heat dissipating device

Abstract

A heat dissipation device includes: a base plate; a housing located above the base plate and having an outer frame, a first partition, an inner frame, and a plurality of heat-conducting pillars, wherein the first partition is connected to an inner sidewall of the outer frame and forms a lower space below the first partition and an upper space above the first partition, the inner frame is located in the outer frame and connected to the first partition, and divides the upper space into a heat dissipation chamber and a flow channel, wherein the plurality of heat-conducting pillars are located in the heat dissipation chamber, and the first partition has a central opening communicating with the heat dissipation chamber and the lower space; and a top cover located above the housing and in contact with a first of the plurality of heat-conducting pillars and the inner frame.

Description

Technical Field

[0001] This application relates to a heat dissipation device. Background Technology

[0002] As the performance of electronic products continues to improve, the power consumption of individual chips or modules is constantly increasing, leading to a higher heat density per unit area. Therefore, heat dissipation devices are often required to introduce coolant for heat dissipation. However, in order to increase the heat exchange area, the structure of heat dissipation devices is becoming increasingly complex, which significantly increases the pressure drop of the coolant during flow, thus reducing the overall heat exchange efficiency. At the same time, complex flow channel designs can also cause localized heat accumulation.

[0003] Therefore, how to develop a heat dissipation device that can solve the above problems is one of the issues that the industry is currently eager to address by investing research and development resources in. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a heat dissipation device that can solve the above-mentioned problems.

[0005] One aspect of this application relates to a heat dissipation device, comprising: a base plate; a housing located above the base plate and having an outer frame, a first partition, an inner frame, and a plurality of heat-conducting pillars, wherein the first partition is connected to an inner sidewall of the outer frame and forms a lower space below the first partition and an upper space above the first partition, the inner frame is located within the outer frame and connected to the first partition, and divides the upper space into a heat dissipation chamber and a flow channel, wherein the plurality of heat-conducting pillars are located in the heat dissipation chamber, and the first partition has a central opening communicating with the heat dissipation chamber and the lower space; and a top cover located above the housing and in contact with a first of the plurality of heat-conducting pillars and the inner frame.

[0006] In some embodiments, the housing also has multiple heat-conducting strips located in the flow channel.

[0007] In some embodiments, the first partition has a side opening connecting the flow channel and the lower space, and one of the plurality of heat-conducting strips is separated from the outer frame and extends downward into the lower space through the side opening.

[0008] In some implementations, one of the plurality of heat-conducting strips contacts the base plate.

[0009] In some embodiments, one of the plurality of heat-conducting strips is located above the first partition and connected between the inner frame and the outer frame.

[0010] In some embodiments, the first partition has adjacent side openings that connect the flow channel and the lower space, and one of the plurality of heat-conducting strips is located between the side openings.

[0011] In some implementations, one of the plurality of heat-conducting strips has a notch.

[0012] In some embodiments, the first of the plurality of heat-conducting pillars has a first height greater than the second of the plurality of heat-conducting pillars has a second height.

[0013] In some implementations, the ratio between the second height and the first height is between 0.01 and 0.33.

[0014] In some implementations, a third of the plurality of heat-conducting pillars is laterally connected to the inner frame.

[0015] In some embodiments, a fourth of the plurality of heat-conducting pillars is located between the first and the second, wherein the fourth pillar has a fourth height greater than the second height, and the first height is greater than the fourth height.

[0016] In some implementations, the ratio between the fourth height and the first height is between 0.33 and 0.75, and the ratio between the second height and the fourth height is between 0.01 and 1.

[0017] In some implementations, multiple heat-conducting pillars are connected to the first partition.

[0018] In some embodiments, the housing also has a second partition located above the first partition, parallel to the first partition, and connected to the inner frame.

[0019] In some embodiments, the housing further has a third partition located above the second partition, parallel to the second partition, and connected to the inner frame, wherein a plurality of the heat-conducting pillars are located above the third partition and connected to the third partition.

[0020] In some embodiments, the housing also has a plurality of heat dissipation fins located above the first partition and the second partition, respectively.

[0021] In some implementations, the flow channel partially surrounds the heat dissipation chamber.

[0022] Another aspect of this application relates to a heat dissipation device, comprising: a base plate having a plurality of heat dissipation fins; a housing located above the base plate and having an outer frame, a first partition, and an inner frame, wherein the first partition is connected to an inner sidewall of the outer frame and forms a lower space below the first partition and an upper space above the first partition, the inner frame is located in the outer frame and connected to the first partition, and divides the upper space into a heat dissipation chamber and a flow channel partially surrounding the heat dissipation chamber, wherein the first partition contacts the plurality of heat dissipation fins and has a central opening and a side opening, wherein the central opening communicates the heat dissipation chamber and the lower space, and the side opening communicates the flow channel and the lower space; and a top cover located above the upper space of the housing and in contact with the outer frame and the inner frame.

[0023] In some embodiments, the outer frame, the first partition, and the inner frame of the housing are integrally formed as a continuous structure.

[0024] Another aspect of this application relates to a heat dissipation device, comprising: a base plate; a housing located above the base plate and having an outer frame, a first partition, an inner frame, and a plurality of heat-conducting strips, wherein the first partition is connected to an inner sidewall of the outer frame and forms a lower space below the first partition and an upper space above the first partition, the inner frame is located in the outer frame and connected to the first partition, and divides the upper space into a heat dissipation chamber and a flow channel, wherein the plurality of heat-conducting strips are located in the flow channel, and the first partition has an opening on one side communicating with the flow channel and the lower space; and a top cover located above the housing and in contact with the outer frame and the inner frame.

[0025] These and other aspects of this application will become apparent from the following description of preferred embodiments in conjunction with the accompanying drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concept of this application. Attached Figure Description

[0026] The accompanying drawings illustrate one or more embodiments of this application and, together with the written description, serve to explain the principles of this application. Throughout the drawings, the same reference numerals are used wherever possible to refer to similar or identical components of the embodiments, wherein:

[0027] Figure 1 This is a split schematic diagram of a heat dissipation device according to some embodiments of this application.

[0028] Figure 2 This is a top view of a heat dissipation device according to some embodiments of this application.

[0029] Figure 3 For some embodiments of the heat dissipation device according to this application along Figure 2The cross-sectional view is shown by line segment AA in the figure.

[0030] Figure 4 For some embodiments of the heat dissipation device according to this application along Figure 2 The cross-sectional view is drawn using line segment BB.

[0031] Figure 5 This is a top view of the housing, water inlet pipe, and water outlet pipe of a heat dissipation device according to some embodiments of this application.

[0032] Figure 6 This is a bottom view of the housing of a heat dissipation device according to some embodiments of this application.

[0033] Figure 7 This is a perspective view of the housing of a heat dissipation device according to some other embodiments of this application.

[0034] Figure 8 This is a split schematic diagram of a heat dissipation device according to some other embodiments of this application.

[0035] Figure 9 This is a top view of a heat dissipation device according to some other embodiments of this application.

[0036] Figure 10 For heat dissipation devices according to other embodiments of this application along Figure 9 The cross-sectional view is drawn using line segment DD.

[0037] Figure 11 For heat dissipation devices according to other embodiments of this application along Figure 9 The cross-sectional view is drawn using line segment EE.

[0038] Figure 12 This is a perspective view of the housing of a heat dissipation device according to some other embodiments of this application.

[0039] Figure 13 This is a top view of the housing of a heat dissipation device according to some other embodiments of this application.

[0040] Figure 14 This is a bottom view of the housing of a heat dissipation device according to some other embodiments of this application.

[0041] Figure 15 For the housing of the heat dissipation device according to some other embodiments of this application along Figure 13 The cross-sectional view is drawn using line segment FF.

[0042] Figure 16 This is a perspective view of the housing of a heat dissipation device according to some other embodiments of this application.

[0043] Figure 17and Figure 18 This is a perspective cross-sectional view of a heat dissipation device according to some other embodiments of this application.

[0044] Figure 19 This is a top view of the housing of a heat dissipation device according to some other embodiments of this application.

[0045] Figure 20 This is a bottom view of the housing of a heat dissipation device according to some other embodiments of this application.

[0046] Explanation of reference numerals in the attached figures

[0047] 10, 20, 20': Heat dissipation device

[0048] 100, 200: Base plate,

[0049] 101, 201, 234, 235, 236, 237: Heat dissipation fins

[0050] 120, 120', 220, 220': Shell,

[0051] 121, 221: Outer frame

[0052] 122, 222: First partition,

[0053] 123, 223: Inner frame,

[0054] 124, 224: First heat-conducting column

[0055] 125, 225: Second heat-conducting column

[0056] 126, 226, 229: Heat-conducting strips

[0057] 127, 227: Third heat-conducting column

[0058] 140, 240: Top cover,

[0059] 160, 230: Water inlet pipes

[0060] 162, 231: Water outlet pipes

[0061] 202: Border,

[0062] 228: Fourth heat-conducting column

[0063] 232: Second partition,

[0064] 233: Third partition

[0065] AA, BB, DD, EE, FF: line segments

[0066] CC: Heat dissipation chamber

[0067] COP1, COP2: Center opening,

[0068] D1, D2: Depth

[0069] FC: flow channel

[0070] FCP1: Part One

[0071] FCP2: Part Two

[0072] FCP3: Part Three

[0073] H1: First Height

[0074] H2: Second altitude

[0075] H4: Fourth Height

[0076] HL: High heat load area

[0077] LL: Low heat load zone

[0078] LS: Lower Space

[0079] N: notch,

[0080] SOP1, SOP2, SOP3, SOP4: Side openings

[0081] US: Upper Space

[0082] X, Y, Z: Direction. Detailed Implementation

[0083] To provide a more detailed description of the contents of this application, the following description focuses on implementation methods, but this does not limit the implementation methods of this application to be the only form. The implementation methods of this application may be combined with and / or substituted for each other where advantageous, and other implementation methods may be added without further explanation.

[0084] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, meanings that are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as having the meaning consistent with the relevant field of this application. Unless specifically defined, these terms will not be construed as having idealized or overly formal meanings.

[0085] As used herein, the words “comprising,” “including,” “having,” and similar terms indicate the features, regions, integers, steps, operations, components, and / or components described herein, but do not exclude one or more other features, regions, integers, steps, operations, components, and / or groups thereof described herein or additionally.

[0086] The terms "about," "substantially," and "truly" as used in this application encompass the range of deviations of the stated numerical values ​​(or features) and those understood by one of ordinary skill in the art. For example, considering the potential for errors in numerical values ​​(or features), these terms may indicate values ​​within the standard deviation of the stated value (e.g., ±30%, ±20%, ±15%, ±10%, or ±5%), or may indicate deviations covered by the stated feature in practical operation (e.g., the description "truly parallel" may indicate practically close to parallel rather than ideally perfectly parallel). Furthermore, acceptable ranges of deviation may be selected based on the nature of the measurement or other properties.

[0087] It should be understood that when a component such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another component, it may be directly on or connected to the other component, or an intermediate component may also be present. Conversely, when a component is referred to as being "directly on" or "directly connected" to another component, no intermediate component is present. As used herein, "connection" may refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other components between the two components.

[0088] This application aims to provide a heat dissipation device that consists of multiple cavities, and by setting different heat dissipation structures such as heat-conducting pillars, heat-conducting strips and heat dissipation fins in each cavity, the temperature distribution of each cavity can be controlled to improve heat dissipation efficiency and structural rigidity.

[0089] Please refer to Figures 1 to 5 . Figure 1 This is a split schematic diagram of a heat dissipation device 10 according to some embodiments of this application. Figure 2 This is a top view of the heat dissipation device 10. Figure 3 For along Figure 2 The heat dissipation device 10 is shown in cross-sectional view by line segment AA. Figure 4 For along Figure 2 The heat dissipation device 10 is shown in the cross-sectional view of line segment BB. Figure 5 This is a top view of the housing 120, water inlet pipe 160, and water outlet pipe 162 of the heat dissipation device 10. Figure 6 This is a bottom view of the housing 120 of the heat dissipation device 10. The directions X, Y, and Z are indicated as shown in the figures.

[0090] like Figure 1As shown, the heat dissipation device 10 includes a base plate 100, a housing 120, and a top cover 140. The housing 120 is located above the base plate 100. The top cover 140 is located above the housing 120. In some embodiments, the base plate 100, housing 120, and top cover 140 are all made of copper (Cu).

[0091] like Figure 1 and Figure 2 As shown, the heat dissipation device 10 also includes a water inlet pipe 160 and a water outlet pipe 162. The water inlet pipe 160 and the water outlet pipe 162 are respectively connected to the housing 120. In some embodiments, the housing 120 is generally rectangular, and the water inlet pipe 160 and the water outlet pipe 162 are located on the same side of the rectangular housing 120. It is worth noting that the water inlet pipe 160 and the water outlet pipe 162 are not located on the central axis of the housing 120 (coinciding with line segment AA). Instead, the water inlet pipe 160 may be offset to one side of the central axis of the housing 120, while the water outlet pipe 162 may be offset to the other side of the central axis of the housing 120. The water inlet pipe 160 and the water outlet pipe 162 may be mirror-symmetrical along the central axis of the housing 120.

[0092] like Figure 1 , Figure 3 as well as Figure 4 As shown, the base plate 100 has a plurality of heat dissipation fins 101 thereon. The bottom surface of the base plate 100 is configured to contact a heat source (not shown). In some embodiments, the heat source may be a chip integrating different power components.

[0093] like Figure 3 and Figure 4 As shown, the housing 120 has an outer frame 121, a first partition 122, and an inner frame 123.

[0094] The first partition 122 is connected to the inner wall of the outer frame 121, forming a lower space LS below the first partition 122 and an upper space US above the first partition 122. Specifically, the first partition 122 is connected to the middle part of the inner wall of the outer frame 121, so that in a cross-sectional view, the first partition 122 and the inner wall of the outer frame 121 form an "H"-like shape.

[0095] like Figures 3 to 5 As shown, the inner frame 123 is located within the outer frame 121 and connects to the first partition 122, dividing the upper space US into a heat dissipation chamber CC and a flow channel FC. In some embodiments, the inner frame 123 may be arranged perpendicular to the first partition 122. In some embodiments, the flow channel FC partially surrounds the heat dissipation chamber CC. Specifically, as... Figure 1 and Figure 5As shown in the diagram, viewed from above, the heat dissipation chamber CC is roughly rectangular, and the flow channel FC can be divided into a first part FCP1, a second part FCP2, and a third part FCP3. The first part FCP1, the second part FCP2, and the third part FCP3 are located along three sides of the rectangular heat dissipation chamber CC, respectively. The second part FCP2 connects the first part FCP1 and the third part FCP3. The third part FCP3 is located relative to the first part FCP1 across the heat dissipation chamber CC.

[0096] like Figure 3 and Figure 4 As shown, the base plate 100 contacts the outer frame 121 to enclose the lower space LS. The upper cover 140 contacts the outer frame 121 and the inner frame 123 to enclose the upper space US, and prevents direct communication between the heat dissipation chamber CC and the flow channel FC. In some embodiments, such as Figure 3 and Figure 4 As shown, the base plate 100 and the top cover 140 do not have raised borders and are designed to be mostly flat.

[0097] Since the flow channel FC only partially surrounds the outside of the heat dissipation chamber CC, therefore, as Figure 5 As shown, the water inlet pipe 160 can be disposed adjacent to the heat dissipation chamber CC and directly connected to the heat dissipation chamber CC through the opening of the outer frame 121. Specifically, the water inlet pipe 160 faces one corner of the heat dissipation chamber CC. On the other hand, the water outlet pipe 162 is connected to the third part FCP3 of the flow channel FC through another opening of the outer frame 121.

[0098] To improve heat dissipation efficiency, heat dissipation structures are respectively provided in the heat dissipation chamber CC, the flow channel FC, and the lower space LS to increase the heat exchange area when the coolant flows through. In some embodiments, the coolant includes water and propylene glycol.

[0099] Specifically, such as Figure 3 and Figure 4 As shown, the heat dissipation fins 101 of the base plate 100 are housed in the lower space LS for heat exchange with the coolant. The top of the heat dissipation fins 101 of the base plate 100 contacts the bottom surface of the first partition 122 to simultaneously conduct the heat generated by the heat source below the base plate 100 upwards.

[0100] Within the heat dissipation chamber CC, the housing 120 has multiple heat-conducting pillars for heat exchange with the coolant. For example, such as... Figures 3 to 5 The first heat-conducting pillar 124 and the second heat-conducting pillar 125 are shown in the figure. Furthermore, the first heat-conducting pillar 124 and the second heat-conducting pillar 125 are connected to the top surface of the first partition 122.

[0101] It is worth noting that although the heat-conducting pillar is depicted as a cylinder in the accompanying drawings, those skilled in the art can modify the cross-section of the heat-conducting pillar to any shape as needed without departing from the scope of this application.

[0102] In some embodiments, the first heat-conducting pillar 124 and the second heat-conducting pillar 125 may have different heights. For example, such as Figure 4 As shown, the first height H1 of the first heat-conducting pillar 124 is greater than the second height H2 of the second heat-conducting pillar 125. In some embodiments, the ratio between the second height H2 and the first height H1 is between 0.01 and 0.33. For example, the first height H1 is 6.51 mm and the second height H2 is 1 mm. In some embodiments, the first heat-conducting pillar 124 contacts the upper cover 140 to reinforce support.

[0103] like Figures 4 to 6 As shown, the first partition 122 has a central opening COP1, a side opening SOP1, and a side opening SOP2. The central opening COP1 connects the heat dissipation chamber CC to the lower space LS. In some embodiments, the central opening COP1 has a spindle-like profile. The side opening SOP1 connects a first portion FCP1 of the flow channel FC to the lower space LS. The side opening SOP2 connects a third portion FCP3 of the flow channel FC to the lower space LS. In some embodiments, the side openings SOP1 and SOP2 have a serrated profile.

[0104] In flow channel FC, such as Figures 4 to 6 As shown, the housing 120 has multiple heat-conducting strips 126. Specifically, viewed from above, the heat-conducting strips 126 are located in the first portion FCP1 and the third portion FCP3 of the flow channel FC, and are situated between the outer frame 121 and the inner frame 123. In some embodiments, the heat-conducting strips 126 are connected to the first partition 122 and are separate from the outer frame 121 and the inner frame 123. The heat-conducting strips 126 are columnar and extend downward into the lower space LS through side openings SOP1 or SOP2. These heat-conducting strips 126 are used to assist in heat dissipation. Simultaneously, the heat-conducting strips 126 cause changes in the cross-sectional area of ​​the side openings SOP1 and SOP2, thereby guiding the flow of coolant and increasing its flow rate, so that the coolant, after absorbing sufficient heat and heating up, can leave the heat dissipation device 10 more quickly. In some embodiments, such as... Figure 4 As shown, the heat-conducting strip 126 contacts the base plate 100 to assist in the positioning and support of the housing 120.

[0105] In some embodiments, the outer frame 121, the first partition 122, the inner frame 123, the first heat-conducting pillar 124, the second heat-conducting pillar 125, and the heat-conducting strip 126 of the housing 120 are integrally formed continuous structures (unibody).

[0106] In this configuration, the coolant flows into the heat dissipation chamber CC from the inlet pipe 160, passes through the heat-conducting columns (such as the first heat-conducting column 124 and the second heat-conducting column 125), and then flows downward into the lower space LS through the central opening COP1. It then flows radially outward from the center through the heat dissipation fins 101, and then flows upward through the side openings SOP1 and / or SOP2, passing through the heat-conducting strips 126 and entering the flow channel FC. Finally, it flows out from the outlet pipe 162. In some embodiments, since the inlet pipe 160 and the outlet pipe 162 are located on the same side of the housing 120, the coolant flows in opposite directions.

[0107] It is worth noting that the coolant in the lower space LS can flow upward into the first part FCP1 of the flow channel FC through the side opening SOP1 or into the third part FCP3 of the flow channel FC through the side opening SOP2. Since the side opening SOP1 is farther away from the outlet pipe 162 than the side opening SOP2, the coolant flowing into the first part FCP1 through the side opening SOP1 will flow sequentially along the first part FCP1, the second part FCP2, and the third part FCP3 of the flow channel FC around the outside of the heat dissipation chamber CC before entering the outlet pipe 162.

[0108] Because different power components may be located at different positions of the heat source, the heat distribution in different areas of the heat source is uneven. This heat is transferred upwards through the heat dissipation fins 101, resulting in high heat load areas and low heat load areas (such as...) within the heat dissipation chamber CC. Figure 5 The high heat load region HL and the low heat load region LL are in the middle.

[0109] Therefore, in some embodiments, to promote heat dissipation in the high heat load region HL, a first heat-conducting pillar 124 with a relatively high height is provided in the high heat load region HL, and a second heat-conducting pillar 125 with a relatively low height is provided in the low heat load region LL. In some embodiments, such as Figure 5 As shown, the low heat load area LL is located in the central region of the heat dissipation chamber CC, and the high heat load area HL is located in the peripheral region of the heat dissipation chamber CC. Therefore, the first heat-conducting pillar 124 surrounds the second heat-conducting pillar 125, and the second heat-conducting pillar 125 surrounds the central opening COP1 of the first partition 122.

[0110] The height difference between the first heat-conducting column 124 and the second heat-conducting column 125 also facilitates airflow. Specifically, coolant located near the first heat-conducting column 124 tends to flow towards the second heat-conducting column 125, which has less resistance. Thus, after the coolant flows into the heat dissipation chamber CC from the offset inlet pipe 160, it first flows through the corners of the heat dissipation chamber CC to absorb accumulated heat, then concentrates in the central region of the heat dissipation chamber CC, and flows downward through the central opening COP1 of the first baffle 122. In some embodiments, the second heat-conducting column 125, which has a lower height, can be positioned in the region adjacent to the inlet pipe 160 for the purpose of airflow guidance to promote coolant flow and prevent coolant stagnation in the heat dissipation chamber CC.

[0111] By setting heat-conducting columns of different heights according to the heat load, the heat exchange area can be increased, the heat accumulation in the corners of the chamber can be reduced, and the maximum temperature in the chamber can be lowered. In addition, the pressure drop caused by space constraints can be avoided, thereby reducing energy consumption and pump load.

[0112] Please refer to Figure 7 . Figure 7 This is a perspective view of the housing 120' of the heat dissipation device 10 according to other embodiments of this application. It should be understood that the structural connections, materials and functions already described will not be repeated, but will be stated first.

[0113] One difference between housing 120' and housing 120 is that housing 120' also has a third heat-conducting pillar 127 located in the heat dissipation chamber CC and laterally connected to the inner frame 123 or the outer frame 121. The third heat-conducting pillar 127 can further conduct heat accumulated in the surrounding area of ​​the heat dissipation chamber CC, improving heat dissipation efficiency. In some embodiments, the third heat-conducting pillar 127 is substantially the same height as the first heat-conducting pillar 124. In some embodiments, the outer frame 121, the first partition 122, the inner frame 123, the first heat-conducting pillar 124, the second heat-conducting pillar 125, the heat-conducting strip 126, and the third heat-conducting pillar 127 of housing 120' are integrally formed continuous structures.

[0114] Another difference between housing 120' and housing 120 is that the central opening COP1 of the first partition 122 of housing 120' has a narrow rectangular profile. Accordingly, a first heat-conducting pillar 124 and a second heat-conducting pillar 125 are staggered around the central opening COP1 to meet the requirements of heat dissipation and airflow.

[0115] Please refer to Figures 8 to 15 . Figure 8 This is a split schematic diagram of the heat dissipation device 20 according to some other embodiments of this application. Figure 9 This is a top view of the heat dissipation device 20. Figure 10 For along Figure 9The line segment DD in the figure represents a cross-sectional view of the heat dissipation device 20. Figure 11 For along Figure 9 The line segment EE in the figure represents a cross-sectional view of the heat dissipation device 20. Figure 12 This is a perspective view of the housing 220 of the heat dissipation device 20. Figure 13 This is a top view of housing 220. Figure 14 This is a bottom view of housing 220. Figure 15 For along Figure 13 The line segment FF in the figure represents a cross-sectional view of the housing 220.

[0116] like Figure 8 and Figure 9 As shown, the heat dissipation device 20 includes a base plate 200, a housing 220, and a top cover 240. The housing 220 is located above the base plate 200. The top cover 240 is located above the housing 220.

[0117] Unlike the heat dissipation device 10, the water inlet pipe 230 and the water outlet pipe 231 of the heat dissipation device 20 are part of the integrally formed continuous structure of the housing 220.

[0118] like Figure 8 , Figure 10 as well as Figure 11 As shown, the base plate 200 has a plurality of heat dissipation fins 201 thereon. In addition, the base plate 200 has a raised frame 202 surrounding the heat dissipation fins 201.

[0119] like Figure 10 and Figure 11 As shown, the housing 220 has an outer frame 221, a first partition 222, and an inner frame 223. The first partition 222 is connected to the inner sidewall of the outer frame 221, forming a lower space LS below the first partition 222 and an upper space US above the first partition 222. Compared to the heat dissipation device 10, the first partition 222 of the heat dissipation device 20 is connected to a lower portion of the inner sidewall of the outer frame 221 to accommodate the smaller heat dissipation fins 201 in the lower space LS. Furthermore, as... Figure 10 and Figure 11 As shown, the frame 202 of the base plate 200 contacts the first partition 222.

[0120] The inner frame 223 is connected to the outer frame 221 and the first partition 222, and divides the upper space US into a heat dissipation chamber CC and a flow channel FC. In some embodiments, the flow channel FC partially surrounds the outside of the heat dissipation chamber CC. Similar to the heat dissipation device 10, the flow channel FC can be divided into a first part FCP1, a second part FCP2, and a third part FCP3.

[0121] like Figure 10 and Figure 11As shown, the base plate 200 contacts the outer frame 221 to enclose the lower space LS. The upper cover 240 contacts the outer frame 221 and the inner frame 223 to enclose the upper space US, and prevents the heat dissipation chamber CC from being directly connected to the flow channel FC.

[0122] Similarly, in order to improve heat dissipation efficiency, heat dissipation structures are respectively provided in the heat dissipation chamber CC, the flow channel FC, and the lower space LS of the housing 220.

[0123] Specifically, the heat dissipation fins 201 of the base plate 200 are housed in the lower space LS. The top of the heat dissipation fins 201 of the base plate 200 contacts the bottom surface of the first partition 222.

[0124] Within the heat dissipation chamber CC, the housing 220 has multiple heat-conducting pillars. For example, such as... Figures 10 to 13 The diagram shows a first heat-conducting pillar 224, a second heat-conducting pillar 225, a third heat-conducting pillar 227, and a fourth heat-conducting pillar 228. Further, the first heat-conducting pillar 224, the second heat-conducting pillar 225, the third heat-conducting pillar 227, and the fourth heat-conducting pillar 228 are connected to the top surface of the first partition 222. The third heat-conducting pillar 227 is also laterally connected to the inner frame 223.

[0125] In some implementations, the heat-conducting pillars can have different heights. For example, such as... Figure 11 As shown, the first height H1 of the first heat-conducting pillar 224 is greater than the fourth height H4 of the fourth heat-conducting pillar 228, and the fourth height H4 of the fourth heat-conducting pillar 228 is greater than the second height H2 of the second heat-conducting pillar 225. In some embodiments, the ratio between the fourth height H4 and the first height H1 is between 0.33 and 0.75, and the ratio between the second height H2 and the fourth height H4 is between 0.01 and 1. For example, the first height H1 is 11.25 mm, the second height H2 is 1.25 mm, and the fourth height H4 is 6.50 mm. In some embodiments, the first heat-conducting pillar 224 is configured to contact the top cover 240 to reinforce support.

[0126] Similarly, heat-conducting pillars of varying heights can be configured according to the distribution of the heat load within the heat dissipation chamber CC. For example, such as Figure 12 As shown, the tallest first heat-conducting column 224 and the second tallest fourth heat-conducting column 228 are positioned in the peripheral region with higher heat load, while the shortest second heat-conducting column 225 is positioned in the central region with lower heat load. In some embodiments, such as Figure 11 and Figure 12 As shown, a fourth heat-conducting pillar 228 is disposed between the first heat-conducting pillar 224 and the second heat-conducting pillar 225. On the other hand, as... Figure 12As shown, the first heat-conducting pillar 224 and the fourth heat-conducting pillar 228 together surround the second heat-conducting pillar 225, and the second heat-conducting pillar 225 surrounds the central opening COP1 of the first partition 222.

[0127] Furthermore, for the purpose of airflow guidance, a lower-height second heat-conducting column 225 is installed in the area adjacent to the water inlet pipe 230 to promote coolant flow and prevent coolant from stagnating in the heat dissipation chamber CC. At the same time, the first heat-conducting column 224 and the second heat-conducting column 225 are staggered around the central opening COP1 to meet the requirements of heat dissipation and airflow guidance.

[0128] like Figure 11 , Figure 13 as well as Figure 14 As shown, the first partition 222 has a plurality of side openings SOP1 and a plurality of side openings SOP2. Each side opening SOP1 connects a first portion FCP1 of the flow channel FC to the lower space LS. Each side opening SOP2 connects a third portion FCP3 of the flow channel FC to the lower space LS. In some embodiments, the side openings SOP1 and SOP2 have a generally rectangular outline.

[0129] In flow channel FC, such as Figure 11 , Figure 13 as well as Figure 14 As shown, the housing 220 has multiple heat-conducting strips 226. Specifically, viewed from above, the heat-conducting strips 226 are located in the first portion FCP1 and the third portion FCP3 of the flow channel FC, and are situated between the outer frame 221 and the inner frame 223. In some embodiments, the heat-conducting strips 226 are connected to the first partition 222. The heat-conducting strips 226 are plate-shaped and located between two adjacent side openings SOP1 or two side openings SOP2. The heat-conducting strips 226 are located above the first partition 222 and are connected between the inner frame 223 and the outer frame 221. These heat-conducting strips 226 are used to assist in heat dissipation and also have the function of guiding the flow of coolant and increasing the flow rate. In some embodiments, such as Figure 11 As shown, the top surface height of the heat-conducting strip 226 is lower than the top surface height of the inner frame 223.

[0130] In some implementations, such as Figure 10 , Figure 12 as well as Figure 13 As shown, the housing 220 also has a heat-conducting strip 229 located in the second part FCP2 of the flow channel FC, connecting the inner frame 223 and the outer frame 221, with its top surface height lower than that of the inner frame 223. In some embodiments, such as Figure 10 and Figure 13 As shown, each heat-conducting strip 229 has a notch N. Figure 15 The illustrated cross-section passes through the notch N of the heat-conducting strip 229. (Example) Figure 15As shown, the depths of the notches N in adjacent heat-conducting strips 229 can be different (e.g., depth D1 and depth D2) to create differences in coolant flow rates, generating more vortices and backflow. This promotes coolant mixing, ensures a more uniform temperature distribution within the flow channel FC, and avoids localized overheating.

[0131] In some embodiments, the outer frame 221, the first partition 222, the inner frame 223, the first heat-conducting pillar 224, the second heat-conducting pillar 225, the heat-conducting strip 226, the third heat-conducting pillar 227, the fourth heat-conducting pillar 228, and the heat-conducting strip 229 of the housing 220 are integrally formed continuous structures.

[0132] Please refer to Figures 16 to 20 . Figure 16 This is a perspective view of the housing 220' according to some other embodiments of this application. Figure 17 and Figure 18 This is a perspective cross-sectional view of the heat dissipation device 20' including the housing 220'. Figure 17 Draw along the central axis of the shell 220' parallel to direction X (similar to the position of line segment AA), and Figure 18 Draw along the central axis of the housing 220' parallel to the direction Y (similar to the position of line segment BB). Figure 19 This is a top view of the housing 220'. Figure 20 This is a bottom view of the housing 220'.

[0133] One of the differences between heat dissipation device 20' and heat dissipation device 20 is that, as Figures 16 to 18 As shown, the housing 220' of the heat dissipation device 20' also has a second partition 232 and a third partition 233. The second partition 232 and the third partition 233 are parallel to the first partition 222 and connected to the inner frame 223. The second partition 232 is located above the first partition 222. The third partition 233 is parallel to the second partition 232 and is located above the second partition 232.

[0134] In addition, such as Figures 16 to 18 As shown, the second partition 232 has side openings SOP3 and SOP4. The third partition 233 has a central opening COP2. In some embodiments, the central opening COP2 of the third partition 233 and the central opening COP1 of the first partition 222 may have different profiles. Figure 19 and Figure 20 As shown, the central opening COP2 of the third partition 233 has a narrow rectangular outline, while the central opening COP1 of the first partition 222 has a spindle-shaped outline.

[0135] In some implementations, such as Figures 16 to 18As shown, the housing 220' also has heat dissipation fins 234 and 235 above the first partition 222, contacting the second partition 232, and respectively located on both sides of the central opening COP1 of the first partition 222. In some embodiments, the housing 220' also has heat dissipation fins 236 and 237 above the second partition 232, contacting the third partition 233, and respectively located on both sides of the central opening COP2 of the third partition 233.

[0136] Another difference between heat dissipation device 20' and heat dissipation device 20 is that the heat-conducting pillars of housing 220' are of uniform height and all contact the upper cover 240. Specifically, housing 220' has a first heat-conducting pillar 224 located above and connected to the third partition 233, such as... Figure 17 and Figure 18 As shown in the image.

[0137] In this configuration, the coolant flows into the heat dissipation chamber CC from the inlet pipe 230, flows through the first heat-conducting column 224 located on the third partition 233, and then flows downward through the central opening COP2 of the third partition 233 to the space between the third partition 233 and the second partition 232. It then flows radially from the center to the periphery through the heat dissipation fins 236 and 237, and then flows downward through the side openings SOP3 and SOP4 of the second partition 232 to the space between the second partition 232 and the first partition 222. It then flows through the heat dissipation fins 234 and 235, and concentrates at the central opening COP1 of the first partition 222. It then flows downward into the lower space LS, and then flows radially from the center to the periphery through the heat dissipation fins 201. Finally, it flows upward through the side openings SOP1 and SOP2 of the first partition 222 through the heat-conducting strip 226 and into the flow channel FC, and finally flows out from the outlet pipe 231.

[0138] By setting the second partition 232 and the third partition 233, the heat dissipation chamber CC can be further divided into layers, and more heat dissipation fins can be installed, thereby increasing the total surface area for heat exchange. At the same time, the multi-layered heat dissipation fins help the coolant flow through more areas in the heat dissipation chamber CC, thereby reducing heat accumulation in the surrounding areas of the heat dissipation chamber CC and improving the overall heat exchange efficiency.

[0139] The detailed description of the specific embodiments of this application above clearly shows that in the heat dissipation device of some embodiments of this application, dividing the shell into multiple chambers (i.e., the heat dissipation chamber in the upper space, the flow channel, and the lower space), and setting different heat dissipation structures in each chamber, can increase the heat exchange area and improve heat dissipation efficiency. Furthermore, in the heat dissipation chamber of the upper space through which the coolant first passes, heat-conducting columns of different heights or multi-layered heat dissipation fins are set according to the heat load, which can reduce heat accumulation in the corners of the chamber, thereby lowering the maximum temperature inside the chamber. Heat-conducting columns of different heights also help guide the flow and avoid increased pressure drop. Heat dissipation fins are set in the lower space through which the coolant next passes. And in the flow channel of the upper space through which the coolant last passes, heat-conducting strips are set to assist heat dissipation and guide the flow of coolant and increase the flow rate.

[0140] The foregoing description is only for illustrating exemplary embodiments of this application and is not intended to exhaustively describe or limit the precise forms of the utility models disclosed in this application. The above teachings may be modified or varied.

[0141] The selected and illustrated embodiments are intended to explain the content of this application and their practical application, thereby inspiring those skilled in the art to utilize this application and its various embodiments, and to make various modifications to suit specific intended uses. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of this application. Therefore, the scope of this application is defined by the appended utility model claims, and not by the foregoing description and the exemplary embodiments described therein.

Claims

1. A heat dissipation device, characterized in that, Include: One base plate; A housing is located above the base plate and has an outer frame, a first partition, an inner frame, and multiple heat-conducting pillars. The first partition is connected to an inner wall of the outer frame, forming a lower space below the first partition and an upper space above the first partition. The inner frame is located within the outer frame and connected to the first partition, dividing the upper space into a heat dissipation chamber and a flow channel. The multiple heat-conducting pillars are located in the heat dissipation chamber, and the first partition has a central opening connecting the heat dissipation chamber and the lower space. A top cover is located above the housing and contacts a first of the plurality of heat-conducting pillars and the inner frame.

2. The heat dissipation device according to claim 1, characterized in that, The housing also has multiple heat-conducting strips located in the flow channel.

3. The heat dissipation device according to claim 2, characterized in that, The first partition has an opening on one side connecting the flow channel and the lower space, and one of the plurality of heat-conducting strips is separated from the outer frame and extends downward into the lower space through the side opening.

4. The heat dissipation device according to claim 3, characterized in that, One of the multiple heat-conducting strips is in contact with the base plate.

5. The heat dissipation device according to claim 2, characterized in that, One of the multiple heat-conducting strips is located above the first partition and connected between the inner frame and the outer frame.

6. The heat dissipation device according to claim 5, characterized in that, The first partition has adjacent two side openings that connect the flow channel and the lower space respectively, and one of the plurality of heat-conducting strips is located between the two side openings.

7. The heat dissipation device according to claim 5, characterized in that, One of the multiple heat-conducting strips has a notch.

8. The heat dissipation device according to claim 1, characterized in that, The first of the plurality of heat-conducting pillars has a first height greater than the second of the plurality of heat-conducting pillars.

9. The heat dissipation device according to claim 8, characterized in that, The ratio between the second height and the first height is between 0.01 and 0.

33.

10. The heat dissipation device according to claim 8, characterized in that, A third of the plurality of heat-conducting pillars is laterally connected to the inner frame.

11. The heat dissipation device according to claim 8, characterized in that, A fourth of the plurality of heat-conducting pillars is located between the first and the second pillars, wherein the fourth pillar has a fourth height greater than the second height, and the first height is greater than the fourth height.

12. The heat dissipation device according to claim 11, characterized in that, The ratio between the fourth height and the first height is between 0.33 and 0.75, and the ratio between the second height and the fourth height is between 0.01 and 1.

13. The heat dissipation device according to claim 1, characterized in that, Multiple heat-conducting pillars are connected to the first partition.

14. The heat dissipation device according to claim 1, characterized in that, The housing also has a second partition located above the first partition, parallel to the first partition, and connected to the inner frame.

15. The heat dissipation device according to claim 14, characterized in that, The housing also has a third partition located above the second partition, parallel to the second partition, and connected to the inner frame, wherein a plurality of the heat-conducting columns are located above the third partition and connected to the third partition.

16. The heat dissipation device according to claim 14, characterized in that, The housing also has multiple heat dissipation fins located above the first partition and the second partition, respectively.

17. The heat dissipation device according to claim 1, characterized in that, The flow channel partially surrounds the heat dissipation chamber.

18. A heat dissipation device, characterized in that, Include: The base plate has multiple heat dissipation fins; A housing is located above the base plate and has an outer frame, a first partition, and an inner frame. The first partition is connected to an inner sidewall of the outer frame, forming a lower space below the first partition and an upper space above the first partition. The inner frame is located within the outer frame and connected to the first partition, dividing the upper space into a heat dissipation chamber and a flow channel partially surrounding the heat dissipation chamber. The first partition contacts a plurality of heat dissipation fins and has a central opening and a side opening. The central opening connects the heat dissipation chamber and the lower space, and the side opening connects the flow channel and the lower space. A top cover is located above the upper space of the housing and contacts the outer frame and the inner frame.

19. The heat dissipation device according to claim 18, characterized in that, The outer frame, the first partition, and the inner frame of the housing are integrally formed as a continuous structure.

20. A heat dissipation device, characterized in that, Include: One base plate; A housing is located above the base plate and has an outer frame, a first partition, an inner frame, and multiple heat-conducting strips. The first partition is connected to an inner sidewall of the outer frame, forming a lower space below the first partition and an upper space above the first partition. The inner frame is located within the outer frame and connected to the first partition, dividing the upper space into a heat dissipation chamber and a flow channel. Multiple heat-conducting strips are located in the flow channel, and the first partition has an opening on one side connecting the flow channel and the lower space. A top cover is located above the housing and contacts the outer frame and the inner frame.

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