An immersion evaporator

Abstract

The utility model belongs to the technical field of heat dissipation device, disclose a kind of immersion evaporator.The utility model described immersion evaporator including diamond substrate, first metal layer and several fins;The diamond substrate is the integrated structure with several clamping slots or the integrated structure with recess;The number of clamping slot is equal to the number of fin;The fin is placed in clamping slot or recess;The first metal layer is between the bottom surface of fin and diamond substrate, and the bottom surface of fin and diamond substrate are connected respectively.The utility model connects with fin by splicing, has the advantage of easier processing, lower cost;And use high thermal conductivity coefficient diamond as main material, obtain better heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the technical field of heat dissipation devices, and specifically relates to an immersion evaporator. Background Technology

[0002] With the rapid development of the data center industry, the computing power and energy consumption of data centers are rising accordingly. The heat generated has gradually exceeded the threshold of air cooling, and liquid cooling is becoming a new trend in the field of thermal management. Immersion liquid cooling, as a form of liquid cooling, is gradually gaining favor in the industry due to its high-efficiency heat dissipation, energy saving, low noise, and uniform temperature.

[0003] Immersion liquid cooling is divided into single-phase immersion liquid cooling and two-phase immersion liquid cooling. Phase change immersion liquid cooling can fully utilize the latent heat of phase change for heat dissipation, possessing a larger heat transfer coefficient and a higher heat dissipation limit, thus making it a new trend in future data center heat dissipation. As the core heat dissipation component of the phase change immersion liquid cooling system, the evaporator's heat dissipation material largely determines the immersion cooling performance. Diamond is one of the materials with the highest heat dissipation coefficient in nature, with a thermal conductivity of up to 2000 W / (m·K) at room temperature, far exceeding that of traditional heat dissipation materials such as copper and aluminum. However, diamond has high hardness, and the process of directly manufacturing it into an evaporator is complex and requires harsh conditions, thus limiting the application of diamond-based evaporators in thermal management systems. Utility Model Content

[0004] In view of the technical problems existing in the prior art, the purpose of this utility model is to provide an immersion evaporator.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An immersion evaporator includes a diamond substrate, a first metal layer, and several fins;

[0007] The diamond substrate is an integral structure with several slots or an integral structure with grooves; the number of slots is equal to the number of fins.

[0008] The fins are placed in slots or grooves;

[0009] The first metal layer is located between the bottom surface of the fin and the diamond substrate, respectively connecting the bottom surface of the fin and the diamond substrate.

[0010] Furthermore, the heat transfer surface of the fin is parallel to the heat transfer surface of the adjacent fin.

[0011] Furthermore, the size of the slot is such that it can accommodate one fin; the size of the groove is such that it can accommodate all fins.

[0012] Furthermore, when the diamond substrate is an integral structure with grooves, the fins include long fins and short fins; the short fins are located between two adjacent long fins and abut against the long fins.

[0013] Furthermore, when the diamond substrate is an integral structure with several slots, the height of the fins is higher than the horizontal height of the slot edge; when the diamond substrate is an integral structure with a groove, the height of the short fins is the same as the horizontal height of the groove edge, and the height of the long fins is higher than the horizontal height of the groove edge.

[0014] Furthermore, the depth of the slot or groove satisfies the requirement that the thickness of the bottom of the diamond substrate is 0.5mm-1mm.

[0015] Furthermore, when the diamond substrate is an integral structure with several slots, the thickness of the fins is 0.05mm-0.5mm, and the spacing between the fins is 0.05mm-0.5mm; when the diamond substrate is an integral structure with grooves, the thickness of the long fins and the short fins is independently 0.05mm-0.5mm.

[0016] Furthermore, the fin is a diamond fin or a metal fin; when the fin is a diamond fin, a second metal layer is included between the bottom surface of the fin and the first metal layer, and the second metal layer is connected to the bottom surface of the fin and the first metal layer respectively.

[0017] Furthermore, the first metal layer and the second metal layer are independently copper layers or nickel layers; the thickness of the first metal layer and the second metal layer are independently 0.002-0.005 mm.

[0018] Furthermore, the heat transfer surface of the fins includes at least one of micropores, micropillars, and microchannels.

[0019] Furthermore, the diamond substrate is a pure diamond substrate or a diamond composite material substrate.

[0020] Furthermore, the diamond fins are pure diamond fins or diamond composite material fins.

[0021] The following are the beneficial effects of implementing this utility model:

[0022] This invention connects the diamond substrate and fins in a spliced ​​manner. The substrate and fins are processed separately and then connected, which makes the processing of the submerged evaporator easier and reduces the cost of the submerged evaporator. Furthermore, different fin materials can be selected according to heat dissipation requirements, thereby expanding the application of diamond evaporators in thermal management systems.

[0023] This invention relates to an immersion evaporator made primarily of diamond, a material with high thermal conductivity, exhibiting excellent thermal conductivity. High-power devices, after being coated with thermal grease, can more efficiently transfer heat to the immersion evaporator. Furthermore, the addition of several fins increases the heat dissipation surface area, enabling better heat dissipation from the immersion liquid. The superior heat dissipation performance of this immersion evaporator can solve the heat dissipation problem of high heat flux density in data centers, laying the foundation for the development of data centers towards intelligent computing centers. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the immersion evaporator described in this utility model.

[0025] Figure 2 This is a schematic diagram of the substrate of the immersion evaporator described in this utility model.

[0026] Figure 3 This is a schematic diagram showing the connection between the fins and the diamond substrate.

[0027] Wherein, 1-diamond substrate; 101-groove; 102-slot; 2-first metal layer; 3-fin; 301-long fin; 302-short fin; 4-second metal layer. Detailed Implementation

[0028] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this utility model and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on this utility model.

[0029] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are used only for the convenience of describing this utility model and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0030] In the following embodiments, the length, width, and height of the cuboid structure are specifically defined as follows: the longer side of the bottom surface is the length, the shorter side is the width, and the side perpendicular to the bottom surface is the height.

[0031] Example 1

[0032] like Figures 1-3 As shown, this embodiment provides an immersion evaporator, including a diamond substrate 1, a first metal layer 2, and a plurality of fins 3; the diamond substrate 1 is an integral structure with a plurality of slots 102; the number of slots 102 is equal to the number of fins 3; the fins 3 are placed in the slots 102; the first metal layer 2 is located between the bottom surface of the fins 3 and the diamond substrate 1, respectively connecting the bottom surface of the fins 3 and the diamond substrate 1.

[0033] In this invention, the immersion evaporator mainly comprises a diamond substrate 1, a first metal layer 2, and fins 3. The diamond substrate 1 has an overall rectangular structure with several slots 102, and is integrally formed. Each slot 102 is a rectangular groove closed at both ends. The length of each slot 102 is aligned with the width of the diamond substrate 1, and the slots 102 are arranged parallel to each other along the length of the diamond substrate 1; or the length of each slot 102 is aligned with the length of the diamond substrate 1, and the slots 102 are arranged parallel to each other along the width of the diamond substrate 1. The bottom surface of the diamond substrate 1 is larger than or equal to the surface of the high-power device in contact with the immersion evaporator, so that the immersion evaporator achieves better heat dissipation. The diamond substrate 1 can be a pure diamond substrate or a diamond composite material substrate. When the diamond substrate 1 is a pure diamond substrate, its thermal conductivity is better; when the diamond substrate 1 is a diamond composite material substrate, the processing of the diamond substrate 1 is easier and the cost is lower. Among them, diamond composite materials include one of diamond / copper composite materials, diamond / aluminum composite materials, and diamond / magnesium composite materials. The diamond substrate 1 can also be a cube, trapezoid, cylinder, or other structure that can be closely attached to the heat dissipation surface of high-power devices.

[0034] Specifically, the size of the slot 102 is such that it can accommodate one fin 3. The bottom surface of the fin 3 is in contact with the bottom surface of the slot 102, and the bottom surface of the slot 102 is slightly larger than or equal to the bottom surface of the fin 3, so that the fin 3 can be inserted into the slot 102. The depth of the slot 102 is such that the thickness of the bottom of the diamond substrate 1 is 0.5mm-1mm. Specifically, the thickness of the bottom of the diamond substrate 1 can be any value within this range, preferably 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm. The thickness of the bottom of the diamond substrate 1 refers to the distance from the bottom surface of the slot 102 to the bottom surface of the diamond substrate. The high hardness of diamond allows the bottom of the diamond substrate to be machined to a thickness of 0.5mm-1mm, thereby reducing the thermal resistance at the bottom of the substrate and achieving better heat transfer.

[0035] Furthermore, the first metal layer 2 is first attached to the surface of the diamond substrate 1 by electroplating, thereby achieving a good splicing between the diamond substrate and the fin 3. Alternatively, the first metal layer 2 can be attached to the diamond substrate 1 by magnetron sputtering, chemical deposition, sintering, or other methods. The first metal layer 2 can be attached only at the junction of the diamond substrate 1 and the fin 3, or it can be attached to the entire surface of the diamond substrate 1. Then, the first metal layer 2 is connected to the bottom surface of the fin 3 by low-temperature welding.

[0036] Furthermore, the heat transfer surface of the fin 3 is parallel to the heat transfer surface of the adjacent fin 3. The fin 3 is a cuboid structure that matches the slot 102, and the heat transfer surface is the surface formed by the length and height of the fin 3. Specifically, the parallel heat transfer surfaces allow for the insertion of as many fins 3 as possible onto the diamond substrate 1; and the fins do not intersect, maintaining flow channels for the immersion liquid between them, achieving better contact between the immersion liquid and the fins, and thus better heat dissipation. The fin 3 and the slot 102 can also be cubic, trapezoidal, cylindrical, or other structures, wherein the shape of the portion of the fin 3 inserted into the slot 102 matches the shape of the slot 102, allowing the fin 3 to be inserted into the slot 102 and tightly attached to the bottom of the slot 102.

[0037] The height of fin 3 is higher than the horizontal height of the edge of slot 102. In the immersion evaporator of this utility model, the process of transferring heat to the immersion liquid is mainly achieved through the part of fin 3 that is higher than the edge of slot 102. The part of fin 3 inserted into slot 102 can better transfer the heat of diamond substrate 1 to fin 3, thereby realizing the transfer of heat to immersion liquid.

[0038] The thickness of fin 3 is 0.05mm-0.5mm, and the spacing between fins 3 is 0.05mm-0.5mm. Specifically, the thickness of fin 3 can be selected from any value within this range, preferably 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, or 0.5mm; the spacing between fins 3 can be selected from any value within this range, preferably 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, or 0.5mm. The thickness of fin 3 refers to the width of the cuboid fin 3. In this invention, fin 3 and diamond substrate 1 are processed separately, making it easier to obtain fins 3 with a thinner thickness, reducing the thermal resistance of fin 3, and achieving better heat dissipation. The spacing between fins 3 refers to the width of the channel formed between two adjacent fins 3. If the width is too large, the number of fins 3 will be reduced, thus reducing the heat transfer efficiency. In the arrangement of several fins 3, the spacing between fins 3 can be the same or different. A spacing within the range of 0.05mm-0.5mm can achieve good heat transfer effect.

[0039] Fin 3 has two implementation methods based on its material:

[0040] In one embodiment, the fin 3 is a diamond fin. A second metal layer 4 is included between the bottom surface of the fin 3 and the first metal layer 2, connecting both the bottom surface of the fin 3 and the first metal layer 2. The second metal layer 4 is first electroplated onto the surface of the diamond fin, achieving a good connection between the diamond fin and the diamond substrate 1 with the first metal layer 2 attached. Alternatively, the second metal layer 4 can be attached to the diamond fin using magnetron sputtering, chemical deposition, sintering, or other methods. The second metal layer 4 can be attached only at the junction of the fin 3 and the diamond substrate 1, or it can be attached to the entire surface of the fin 3. Then, the second metal layer 4 is connected to the first metal layer 2 attached to the diamond substrate 1 by low-temperature welding. The diamond fin is a pure diamond fin or a diamond composite material fin.

[0041] In another embodiment, the fin 3 is a metal fin. The bottom surface of the fin 3 is connected to the first metal layer 2 attached to the diamond substrate 1 by low-temperature welding. The metal fin is preferably a heat exchanger plate, wherein the heat exchanger plate is a material with high heat exchange performance composed of a sealed container, capillary structure and working fluid, and its outer shell is made of metal. The high thermal conductivity achieved by the heat exchanger plate structure and material enables the submerged evaporator to achieve efficient heat dissipation.

[0042] The heat transfer surface of fin 3 includes at least one of micropores, micropillars, and microchannels. The arrangement of microstructures can expand the heat dissipation surface and increase the turbulence structure, thereby enhancing heat dissipation.

[0043] Furthermore, the first metal layer 2 and the second metal layer 4 are independently copper or nickel layers; the thickness of the first metal layer 2 and the second metal layer 4 are independently 0.002-0.005 mm. Specifically, the thickness of the first metal layer 2 and the second metal layer 4 can be selected independently within this range, preferably 0.002 mm, 0.003 mm, 0.004 mm, or 0.005 mm. The first metal layer 2 and the second metal layer 4 are the medium for splicing the diamond substrate 1 and the fins 3. Compared with the thermal conductivity of the diamond substrate 1 and the fins 3, their thermal conductivity is poor. Therefore, if the thickness is too high, it will affect the heat dissipation effect of the immersion evaporator. Therefore, a thickness of 0.002-0.005 mm is preferable, which can achieve low-temperature welding to splice the diamond substrate 1 and the fins 3, and also achieve good heat transfer effect.

[0044] When the diamond substrate 1 is a pure diamond substrate, if the first metal layer 2 is a nickel layer, its thermal conductivity can reach 1500 W / (m·K); if the first metal layer 2 is a copper layer, its thermal conductivity can reach 1200 W / (m·K).

[0045] When the diamond substrate 1 is a diamond composite material substrate, its thermal conductivity can reach 800 W / (m·K).

[0046] Example 2

[0047] like Figures 1-3 As shown, this embodiment provides an immersion evaporator, which differs from Embodiment 1 in that: the diamond substrate 1 is an integral structure with a groove 101; the fins 3 are placed in the groove 101. Compared to the mode of Embodiment 1, the groove 101 form of this embodiment makes the processing of the diamond substrate 1 easier.

[0048] The overall structure of the diamond substrate 1 is a cuboid structure with grooves 101, which is a one-piece molded structure. The grooves 101 are cuboid grooves closed at both ends. The four corners of the grooves 101 may also include four cylindrical grooves of the same height as the grooves 101 and communicating with the grooves 101, so as to place the edge fins 3.

[0049] The size of the groove 101 is such that it can accommodate all the fins 3. The bottom surface of the fins 3 is in contact with the bottom surface of the groove 101. The bottom surface of the groove 101 is slightly larger than or equal to the sum of the bottom surfaces of all the fins 3, so that all the fins 3 can be accommodated in the groove 101. In the groove 101, the length of the fins 3 is aligned with the width of the groove 101, and all the fins 3 are stacked sequentially along the length of the groove 101 and are parallel to each other; or, the length of the fins 3 is aligned with the length of the groove 101, and all the fins 3 are stacked sequentially along the width of the groove 101 and are parallel to each other. The groove 101 can also be a cube, trapezoid, cylinder, or other structures, where the shape of the groove 101 matches the shape of all the stacked fins 3, allowing all the fins 3 to be accommodated in the groove 101 and tightly attached to the bottom of the groove 101. The depth of the groove 101 is such that the thickness of the bottom of the diamond substrate 1 is 0.5mm-1mm. Specifically, the thickness of the bottom of the diamond substrate 1 can be selected from any value within this range, preferably 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm.

[0050] The fin 3 includes long fins 301 and short fins 302; the short fins 302 are located between two adjacent long fins 301 and abut against the long fins 301. The height of the short fins 302 is the same as the horizontal height of the edge of the groove 101, while the height of the long fins 301 is higher than the horizontal height of the edge of the groove 101. The short fins 302 mainly serve to separate the long fins 301, forming a flow channel for the immersion liquid and improving heat transfer. The portion of the long fins 301 that extends above the groove 101 plays a major role in transferring heat to the immersion liquid. The thickness of the long fins 301 and the short fins 302 is independently 0.05mm-0.5mm. Specifically, the thickness of the long fins 301 and the short fins 302 can be selected independently within this range, preferably 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, or 0.5mm. The long fin 301 and the short fin 302 can be made of the same material or different materials.

[0051] The immersion evaporator of this invention is placed in an immersion liquid during use. The evaporator is in indirect contact with high-power devices through thermally conductive silicone grease, transferring heat from the high-power devices to the evaporator. After entering the evaporator, the heat first enters the diamond substrate 1, and then is conducted to the fins 3. The fins 3 quickly transfer the heat from the high-power devices to the immersion liquid near the evaporator. The immersion liquid undergoes a phase change to form vapor, carrying away the corresponding heat. The un-phase-changed liquid in the immersion liquid is automatically replenished internally, completing the evaporation and heat dissipation process.

[0052] It is understood that the above embodiments only illustrate preferred embodiments of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present utility model patent. It should be noted that for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present utility model, all of which fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present utility model should fall within the coverage of the claims of the present utility model.

Claims

1. A submersible evaporator, characterized in that: It includes a diamond substrate, a first metal layer, and several fins; The diamond substrate is an integral structure with several slots or an integral structure with grooves; the number of slots is equal to the number of fins. The fins are placed in slots or grooves; The first metal layer is located between the bottom surface of the fin and the diamond substrate, respectively connecting the bottom surface of the fin and the diamond substrate.

2. The submersible evaporator according to claim 1, characterized in that: The heat transfer surface of the fin is parallel to the heat transfer surface of the adjacent fin.

3. The submersible evaporator according to claim 1, characterized in that: The size of the slot is such that it can accommodate one fin; the size of the groove is such that it can accommodate all fins.

4. The submersible evaporator according to claim 1, characterized in that: When the diamond substrate is an integral structure with grooves, the fins include long fins and short fins; the short fins are located between two adjacent long fins and abut against the long fins.

5. The submersible evaporator according to claim 4, characterized in that: When the diamond substrate is an integral structure with several slots, the height of the fins is higher than the horizontal height of the slot edge; when the diamond substrate is an integral structure with a groove, the height of the short fins is the same as the horizontal height of the groove edge, and the height of the long fins is higher than the horizontal height of the groove edge.

6. The submersible evaporator according to claim 1, characterized in that: The depth of the slot or groove is such that the thickness of the bottom of the diamond substrate is 0.5mm-1mm.

7. The submersible evaporator according to claim 4, characterized in that: When the diamond substrate is an integral structure with several slots, the thickness of the fins is 0.05mm-0.5mm, and the spacing between the fins is 0.05mm-0.5mm; when the diamond substrate is an integral structure with grooves, the thickness of the long fins and the short fins is independently 0.05mm-0.5mm.

8. The submersible evaporator according to claim 1, characterized in that: The fin is a diamond fin or a metal fin; when the fin is a diamond fin, a second metal layer is included between the bottom surface of the fin and the first metal layer, and the second metal layer is connected to the bottom surface of the fin and the first metal layer respectively.

9. The submersible evaporator according to claim 8, characterized in that: The first metal layer and the second metal layer are independently copper or nickel layers; the thickness of the first metal layer and the second metal layer are independently 0.002-0.005 mm.

10. The submersible evaporator according to claim 1, characterized in that: The heat transfer surface of the fins includes at least one of micropores, micropillars, and microchannels.

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