A local heat dissipation device

Abstract

The utility model provides a local heat abstractor for local heat source's heat dissipation, include: high heat block, high heat block abuts on the heat source along first direction, high heat block has the thermal conductivity in first direction, diffusion block, diffusion block abuts on the side of high heat block opposite to the heat source along first direction, diffusion block has the thermal conductivity in first direction and first plane, and the first plane is the plane with first direction as normal, heat dissipation mechanism, heat dissipation mechanism abuts on the side of diffusion block opposite to the high heat block along first direction, the one side of diffusion block and high heat block abut is first abutment surface, the one side of diffusion block and heat dissipation mechanism abut is second abutment surface, the projection of first abutment surface in first direction is in second abutment surface, and the area of first abutment surface is A, and the area of second abutment surface is B, A < B, the utility model puts forward a kind of local heat abstractor, can efficiently and fast to local high heat area heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of thermal control technology, and in particular to a local heat dissipation device. Background Technology

[0002] With the rapid development of communication technology, artificial intelligence, and other fields, the power of portable devices, high-performance computing devices, data centers, and other equipment is constantly increasing, and the integration of these devices is becoming increasingly sophisticated. The thermal design power is growing exponentially, but the space available for heat dissipation equipment within these devices is becoming increasingly limited. Therefore, heat transfer (heat extraction) devices with ultra-thin dimensions, such as flat-plate heat pipes and vapor chambers, have been successively used in the heat dissipation systems of these high-power devices. These devices transfer heat between the heat source (heat-generating device) and the cold source (external cooling equipment) through the self-heating of the internal working medium (fluid), and then the heat is removed by cooling equipment placed in a large external space, achieving efficient thermal management (temperature control or heat dissipation) for these devices. Existing technologies for heat dissipation of heat-generating electronic components mostly achieve this through direct liquid cooling and air cooling. Liquid cooling solutions often involve arranging finned heat sinks and liquid cooling pipes on the surface of the heat-generating device, transferring heat to an extended surface of equal size through the fins and other structures, and then using a circulating low-temperature liquid to remove the heat. In some devices, heat generation is often non-uniform due to their design and manufacturing process, resulting in localized areas of high heat flux density. There may even be extremely high heat flux density hotspots (very small area, extremely high heat generation) caused by manufacturing defects. In these smaller heat-generating locations, the limited area makes heat dissipation inefficient to meet the heat source's cooling requirements. Therefore, a device is needed to efficiently dissipate heat from these localized high-heat areas. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a local heat dissipation device that can efficiently and quickly dissipate heat from localized high-heat areas.

[0004] According to a first aspect embodiment of the present invention, a local heat dissipation device is used for dissipating heat from a local heat source, comprising: a high-heat block, the high-heat block abutting against the heat source along a first direction, the high-heat block being thermally conductive in the first direction; a diffuser block, the diffuser block abutting against the side of the high-heat block opposite to the heat source along the first direction, the diffuser block being thermally conductive both in the first direction and in a first plane, the first plane being a plane with the first direction as its normal; and a heat dissipation mechanism, the heat dissipation mechanism abutting against the side of the diffuser block opposite to the high-heat block along the first direction; the side of the diffuser block abutting against the high-heat block is a first abutting surface, the side of the diffuser block abutting against the heat dissipation mechanism is a second abutting surface, the projection of the first abutting surface in the first direction lies within the second abutting surface, the area of ​​the first abutting surface is A, and the area of ​​the second abutting surface is B, where A... <B。

[0005] The local heat dissipation device according to the first aspect of this utility model has at least the following beneficial effects: by setting a diffusion block and making the diffusion block thermally conductive in the transverse direction of the heat transfer path, the effective heat transfer area of ​​the heat source, i.e., the area of ​​the first contact surface, is expanded to the area of ​​the second contact surface, thereby greatly improving the efficiency of heat dissipation from the heat source.

[0006] According to some embodiments of the present invention, the thickness of the diffusion block in the first direction is D, the distance between the edge of the first abutting surface and the edge of the second abutting surface is C, and D is not less than 0.2C.

[0007] According to some embodiments of the present invention, the area B of the second contact surface is not less than three times the area A of the first contact surface.

[0008] According to some embodiments of this utility model, the material of the diffusion block is diamond.

[0009] According to some embodiments of the present invention, the diffusion block includes a plurality of diffusion layers, which are stacked sequentially along a first direction, and the projection of the diffusion layer near the heat source in the first direction is within the diffusion layer near the heat dissipation mechanism.

[0010] According to some embodiments of the present invention, the side of the diffusion block facing the high-heat block is a heat-absorbing surface, and the first contact surface is inside the heat-absorbing surface.

[0011] According to some embodiments of the present invention, the heat dissipation mechanism includes a main body block and a heat dissipation plate, the main body block abutting against the diffuser block, and the heat dissipation plate being disposed on the side of the main body block opposite to the diffuser block.

[0012] According to some embodiments of the present invention, a cavity is provided inside the main body block, and a heat-conducting medium is provided inside the cavity, and the heat-conducting medium flows inside the cavity.

[0013] According to some embodiments of the present invention, the heat dissipation mechanism includes a main pipe and a cooling section. One end of the main pipe abuts against the diffuser block, and the cooling section is disposed at the other end of the main pipe. The cooling section is used to cool the main pipe.

[0014] According to some embodiments of the present invention, a flow channel is provided inside the main pipe, and a heat-conducting medium is provided inside the flow channel, and the heat-conducting medium circulates at both ends of the main pipe.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a local heat dissipation device according to the present invention; Figure 2 This is a schematic diagram of the structure of a local heat dissipation device of the present invention, including a diffusion layer; Figure 3 This is a schematic diagram of the structure of a local heat dissipation device according to the present invention, including a main block and a heat dissipation plate; Figure 4 This is a schematic diagram of the heat dissipation mechanism of a local heat dissipation device according to the present invention, including a main pipe and a cooling section.

[0017] Icon labels: 1. Heat dissipation mechanism; 11. Main block; 12. Heat dissipation plate; 13. Main pipe; 14. Cooling section; 2. Diffusion block; 21. First contact surface; 22. Second contact surface; 23. Diffusion layer; 3. High heat block. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] In the description of this utility model, it should be understood that the orientation descriptions, such as up and down, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0021] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0022] Severe localized overheating in equipment can cause numerous hazards, including material damage, functional failure, safety risks, systemic cascading effects, and increased energy loss. Excessively high local temperatures can lead to material softening, oxidation, and even melting. For example, metal components may experience fatigue due to high temperatures, and insulating materials may carbonize and lose their insulating properties. Localized overheating can trigger thermal runaway in internal components; for instance, overheating of batteries can lead to explosions, and damage to transformer insulation can cause short circuits. These functional failures directly impact the normal operation of the equipment. High-temperature environments can ignite flammable materials, especially in environments with oil leaks or dust, where localized overheating can easily cause fires or explosions, posing a serious threat to personnel and equipment safety. Localized temperature anomalies can be conducted to other components, leading to wider malfunctions. For example, overheating of a chip can cause the motherboard to burn out, affecting the stability of the entire system. Localized overheating increases conductor resistance, further exacerbating energy loss. This energy loss not only increases operating costs but can also further exacerbate overheating, creating a vicious cycle.

[0023] Reference Figure 1 and Figure 2, the local heat dissipation device in the first embodiment of the present utility model is used for heat dissipation of a local heat source, and comprises: a high heat block 3, a diffusion block 2 and a heat dissipation mechanism 1, the high heat block 3 abuts against the heat source along a first direction, and the high heat block 3 has thermal conductivity in the first direction. The high heat block 3 can rapidly conduct the heat generated by the heat source to the diffusion block 2 along the first direction. The high heat block 3 performs high-efficiency heat propagation through abutment, so as to conduct the heat of the heat source rapidly. There are two main functions of arranging the high heat block 3. First, the high thermal conductivity block has a small size, and can directly abut against the heat source through the high heat block 3 even in some narrow spaces. Second, the high heat block 3 can isolate the diffusion block 2 from the area around the heat source, thereby preventing the heat on the diffusion block 2 from affecting workpieces in the area around the heat source. Therefore, arranging the high heat block 3 can not only rapidly transfer the heat out of the heat source, but also prevent the diffusion block 2 from affecting the surrounding area of the heat source. The diffusion block 2 abuts against a side of the high heat block 3 facing away from the heat source along the first direction, and the diffusion block 2 has thermal conductivity both in the first direction and in a first plane, wherein the first plane is a plane whose normal direction is the first direction. The diffusion block 2 can not only conduct heat in the first direction, but also uniformly distribute the heat in the first plane, which effectively increases the heat dissipation area and improves the heat dissipation efficiency. After the heat is transferred to the diffusion block 2, the heat is not only transferred longitudinally, that is, transferred along the first direction, but also transferred laterally to a certain extent, that is, transferred in the first plane. This enables the heat to have a larger propagation path after entering the diffusion block 2, thereby improving the propagation efficiency of heat from the heat source. The heat dissipation mechanism 1 abuts against a side of the diffusion block 2 facing away from the high heat block 3 along the first direction; a surface of the diffusion block 2 abutting the high heat block 3 is a first abutment surface 21, and a surface of the diffusion block 2 abutting the heat dissipation mechanism 1 is a second abutment surface 22, the projection of the first abutment surface 21 in the first direction is within the second abutment surface 22, the area of the first abutment surface 21 is A, the area of the second abutment surface 22 is B, and A < B. The heat dissipation mechanism 1, such as a fan or a heat sink, is responsible for further dissipating the heat on the diffusion block 2 into the surrounding environment. This design ensures that heat can be transferred from the heat source to the heat dissipation mechanism 1 quickly and efficiently, and avoids the occurrence of local overheating. Wherein, since the area of the first abutment surface 21 is smaller than the area of the second abutment surface 22, the diffusion block 2 can more effectively disperse the heat from the high heat block 3 to a larger area, that is, the heat has a larger propagation path after entering the diffusion block 2.

[0024] The speed of heat transfer depends on several factors. The basic modes of heat transfer are primarily three: conduction, convection, and radiation. Conduction: Heat is transferred within a solid from a high-temperature region to a low-temperature region, or between solids at different temperatures. The speed of conduction is affected by the thermal conductivity of the material; the higher the thermal conductivity, the faster the conduction. Convection: Heat is transferred due to the macroscopic movement of molecules within a fluid (liquid or gas) caused by temperature differences. The convection speed is affected by factors such as the density, viscosity, and flow characteristics of the medium. Radiation: Heat propagates outward in the form of electromagnetic waves without a medium. In environments with a medium, the medium may absorb or scatter radiant energy, thus reducing the propagation efficiency.

[0025] The main factors affecting the speed of heat transfer include: Material properties: Different materials have different thermal conductivity, thus affecting the speed of heat transfer. For example, metals are good conductors of heat with high thermal conductivity, resulting in fast heat transfer; while wood and other materials are poor conductors of heat with low thermal conductivity, resulting in slow heat transfer. Temperature difference: The greater the temperature difference, the greater the driving force for heat transfer, and therefore the faster the heat transfer speed. Fourier's law shows that the rate of heat conduction is directly proportional to the temperature gradient. Distance and thickness: The shorter the heat transfer distance or the thinner the object, the shorter the time required for heat transfer, and therefore the relatively faster the heat transfer speed. Contact area: The larger the contact area, the more interfaces for heat transfer, thereby improving the efficiency of heat transfer and accelerating the heat transfer speed. In summary, the speed of heat transfer is affected by many factors, including the heat transfer method, material properties, temperature difference, distance and thickness, and contact area. In practical applications, these factors can be adjusted to optimize the heat transfer effect.

[0026] Heat transfer is faster in solids primarily due to several factors: Firstly, solids have smaller intermolecular distances and a more fixed structure. The relatively small distances between molecules or atoms in solids, coupled with their relatively fixed structure, allow heat energy to be rapidly transferred in the form of lattice vibration waves (phonons). Furthermore, the presence of free electrons in metals further accelerates energy transfer. Secondly, gases have larger intermolecular distances and more free molecular movement. Heat conduction in gases mainly relies on random collisions between molecules to transfer kinetic energy. However, due to the relatively low collision frequency and tortuous collision paths, heat conduction efficiency is lower in gases. Thirdly, the heat conduction mechanism differs. Solids primarily rely on lattice vibrations and free electrons (in metals), both of which enable efficient heat transfer. In contrast, heat conduction in gases relies mainly on intermolecular collisions, a relatively less efficient mechanism. In summary, the smaller intermolecular distances, fixed structure, and different heat conduction mechanisms in solids contribute to the faster heat transfer rate.

[0027] According to some embodiments of this utility model, the thickness of the diffuser block 2 in the first direction is D, and the distance between the edge of the first abutment surface 21 and the edge of the second abutment surface 22 is C, where D is not less than 0.2C. When the thickness of the diffuser block 2 in the first direction is too small, the heat on the first abutment surface 21 cannot be fully transferred to the rear through the second abutment surface 22; that is, only a portion of the middle area of ​​the second abutment surface 22 can be utilized, and the edge areas of the second abutment surface 22 will experience insufficient heat transfer, resulting in waste. Therefore, the diffuser block 2 needs to have sufficient thickness to ensure that the area of ​​the second abutment surface 22 is fully utilized.

[0028] According to some embodiments of this utility model, the area B of the second contact surface 22 is not less than three times the area A of the first contact surface 21. By increasing the area of ​​the second contact surface 22, the heat transfer efficiency of the diffuser block 2 is more effectively improved.

[0029] According to some embodiments of this invention, the material of the diffuser block 2 is diamond. Diamond has extremely excellent thermal conductivity, typically reaching around 2000 W / m, a figure that is among the best of known materials, significantly surpassing common metals such as copper (thermal conductivity approximately 398 W / m·K) and aluminum (thermal conductivity approximately 200 W / m·K), and even exceeding many specially designed thermally conductive materials. This superior thermal conductivity makes diamond irreplaceable in high-end heat dissipation fields, such as high-performance electronic devices, aerospace components, and precision instruments. The thermal conductivity principle of diamond is mainly based on the phonon conduction mechanism. Diamond is a tetrahedral crystal structure composed of carbon atoms bonded by strong covalent bonds. Each carbon atom forms strong covalent bonds with four surrounding carbon atoms, constituting an extremely stable and regular crystal network. In this crystal structure, the tiny vibrations of carbon atoms transfer heat in the form of phonons. Phonons, as a type of quantized lattice vibration, can efficiently transfer energy in diamond crystals. Because of its extremely strong covalent bonds, highly symmetrical crystal structure, and very few defects, diamond experiences very low scattering of phonons during propagation, enabling it to conduct heat away with exceptional speed and efficiency. Unlike metals, which primarily rely on free electrons for heat conduction, diamond's phonon-based thermal conductivity allows it to maintain superior thermal performance even at high temperatures, unlike metals where increased electron scattering at higher temperatures significantly reduces thermal conductivity. Furthermore, diamond possesses extremely high thermal stability and chemical inertness, further enhancing its reliability in extreme conditions.

[0030] According to some embodiments of the present invention, the diffusion block 2 includes a plurality of diffusion layers 23, which are stacked sequentially along a first direction. The projection of the diffusion layer 23 near the heat source in the first direction is within the diffusion layer 23 near the heat dissipation mechanism 1. By providing multiple diffusion layers 23, the contact area between the diffusion layers 23 increases sequentially along the first direction, thereby making fuller use of the volume of the diffusion block 2.

[0031] According to some embodiments of this utility model, the side of the diffuser block 2 facing the high-heat block 3 is the heat-absorbing surface, and the first contact surface 21 is within the heat-absorbing surface. That is, the side of the high-heat block 3 facing the diffuser block 2 is contained within the side of the diffuser block 2 facing the high-heat block 3. This makes the first contact surface 21 have a larger area, so that the heat transferred from the high-heat block 3 to the diffuser block 2 has a greater transfer efficiency.

[0032] According to some embodiments of this utility model, refer to Figure 3 The heat dissipation mechanism 1 includes a main body block 11 and a heat dissipation plate 12. The main body block 11 abuts against the diffuser block 2, and the heat dissipation plate 12 is disposed on the side of the main body block 11 facing away from the diffuser block 2. The heat dissipation mechanism 1 better transfers the heat from the diffuser block 2 to the outside environment. The heat is first transferred to the main body block 11, and then the heat on the main body block 11 is dissipated to the external environment through the heat dissipation plate 12.

[0033] According to some embodiments of this utility model, a cavity is provided inside the main body block 11, and a heat-conducting medium is provided inside the cavity, with the heat-conducting medium flowing within the cavity. By providing a cavity inside the main body block 11 and providing a flowing heat-conducting medium within the cavity, heat can be transported more quickly from the side of the main body near the diffuser block 2 to the side of the main body near the heat sink 12.

[0034] According to some embodiments of this utility model, refer to Figure 4 The heat dissipation mechanism 1 includes a main pipe 13 and a cooling section 14. One end of the main pipe 13 abuts against the diffuser block 2, and the cooling section 14 is disposed at the other end of the main pipe 13. The cooling section 14 is used to cool the main pipe 13. The main pipe 13 is disposed over a long heat dissipation distance. After absorbing heat from the diffuser block 2 at one end, the main pipe 13 transfers the heat to the other end and releases it through the cooling section 14.

[0035] According to some embodiments of this utility model, a flow channel is provided inside the main pipe 13, and a heat-conducting medium is provided inside the flow channel. The heat-conducting medium circulates at both ends of the main pipe 13. In order to transfer heat more quickly in the main pipe 13, a flow channel is provided in the main pipe 13, and heat is transferred quickly through the flowing heat-conducting medium.

[0036] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A local heat dissipation device for dissipating heat from a local heat source, characterized in that, include: A high-heat block, wherein the high-heat block abuts against the heat source along a first direction, and the high-heat block is thermally conductive in the first direction; A diffusion block abuts against the side of the high-heat block opposite to the heat source along a first direction. The diffusion block is thermally conductive in both the first direction and in a first plane, where the first plane is a plane with the first direction as its normal. A heat dissipation mechanism, wherein the heat dissipation mechanism abuts against the side of the diffuser block opposite to the high-heat block along a first direction; The side of the diffuser block that abuts against the high-heat block is the first abutment surface, and the side of the diffuser block that abuts against the heat dissipation mechanism is the second abutment surface. The projection of the first abutment surface in a first direction falls within the second abutment surface. The area of ​​the first abutment surface is A, and the area of ​​the second abutment surface is B. <B。 2. The local heat dissipation device according to claim 1, characterized in that, The thickness of the diffusion block in the first direction is D, and the distance between the edge of the first abutment surface and the edge of the second abutment surface is C, where D is not less than 0.2C.

3. The local heat dissipation device according to claim 1, characterized in that, The area B of the second contact surface is not less than three times the area A of the first contact surface.

4. A local heat dissipation device according to claim 1, characterized in that, The material of the diffusion block is diamond.

5. A local heat dissipation device according to claim 1, characterized in that, The diffusion block includes several diffusion layers, which are stacked sequentially along a first direction. The projection of the diffusion layer closest to the heat source in the first direction is within the diffusion layer closest to the heat dissipation mechanism.

6. A local heat dissipation device according to claim 1, characterized in that, The side of the diffuser block facing the high-heat block is the heat-absorbing surface, and the first contact surface is inside the heat-absorbing surface.

7. A local heat dissipation device according to claim 1, characterized in that, The heat dissipation mechanism includes a main body block and a heat dissipation plate. The main body block abuts against the diffuser block, and the heat dissipation plate is disposed on the side of the main body block opposite to the diffuser block.

8. A local heat dissipation device according to claim 7, characterized in that, The main body block has a cavity, and a heat-conducting medium is disposed inside the cavity and flows within the cavity.

9. A local heat dissipation device according to claim 1, characterized in that, The heat dissipation mechanism includes a main pipe and a cooling section. One end of the main pipe abuts against the diffuser block, and the cooling section is disposed at the other end of the main pipe. The cooling section is used to cool the main pipe.

10. A local heat dissipation device according to claim 9, characterized in that, The main pipe is provided with a flow channel, and a heat-conducting medium is provided in the flow channel. The heat-conducting medium circulates at both ends of the main pipe.

Images