A high-precision lamination device for multilayer circuit board production

Abstract

This utility model discloses a high-precision lamination device for multilayer circuit board production, belonging to the field of high-precision lamination technology for multilayer circuit board production. The key technical points are: it includes a worktable and a hydraulic telescopic rod. A pressure plate is provided at the telescopic end of the hydraulic telescopic rod. A separation mechanism is provided on the pressure plate. When the hydraulic telescopic rod retracts, a sensor in the separation mechanism controls the start of an air pump, causing compressed air to be delivered to an air supply pipe in the separation mechanism. The gas in the air supply pipe is then transported into multiple grooves in the separation mechanism. The multiple grooves on the pressure plate correspond to the non-functional areas of the multilayer lamination board. Each group of grooves is in the shape of a horizontal trapezoid, with the narrow end of each trapezoidal groove close to the center of the pressure plate and the wide end far from the center. This solves the problem in the prior art where the laminated circuit board cannot be quickly removed, affecting processing efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of high-precision lamination technology in the production of multilayer circuit boards, and in particular, it is a high-precision lamination device for the production of multilayer circuit boards. Background Technology

[0002] Multilayer circuit boards are printed circuit boards made of three or more conductive copper foil layers stacked and pressed together with insulating materials (such as prepreg or resin). By integrating multiple circuit layers on a single substrate, they achieve more complex electrical connections and functional layouts. At the same time, multilayer circuit boards also have non-functional areas (such as board edges or waste edges). These non-functional areas are additional blank areas surrounding the actual circuit body.

[0003] High-precision lamination equipment for multilayer circuit board production is a device used in the manufacturing process of multilayer printed circuit boards to tightly bond multilayer circuit substrates with insulating layers, copper foils, and other materials by precisely controlling temperature, pressure, and positional relationships. It aims to ensure precise alignment between layers, no air bubble residue, and high reliability and consistency to meet the design requirements of high-density interconnect boards and complex circuits.

[0004] Existing high-precision lamination equipment for multilayer circuit board production applies high temperature and pressure during the lamination of multilayer circuit boards, causing the epoxy resin in the prepreg to flow and penetrate into the tiny gap between the circuit board and the pressure plate. When the resin cures, its molecular chains form a three-dimensional network structure through physical entanglement and chemical cross-linking, "anchoring" the circuit board to the pressure plate. This results in the inability to quickly remove the laminated circuit board, affecting processing efficiency.

[0005] The purpose of this invention is to provide a high-precision lamination device for the production of multilayer circuit boards, so as to solve the problems mentioned in the background art. Utility Model Content

[0006] The purpose of this invention is to provide a high-precision lamination device for the production of multilayer circuit boards, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-precision lamination device for multilayer circuit board production, comprising a worktable and a hydraulic telescopic rod, wherein a pressure plate is provided at the telescopic end of the hydraulic telescopic rod; The pressure plate is equipped with a separation mechanism; When the hydraulic telescopic rod retracts, the air pump in the separation mechanism is started by the sensor in the separation mechanism, so that the compressed air is delivered to the air supply pipe in the separation mechanism, and the gas in the air supply pipe is delivered into multiple grooves in the separation mechanism. The multiple grooves on the pressure plate correspond to the non-functional areas of the multi-layer laminated plate. Each group of grooves is in the shape of a horizontal trapezoid, with the narrow end of each trapezoidal groove close to the center of the pressure plate and the wide end far from the center of the pressure plate. The outlet of the gas pipe is located at the narrow end of each group of grooves.

[0008] Furthermore, the telescopic ends of the hydraulic telescopic rod are symmetrically provided with connecting frames, and both sets of connecting frames are provided with vibration mechanisms. Multiple moving rods are provided on both sides of the workbench, and each set of moving rods corresponds to a baffle in the vibration mechanism. When the hydraulic telescopic rod retracts, it drives the pressure plate to move upward. When the pressure plate moves upward, it synchronously drives the support plate in the vibration mechanism to move upward through two sets of connecting frames. When the support plate moves upward, it drives the vibrating plate in the vibration mechanism to move upward. When the vibrating plate moves upward, it drives the baffle in the vibration mechanism to move upward. After the baffle moves upward and disengages from each set of moving rods, each set of springs in the vibration mechanism rebounds, causing the baffle and the vibrating plate to instantly reset. After the vibrating plate instantly resets, one end of the vibrating plate, which is semi-cylindrical, instantly impacts the pressure plate. This instantaneous impact of the vibrating plate on the pressure plate causes the pressure plate to vibrate, thereby achieving a separation effect.

[0009] Furthermore, the separation mechanism includes an air pump, a sensor, an air supply pipe, and grooves. The air pump is installed on the pressure plate, and the sensor is installed on the air pump. The pressing surface of the pressure plate has multiple grooves, and each set of grooves is connected to the air pump through an air supply pipe to facilitate separation by high-pressure gas.

[0010] Furthermore, each set of vibration mechanisms includes a support plate, a vibration plate, a baffle, and a spring. Both sets of connecting frames are provided with support plates, both sets of support plates are slidably provided with vibration plates, and both sets of vibration plates are provided with baffles at the ends away from the pressure plate. Both sets of baffles are connected to the adjacent support plates by multiple sets of equidistant springs, so as to facilitate the vibration of the pressure plate by the vibration plate to achieve the separation effect.

[0011] Furthermore, a base is provided on the upper end of the workbench and corresponding to the pressure plate position, and a detector is provided on the workbench. A support frame is provided on the workbench, and a hydraulic telescopic rod is provided on the support frame. A heater is provided inside the base to facilitate the pressing and forming of multilayer circuit boards.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. This utility model uses a separation mechanism set on the pressure plate. The air pump is started by a sensor. At the same time, the gas generated by the air pump enters each set of trapezoidal grooves through the air supply pipe. At this time, the gas in each set of grooves forms a local high pressure zone between the multi-layer circuit board and the pressure plate, forcing air to infiltrate and break the vacuum adsorption. This achieves the cutting off of the intermolecular forces between the resin and the pressure plate, thereby solving the problem in the prior art that the circuit board cannot be quickly removed after pressing, which affects the processing efficiency.

[0013] 2. This utility model utilizes a vibration mechanism mounted on two sets of connecting frames. When the pressure plate is moved upward by a hydraulic telescopic rod, the two sets of connecting frames move upward synchronously. As the two sets of connecting frames move upward, they drive the two sets of support plates upward. As the two sets of support plates move upward, they drive the two sets of vibrating plates upward. As the two sets of vibrating plates move upward, they drive the two sets of baffles upward. After the two sets of baffles move upward and disengage from the moving rod, each set of springs rebounds, causing the baffles and vibrating plates to instantly reset. After the two sets of vibrating plates instantly reset, one end of the two sets of vibrating plates, which are semi-cylindrical, instantly impacts the pressure plate, thereby generating vibration on the pressure plate. This effectively utilizes the instantaneous release of energy stored in the springs to drive the vibrating plates to impact the pressure plate, generating a dynamic separation force far exceeding the static tensile force, thus achieving the separation of multi-layer circuit boards from the pressure plate. Attached Figure Description

[0014] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of the workbench in this utility model; Figure 3 This is a schematic diagram of the connecting frame in this utility model; Figure 4 This utility model Figure 3 Enlarged structural diagram at point A; Figure 5 This is a schematic diagram of the structure of the pressure plate of this utility model; Figure 6 This utility model Figure 3 Enlarged structural diagram at point B; Figure 7 This utility model Figure 2 Enlarged structural diagram at point C.

[0016] Explanation of reference numerals in the attached figures: In the picture: 1. Workbench; 2. Base; 3. Detector; 4. Support frame; 5. Hydraulic telescopic rod; 6. Pressure plate; 7. Separation mechanism; 701. Air pump; 702. Sensor; 703. Air supply pipe; 704. Groove; 8. Connecting frame; 9. Vibration mechanism; 901. Support plate; 902. Vibration plate; 903. Baffle; 904. Spring; 10. Moving rod; 11. Heater. Detailed Implementation

[0017] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0018] Unless otherwise defined, the directions mentioned herein, such as up, down, left, right, front, back, inside, and outside, are based on the directions shown in the figures of this utility model, and are explained here together.

[0019] The connection method can be any existing method, such as bonding, welding, or bolting, depending on the actual needs.

[0020] Please see Figures 1 to 7 As shown, this utility model provides a high-precision pressing device for the production of multilayer circuit boards, including a worktable 1 and a hydraulic telescopic rod 5. The telescopic end of the hydraulic telescopic rod 5 is provided with a pressure plate 6, which is used to press the multilayer circuit board. Among them, the pressure plate 6 is provided with a separation mechanism 7, which is used to realize the gas generated by the air pump 701 to impact the multi-layer circuit board, thereby achieving the separation of the multi-layer circuit board. When the hydraulic telescopic rod 5 retracts, the air pump 701 in the separation mechanism 7 is started by the sensor 702 in the separation mechanism 7, so that the compressed air of the air pump 701 is delivered to the air supply pipe 703 in the separation mechanism 7, and the gas in the air supply pipe 703 is delivered into the multiple grooves 704 in the separation mechanism 7. The multiple grooves 704 on the pressure plate 6 correspond to the non-functional areas of the multilayer laminated plate. They are used to prevent the grooves 704 from damaging the functional areas of the circuit board during the pressing process. Each set of grooves 704 is in the shape of a horizontal trapezoid. It is used to enhance the Bernoulli effect, accelerate the airflow to the speed of sound through the contraction section, and form a low-pressure zone at the outlet section, generating a strong adsorption difference. This is to actively "pull" the circuit board away from the pressure plate 6. The narrow end of each set of trapezoidal grooves 704 is close to the center of the pressure plate 6, and the wide end is far away from the center of the pressure plate 6. The outlet end of the gas pipe 703 is located at the narrow end of each set of grooves 704. This is used to ensure that when high-pressure gas is forced through the narrow end inlet of the trapezoidal groove 704, according to the continuity equation (A1v1 = A2v2), the cross-sectional area decreases sharply, resulting in a sharp increase in airflow velocity (up to supersonic speed). At this time, according to Bernoulli's principle, the increase in flow velocity is inevitably accompanied by a significant decrease in static pressure, forming a local low-pressure zone, thereby improving the separation effect. The separation mechanism 7 includes an air pump 701, a sensor 702, an air supply pipe 703, and grooves 704. The air pump 701 is installed on the pressure plate 6 to compress gas. The sensor 702 is installed on the air pump 701 to control the start of the air pump 701. Multiple grooves 704 are formed on the pressing surface of the pressure plate 6 to deliver gas to the circuit board. Each set of grooves 704 is connected to the air pump 701 through the air supply pipe 703, which is used to deliver the gas generated by the air pump 701 to each set of grooves 704 through the air supply pipe 703.

[0021] The extension end of the hydraulic telescopic rod 5 is symmetrically provided with connecting frames 8. Both sets of connecting frames 8 are provided with vibration mechanisms 9. Multiple moving rods 10 are provided on both sides of the workbench 1. When the pressure plate 6 moves downward, each set of moving rods 10 contacts the baffle 903 and moves the baffle 903 outward. Each set of moving rods 10 corresponds to the baffle 903 in the vibration mechanism 9. When the hydraulic telescopic rod 5 retracts, it drives the pressure plate 6 to move upward. When the pressure plate 6 moves upward, it drives the support plate 901 in the vibration mechanism 9 to move upward through the two sets of connecting frames 8. When the support plate 901 moves upward, it drives the vibrating plate 902 in the vibration mechanism 9 to move upward. When the vibrating plate 902 moves upward, it drives the baffle 903 in the vibration mechanism 9 to move upward. After the baffle 903 moves upward and disengages from each set of moving rods 10, it is rebounded by each set of springs 904 in the vibration mechanism 9, which causes the baffle 903 and the vibrating plate 902 to return to their original positions instantly. After the vibrating plate 902 returns to its original position instantly, one of the semi-cylindrical ends of the vibrating plate 902 strikes the pressure plate 6 instantly. Each set of vibration mechanisms 9 includes a support plate 901, a vibration plate 902, a baffle 903, and a spring 904. Support plates 901 are provided on both sets of connecting frames 8. Vibration plates 902 are slidably provided on both sets of support plates 901. They are used to realize that the vibration plates 902 will hit the pressure plate 6 instantly, causing the pressure plate 6 to vibrate, thereby achieving the separation effect of the circuit board. A baffle 903 is provided at the end of each set of vibration plates 902 away from the pressure plate 6. It is used to realize the synchronous movement of the vibration plates 902. Both sets of baffles 903 are connected to the adjacent support plates 901 by multiple sets of equidistant springs 904. They are used to realize that the elasticity of the springs 904 will make the vibration plates 902 hit the pressure plate 6 instantly.

[0022] A base 2 is provided on the upper end of the workbench 1 and at the position corresponding to the pressure plate 6. A detector 3 is provided on the workbench 1 to detect the stacking neatness of the multi-layer circuit boards. A support frame 4 is provided on the workbench 1, and a hydraulic telescopic rod 5 is provided on the support frame 4 to control the vertical movement of the pressure plate 6. A heater 11 is provided inside the base 2 to assist in the pressing and forming of the multi-layer circuit boards by the pressure plate 6.

[0023] Working principle: When it is necessary to prevent the multi-layer circuit board from adhering to the pressure plate 6, after the pressure plate 6 moves upward with the hydraulic telescopic rod 5, the sensor 702 controls the air pump 701 to start. At the same time, the gas generated by the air pump 701 enters each set of trapezoidal grooves 704 through the air supply pipe 703. At this time, the gas in each set of grooves 704 forms a local high pressure zone between the multi-layer circuit board and the pressure plate 6, forcing air to infiltrate and break the vacuum adsorption, thereby cutting off the intermolecular forces between the resin and the pressure plate 6. Simultaneously, when the hydraulic telescopic rod 5 drives the pressure plate 6 to move upward, the two sets of connecting frames 8 move upward synchronously. When the two sets of connecting frames 8 move upward, they drive the two sets of support plates 901 to move upward. When the two sets of support plates 901 move upward, they drive the two sets of vibrating plates 902 to move upward. When the two sets of vibrating plates 902 move upward, they drive the two sets of baffles 903 to move upward. After the two sets of baffles 903 move upward and disengage from the moving rod 10, each set of springs 904 rebounds, causing the baffles 903 and vibrating plates 902 to instantly reset. After the two sets of vibrating plates 902 instantly reset, one end of the two sets of vibrating plates 902, which are semi-cylindrical, instantly strikes the pressure plate 6, thereby generating vibration on the pressure plate 6.

[0024] It should be noted that, in this document, relational terms such as "one" and "two" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision lamination device for multilayer circuit board production, characterized in that: It includes a workbench (1) and a hydraulic telescopic rod (5), and the telescopic end of the hydraulic telescopic rod (5) is provided with a pressure plate (6). The pressure plate (6) is provided with a separation mechanism (7); When the hydraulic telescopic rod (5) retracts, the air pump (701) in the separation mechanism (7) is started by the sensor (702) in the separation mechanism (7), so that the air compressed by the air pump (701) is delivered to the air supply pipe (703) in the separation mechanism (7), and the gas in the air supply pipe (703) is delivered into the multiple grooves (704) in the separation mechanism (7); The multiple grooves (704) opened on the pressure plate (6) correspond to the non-functional areas of the multilayer press plate. Each set of grooves (704) is in the shape of a horizontal trapezoid, and the narrow end of each set of trapezoidal grooves (704) is close to the center of the pressure plate (6), while the wide end is far away from the center of the pressure plate (6). The outlet end of the gas pipe (703) is located at the narrow end of each set of grooves (704).

2. The high-precision lamination device for multilayer circuit board production according to claim 1, characterized in that: The extension end of the hydraulic telescopic rod (5) is symmetrically provided with connecting frames (8), and both sets of connecting frames (8) are provided with vibration mechanisms (9). Multiple moving rods (10) are provided on both sides of the workbench (1), and each set of moving rods (10) corresponds to the baffle (903) in the vibration mechanism (9). When the hydraulic telescopic rod (5) retracts, it drives the pressure plate (6) to move upward. When the pressure plate (6) moves upward, it drives the support plate (901) in the vibration mechanism (9) to move upward synchronously through two sets of connecting frames (8). When the support plate (901) moves upward, it drives the vibration plate (902) in the vibration mechanism (9) to move upward. When the vibration plate (902) moves upward, it drives the baffle (903) in the vibration mechanism (9) to move upward. After the baffle (903) moves upward and disengages from each set of moving rods (10), each set of springs (904) in the vibration mechanism (9) rebounds, causing the baffle (903) and the vibration plate (902) to instantly reset. After the vibration plate (902) instantly resets, one end of the vibration plate (902) in a semi-cylindrical shape instantly strikes the pressure plate (6).

3. The high-precision lamination device for multilayer circuit board production according to claim 2, characterized in that: The separation mechanism (7) includes an air pump (701), a sensor (702), an air supply pipe (703), and a groove (704). The pressure plate (6) is equipped with an air pump (701) and a sensor (702) is equipped on the air pump (701). The pressing surface of the pressure plate (6) is provided with a plurality of grooves (704). Each set of grooves (704) is connected to the air pump (701) through an air supply pipe (703).

4. A high-precision lamination device for multilayer circuit board production according to claim 3, characterized in that: Each set of vibration mechanisms (9) includes a support plate (901), a vibration plate (902), a baffle (903), and a spring (904). Both sets of connecting frames (8) are provided with support plates (901), and both sets of support plates (901) are slidably provided with vibration plates (902). Both sets of vibration plates (902) are provided with a baffle (903) at the end away from the pressure plate (6). Both sets of baffles (903) are connected to the adjacent support plates (901) by multiple sets of equidistant springs (904).

5. A high-precision lamination device for multilayer circuit board production according to claim 4, characterized in that: A base (2) is provided on the upper end of the workbench (1) and at the position corresponding to the pressure plate (6), and a detector (3) is provided on the workbench (1). A support frame (4) is provided on the workbench (1), and a hydraulic telescopic rod (5) is provided on the support frame (4). A heater (11) is provided inside the base (2).

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