Liquid cooling heat sink

Abstract

The utility model relates to liquid cooling radiator technical field, specifically disclose a liquid cooling radiator, including the heat dissipation base plate and setting on the heat dissipation base plate a plurality of heat dissipation spin column, the overall of heat dissipation spin column is the spiral shape of upward direction. The utility model can form the rotating flow field by the spiral mode guidance cooling liquid, and the contact and heat exchange with heat dissipation spin column are strengthened, and the heat exchange path is prolonged simultaneously, reduces the local uneven heat dissipation, and promotes the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling radiator technology, and specifically to a liquid cooling radiator. Background Technology

[0002] Chips generate a significant amount of heat during operation. If heat dissipation is insufficient, the chip temperature will overheat, leading to performance degradation and potentially triggering the electronic product's protection mechanisms, causing automatic shutdown. Therefore, chip cooling is necessary. Currently, air cooling and liquid cooling are the main methods. While air cooling equipment is inexpensive, its cooling effect is not as good as liquid cooling equipment. With technological advancements, the price of liquid cooling equipment has decreased substantially; therefore, liquid cooling is now widely used for chip cooling.

[0003] The radiator in a liquid cooling system is based on a metal substrate, with a large number of dense heat sinks welded or integrally formed. Flow channels are formed between adjacent heat sinks. When the coolant flows through the flow channels under the drive of the pump, heat is transferred from the substrate to the heat sink through thermal conduction, and then heat is exchanged with the coolant through convection. Finally, the coolant carries away the heat.

[0004] Traditional radiators often use a parallel straight-line structure for their flow channels. Among multiple parallel straight-line flow channels, the flow channel closer to the inlet receives more coolant due to lower resistance. However, the coolant has a faster flow rate and shorter residence time, resulting in insufficient heat exchange. On the other hand, the flow channel farther from the inlet may have insufficient flow and a slower flow rate, resulting in excessively long coolant residence time. As the coolant heats up, its heat exchange efficiency decreases, leading to differences in heat dissipation efficiency among different flow channels. This results in uneven heat dissipation and affects the overall heat dissipation effect. Utility Model Content

[0005] To address the shortcomings of the existing technology, this utility model provides a liquid-cooled radiator that can guide the coolant to form a rotating flow field through a spiral shape, enhancing the contact and heat exchange with the heat dissipation column, while extending the heat exchange path, reducing uneven local heat dissipation, and improving heat dissipation efficiency.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A liquid-cooled radiator includes a heat dissipation base plate and a plurality of heat dissipation spiral columns disposed on the heat dissipation base plate, wherein the heat dissipation spiral columns are in an upward spiral shape.

[0008] Preferably, the heat dissipation spiral column is designed to be narrower at the top and wider at the bottom.

[0009] Preferably, the top of the heat dissipation column rotates laterally to the left or right.

[0010] Preferably, one side of the bottom of the heat dissipation column is connected to the heat dissipation substrate, while the other side of the bottom of the heat dissipation column is raised off the ground.

[0011] Preferably, the heat dissipation column is a spiral-shaped curved strip.

[0012] Preferably, the heat dissipation column is a spiral cone.

[0013] The beneficial effects of this invention are as follows: This product includes a heat dissipation substrate and several heat dissipation spiral columns disposed on the heat dissipation substrate. The heat dissipation spiral columns are in an upward spiral shape, which can guide the coolant to form a rotating flow field through the spiral shape, enhance the contact and heat exchange with the heat dissipation spiral columns, extend the heat exchange path, reduce uneven local heat dissipation, and improve heat dissipation efficiency. Attached Figure Description

[0014] Figure 1 : This is a structural schematic diagram of an embodiment of the present utility model;

[0015] Figure 2 : This is a schematic diagram of the heat dissipation spiral column structure according to an embodiment of the present utility model;

[0016] Explanation of the labels in the attached diagram: 10 - heat dissipation substrate, 11 - heat dissipation rotating column. Detailed Implementation

[0017] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments:

[0018] This embodiment: as follows Figure 1-2 As shown, a liquid-cooled radiator includes a heat dissipation base plate 10 and a plurality of heat dissipation spiral columns 11 disposed on the heat dissipation base plate 10. The heat dissipation spiral columns 11 are spiral-shaped curved strips. The overall shape of the heat dissipation spiral columns 11 is an upward spiral shape. Compared with the traditional short and thick needle columns, the heat dissipation spiral columns 11 of this product have a larger surface area. The overall spiral and curved shape makes the space occupied by the heat dissipation spiral columns 11 more compact, achieving a longer length in a limited space. At the same time, it forces the coolant to flow along the spiral trajectory, increasing the path length and extending the heat exchange time. Meanwhile, the spiral shape of the curved strips makes the flow of coolant not only have axial and circumferential movement, but also adds radial oscillation, forming a more complex three-dimensional flow field, which washes the surface of the needle columns without dead angles and avoids local heat accumulation.

[0019] The heat dissipation column 11 is designed to be narrower at the top and wider at the bottom, allowing more space for the bottom flow channel. This allows the coolant to flow smoothly over the bottom, flushing the substrate surface and reducing heat accumulation, while also allowing it to diffuse quickly through the wider gap at the top, avoiding excessive differences in flow rate between the top and bottom.

[0020] The top of the heat dissipation column 11 rotates 40 degrees to the left or right to form a guide vane. In scenarios where the pin columns are densely arranged, the high-speed flow concentrated in a certain area can be diverted to the adjacent low-speed area to avoid the problems of local excess flow and local insufficient flow.

[0021] One side of the bottom of the heat dissipation column 11 is connected to the heat dissipation substrate 10, while the other side of the bottom of the heat dissipation column 11 is raised off the ground. When the bottom of a traditional heat sink is completely attached to the substrate, the gap between the substrate surface and the bottom of the heat sink is extremely small, making it difficult for coolant to flow in. As a result, the heat on the substrate surface can only be conducted away through the heat sink. However, this product uses a design where one side of the bottom is connected and the other side is raised, forming a wedge-shaped channel between the bottom of the heat dissipation column 11 and the heat dissipation substrate 10. Coolant can flow directly into this channel, simultaneously scouring the surface of the heat dissipation substrate 10 and the bottom of the heat dissipation column 11. This upgrades single conductive heat dissipation to a combination of conductive and convective heat dissipation, allowing the surface of the heat dissipation substrate 10 to directly exchange heat with the coolant, effectively improving heat dissipation efficiency.

[0022] It should be noted that the heat dissipation column 11 in this embodiment can also be a spiral cone.

[0023] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Therefore, any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A liquid-cooled heat sink, comprising a heat dissipation substrate and a plurality of heat dissipation spiral pillars disposed on the heat dissipation substrate, characterized in that: The heat dissipation column has an upward spiral shape. One side of the bottom of the heat dissipation column is connected to the heat dissipation base plate, while the other side of the bottom of the heat dissipation column is raised off the ground.

2. The liquid-cooled radiator according to claim 1, characterized in that: The heat dissipation column is designed to be narrower at the top and wider at the bottom.

3. The liquid-cooled radiator according to claim 1, characterized in that: The top of the heat dissipation column can rotate horizontally to the left or right.

4. The liquid-cooled radiator according to any one of claims 1-3, characterized in that: The heat dissipation column is a long, curved spiral.

5. The liquid-cooled radiator according to any one of claims 1-3, characterized in that: The heat dissipation column is a spiral cone.

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