A crease prevention jig in PCB ink curing

Abstract

The utility model discloses a kind of PCB board ink solidification wrinkle-preventing jigs, including protective pad, the size of protective pad is compatible with the exposure part of exposure machine, protective pad is placed on exposure machine, and the front and back of protective pad is provided with the protective member for adsorbing solder resist ink, mounting groove is equipped on protective pad for placing PCB board, and PCB board is placed in mounting groove;Wherein, protective pad can be used as the bottom pressure component of PCB board, effectively transfer the pressure suffered by PCB board, to avoid the appearance of PCB board on film indentation, while protective member can adsorb solder resist ink, prevent ink from being reversely adhered on PCB board or the mesa of exposure machine, improve the overall cleanliness of exposure machine, reduce the number and energy of worker cleaning and cleaning mesa of exposure machine.

Description

Technical Field

[0001] This utility model relates to the field of PCB board manufacturing technology, and in particular to an anti-wrinkle fixture for PCB board ink curing. Background Technology

[0002] A PCB (Printed Circuit Board) is a core component in electronic devices that enables electrical connections between electronic components. It connects components via copper foil traces, supports and fixes them, and provides signal transmission paths. PCBs are widely used in home appliances, smart devices, and industrial control systems, and are considered a key component of modern electronic products, often referred to as the "mother of electronic products." As the "connection hub" of electronic devices, the PCB enables current and signal transmission between components through copper foil traces, while also providing physical support. Its manufacturing quality directly affects the stability, lifespan, and overall performance of electronic products. During the solder mask process of PCB production, the circuitry on the film is printed onto the PCB using an exposure machine. In this process, film indentations can easily form on the PCB, and ink can adhere to the PCB surface, leading to defects and other quality issues. Utility Model Content

[0003] In view of the shortcomings of the above-mentioned technology, such as the easy formation of film indentations and ink back-adhesion on the PCB board during PCB production on the exposure machine table, which leads to poor quality, this utility model provides an anti-wrinkle fixture for PCB board ink curing.

[0004] To achieve the above objectives, this utility model provides an anti-wrinkle fixture for PCB board ink curing, including a protective pad. The size of the protective pad is adapted to the exposure area of ​​the exposure machine. The protective pad is placed on the exposure machine, and protective components for adsorbing solder resist ink are provided on both sides of the protective pad. The protective pad is provided with mounting slots for placing the PCB board, and the PCB board is placed in the mounting slots.

[0005] As an improvement of this utility model, the protective pad is provided with a plurality of air guide holes for venting, and the air guide holes are connected to the wall of the mounting slot.

[0006] As an improvement of this utility model, the protective component is a protective film, which covers both sides of the front of the protective pad and is detachably connected to the protective pad.

[0007] As an improvement of this utility model, a guide structure is formed on the protective pad, and the guide structure is used to guide the protective film to be installed on the protective pad.

[0008] As an improvement of this utility model, the guide structure is a positioning protrusion provided on the edge of the protective pad, and the two ends of the protective film are respectively provided with positioning holes that cooperate with the guide structure. The positioning hole at one end of the protective film is fitted with the positioning protrusion, and the positioning hole at the other end cooperates with it, so that the protective film is assembled on the protective pad.

[0009] As an improvement of this utility model, the protective film is connected to the protective pad by adhesive.

[0010] As an improvement of this utility model, the protective pad is a resin pad.

[0011] The beneficial effects of this utility model are as follows: Compared with the prior art, the anti-wrinkle fixture for PCB board ink curing provided by this utility model includes a protective pad. The size of the protective pad is adapted to the exposure part of the exposure machine table. The protective pad is placed on the exposure machine table, and protective components for adsorbing solder resist ink are provided on both sides of the protective pad. The protective pad is provided with mounting slots for placing the PCB board, and the PCB board is placed in the mounting slots. The protective pad can act as a bottom pressure-bearing component of the PCB board, effectively transferring the pressure on the PCB board to avoid film indentations on the PCB board. At the same time, the protective components can adsorb solder resist ink, preventing the ink from sticking back onto the PCB board or the exposure machine table, improving the overall cleanliness of the exposure machine table, and reducing the number of times and effort required for workers to clean the exposure machine table. Attached Figure Description

[0012] Figure 1 This is a top view of the protective pad of this utility model; Figure 2 This is a perspective view of the protective pad of this utility model; Figure 3 This is a perspective view of the protective film of this utility model.

[0013] The symbols for the main components are explained below: 1. Protective pad; 2. Protective film; 3. Mounting slot; 4. Air vent; 5. Positioning protrusion; 6. Positioning hole. Detailed Implementation

[0014] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide a further picture.

[0015] In the following description, specific examples are given to provide a more in-depth understanding of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of them. It should be understood that the specific embodiments described are only used to explain the present invention and are not intended to limit the present invention.

[0016] It should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of the said feature, integral, step, operation, element, or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0017] In the solder mask production process of PCB boards, the circuits on the film are printed onto the PCB board using an exposure machine. However, the PCB board is prone to film indentation and ink backslide onto the PCB board surface, leading to problems such as poor PCB board quality. Therefore, there is an urgent need for a pad that can avoid film indentation on the PCB board and prevent ink backslide onto the PCB board surface to solve the above-mentioned drawbacks.

[0018] Please see Figure 1 This utility model discloses an anti-wrinkle fixture for PCB board ink curing, comprising a protective pad 1. The size of the protective pad 1 is adapted to the exposure area of ​​the exposure machine. The protective pad 1 is placed on the exposure machine, and protective components for adsorbing solder resist ink are provided on both sides of the protective pad 1. The protective pad 1 has mounting slots 3 for placing the PCB board, and the PCB board is placed in the mounting slots 3. This utility model provides a protective pad 1 with mounting slots 3 for placing the PCB board, thereby providing pressure protection for the PCB board. When the exposure machine is working, the protective pad... 1. Placed below the PCB board, when the cover of the exposure machine is pressed down, the pressure is transmitted through the PCB board to the protective pad 1. The original PCB board is placed directly on the exposure machine table, while the protective pad 1 can act as the bottom pressure-bearing component of the PCB board, effectively absorbing pressure and preventing film indentations on the PCB board from affecting its quality. This effectively improves the problem of PCB quality defects. At the same time, the protective pad 1 is equipped with a protective component for absorbing solder resist ink, which can also effectively prevent ink from sticking back onto the PCB board or the exposure machine table, improving the overall cleanliness of the exposure machine table and reducing the number of times and effort required for workers to clean the exposure machine table.

[0019] In this embodiment, the protective pad 1 is provided with a plurality of air guide holes 4 for venting. The air guide holes 4 are connected to the wall of the mounting slot 3. Since there is a certain air gap between the protective pad 1 and the PCB board, it affects the flatness and curing effect of the PCB board. The exposure machine can suck out the air in the air gap, and the air guide holes 4 can prevent poor air intake. The air guide holes 4 are evenly distributed on the protective pad 1 to ensure that the air can be smoothly discharged during the process of adsorbing solder resist ink, and to maintain the tight fit between the protective pad 1 and the PCB board.

[0020] In this embodiment, the protective component is a protective film 2, which covers both sides of the front of the protective pad 1 and is detachably connected to the protective pad 1. The protective film 2 can be tightly attached to the protective pad 1, ensuring that the effect of absorbing solder resist ink is consistent. Furthermore, the protective film 2 can be removed from the protective pad 1 for cleaning and can be reused multiple times. Using the pad makes cleaning and disassembly and replacement more convenient, which can effectively improve the production efficiency of PCB boards.

[0021] In this embodiment, a guide structure is formed on the protective pad 1. The guide structure is used to guide the protective film 2 to be installed on the protective pad 1. The guide structure enables the protective film 2 to be quickly positioned during the installation process, avoiding problems such as displacement or wrinkling of the protective film 2 due to improper installation, and further ensuring the flatness and quality stability of the PCB board during the ink curing process. Specifically, the guide structure consists of a positioning protrusion 5 located on the edge of the protective pad 1. Positioning holes 6, which mate with the guide structure, are also provided at both ends of the protective film 2. During installation, simply fit the positioning hole 6 at one end of the protective film 2 with the positioning protrusion 5, and then adjust the other end to mate the positioning hole 6. This allows the protective film 2 to be easily mounted onto the protective pad 1. The entire installation process is simple and quick. Thus, the positioning protrusion 5 assists workers in positioning the film, enabling quick replacement and disassembly of the protective film 2, while also enhancing the tightness of the protective film 2's adhesion to the protective pad 1. Furthermore, the protective film 2 is connected to the protective pad 1 via adhesive. This adhesive connection method ensures a tight fit between the protective film 2 and the protective pad 1, while also facilitating the disassembly and replacement of the protective film 2, thus saving considerable production costs.

[0022] In this embodiment, the protective pad 1 is a resin pad. The protective pad 1 is made of resin material, which has good heat resistance, chemical corrosion resistance and mechanical strength, and can ensure stable performance during long-term use.

[0023] The advantages of this utility model are: 1. The protective pad can serve as a bottom pressure-bearing component of the PCB board, effectively transferring the pressure on the PCB board to avoid film indentations on the PCB board. At the same time, the protective pad can absorb solder resist ink, preventing the ink from sticking back onto the PCB board or the exposure machine table, improving the overall cleanliness of the exposure machine table, and reducing the number of times and effort required for workers to clean the exposure machine table.

[0024] The above-disclosed embodiments are only a few specific examples of this utility model. However, this utility model is not limited thereto. Any variations that can be conceived by those skilled in the art should fall within the protection scope of this utility model.

Claims

1. A PCB board ink curing anti-wrinkle fixture, characterized in that, The device includes a protective pad, the size of which is adapted to the exposure area of ​​the exposure machine. The protective pad is placed on the exposure machine and has protective components on both sides for absorbing solder resist ink. The protective pad has mounting slots for placing PCB boards, and the PCB boards are placed in the mounting slots.

2. The anti-wrinkle fixture for PCB board ink curing according to claim 1, characterized in that, The protective pad has multiple air vents for venting, and the air vents are connected to the wall of the mounting slot.

3. The anti-wrinkle fixture for PCB board ink curing according to claim 1, characterized in that, The protective component is a protective film, which covers both sides of the front of the protective pad and is detachably connected to the protective pad.

4. The anti-wrinkle fixture for PCB board ink curing according to claim 3, characterized in that, A guide structure is formed on the protective pad, which is used to guide the protective film to be installed on the protective pad.

5. The anti-wrinkle fixture for PCB board ink curing according to claim 4, characterized in that, The guide structure is a positioning protrusion set on the edge of the protective pad. The protective film has positioning holes at both ends that cooperate with the guide structure. The positioning hole at one end of the protective film is fitted with the positioning protrusion, and the positioning hole at the other end is engaged with the positioning hole, so that the protective film is assembled on the protective pad.

6. The anti-wrinkle fixture for PCB board ink curing according to claim 3, characterized in that, The protective film is attached to the protective pad by means of adhesive.

7. The anti-wrinkle fixture for PCB board ink curing according to claim 1, characterized in that, The protective pad is a resin pad.

Images