Sealing auxiliary tool for bottomless IGBT module

Abstract

The utility model discloses a kind of bottom plate IGBT module sealing auxiliary tool, lower clamp forms multiple shell containing area, for placing the shell of bottom plate IGBT module;Spring assembly 4 are a group in the mounting hole of mounting plate fixed to upper clamp;After placing upper clamp on the shell and DBC substrate of each to be sealed bottom plate IGBT module being placed, the contact block of spring assembly lower end will be supported to the back of DBC substrate and produce compression deformation, contact block is contacted with DBC substrate by spring deformation force, can guarantee that the stress of DBC substrate is uniform and accurate, guarantee the DBC substrate of bottom plate IGBT module and shell stable contact, to improve the reliability of bottom plate IGBT module batch production sealing.

Description

Technical Field

[0001] This utility model relates to tooling, and in particular to a bottomless IGBT module sealing auxiliary tooling. Background Technology

[0002] A baseless IGBT module consists of a DBC (Direct Bonded Copper Ceramic) substrate, a chip, signal terminals, power terminals, a housing, and protective adhesive. The signal and power terminals are metal pins, and the chip and metal pins are soldered to the DBC surface. Traditional sealing methods for baseless IGBT modules use clamps or complex tooling to achieve a seal and secure the connection between the DBC and the housing, but these methods struggle to address issues such as copper oxidation, consistency, and ease of manufacturing. Utility Model Content

[0003] The technical problem to be solved by this utility model is to ensure stable contact between the DBC substrate of the baseless IGBT module and the housing, thereby improving the reliability of sealing in mass production of baseless IGBT modules.

[0004] To solve the above-mentioned technical problems, the present invention provides an IGBT sealing auxiliary tooling, which includes an upper clamp 1 and a lower clamp 2.

[0005] The lower clamp 2 includes a frame 20, a shell placement platform 26, a positioning fence 28, and a shell isolation fence 27;

[0006] The outer shell placement platform 26, the positioning fence 28, and the outer shell isolation fence 27 are fixed inside the frame 20;

[0007] The frame 20 is rectangular, the length direction of the outer shell placement platform 26 and the positioning fence 28 is the front-to-back direction, and the length direction of the outer shell isolation fence 27 is the left-to-right direction.

[0008] The upper and lower ends of K positioning fences 28 are respectively fixed to the upper and lower borders of the frame 20, dividing the area inside the frame 20 into K+1 module placement areas, where K is a positive integer;

[0009] A housing placement platform 26 is fixed to the right side of the left frame 20; a housing placement platform 26 is fixed to the left side of the right frame 20; housing placement platforms 26 are fixed to the left and right sides of the positioning fence 28 respectively; the upper surface of the housing placement platform 26 is lower than the upper surface of the positioning fence 28 and the upper surface of the frame 20.

[0010] The left frame 20 of the same module placement area is separated from the positioning fence 28, or the right frame 20 is separated from the positioning fence 28, or the two adjacent positioning fences 28, by J shell isolation fences 27 into J+1 shell accommodating areas that are sequentially adjacent to each other.

[0011] The upper clamp 1 includes a mounting plate 10 and a spring assembly;

[0012] The mounting plate 10 is a rectangular plate that is consistent with the perimeter of the frame 20;

[0013] The mounting plate 10 has 2(K+1) columns and 2(J+1) rows of mounting holes 11;

[0014] When the mounting plate 10 is placed directly above the frame 20 of the lower clamp 2, the vertical projections of the four mounting holes 11 are located within the same housing area.

[0015] The spring assembly includes a helical spring and a contact block;

[0016] The contact block is fixed to the lower end of the helical spring;

[0017] The upper ends of the helical springs in each spring assembly are fixed in the corresponding mounting holes 11.

[0018] The contact blocks of each spring assembly are used to abut against the back of the DBC substrate of each bottomless IGBT module to be sealed.

[0019] Preferably, the contact block is made of Teflon material.

[0020] Preferably, at least one lower positioning hole 21 is formed on the positioning fence 28 of the lower clamp 2.

[0021] Preferably, each of the outer shell isolation fences 27 of the lower clamp 2 has an upwardly protruding support block 271 formed on the left and right sides of its upper end face, for supporting the front side of the DBC substrate 31 of the bottomless IGBT module.

[0022] Preferably, the mounting hole 11 is a through hole or a blind hole with the opening facing downwards.

[0023] Preferably, the mounting plate 10 of the upper clamp 1 is formed with an upper positioning hole 101 corresponding to the lower positioning hole 21 of the lower clamp 2.

[0024] Preferably, the diameter of the lower positioning hole 21 and the upper positioning hole 101 is 8mm to 12mm.

[0025] Preferably, the mounting plate 10 of the upper clamp 1 is fixedly mounted with upper locking buckles 102 at its front end and rear end respectively;

[0026] The upper frame 20 and lower frame of the lower clamp 2 are respectively fixedly provided with lower locking buckles;

[0027] By engaging the upper locking buckle 102 with the lower locking buckle, the upper clamp 1 and the lower clamp 2 can be locked together.

[0028] This utility model discloses a bottomless IGBT module sealing auxiliary fixture. The lower clamp 2 forms multiple housing areas for placing the bottomless IGBT module housings. Four spring assemblies are fixed to the mounting holes 11 of the mounting plate 10 of the upper clamp 1, forming a group. After the upper clamp 1 is placed on the housings of the bottomless IGBT modules to be sealed and the DBC substrate, the contact blocks at the lower ends of the spring assemblies, whose upper ends are fixed to the mounting holes 11 of the mounting plate 10 of the upper clamp 1, abut against the back of the DBC substrate of each bottomless IGBT module to be sealed, generating compression deformation. The contact blocks contact the DBC substrate through the spring deformation force, ensuring uniform and accurate force on the DBC substrate and stable contact between the DBC substrate and the housing, thereby improving the reliability of sealing in mass production of bottomless IGBT modules. Furthermore, the lower clamp 2 of this bottomless IGBT module sealing auxiliary fixture is compatible and stable, usable in both sealing and baking stations. This bottomless IGBT module sealing auxiliary tooling not only meets the needs of mass production of bottomless IGBT modules, but also ensures the stability and consistency of the connection between the DBC substrate and the shell, and can better prevent DBC copper oxidation. Attached Figure Description

[0029] To more clearly illustrate the technical solution of this utility model, the drawings used in this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a three-dimensional structural diagram of the lower clamp of an embodiment of the bottomless IGBT module sealing auxiliary tooling of this utility model;

[0031] Figure 2 This is a three-dimensional structural schematic diagram of an embodiment of the bottomless IGBT module sealing auxiliary tooling of this utility model;

[0032] Figure 3 This is a schematic diagram of a baseless IGBT module structure.

[0033] Explanation of reference numerals in the attached figures:

[0034] 2 Lower clamp; 20 Frame; 21 Lower positioning hole; 26 Housing placement platform; 28 Positioning fence; 27 Housing isolation fence; 271 Support block; 1 Upper clamp; 10 Mounting plate; 11 Mounting hole; 101 Upper positioning hole; 102 Upper latch; 31 DBC substrate; 33 Power PIN pin; 38 Aluminum wire; 39 IGBT chip. Detailed Implementation

[0035] The technical solutions of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0036] Example 1

[0037] A bottomless IGBT module sealing auxiliary tooling includes an upper clamp 1 and a lower clamp 2;

[0038] like Figure 1 As shown, the lower clamp 2 includes a frame 20, a shell placement platform 26, a positioning fence 28, and a shell isolation fence 27;

[0039] The outer shell placement platform 26, the positioning fence 28, and the outer shell isolation fence 27 are fixed inside the frame 20;

[0040] The frame 20 is rectangular, the length direction of the outer shell placement platform 26 and the positioning fence 28 is the front-to-back direction, and the length direction of the outer shell isolation fence 27 is the left-to-right direction.

[0041] The upper and lower ends of K positioning fences 28 are respectively fixed to the upper and lower borders of the frame 20, dividing the area inside the frame 20 into K+1 module placement areas, where K is a positive integer;

[0042] A housing placement platform 26 is fixed to the right side of the left frame 20; a housing placement platform 26 is fixed to the left side of the right frame 20; housing placement platforms 26 are fixed to the left and right sides of the positioning fence 28 respectively; the upper surface of the housing placement platform 26 is lower than the upper surface of the positioning fence 28 and the upper surface of the frame 20.

[0043] The left frame 20 of the same module placement area is separated from the positioning fence 28, or the right frame 20 is separated from the positioning fence 28, or the two adjacent positioning fences 28, by J shell isolation fences 27 into J+1 shell accommodating areas that are sequentially adjacent to each other.

[0044] like Figure 2 As shown, the upper clamp 1 includes a mounting plate 10 and a spring assembly;

[0045] The mounting plate 10 is a rectangular plate that is consistent with the perimeter of the frame 20;

[0046] The mounting plate 10 has 2(K+1) columns and 2(J+1) rows of mounting holes 11;

[0047] When the mounting plate 10 is placed directly above the frame 20 of the lower clamp 2, the vertical projections of the four mounting holes 11 are located within the same housing area.

[0048] The spring assembly includes a helical spring and a contact block;

[0049] The contact block is fixed to the lower end of the helical spring;

[0050] The upper ends of the helical springs in each spring assembly are fixed in the corresponding mounting holes 11.

[0051] The contact blocks of each spring assembly are used to abut against the back of the DBC substrate of each bottomless IGBT module to be sealed.

[0052] like Figure 3 As shown, the baseless IGBT module includes an IGBT chip 39, a DBC substrate 31, a power PIN pin 33, an aluminum wire 38, and a housing 4; the IGBT chip 39 and the power PIN pin 33 are soldered onto the conductive copper layer on the front side of the DBC substrate 31.

[0053] Electrical connection is achieved between the IGBT chip 39 and the corresponding conductive layer of the DBC substrate 31 via aluminum wire 38 bonding.

[0054] The outer casing 4 is used to fasten to the front of the DBC substrate 31. The IGBT chip 39 and aluminum wire 38 are placed in the cavity formed by the outer casing 4 and the front of the DBC substrate 31. The upper end of the power PIN pin 33 protrudes above the outer casing 4.

[0055] The outer shell 4 is made of plastic, which can be made of one of PBT, PPS, or nylon, or similar high-temperature resistant and insulating plastics.

[0056] The left and right side walls of the outer casing 4 can each be fixed with outwardly protruding lugs; the lugs can be made of metal.

[0057] A sealing method for an IGBT module using the aforementioned bottomless IGBT module sealing auxiliary tooling includes the following steps:

[0058] S1. Install the lower clamp 2 onto the dispensing equipment;

[0059] S2. Place the housings of each IGBT module to be sealed without a base plate into their respective housing receiving areas, with the front of the housing top plate fitting against the housing placement platform 26;

[0060] S3. The dispensing equipment operates, dispensing adhesive evenly onto the back of the top panel of the outer casing;

[0061] S4. Place the DBC substrate of each bottomless IGBT module to be sealed onto the back of the corresponding housing top plate, so that the DBC substrate of each bottomless IGBT module to be sealed is bonded to the housing with adhesive.

[0062] S5. Remove the lower clamp 2, which holds the housings of the various IGBT modules to be sealed without base plates and the DBC substrate, from the dispensing equipment;

[0063] S6. Place the upper clamp 1 on the DBC substrate of each bottomless IGBT module to be sealed on the lower clamp 2; the contact block of each spring assembly abuts against the back of the DBC substrate of each bottomless IGBT module to be sealed.

[0064] S7. Lock the upper clamp 1 together with the lower clamp 2;

[0065] S8. Place the locked upper clamp 1 and lower clamp 2 into the oven for baking.

[0066] The bottomless IGBT module sealing auxiliary fixture of Embodiment 1 has a lower clamp 2 forming multiple housing areas for placing the housings of the bottomless IGBT modules. Four spring assemblies are grouped together and fixed to the mounting holes 11 of the mounting plate 10 of the upper clamp 1. After the upper clamp 1 is placed on the housings of the bottomless IGBT modules to be sealed and the DBC substrate, the contact blocks at the lower ends of the spring assemblies fixed to the mounting holes 11 of the mounting plate 10 of the upper clamp 1 abut against the back of the DBC substrate of each bottomless IGBT module to be sealed, generating compression deformation. The contact blocks contact the DBC substrate through the spring deformation force, ensuring uniform and accurate force on the DBC substrate and stable contact between the DBC substrate and the housing of the bottomless IGBT module, thereby improving the reliability of sealing in mass production of bottomless IGBT modules. Furthermore, the lower clamp 2 of this bottomless IGBT module sealing auxiliary fixture is compatible and stable, usable in both sealing and baking stations.

[0067] The bottomless IGBT module sealing auxiliary tooling in Example 1 not only meets the needs of mass production of bottomless IGBT modules, but also ensures the stability and consistency of the connection between the DBC substrate and the shell, and can better avoid DBC copper oxidation.

[0068] Example 2

[0069] Based on the bottomless IGBT module sealing auxiliary tooling of Embodiment 1, at least one lower positioning hole 21 is formed on the positioning fence 28 of the lower clamp 2.

[0070] In the IGBT module sealing method of the bottomless IGBT module sealing auxiliary tooling, in step S1, the lower clamp 2 is installed on the dispensing equipment, and the lower positioning hole 21 is positioned with the pin on the dispensing equipment.

[0071] Example 3

[0072] Based on the bottomless IGBT module sealing auxiliary tooling of Embodiment 2, the mounting plate 10 of the upper clamp 1 has an upper positioning hole 101 corresponding to the lower positioning hole 21 of the lower clamp 2.

[0073] In the IGBT module sealing method of the bottomless IGBT module sealing auxiliary tooling, in step S6, a positioning pin is inserted into the upper positioning hole 101 of the upper clamp 1 mounting plate 10 and the corresponding lower positioning hole 21 of the lower clamp 2 to make the upper clamp 1 and the lower clamp 2 laterally positioned.

[0074] Preferably, the diameter of the lower positioning hole 21 and the upper positioning hole 101 is 8mm to 12mm (e.g., 10mm).

[0075] Preferably, the contact block is made of Teflon material. Teflon material has the characteristics of heat resistance, non-stickiness, corrosion resistance, low coefficient of friction, wear resistance, and chemical stability.

[0076] Example 4

[0077] Based on the bottomless IGBT module sealing auxiliary tooling of Embodiment 1, each of the outer shell isolation fences 27 of the lower clamp 2 has an upwardly protruding support block 271 formed on the left and right sides of the upper end face, which is used to support the front side of the DBC (direct bonding copper ceramic) substrate 31 of the bottomless IGBT module.

[0078] Preferably, the mounting hole 11 is a through hole or a blind hole with the opening facing downwards.

[0079] Preferably, the mounting plate 10 of the upper clamp 1 is fixedly mounted with upper locking buckles 102 at its front end and rear end respectively;

[0080] The upper frame 20 and lower frame of the lower clamp 2 are respectively fixedly provided with lower locking buckles;

[0081] By engaging the upper locking buckle 102 with the lower locking buckle, the upper clamp 1 and the lower clamp 2 can be locked together.

[0082] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A bottomless IGBT module sealing auxiliary tooling, characterized in that, It includes an upper clamp (1) and a lower clamp (2); The lower clamp (2) includes a frame (20), a shell placement platform (26), a positioning fence (28), and a shell isolation fence (27); The outer shell placement platform (26), positioning fence (28), and outer shell isolation fence (27) are fixed inside the frame (20); The frame (20) is rectangular, the length direction of the outer shell placement platform (26) and the positioning fence (28) is the front-to-back direction, and the length direction of the outer shell isolation fence (27) is the left-to-right direction; The upper and lower ends of the K-root positioning fence (28) are respectively fixed to the upper and lower borders of the frame (20), dividing the area inside the frame (20) into K+1 module placement areas, where K is a positive integer; A shell placement platform (26) is fixed on the right side of the left frame (20); a shell placement platform (26) is fixed on the left side of the right frame (20); a shell placement platform (26) is fixed on the left and right sides of the positioning fence (28); the upper surface of the shell placement platform (26) is lower than the upper surface of the positioning fence (28) and the upper surface of the frame (20); The left frame (20) of the same module placement area is separated from the positioning fence (28) by J shell isolation fences (27), or the right frame (20) is separated from the positioning fence (28) by J shell isolation fences (27), forming J+1 shell accommodating areas that are adjacent to each other. The upper clamp (1) includes a mounting plate (10) and a spring assembly; The mounting plate (10) is a rectangular plate that is consistent with the periphery of the frame (20); The mounting plate (10) has 2 (K+1) columns and 2 (J+1) rows of mounting holes (11). When the mounting plate (10) is placed directly above the frame (20) of the lower clamp (2), the vertical projections of the four mounting holes (11) are located within the same housing accommodating area; The spring assembly includes a helical spring and a contact block; The contact block is fixed to the lower end of the helical spring; The upper ends of the helical springs of each spring assembly are fixed in the corresponding mounting holes (11); The contact blocks of each spring assembly are used to abut against the back of the DBC substrate of each bottomless IGBT module to be sealed.

2. The bottomless IGBT module sealing auxiliary tooling according to claim 1, characterized in that, The contact block is made of Teflon material.

3. The bottomless IGBT module sealing auxiliary tooling according to claim 1, characterized in that, At least one lower positioning hole (21) is formed on the positioning fence (28) of the lower clamp (2).

4. The bottomless IGBT module sealing auxiliary tooling according to claim 1, characterized in that, Each of the outer shell isolation fences (27) of the lower clamp (2) has an upwardly protruding support block (271) formed on the left and right sides of the upper end face, which is used to support the front of the DBC substrate (31) of the bottomless IGBT module.

5. The bottomless IGBT module sealing auxiliary tooling according to claim 1, characterized in that, The mounting hole (11) is a through hole or a blind hole with the opening facing downwards.

6. The bottomless IGBT module sealing auxiliary tooling according to claim 3, characterized in that, Corresponding to the lower positioning hole (21) of the lower clamp (2), the mounting plate (10) of the upper clamp (1) is formed with an upper positioning hole (101).

7. The bottomless IGBT module sealing auxiliary tooling according to claim 6, characterized in that, The diameters of the lower positioning hole (21) and the upper positioning hole (101) are 8mm to 12mm.

8. The bottomless IGBT module sealing auxiliary tooling according to claim 1, characterized in that, The upper clamp (1) has upper locking buckles (102) fixedly installed at the front and rear ends of the mounting plate (10). The upper frame (20) and lower frame of the lower clamp (2) are respectively fixedly provided with lower locking buckles; By engaging the upper latch (102) with the lower latch, the upper clamp (1) and the lower clamp (2) can be locked together.

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