Building electrical overvoltage protection device

Abstract

The utility model discloses a kind of building electrical overvoltage protection devices. Building electrical overvoltage protection device includes mounting plate, overvoltage protector body and heat dissipation box. Overvoltage protector body is installed on mounting plate;Heat dissipation box is installed on the side of overvoltage protector body;Wherein, the side wall of heat dissipation box is equipped with installation opening, and heat dissipation box is provided with miniature water pump, water storage box, water pipeline, heat dissipation component, heat dissipation component is penetrated and is attached to the surface of overvoltage protector body with installation opening, and water storage box is cyclically communicated with heat dissipation component by miniature water pump, water pipeline. The application is composed of water-cooling heat dissipation system by setting water storage box and heat dissipation component, and the heat dissipation efficiency is improved. Through the attachment design of heat dissipation component and the surface of overvoltage protector body, the efficiency of heat transfer is ensured. The design of circulating water cooling system can continuously take away heat from overvoltage protector body, avoid heat accumulation, thereby prolong the service life of device.

Description

Technical Field

[0001] This utility model relates to the field of electrical protection technology, specifically to a building electrical overvoltage protection device. Background Technology

[0002] Building electrical engineering refers to the technologies and engineering related to the design, installation, operation, and maintenance of electrical systems in buildings. It encompasses various systems and equipment that provide safe, reliable, efficient, and economical electrical energy supply and use for buildings. The main objective of building electrical engineering is to ensure that the electrical equipment and systems inside buildings can meet the needs of users while protecting personnel safety and property.

[0003] An overvoltage protection device is used to protect electrical equipment and wiring from excessive voltage. It primarily monitors the voltage level in a circuit, and when the voltage exceeds a preset safety threshold, the protector will quickly activate, cutting off the circuit or taking other measures to prevent equipment damage and dangerous situations such as fires. Existing building electrical overvoltage protection devices continuously generate heat during prolonged operation. In hot weather, this heat may be difficult to dissipate with the environment, leading to insufficient heat dissipation, protection failure, and a shortened lifespan.

[0004] In summary, existing building electrical overvoltage protection devices suffer from insufficient heat dissipation. Utility Model Content

[0005] The purpose of this application is to overcome the above-mentioned technical deficiencies and propose a building electrical overvoltage protection device to solve the technical problem of insufficient heat dissipation in the prior art.

[0006] To achieve the above-mentioned technical objectives, this application adopts the following technical solution: This application provides a building electrical overvoltage protection device, including a mounting plate, an overvoltage protector body, and a heat sink box.

[0007] The overvoltage protector body is mounted on the mounting plate; The heat sink is installed on the side of the overvoltage protector body; The heat dissipation box has an installation opening on its side wall. Inside the heat dissipation box are a miniature water pump, a water storage box, a cooler, a water supply pipe, and a heat dissipation component. The heat dissipation component passes through the installation opening and is attached to the surface of the overvoltage protector body. The water storage box is circulated with the heat dissipation component through the miniature water pump and the water supply pipe. The cold end of the cooler is attached to the outer wall of the water storage box.

[0008] In some embodiments of this application, the heat dissipation component includes a heat-conducting plate and a circulating condensing coil. The heat-conducting plate is attached to the surface of the overvoltage protector body. The circulating condensing coil is embedded inside the heat-conducting plate, and its inlet and outlet are respectively connected to the heat dissipation component through the micro water pump and the water supply pipe.

[0009] In some embodiments of this application, a partition is also included, which is fixed inside the heat dissipation box and divides the heat dissipation box into a heat conduction cavity and a heat exchange cavity. The heat dissipation component is located in the heat conduction cavity, and the micro water pump and the water storage box are located in the heat exchange cavity.

[0010] In some embodiments of this application, a cooling fan is also included, wherein the cooler is a semiconductor cooler, and the cooling fan is directed toward the hot end of the cooler.

[0011] In some embodiments of this application, the heat-conducting plate has an inner cavity, and the circulating condensing coil is embedded in the inner cavity in a reciprocating manner and contacts at least two inner wall surfaces of the heat-conducting plate for heat conduction. The circulating condensing coil is arranged in a multi-pass reciprocating pattern.

[0012] In some embodiments of this application, the heat dissipation assembly further includes a temperature sensor and a controller. The temperature sensor is attached to the inner wall of the heat-conducting plate, and the controller is electrically connected to the temperature sensor, the micro water pump, and the cooler, respectively.

[0013] In some embodiments of this application, the heat dissipation assembly further includes a filter screen, and the side wall of the heat dissipation box has ventilation holes, with the filter screen covering the surface of the ventilation holes.

[0014] In some embodiments of this application, the water storage box has a threaded sealed water inlet at the top and a drain valve at the bottom.

[0015] In some embodiments of this application, a plurality of connecting plates are also included. The plurality of connecting plates are bolted to the two side walls of the overvoltage protector body, and two connecting plates on the same side are symmetrically distributed and bolted to the two ends opposite to the heat sink box.

[0016] Compared with the prior art, the beneficial technical effects of the technical solution provided in this application include: This application utilizes a water-cooling system comprised of a water storage box and heat dissipation components to effectively improve the heat dissipation efficiency of the overvoltage protector. Compared to traditional air cooling, water cooling more efficiently removes the heat generated during the operation of the overvoltage protector. The close fit design between the heat dissipation components and the surface of the overvoltage protector ensures highly efficient heat transfer. The circulating water cooling system continuously removes heat from the overvoltage protector, preventing heat accumulation and extending the device's lifespan. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the embodiments will be briefly described below: Figure 1 This is a schematic diagram of the structure of a building electrical overvoltage protection device according to an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of a building electrical overvoltage protection device according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a heat-conducting plate in an embodiment of this application.

[0018] Figure label: Mounting plate 1, overvoltage protector body 2, heat sink box 3, heat conduction cavity 3a, heat exchange cavity 3b, micro water pump 4, water storage box 5, heat dissipation assembly 6, heat conduction plate 61, circulating condensing coil 62, partition plate 7, connecting plate 8, mounting hole 9. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Those skilled in the art will understand that, in this specification, the term "comprising" is an open-ended expression, meaning that the stated feature is present but other features are excluded. Directional terms such as "upper," "lower," "left," and "right" refer to exemplary directions based on the accompanying drawings. Features specified as "first" or "second" implicitly include one or more of that feature. Singular expressions can also be used in plural forms. "Multiple" means two or more. The terms "installed," "connected," and "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection via an intermediate medium, and it can be a connection within two components. Furthermore, "linked" can include wireless connections.

[0021] The purpose of this application is to overcome the above-mentioned technical deficiencies and propose a building electrical overvoltage protection device to solve the technical problem of insufficient heat dissipation in the prior art.

[0022] To achieve the above-mentioned technical objectives, this application adopts the following technical solution: like Figures 1-3 As shown. This application provides a building electrical overvoltage protection device, including a mounting plate 1, an overvoltage protector body 2, and a heat sink 3.

[0023] The overvoltage protector body 2 is mounted on the mounting plate 1.

[0024] The heat sink 3 is installed on the side of the overvoltage protector body 2.

[0025] The heat dissipation box 3 has an installation opening on its side wall. Inside the heat dissipation box 3 are a miniature water pump 4, a water storage box 5, a cooler, water supply pipes, and a heat dissipation assembly 6. The heat dissipation assembly 6 penetrates the installation opening and is attached to the surface of the overvoltage protector body 2. The water storage box 5 is circulated with the heat dissipation assembly 6 via the miniature water pump 4 and the water supply pipes. The cold end of the cooler is attached to the outer wall of the water storage box 5. When the overvoltage protector body 2 operates, it generates heat. This heat is absorbed by the heat dissipation assembly 6, which is in close contact with its surface. Driven by the miniature water pump 4, the cooling water inside the heat dissipation assembly 6 circulates between the water storage box 5 and the heat dissipation assembly 6 through the water supply pipes, carrying away and storing the heat in the water storage box 5, thus achieving continuous and efficient heat dissipation.

[0026] This application utilizes a water-cooling system comprised of a water storage box 5 and a heat dissipation component 6 to effectively improve the heat dissipation efficiency of the overvoltage protector body 2. Compared to traditional air cooling, water cooling can more efficiently remove the heat generated during the operation of the overvoltage protector body 2. The close fit design between the heat dissipation component 6 and the surface of the overvoltage protector body 2 ensures efficient heat transfer. The circulating water cooling system continuously removes heat from the overvoltage protector body 2, preventing heat accumulation and extending the device's lifespan.

[0027] In some embodiments of this application, the heat dissipation component 6 includes a heat-conducting plate 61 and a circulating condensing coil 62. The heat-conducting plate 61 is attached to the surface of the overvoltage protector body 2. The circulating condensing coil 62 is embedded inside the heat-conducting plate 61 and its inlet and outlet are respectively connected to the heat dissipation component 6 through the micro water pump 4 and the water supply pipe.

[0028] The heat-conducting plate 61 is tightly attached to the surface of the overvoltage protector body 2, efficiently absorbing the heat generated during its operation and quickly conducting the heat to the circulating condensing coil 62 embedded inside it; when the cooling water flows through the coil, it absorbs heat through heat exchange with the heat-conducting plate 61, and then is driven by the micro water pump 4 to flow back to the water storage box 5 through the water supply pipe, forming a closed-loop heat dissipation cycle.

[0029] The combination of the heat-conducting plate 61 and the coil enables rapid heat conduction and diffusion, significantly improving heat dissipation efficiency. The embedded coil design is not only compact but also maximizes the use of the heat-conducting plate 61 area, ensuring that heat is fully absorbed. In addition, this structure enhances the stability and reliability of the heat dissipation system, effectively preventing equipment failures caused by local overheating and further extending the service life of the device.

[0030] In some embodiments of this application, a partition 7 is also included, which is fixed inside the heat dissipation box 3 and divides the heat dissipation box 3 into a heat conduction cavity 3a and a heat exchange cavity 3b. The heat dissipation assembly 6 is located in the heat conduction cavity 3a, and the micro water pump 4 and the water storage box 5 are located in the heat exchange cavity 3b.

[0031] The heat dissipation component 6 is located in the heat conduction cavity 3a and directly contacts the overvoltage protector body 2 to absorb heat; while the micro water pump 4 and the water storage box 5 are located in an independent heat exchange cavity 3b. The two form a circulating water path through the water supply pipe. After the cooling water absorbs heat by flowing through the heat dissipation component 6, it returns to the water storage box 5 in the heat exchange cavity 3b to release heat.

[0032] Spatial isolation effectively avoids thermal interference between high-temperature components, improving heat dissipation efficiency. At the same time, functional zoning makes the structure more compact and orderly, facilitating maintenance and repair. In addition, the isolation design can reduce the impact of vibration and heat generated by the water pump 4 on heat dissipation performance, ensuring the stability and reliability of system operation and further extending the service life of the device.

[0033] In some embodiments of this application, a cooling fan is also included, wherein the cooler is a semiconductor cooler, and the cooling fan is directed toward the hot end of the cooler.

[0034] The cooler can be a semiconductor cooler. After the cooler is powered on, its cold end absorbs the heat of the circulating water in the water storage box 5, which lowers the water temperature. Then, the low-temperature cooling water, which is pressurized by the micro water pump 4, flows through the heat dissipation component 6 and can more efficiently absorb the heat generated by the overvoltage protector body 2. It then returns to the water storage box 5 for secondary cooling, forming an enhanced heat dissipation cycle.

[0035] The combination of active cooling and passive water cooling breaks through the limitations of traditional water cooling systems that rely solely on ambient temperature for heat dissipation. Even in extreme high-temperature environments, it can maintain a low cooling water temperature, significantly improving the heat dissipation margin and thermal stability of the overvoltage protector. This effectively avoids performance degradation or failure caused by overheating, further extending the service life and reliability of the device under harsh conditions.

[0036] In some embodiments of this application, the heat-conducting plate 61 has an inner cavity, and the circulating condensing coil 62 is embedded in the inner cavity in a reciprocating manner and contacts at least two inner wall surfaces of the heat-conducting plate 61 for heat conduction. The circulating condensing coil 62 is arranged in a multi-pass reciprocating pattern.

[0037] The heat-conducting plate 61 is made of copper plate, and the coils are arranged in an S-shape or spiral shape. When the cooling water flows through the multi-pass reciprocating coils, the residence time and path of the water flow in the heat-conducting plate 61 are extended, increasing the contact area and heat exchange time with the heat-conducting plate 61, thereby more efficiently absorbing the heat conducted by the overvoltage protector body 2 through the heat-conducting plate 61.

[0038] The multi-pass reciprocating arrangement significantly increases the contact area between the coil and the heat conduction plate 61, enhancing the heat transfer efficiency; the extended water flow path allows the cooling water to fully absorb heat, improving the heat exchange efficiency; at the same time, the compact spiral structure maximizes heat exchange within a limited space, making the heat dissipation component 6 structure more compact and efficient, further improving the performance and reliability of the entire heat dissipation system.

[0039] In some embodiments of this application, the heat dissipation assembly 6 further includes a temperature sensor and a controller. The temperature sensor is attached to the inner wall of the heat-conducting plate 61, and the controller is electrically connected to the temperature sensor, the micro water pump 4, and the cooler, respectively.

[0040] The temperature sensor monitors the temperature of the inner wall of the heat-conducting plate 61 in real time and transmits the data to the controller. The controller automatically adjusts the working status of the micro water pump 4 and the cooler according to the preset temperature threshold. When the temperature rises, the controller increases the speed of the water pump 4 or starts the cooler to enhance heat dissipation. When the temperature drops, the controller reduces power consumption.

[0041] The system enables on-demand adjustment of the heat dissipation system, avoiding energy waste; intelligent control ensures that the overvoltage protector body 2 always operates within the optimal temperature range, effectively preventing overheating or excessive cooling; at the same time, the system responds quickly and can dynamically adjust the heat dissipation strategy according to load changes, significantly improving the operational stability and reliability of the device, further extending the service life of the equipment and reducing maintenance costs.

[0042] In some embodiments of this application, the heat dissipation assembly 6 further includes a filter screen, and the side wall of the heat dissipation box 3 is provided with ventilation holes, with the filter screen covering the surface of the ventilation holes.

[0043] When there is a temperature difference between the inside and outside of the heat sink 3, air will naturally circulate through the ventilation holes to help dissipate heat, while the filter screen can effectively block dust, impurities and other particles in the outside air from entering the heat sink 3.

[0044] The filter effectively prevents dust and foreign objects from entering the heat dissipation system, avoiding problems such as clogging water pipes, adhering to the surface of heat dissipation components 6 and affecting heat dissipation efficiency, and corroding electronic components. It significantly improves the long-term operational reliability and maintenance cycle of the system. At the same time, the structure is simple and practical, and without increasing additional energy consumption, it effectively protects the entire heat dissipation system, ensuring the stable working performance of the water cooling device in various complex environments.

[0045] In some embodiments of this application, the water storage box 5 has a threaded sealed water inlet at the top and a drain valve at the bottom.

[0046] When the system needs to be replenished with water or the coolant replaced, liquid can be injected by unscrewing the top inlet, and the threaded structure ensures a tight seal. When the system needs maintenance or cleaning, the internal liquid can be completely drained through the drain valve at the bottom.

[0047] The threaded seal water inlet facilitates daily refrigerant filling and effectively prevents coolant evaporation and leakage, ensuring the system's airtightness and stability. Meanwhile, the bottom drain valve completely solves the problem of incomplete drainage in traditional devices, facilitating thorough cleaning and maintenance, effectively preventing the long-term accumulation of scale and impurities, thereby extending the service life of the entire heat dissipation system, simplifying the maintenance process, and reducing maintenance costs.

[0048] In some embodiments of this application, a plurality of connecting plates 8 are also included. The plurality of connecting plates 8 are bolted to the two side walls of the overvoltage protector body 2 respectively. Two connecting plates 8 on the same side are symmetrically distributed and bolted to the two ends opposite to the heat sink 3 respectively.

[0049] In this embodiment, multiple connecting plates 8 are provided, which are bolted to the two side walls of the overvoltage protector body 2 and to both ends of the heat sink 3 through mounting holes 9, forming a stable assembly structure. The connecting plates 8 serve as intermediate transition parts, tightly fixing the overvoltage protector body 2 and the heat sink 3 together, ensuring a stable contact pressure between the heat dissipation component 6 and the overvoltage protector body 2, thereby ensuring heat conduction efficiency.

[0050] The modular connection structure facilitates installation, disassembly, and maintenance. At the same time, the symmetrically distributed connection design makes the stress distribution more uniform, avoiding structural deformation or damage caused by stress concentration. The bolt connection method not only provides reliable mechanical strength, but also allows the installation position and pressure to be adjusted according to actual needs, ensuring optimal contact between the heat dissipation component 6 and the overvoltage protector body 2, thereby improving the stability and long-term reliability of the heat dissipation system.

[0051] Compared with the prior art, the beneficial technical effects of the technical solution provided in this application include: This application utilizes a water-cooling system comprised of a water storage box 5 and a heat dissipation component 6 to effectively improve the heat dissipation efficiency of the overvoltage protector body 2. Compared to traditional air cooling, water cooling can more efficiently remove the heat generated during the operation of the overvoltage protector body 2. The close fit design between the heat dissipation component 6 and the surface of the overvoltage protector body 2 ensures efficient heat transfer. The circulating water cooling system continuously removes heat from the overvoltage protector body 2, preventing heat accumulation and extending the device's lifespan.

[0052] Those skilled in the art will understand that the steps, measures, and schemes in the various operations, methods, processes, and procedures discussed in this application can be alternated, modified, rearranged, decomposed, combined, or deleted.

[0053] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Any other corresponding changes and modifications made based on the technical concept of this application should be included within the scope of protection of the claims of this application.

Claims

1. A building electrical overvoltage protection device, characterized in that, include: Mounting plate; The overvoltage protector body is mounted on the mounting plate; A heat sink is installed on the side of the overvoltage protector body; The heat dissipation box has an installation opening on its side wall. Inside the heat dissipation box are a miniature water pump, a water storage box, a cooler, a water supply pipe, and a heat dissipation component. The heat dissipation component passes through the installation opening and is attached to the surface of the overvoltage protector body. The water storage box is circulated with the heat dissipation component through the miniature water pump and the water supply pipe. The cold end of the cooler is attached to the outer wall of the water storage box.

2. The building electrical overvoltage protection device according to claim 1, characterized in that, The heat dissipation component includes a heat-conducting plate and a circulating condensing coil. The heat-conducting plate is attached to the surface of the overvoltage protector body. The circulating condensing coil is embedded inside the heat-conducting plate, and its inlet and outlet are respectively connected to the heat dissipation component through the micro water pump and the water supply pipe.

3. The building electrical overvoltage protection device according to claim 1, characterized in that, It also includes a partition, which is fixed inside the heat dissipation box and divides the heat dissipation box into a heat conduction cavity and a heat exchange cavity. The heat dissipation component is located in the heat conduction cavity, and the micro water pump and the water storage box are located in the heat exchange cavity.

4. The building electrical overvoltage protection device according to claim 1, characterized in that, It also includes a cooling fan, the cooler is a semiconductor cooler, and the cooling fan is directed toward the hot end of the cooler.

5. The building electrical overvoltage protection device according to claim 2, characterized in that, The heat-conducting plate has an inner cavity, and the circulating condensing coil is embedded in the inner cavity in a reciprocating manner and contacts at least two inner wall surfaces of the heat-conducting plate for heat conduction. The circulating condensing coil is arranged in a multi-pass reciprocating pattern.

6. The building electrical overvoltage protection device according to claim 5, characterized in that, The heat dissipation assembly also includes a temperature sensor and a controller. The temperature sensor is attached to the inner wall of the heat-conducting plate, and the controller is electrically connected to the temperature sensor, the micro water pump, and the cooler.

7. The building electrical overvoltage protection device according to claim 1, characterized in that, The heat dissipation assembly also includes a filter screen, and the side wall of the heat dissipation box has ventilation holes, with the filter screen covering the surface of the ventilation holes.

8. The building electrical overvoltage protection device according to claim 1, characterized in that, The water storage box has a threaded sealed water inlet at the top and a drain valve at the bottom.

9. The building electrical overvoltage protection device according to claim 1, characterized in that, It also includes multiple connecting plates, which are bolted to the two side walls of the overvoltage protector body, and two connecting plates on the same side are symmetrically distributed and bolted to the two ends opposite to the heat sink box.

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