the correction effect. Additionally, it's difficult to flexibly adjust parameters according to circuit board type, resulting in poor adaptability. Therefore, there is an urgent need to develop a circuit board warping correction device that evenly heats the circuit board and uses elastic correction airbags to apply flexible and uniform pressure to adapt to complex circuit board shapes, reducing stress concentration and surface damage. This would achieve efficient and low-damage correction, with easily adjustable extrusion force to accommodate different circuit boards, overcoming the shortcomings of current applications and meeting current needs. Utility Model Content

[0003] The purpose of this invention is to provide a circuit board warping correction device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A circuit board warpage correction device includes a worktable, a pressure sensor, a heating mechanism, a flexible pressure correction mechanism, and a PLC controller. The pressure sensor is fixedly mounted on the worktable, the heating mechanism is fixedly connected to the upper side of the pressure sensor, the flexible pressure correction mechanism is mounted on the worktable and extends above the heating mechanism, and the PLC controller is fixedly mounted on the worktable. The heating mechanism includes a support housing, a heat insulation layer, a thermally conductive copper plate, a graphene thermally conductive layer, and an electric heater. The support housing is fixedly mounted above the pressure sensor, and the heat insulation layer is fixed inside the support housing. The thermally conductive copper plate is fixedly installed on the top of the support shell. An electric heater is fixedly installed on the lower side of the thermally conductive copper plate. A graphene thermally conductive layer is fixed on the top of the thermally conductive copper plate. The flexible pressure correction mechanism includes: a high-pressure air pump, a rigid bracket, an elastic correction airbag, a conduit, a solenoid valve, and a pressure sensor. The high-pressure air pump and the rigid bracket are both fixedly installed on the workbench. The elastic correction airbag is fixedly installed inside the rigid bracket and is located directly above the heating mechanism. The high-pressure air pump is connected to the elastic correction airbag through a conduit. A solenoid valve and a pressure sensor are installed on the conduit.

[0006] Preferably, a temperature sensor is fixedly installed on the bottom of the thermally conductive copper plate.

[0007] Preferably, the pressure sensor, temperature sensor, electric heater, high-pressure air pump, solenoid valve, and air pressure sensor are electrically connected to the PLC controller.

[0008] Preferably, the high-pressure air pump is a reciprocating high-pressure bidirectional air pump.

[0009] Preferably, the elastic corrective airbag is made of fluororubber.

[0010] The beneficial effects of this utility model are as follows: When using this circuit board warpage correction device, the circuit board is placed on top of the graphene thermal conductive layer. An electric heater heats the thermally conductive copper plate. Through the uniform heat conduction of the graphene thermal conductive layer, the heat on the copper plate is evenly transferred to the circuit board, resulting in more uniform heating. Heating softens the circuit board material, reducing its yield strength and making it easier to correct deformation. Then, the solenoid valve is opened, and a high-pressure air pump inflates the elastic correction airbag, causing it to expand. The gradually expanding airbag compresses and corrects the circuit board. The airbag compression straightening method uses flexible and uniform pressure to adapt to complex workpiece shapes, reducing stress concentration and surface damage, achieving precise, efficient, and low-damage straightening. Furthermore, a pressure sensor detects the pressure on the circuit board, and an air pressure sensor detects the air pressure inside the elastic straightening airbag. A high-pressure air pump inflates or deflates the elastic straightening airbag to control its internal air pressure, thereby controlling the expansion degree of the airbag and changing the compression force applied to the circuit board. This allows for adjustment of the compression force according to different types of circuit boards. In summary, this invention provides uniform heating of the circuit board, uses the elastic straightening airbag to adapt to complex-shaped circuit boards with flexible and uniform pressure, reduces stress concentration and surface damage, achieving efficient and low-damage straightening. Moreover, the compression straightening force is easily adjustable, making it suitable for different circuit boards. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0012] Figure 2 This is a schematic diagram of the usage state of this utility model.

[0013] Figure 3 This is a cross-sectional view of the heating mechanism in this utility model.

[0014] Figure 4 This is a perspective view of the flexible pressure correction mechanism in this utility model.

[0015] Figure 5 This is a diagram illustrating the signal transmission and control of this utility model.

[0016] Legend:

[0017] 1. Workbench; 2. Pressure sensor; 3. Heating mechanism; 301. Support housing; 302. Heat insulation layer; 303. Thermally conductive copper plate; 3031. Temperature sensor; 304. Graphene thermally conductive layer; 305. Electric heater; 4. Flexible pressure correction mechanism; 401. High-pressure air pump; 402. Rigid bracket; 403. Elastic correction airbag; 404. Conduit; 405. Solenoid valve; 406. Air pressure sensor; 5. PLC controller. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] Specific implementation examples are given below.

[0020] See Figures 1-5 In this embodiment of the utility model, a circuit board warping correction device includes a workbench 1, a pressure sensor 2, a heating mechanism 3, a flexible pressure correction mechanism 4, and a PLC controller 5. The pressure sensor 2 is fixedly installed on the workbench 1, and the heating mechanism 3 is fixedly connected to the upper side of the pressure sensor 2. The heating mechanism 3 is used to place the circuit board and heat it. The pressure sensor 2 detects the pressure from the heating mechanism 3. The flexible pressure correction mechanism 4 is installed on the workbench 1 and extends above the heating mechanism 3. In use, the warped circuit board is placed on the heating mechanism 3 and heated. The flexible pressure correction mechanism 4 applies pressure to the circuit board to correct it. The PLC controller 5 is fixedly installed on the workbench 1 and is used for overall electrical system control.

[0021] The heating mechanism 3 includes: a supporting shell 301, a heat insulation layer 302, a thermally conductive copper plate 303, a graphene thermally conductive layer 304, and an electric heater 305. The supporting shell 301 is fixedly installed on the upper side of the pressure sensor 2. The heat insulation layer 302 is fixedly fixed inside the supporting shell 301. The thermally conductive copper plate 303 is fixedly installed on the top of the supporting shell 301. The electric heater 305 is fixedly installed on the lower side of the thermally conductive copper plate 303. The heat insulation layer 302 reduces the heat dissipation of the electric heater 305 to the outside, allowing most of the heat from the electric heater 305 to be absorbed and utilized by the thermally conductive copper plate 303, thus improving the heat utilization rate. The top of the thermally conductive copper plate 303 is fixed with... A graphene thermal conductive layer 304 is provided, which has good heat conduction uniformity and can evenly distribute the heat on the thermally conductive copper plate 303. A temperature sensor 3031 is fixedly installed at the bottom of the thermally conductive copper plate 303 to detect the temperature of the thermally conductive copper plate 303. In use, the circuit board is placed on the upper side of the graphene thermal conductive layer 304, and the thermally conductive copper plate 303 is heated by the electric heater 305. Through the uniform heat conduction of the graphene thermal conductive layer 304, the heat on the thermally conductive copper plate 303 can be evenly transferred to the circuit board, making the circuit board more evenly heated. In addition, the heating temperature of the electric heater 305 is set to 100°C.

[0022] The sides of both the support housing 301 and the heat insulation layer 302 are provided with mounting holes for wires to pass through.

[0023] The flexible pressure correction mechanism 4 includes: a high-pressure air pump 401, a rigid support 402, an elastic correction airbag 403, a conduit 404, a solenoid valve 405, and a pressure sensor 406. The high-pressure air pump 401 and the rigid support 402 are fixedly mounted on the workbench 1. The elastic correction airbag 403 is fixedly mounted inside the rigid support 402 and is located directly above the heating mechanism 3. The high-pressure air pump 401 is connected to the elastic correction airbag 403 via the conduit 404. The solenoid valve 405 and the pressure sensor 406 are installed on the conduit 404. The pressure sensor 406 monitors the air pressure inside the elastic correction airbag 403. In use, the solenoid valve 405 opens, and the high-pressure air pump 401 inflates the elastic correction airbag 403. The elastic corrective airbag 403 expands gradually to compress and correct the circuit board. The air pressure sensor 406 monitors the air pressure in real time, and the compression force can be adjusted according to different circuit boards. The elastic corrective airbag 403 can closely fit the surface of workpieces with different shapes. Whether the workpiece has a complex curved surface, groove or protrusion structure, it can achieve all-round and no dead angle pressure coverage, effectively avoiding the problem of local stress concentration caused by uneven force in traditional rigid extrusion tools. In addition, this uniform pressure transmission can not only accurately correct the warping and deformation of the workpiece, but also minimize the damage to the workpiece surface. While ensuring accurate and reliable correction effect, it greatly improves the efficiency of the correction process and reduces the cost loss caused by workpiece damage.

[0024] The high-pressure air pump 401 is a reciprocating high-pressure bidirectional air pump, which can both inflate and exhaust air.

[0025] The elastic corrective airbag 403 is made of fluororubber, which can withstand high temperatures of 200°C, giving the elastic corrective airbag 403 good high-temperature resistance.

[0026] The pressure sensor 2, temperature sensor 3031, electric heater 305, high-pressure air pump 401, solenoid valve 405, and air pressure sensor 406 are electrically connected to the PLC controller 5 and controlled by the PLC controller 5. The PLC controller 5 has a built-in display screen and control buttons. The display screen shows the pressure, temperature, and air pressure values ​​detected by the pressure sensor 2, temperature sensor 3031, and air pressure sensor 406 for human viewing.

[0027] Working principle: In use, the circuit board warpage correction device places the circuit board on top of the graphene thermal conductive layer 304. The electric heater 305 heats the thermally conductive copper plate 303. Through the uniform heat conduction of the graphene thermal conductive layer 304, the heat from the copper plate 303 is evenly transferred to the circuit board, resulting in more uniform heating. Heating softens the circuit board material, reducing its yield strength and making it easier to correct deformation. Then, the solenoid valve 405 is opened, and the high-pressure air pump 401 inflates the elastic correction airbag 403. The elastic correction airbag 403 gradually expands, compressing and correcting the circuit board. The 403 extrusion straightening device can adapt to complex workpiece shapes through flexible and uniform pressure, reducing stress concentration and surface damage, and achieving precise, efficient, and low-damage straightening. In addition, the pressure sensor 2 can detect the pressure on the circuit board, and the air pressure sensor 406 can detect the air pressure inside the elastic straightening airbag 403. The high-pressure air pump 401 controls the air pressure inside the elastic straightening airbag 403 by inflating or deflating it, thereby controlling the expansion degree of the elastic straightening airbag 403 and changing the extrusion force of the elastic straightening airbag 403 on the circuit board, so as to adjust the extrusion force according to different types of circuit boards.

[0028] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A circuit board warpage correction device, characterized in that, The system includes a workbench (1), a pressure sensor (2), a heating mechanism (3), a flexible pressure correction mechanism (4), and a PLC controller (5). The pressure sensor (2) is fixedly installed on the workbench (1). The heating mechanism (3) is fixedly connected to the upper side of the pressure sensor (2). The flexible pressure correction mechanism (4) is installed on the workbench (1) and extends above the heating mechanism (3). The PLC controller (5) is fixedly installed on the workbench (1). The heating mechanism (3) includes a support housing (301), a heat insulation layer (302), a thermally conductive copper plate (303), a graphene thermally conductive layer (304), and an electric heater (305). The support housing (301) is fixedly installed on the upper side of the pressure sensor (2). The heat insulation layer (302) is fixed inside the support housing (301). The thermally conductive copper plate (303) is fixedly installed on the support housing (301). The top of the heat-conducting copper plate (303) is fixedly equipped with an electric heater (305) on the lower side. A graphene heat-conducting layer (304) is fixedly installed on the top of the heat-conducting copper plate (303). The flexible pressure correction mechanism (4) includes: a high-pressure air pump (401), a rigid bracket (402), an elastic correction airbag (403), a conduit (404), a solenoid valve (405), and a pressure sensor (406). The high-pressure air pump (401) and the rigid bracket (402) are fixedly installed on the workbench (1). The elastic correction airbag (403) is fixedly installed inside the rigid bracket (402). The elastic correction airbag (403) is located directly above the heating mechanism (3). The high-pressure air pump (401) is connected to the elastic correction airbag (403) through the conduit (404). The solenoid valve (405) and the pressure sensor (406) are installed on the conduit (404).

2. The circuit board warpage correction device according to claim 1, characterized in that, A temperature sensor (3031) is fixedly installed on the bottom of the thermally conductive copper plate (303).

3. The circuit board warpage correction device according to claim 2, characterized in that, The pressure sensor (2), temperature sensor (3031), electric heater (305), high-pressure air pump (401), solenoid valve (405), and air pressure sensor (406) are electrically connected to the PLC controller (5).

4. The circuit board warpage correction device according to claim 1, characterized in that, The high-pressure air pump (401) is a reciprocating high-pressure bidirectional air pump.

5. The circuit board warpage correction device according to claim 1, characterized in that, The elastic corrective airbag (403) is made of fluororubber.

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