Housing for a controller and controller

Abstract

The utility model discloses a kind of shell for controller, it includes: first shell portion (1) and the second shell portion (2) being connected with first shell portion, the second shell portion and first shell portion enclose the internal space of shell;Wherein, the top plate outer surface (P1) of the first shell portion at least has first planar region (11) and the second planar region (12) with first planar region non-coplanar, the first planar region is equipped with several first radiating fins (111) of vertical arrangement to form several first air duct (112), the second planar region is equipped with several second radiating fins (121) of vertical arrangement to form several second air duct (122);The side surface of the first shell portion is equipped with first air inlet (14), second air inlet (15) and air outlet (16), wherein along the extension direction of first air duct and second air duct, the first air inlet is located at one side, and the second air inlet and air outlet are located at the other side.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure, and more particularly to a heat dissipation structure for a controller. Background Technology

[0002] The controller is the core computing unit of many smart devices. As the computing power requirements of various smart devices continue to increase, the power of controllers is also increasing, thus requiring more efficient heat dissipation. Especially for controllers with high-power chips, if these chips cannot be cooled quickly and promptly, heat will accumulate inside the controller's casing, causing the internal temperature to rise and severely impacting the overall performance of the controller.

[0003] Especially for controllers with two or more printed circuit board assemblies, it is even more necessary to consider efficient heat dissipation for the core heat-generating components on different printed circuit board assemblies. Utility Model Content

[0004] One of the objectives of this invention is to provide a housing for a controller that can meet the heat dissipation requirements of multiple printed circuit board components of the controller within a limited space and volume, and has a simple structure that is easy to manufacture and process.

[0005] To achieve the above objectives, this utility model proposes a housing for a controller, comprising: a first housing portion and a second housing portion connected to the first housing portion, wherein the second housing portion and the first housing portion together form an internal space of the housing; wherein:

[0006] The outer surface of the top plate of the first housing portion has at least a first planar region and a second planar region that is not coplanar with the first planar region. The first planar region is provided with a plurality of vertically arranged first heat dissipation fins to form a plurality of first air ducts, and the second planar region is provided with a plurality of vertically arranged second heat dissipation fins to form a plurality of second air ducts.

[0007] The first housing portion has a first air inlet, a second air inlet, and an air outlet on its side. The first air inlet is located on one side along the extension direction of the first and second air ducts, while the second air inlet and air outlet are located on the other side.

[0008] Furthermore, in the housing described in this utility model, the extension height of the first heat dissipation fin is greater than the extension height of the second heat dissipation fin; and / or the number of the first heat dissipation fins is greater than the number of the second heat dissipation fins.

[0009] Furthermore, in the housing described in this utility model, the width of the first air duct is smaller than the width of the second air duct.

[0010] Furthermore, in the housing described in this utility model, the air outlet and a portion of the first air inlet are located on both sides of the first air duct in the extension direction of the first air duct; the second air inlet and another portion of the first air inlet are located on both sides of the second air duct in the extension direction of the second air duct.

[0011] Furthermore, in the outer casing of this utility model, there is an inclined region between the first planar region and the second planar region, and the inclined region is provided with a plurality of vertically arranged third heat dissipation fins to form a plurality of third air ducts.

[0012] Furthermore, in the housing described in this utility model, a fourth heat dissipation fin is provided on the inner surface of the top plate of the first housing portion at a position corresponding to the inclined area.

[0013] Furthermore, in the housing described in this utility model, the inner surface of the top plate of the first housing portion is provided with a first heat dissipation boss protruding from the inner surface of the top plate at a position corresponding to the first planar region.

[0014] Furthermore, in the housing described in this utility model, the surface of the first heat dissipation boss that is used to abut against and connect with the electronic components of the controller is provided with a first thermally conductive material layer.

[0015] Furthermore, in the housing described in this utility model, a second heat dissipation boss protruding from the inner surface of the top plate of the first housing portion is provided at a position corresponding to the second planar region.

[0016] Furthermore, in the housing described in this utility model, the surface of the second heat dissipation boss used for corresponding contact and connection with the electronic components of the controller is provided with a second thermally conductive material layer.

[0017] Furthermore, the housing described in this utility model includes a cover plate that covers the first housing portion, so that at least the first heat dissipation fin and the second heat dissipation fin are disposed in a relatively enclosed space.

[0018] Furthermore, in the outer shell described in this utility model, the first shell portion is an integral die-cast structure.

[0019] Another objective of this invention is to provide a controller that can quickly dissipate heat to ensure stable performance.

[0020] To achieve the above objectives, the present invention also provides a controller, which includes:

[0021] The outer casing as described above;

[0022] An air-cooling element is located at the air outlet of the housing;

[0023] At least two printed circuit board assemblies are disposed within the housing.

[0024] Furthermore, in the controller described in this utility model, the air-cooling element includes a fan.

[0025] The housing structure described in this invention is simple and can efficiently dissipate heat from different printed circuit board components inside the controller simultaneously or synchronously, which helps to ensure the stable performance of the controller. Attached Figure Description

[0026] Figure 1 The diagram shows a split structure of the outer shell of this utility model in one embodiment.

[0027] Figure 2 A cross-sectional view of the housing described in this utility model is shown from a frontal perspective in one embodiment.

[0028] Figure 3 The partial structure of the first housing portion of the housing according to one embodiment of the present invention is shown in cross-section.

[0029] Figure 4 The cooling airflow path of the housing described in this invention is shown from a top-down perspective in one embodiment.

[0030] Figure 5 This invention shows the structure of the first housing portion in one embodiment of the housing, from another perspective.

[0031] Figure 6 The partial structure of the first housing portion of the housing described in one embodiment of the present invention is shown from another perspective in a sectional view.

[0032] Figure 7 The diagram shows a split structure of the controller according to one embodiment of the present invention. Detailed Implementation

[0033] The housing and controller of this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, such explanation and description do not constitute an undue limitation on the technical solution of this utility model.

[0034] As the computing power requirements for controllers continue to increase, the power consumption of controllers is also increasing, leading to higher demands for heat dissipation. This is especially true for controllers with two or more printed circuit board assemblies. If these assemblies are not cooled quickly and promptly, heat will accumulate inside the controller housing, causing the internal temperature to rise and severely impacting the overall performance of the controller.

[0035] To address the aforementioned problems, this invention provides a housing for a controller in one embodiment.

[0036] Figure 1 The diagram shows a split structure of the outer shell of this utility model in one embodiment.

[0037] like Figure 1 As shown, in some embodiments, the housing for the controller may include a first housing portion 1 and a second housing portion 2 connected to the first housing portion 1, thereby forming a relatively enclosed internal space of the housing. In some more specific embodiments, the first housing portion 1 may be connected to the second housing portion 2 by a first connecting bolt 21. In other more specific embodiments, the first housing portion may also be connected to the second housing portion by other means, such as by a snap-fit ​​connection.

[0038] In some specific embodiments, the housing may also include an antenna cover 3, which can be connected to the first housing portion by a second connecting bolt 31.

[0039] Figure 2 A cross-sectional view of the housing described in this utility model is shown from a frontal perspective in one embodiment.

[0040] Figure 3 The partial structure of the first housing portion of the housing according to one embodiment of the present invention is shown in cross-section.

[0041] like Figure 2 and Figure 3 As shown, the outer surface P1 of the top plate of the first housing portion 1 has at least a first planar region 11 and a second planar region 12 that is not coplanar with the first planar region. The first planar region 11 has a plurality of vertically arranged first heat dissipation fins 111, and adjacent first heat dissipation fins 111 form a first airflow channel 112, thus the plurality of first heat dissipation fins 111 form a plurality of first airflow channels 112. The second planar region 12 has a plurality of vertically arranged second heat dissipation fins 121, and adjacent second heat dissipation fins 121 form a second airflow channel 122, thus the plurality of second heat dissipation fins 121 form a plurality of second airflow channels 122.

[0042] It should be noted that the term "vertically positioned" in this invention refers to the heat dissipation fins extending from their respective planar regions. In some possible embodiments, the heat dissipation fins may be "absolutely perpendicular" to their respective planar regions. In other possible embodiments, it is also feasible for the first and second heat dissipation fins to be inclined within a certain range in the planar region, for example, with an angle of 1 degree relative to the normal of the planar region.

[0043] like Figure 1 and Figure 2 As shown, the first housing part 1 has a first air inlet 14 and a second air inlet 15 on its side. Figure 1 The first air inlet 14 is located on one side of the first housing part 1, and the second air inlet 15 and air outlet 16 are located on the other side, along the extending direction of the first air duct 112 and the second air duct 122.

[0044] With this configuration, the heat dissipated by at least two printed circuit board assemblies (each of which includes a printed circuit board and electronic components disposed thereon) within the housing can be transferred to the outside of the housing at least through the first and second heat dissipation fins. Figure 4 As shown, cooling air can enter the housing from the first air inlet 14 and the second air inlet 15, and after sufficient heat exchange with at least the first heat dissipation fins and the second heat dissipation fins, it flows out from the air outlet 16, thereby achieving rapid heat dissipation for at least two printed circuit board assemblies.

[0045] In some more specific implementations, to further improve the heat dissipation effect, such as Figure 2 and Figure 3 As shown, a number of vertically arranged third heat dissipation fins 131 can also be provided in the inclined area 13 between the first plane area 11 and the second plane area 12. Adjacent third heat dissipation fins 131 form a third air duct 132, thereby making a number of third heat dissipation fins 131 form a number of third air ducts 132.

[0046] In some specific embodiments, if the power and heat dissipation of the first printed circuit board assembly corresponding to the first planar region are greater than the power and heat dissipation of the second printed circuit board assembly corresponding to the second planar region, such as... Figure 4 As shown, an air outlet 16 and a portion of the first air inlet can be provided on both sides of the first air duct 112 in the extension direction of the first air duct, and a second air inlet 15 and another portion of the first air inlet can be provided on both sides of the second air duct 122 in the extension direction of the second air duct.

[0047] Specifically, the air-cooled component is located at the air outlet. When the air-cooled component, such as a fan, is working, the area where the first air duct 112 is located is directly opposite the air-cooled component, causing a low-pressure area to form within the first air duct, and a large amount of cooling air F flows out from it. Figure 4 The first air inlet 14 on the right side of the first air duct draws in air, which flows through the first heat dissipation fins. After heat exchange with the first heat dissipation fins, the air is discharged from the outlet 16. At the same time, inside the second air duct 122, due to the low pressure formed in the first air duct, cold air F is drawn into the second air duct from the second air inlets 15 on both sides of the second air duct 122 and from another part of the first air inlets. This cooling airflow exchanges heat with the second heat dissipation fins and continues to converge from the right side of the first air duct back into the first air duct, and is finally discharged together with the cooling air in the first air duct.

[0048] Similarly, when a third heat dissipation fin 131 and a third air duct 132 are provided, the low pressure formed in the first air duct causes cold air F to be drawn into the third air duct from the second air inlet 15 on the left and right sides of the third air duct 132 and another part of the first air inlet. After the cooling air flows through the third heat dissipation fin and exchange heat with the third heat dissipation fin, it will continue to converge from the right side of the first air duct into the first air duct, and finally be discharged together with the cooling air in the first air duct.

[0049] With this configuration, a larger cooling airflow flows through the first planar area used to dissipate heat from the first printed circuit board assembly, thereby meeting its higher heat dissipation requirements.

[0050] It should be noted that the description of the first planar region and the first heat dissipation fins disposed thereon, the second planar region and the second heat dissipation fins disposed thereon, in this utility model does not limit the utility model to only being used for heat dissipation of two printed circuit board assemblies. Rather, it is intended to show that the housing described in this utility model can simultaneously or concurrently dissipate heat from more than one printed circuit board assembly. It is understood that the housing may also be provided with a third planar region and corresponding heat dissipation fins, a fourth planar region and corresponding heat dissipation fins, or more planar regions and corresponding heat dissipation fins, to simultaneously or concurrently dissipate heat from a third, fourth, or more printed circuit board assemblies, respectively.

[0051] It should also be noted that the top plate of the first housing portion described in this utility model is to distinguish it from the side of the first housing portion. Here, "top plate" refers to the part of the first housing portion that is opposite to the second housing portion, and does not mean that the top plate is necessarily located above the second housing portion in actual use. Depending on the placement of the outer shell, the top plate may also be located below or beside the second housing portion. The outer surface of the top plate refers to the surface on the top plate that is opposite to the cavity of the outer shell.

[0052] In some specific implementations, in order to further meet the heat dissipation requirements of the high-power printed circuit board assembly corresponding to the first planar region, such as Figure 2 and Figure 3 As shown, the extension height of the first heat dissipation fin 111 can be greater than the extension height of the second heat dissipation fin 121, thereby giving the first heat dissipation fin a larger heat dissipation area.

[0053] In some other specific embodiments, in order to further meet the heat dissipation requirements of the high-power printed circuit board assembly corresponding to the first planar region, the number of first heat dissipation fins 111 can be greater than the number of second heat dissipation fins 121.

[0054] Of course, in some other specific embodiments, the extension height of the first heat dissipation fin 111 can be greater than the extension height of the second heat dissipation fin 121, and the number of the first heat dissipation fins 111 can be greater than the number of the second heat dissipation fins 121.

[0055] Furthermore, in some specific embodiments, in order to further meet the heat dissipation requirements of the high-power printed circuit board assembly corresponding to the first planar region, the width of the first air duct 112 can be made smaller than the width of the second air duct 122. This is beneficial to make the cooling air velocity in the first air duct faster, thereby allowing a larger cooling air volume to pass through the first air duct per unit time, so as to further improve the cooling efficiency of the region.

[0056] like Figure 2 , Figure 3 and Figure 5 As shown, in order to further improve the heat dissipation effect of the casing, in some specific embodiments, a plurality of fourth heat dissipation fins 133 can be provided on the inner surface of the top plate of the first casing part (i.e. the surface facing the internal space of the casing) corresponding to the inclined area 13, so as to further increase the heat dissipation area of ​​the casing.

[0057] In some more specific implementations, such as Figure 1 As shown, the housing may also include a cover plate 4, which covers the first housing portion 1, so that at least the first heat dissipation fin 111 and the second heat dissipation fin 121 are located in a relatively enclosed space, thereby ensuring low pressure in the first air duct when the air-cooled component is working.

[0058] like Figure 5As shown, in order to further improve the heat dissipation effect and to perform targeted heat dissipation on high-power electronic devices, such as chips, in the printed circuit board assembly corresponding to the first planar area, in some specific embodiments, the inner surface P2 of the top plate of the first housing portion (i.e. the side facing the housing cavity) is provided with a first heat dissipation protrusion 141 protruding from the inner surface of the top plate at the position corresponding to the first planar area.

[0059] It should be noted that this utility model does not limit the number of first heat dissipation protrusions; there can be one or more. Those skilled in the art can set the number of first heat dissipation protrusions according to needs, such as the number of electronic devices requiring targeted heat dissipation. The first heat dissipation protrusion 141 is used to respectively abut and connect with at least one electronic device of one of the printed circuit board assemblies for heat exchange, thereby achieving the function of heat dissipation for the electronic devices. In this way, the housing can simultaneously provide targeted heat dissipation and cooling for one or more heat-generating electronic devices on the printed circuit board assembly through one or more first heat dissipation protrusions 141, effectively avoiding the problem of uneven heat dissipation and further improving heat dissipation efficiency.

[0060] Similarly, as Figure 5 As shown, in order to further improve the heat dissipation effect and to perform targeted heat dissipation on high-power electronic devices, such as chips, in the printed circuit board assembly corresponding to the second planar region, in some specific embodiments, the inner surface P2 of the top plate of the first housing portion (i.e. the side facing the housing cavity) is provided with a second heat dissipation protrusion 142 protruding from the inner surface of the top plate at the position corresponding to the second planar region.

[0061] This invention does not limit the number of second heat dissipation protrusions; there can be one or more. Those skilled in the art can determine the number of second heat dissipation protrusions as needed, such as the number of electronic devices requiring targeted heat dissipation. The second heat dissipation protrusion 142 is used to respectively abut and connect with at least one electronic device of another printed circuit board assembly for heat exchange, thereby dissipating heat from the electronic device. In this way, the housing can simultaneously provide targeted heat dissipation and cooling to one or more heat-generating electronic devices on the printed circuit board assembly through one or more second heat dissipation protrusions 142, effectively avoiding uneven heat dissipation and further improving heat dissipation efficiency.

[0062] It is understood that in some specific embodiments, both a first heat dissipation boss and a second heat dissipation boss may be provided. In other specific embodiments, only the first heat dissipation boss may be provided. In still other specific embodiments, only the second heat dissipation boss may be provided.

[0063] In some specific implementations, the first housing portion can be an integral die-cast structure.

[0064] In some specific embodiments, the material of the first housing part can be aluminum or aluminum alloy or other materials that take into account both lightness and heat dissipation.

[0065] In some other embodiments, this invention also provides a controller that can quickly dissipate heat to ensure stable performance.

[0066] Figure 7 The diagram shows a split structure of the controller according to one embodiment of the present invention.

[0067] like Figure 7 As shown, in some embodiments, the controller may include a housing as described in the above embodiments, with a cooling element 5 provided at the air outlet 16 of the housing at the air-cooling element receiving station 161. In addition, at least two printed circuit board assemblies are provided inside the housing, such as a main printed circuit board assembly 61 and a sub-printed circuit board assembly 62.

[0068] In some specific implementation methods, such as Figure 7 As shown, a shielding plate 63 may be provided between the main printed circuit board assembly 61 and the sub-printed circuit board assembly 62. The shielding plate 63 can be installed between the main printed circuit board assembly 61 and the sub-printed circuit board assembly 62 by screws 64.

[0069] In some more specific implementations, such as Figure 7 As shown, the surface of the first heat dissipation protrusion 141, which is used to abut and connect with the electronic components of the controller, is provided with a first thermally conductive material layer 151. That is, the first thermally conductive material layer 151 is disposed between the electronic component of one of the corresponding printed circuit board assemblies (e.g., the electronic component on the main printed circuit board) and the first heat dissipation protrusion.

[0070] In some more specific implementations, such as Figure 7 As shown, the surface of the second heat dissipation protrusion 142, which is used to abut against and connect with the electronic components of the controller, is provided with a second thermally conductive material layer 152. That is, the second thermally conductive material layer 152 is disposed between the electronic components of another printed circuit board assembly (e.g., electronic components on a sub-printed circuit board) and the second heat dissipation protrusion.

[0071] Similarly, in other implementations, such as Figure 7 As shown, the inner surface of the second housing portion 2 (i.e., the surface facing the outer housing cavity) has a heat dissipation protrusion 143. The heat dissipation protrusion 143 can facilitate heat exchange with electronic devices located on one side of the second housing portion.

[0072] In some more specific implementations, such as Figure 7 As shown, the surface of the heat dissipation protrusion 143 of the second housing portion, which is used to abut and connect with the corresponding electronic device of the controller, is provided with a third thermally conductive material layer 153. That is, the third thermally conductive material layer 153 is disposed between the corresponding electronic device (e.g., electronic device on the main printed circuit board) and the heat dissipation protrusion 143 of the second housing portion.

[0073] The aforementioned thermally conductive material layer can reduce thermal resistance, thereby further improving the thermal conductivity.

[0074] In some more specific embodiments, the thermally conductive material layer may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation.

[0075] Of course, in other more specific embodiments, the thermally conductive material layer can also be thermally conductive putty, thermally conductive gel, thermally conductive double-sided tape, thermally conductive graphite sheet or similar thermally conductive element.

[0076] In some more specific embodiments, the air-cooling element 5 may include a fan. In other more specific embodiments, the air-cooling element may also include a suction device, such as a suction pump.

[0077] Through the above-described configuration, the controller of this invention achieves efficient heat dissipation with a simple structure, meeting the heat dissipation requirements of different printed circuit board components. Furthermore, the controller's assembly process is simple, improving production efficiency. Specifically, the entire assembly process only requires stacking components on one side in a pyramidal fashion, without any component flipping, which facilitates automated assembly on the production line. For example, in an exemplary embodiment, the air-cooled component can be placed on the first housing part first, then a first thermally conductive material layer can be placed on the first heat dissipation protrusion, followed by the placement of the sub-printed circuit board, the placement of the shielding plate and screw tightening, then the placement of the main printed circuit board and the second housing part, and finally the tightening of the first connecting bolt. During this process, no components are flipped, improving assembly efficiency.

[0078] It should also be noted that, although Figure 7 The example shows a controller comprising two printed circuit board assemblies, but the present invention does not limit the number of printed circuit board assemblies the controller may have. In other embodiments, the number of printed circuit board assemblies may be set to multiple, such as two or three or other numbers, as needed.

[0079] Since this utility model does not involve improvements to other components of the controller, the other components of the controller and their working process will not be described in detail.

[0080] It should be noted that the controller described in this utility model can include various types, such as vehicle controllers or other types of controllers, like smart home controllers or robot controllers. Furthermore, the vehicle controller can be a domain controller, an MCU (Microcontroller Unit), an ECU (Electronic Control Unit), or an IDC (Intelligent Drive Control), etc.

[0081] A printed circuit board (PCB) can be a printed circuit board that integrates various electronic components. The electronic components on the PCB can be a system on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.

[0082] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0083] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0084] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A housing for a controller, comprising: A first housing portion (1) and a second housing portion (2) connected to the first housing portion, the second housing portion and the first housing portion forming an internal space of the outer shell; characterized in that: The outer surface (P1) of the top plate of the first housing portion has at least a first planar region (11) and a second planar region (12) that is not coplanar with the first planar region. The first planar region is provided with a plurality of vertically arranged first heat dissipation fins (111) to form a plurality of first air ducts (112), and the second planar region is provided with a plurality of vertically arranged second heat dissipation fins (121) to form a plurality of second air ducts (122). The first housing portion has a first air inlet (14), a second air inlet (15), and an air outlet (16) on its side. The first air inlet is located on one side along the extension direction of the first air duct and the second air duct, while the second air inlet and the air outlet are located on the other side.

2. The outer casing as claimed in claim 1, characterized in that, The extension height of the first heat dissipation fin (111) is greater than the extension height of the second heat dissipation fin (121); and / or the number of the first heat dissipation fins (111) is greater than the number of the second heat dissipation fins (121).

3. The outer casing as described in claim 1, characterized in that, The width of the first air duct (112) is smaller than the width of the second air duct (122).

4. The outer casing as claimed in claim 1, characterized in that, The air outlet (16) and a portion of the first air inlet are located on both sides of the first air duct (112) in the extension direction of the first air duct; the second air inlet (15) and another portion of the first air inlet are located on both sides of the second air duct (122) in the extension direction of the second air duct.

5. The outer casing as claimed in claim 1, characterized in that, There is a sloping region (13) between the first planar region (11) and the second planar region (12), and the sloping region is provided with a plurality of vertically arranged third heat dissipation fins (131) to form a plurality of third air ducts (132).

6. The outer casing as claimed in claim 5, characterized in that, A fourth heat dissipation fin (133) is provided on the inner surface of the top plate of the first housing portion (P2) at a position corresponding to the inclined area.

7. The outer casing as claimed in claim 1, characterized in that, The inner surface of the top plate of the first housing portion (P2) is provided with a first heat dissipation boss (141) protruding from the inner surface of the top plate at the position corresponding to the first planar region.

8. The outer casing as claimed in claim 7, characterized in that, The surface of the first heat dissipation protrusion, which is used to abut against the electronic components of the controller, is provided with a first thermally conductive material layer (151).

9. The outer casing as claimed in claim 1, characterized in that, The inner surface of the top plate of the first housing portion is provided with a second heat dissipation boss (142) protruding from the inner surface of the top plate at a position corresponding to the second planar region.

10. The outer casing as claimed in claim 9, characterized in that, The second heat dissipation protrusion has a second thermally conductive material layer (152) on its surface that is used to attach and connect with the electronic components of the controller.

11. The outer casing as claimed in claim 1, characterized in that, Also includes: A cover plate (4) is placed on the first housing portion to at least place the first heat dissipation fins and the second heat dissipation fins in a relatively enclosed space.

12. The outer casing as claimed in claim 1, characterized in that, The first shell part is a one-piece die-cast structure.

13. A controller, characterized in that, It includes: The housing as described in any one of claims 1-12; A cooling element (5) is provided at the air outlet of the housing; At least two printed circuit board assemblies are disposed within the housing.

14. The controller as claimed in claim 13, characterized in that, The air-cooling component includes a fan.

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