Liquid-cooled heat dissipation substrate for power module and power module
Patent Information
- Application Number
- CN202522110970.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-09-30
AI Technical Summary
[0004]但是传统结构的鳍片式散热片，所采用的针翅阵列由大量独立柱体密集排布而成，由此形成的冷却液流通通道不仅截面尺寸极小，还会因柱体交错排布对冷却液形成强烈阻碍，导致流阻显著升高，冷却液循环速度大幅放缓，热量无法及时被带走，最终造成散热效率低下，冷却效果难以满足功率模块高负荷工况下的散热需求
[0021]本实用新型提供了一种用于功率模块的液冷散热基板，通过在围挡结构围合形成的散热区域内，沿第一方向阵列设置多个分流主干，并在各分流主干两侧分别布置多个分流支干，不仅能借助主干与支干的协同作用显著扩大液冷散热基板与冷却液的接触面积，而且将分流支干的截面形状设计为第二方向的宽度沿远离分流主干逐渐缩小的锥形，从而有效拓宽冷却液的流动空间以降低流动阻力、提升流动速度，进而初步提高散热效率；同时，通过在各分流支干的一端设置第一扰流凸起，可促使冷却液流经分流支干时形成湍流，进而产生涡流与二次流，以此扰动并破坏贴近流道壁面的层流边界层，最终进一步提升散热效率。
Smart Images
Figure CN224790957U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vehicle technology, and in particular to a liquid-cooled heat dissipation substrate for a power module and a power module. Background Technology
[0002] The power module on a vehicle inverter is the core component for energy conversion. Its core function is to efficiently convert the direct current output from the vehicle's power battery into the alternating current required to drive the motor by precisely controlling the switching of semiconductor devices. It can also adjust the output voltage and frequency to match the motor's operating conditions. It directly affects the inverter's power density, conversion efficiency, and operational stability. At the same time, because it generates a lot of heat during operation, it usually needs to be equipped with a heat dissipation structure (such as heat sinks and cooling water circuits) to ensure continuous and reliable operation during vehicle operation. It is a key link in ensuring the vehicle's power output.
[0003] Currently, finned heat sinks are commonly used to address this requirement. These typically consist of a base plate and a pin-fin array composed of multiple independent pillars. The pin-fin array on the base plate creates a flow path for the coolant. During heat dissipation, the coolant, driven by a circulation system, flows continuously along the channels within the finned heat sink, making full contact with the heat sink body and efficiently absorbing heat transferred from the power module to the heat sink. The coolant, carrying heat, then flows out of the heat sink and enters subsequent cooling circuits to release heat, completing the heat transfer cycle. This ultimately achieves continuous cooling of the power module, ensuring it always operates within a safe temperature range and guaranteeing the reliable operation of the inverter and vehicle powertrain.
[0004] However, traditional finned heat sinks use a dense array of needle-fins composed of numerous independent columns. This results in coolant flow channels with extremely small cross-sectional dimensions. The staggered arrangement of the columns also strongly obstructs the coolant flow, significantly increasing flow resistance and drastically slowing coolant circulation. Heat cannot be dissipated in time, ultimately leading to low heat dissipation efficiency and failing to meet the cooling requirements of power modules under high load conditions. Furthermore, to overcome the high flow resistance and maintain the necessary coolant flow, the pump needs to continuously output greater power. This not only increases the vehicle's energy consumption but also places higher demands on the pump's performance and durability, indirectly increasing system manufacturing costs and the risk of failure. Moreover, the extremely small channel cross-section is easily clogged by impurities in the coolant or by precipitates that form over long-term use; once clogged, this further increases flow resistance and reduces heat dissipation efficiency. Utility Model Content
[0005] The purpose of this invention is to provide a liquid-cooled heat dissipation substrate and power module for power modules, which has a large flow space, low flow resistance, fast flow speed, high heat dissipation efficiency, and is not easily blocked.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] On one hand, a liquid-cooled heat dissipation substrate for a power module is provided, the liquid-cooled heat dissipation substrate for the power module comprising:
[0008] Support plate;
[0009] The enclosure structure is a protruding structure provided on the supporting plate, and a heat dissipation area for coolant flow is enclosed on the side of the supporting plate away from the power module.
[0010] The flow channel structure includes a main branch and branch branches. Multiple main branches are arrayed along a first direction within the heat dissipation area to divide the heat dissipation area into multiple flow channels that guide the flow of coolant. Each main branch has multiple branch branches extending into the flow channels on both sides along the first direction. The cross-sectional shape of each branch branch is a cone with a width that gradually decreases away from the main branch in a second direction. Each branch branch has a first turbulence protrusion at one end away from the main branch. Multiple branch branches located on both sides of the same main branch are mirror images of each other along the second direction.
[0011] Optionally, the flow channel structure further includes multiple buffer protrusions, which are spaced apart on the side of the main branch near the coolant outlet in the heat dissipation area along the first direction, and the cross-section of the buffer protrusions is triangular.
[0012] Optionally, the two sets of branch branches located between two adjacent main branches and within the same flow channel are staggered along the second direction.
[0013] Optionally, each of the branch trunks is inclined along the direction of coolant outflow.
[0014] Optionally, a transition rounded corner is provided at the junction of the main branch and the branch trunk.
[0015] Optionally, the enclosure structure includes two first enclosure plates arranged opposite each other along the first direction and two second enclosure plates arranged opposite each other along the second direction, and the two first enclosure plates are provided with auxiliary branches extending close to the main branch on the inner side of the heat dissipation area.
[0016] Optionally, the auxiliary branch has a second turbulence protrusion on the side opposite to the first enclosure plate.
[0017] Optionally, the plurality of auxiliary branches and the plurality of adjacent diversion branches are staggered along the second direction.
[0018] Optionally, each of the auxiliary branches is inclined along the direction of coolant outflow.
[0019] On the other hand, a power module is provided, the power module including a liquid-cooled heat dissipation substrate for a power module as described in any of the preceding claims.
[0020] The beneficial effects of this utility model are:
[0021] This invention provides a liquid-cooled heat dissipation substrate for power modules. Within the heat dissipation area enclosed by a barrier structure, multiple main flow branches are arrayed along a first direction, and multiple branch flow branches are arranged on both sides of each main flow branch. This not only significantly expands the contact area between the liquid-cooled heat dissipation substrate and the coolant through the synergistic effect of the main and branch flow branches, but also effectively widens the flow space of the coolant by designing the cross-sectional shape of the branch flow branches as a cone whose width gradually decreases away from the main flow branch in the second direction. This reduces flow resistance and increases flow velocity, thereby initially improving heat dissipation efficiency. Simultaneously, by providing a first turbulence protrusion at one end of each branch flow branch, turbulence is generated when the coolant flows through the branch flow branch, resulting in eddies and secondary flows. This disturbs and disrupts the laminar boundary layer close to the flow channel wall, ultimately further improving heat dissipation efficiency. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of the liquid-cooled heat dissipation substrate for power modules provided by this utility model;
[0023] Figure 2 yes Figure 1 Enlarged view of the structure of section A;
[0024] Figure 3 yes Figure 1 Enlarged view of the structure of part B.
[0025] In the picture:
[0026] 100. Heat dissipation area; 200. Airflow channel;
[0027] 1. Load-bearing plate;
[0028] 2. Enclosure structure; 21. First enclosure panel; 22. Second enclosure panel; 23. Auxiliary branch; 24. Second spoiler protrusion;
[0029] 3. Flow channel structure; 31. Main branch; 32. Branch branch; 33. First turbulence protrusion; 34. Buffer protrusion; 35. Transition fillet. Detailed Implementation
[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] Traditional finned heat sinks, with their densely arranged pin-fin arrays of numerous independent columns, create coolant flow channels with extremely small cross-sectional dimensions. The staggered arrangement of these columns also significantly impedes coolant flow, resulting in a substantial increase in flow resistance. This drastically slows coolant circulation, preventing timely heat dissipation and ultimately leading to low cooling efficiency. The cooling effect is insufficient to meet the high-load cooling requirements of the power module. Furthermore, to overcome this high flow resistance and maintain the necessary coolant flow, the pump must continuously output greater power. This not only increases overall vehicle energy consumption but also places higher demands on the pump's performance and durability, indirectly increasing system manufacturing costs and the risk of failure. Moreover, the extremely small channel cross-section is easily clogged by impurities in the coolant or by precipitates that develop over time. Once clogged, this further increases flow resistance and reduces cooling efficiency.
[0035] Therefore, in order to expand the space for cooling flow, reduce flow resistance, increase flow velocity, enhance heat dissipation, and reduce the probability of blockage, this embodiment provides a liquid-cooled heat dissipation substrate for power modules.
[0036] like Figures 1 to 3 As shown, the liquid-cooled heat dissipation substrate for the power module includes a support plate 1, a baffle structure 2, and a flow channel structure 3. The baffle structure 2 is a protrusion on the support plate 1, and a heat dissipation area 100 for coolant flow is formed on the side of the support plate 1 away from the power module. The flow channel structure 3 includes a main branch 31 and branch branches 32. Multiple main branches 31 are arrayed in the heat dissipation area 100 along a first direction to divide multiple flow channels 200 for guiding coolant flow within the heat dissipation area 100. Each main branch 31 has multiple branch branches 32 extending into the flow channel 200 on both sides along the first direction. The cross-sectional shape of the branch branches 32 is a cone with a width that gradually decreases away from the main branch 31 in the second direction. Each branch branch 32 has a first turbulence protrusion 33 at one end away from the main branch 31. Multiple branch branches 32 located on both sides of the same main branch 31 are mirror images of each other along the second direction.
[0037] By arranging multiple main flow branches 31 along the first direction within the heat dissipation area 100 enclosed by the enclosure structure 2, and arranging multiple branch flow branches 32 on both sides of each main flow branch 31, the contact area between the liquid-cooled heat dissipation substrate and the coolant can be significantly expanded by the synergistic effect of the main and branch flow branches. Furthermore, the cross-sectional shape of the branch flow branches 32 is designed as a cone with a width that gradually decreases away from the main flow branch 31 in the second direction, thereby effectively widening the flow space of the coolant to reduce flow resistance and increase flow velocity, thus initially improving heat dissipation efficiency. At the same time, by setting a first turbulence protrusion 33 at one end of each branch flow branch 32, turbulence can be formed when the coolant flows through the branch flow branch 32, thereby generating eddies and secondary flows, which disturb and destroy the laminar boundary layer close to the flow channel wall, ultimately further improving heat dissipation efficiency.
[0038] In this embodiment, the surface of the first turbulence protrusion 33 that contacts the coolant is an arc surface. On the one hand, the arc surface can avoid the local eddy dead zone that is easily generated by sharp surfaces, reducing the flow resistance of the coolant when it flows through the first turbulence protrusion 33. On the other hand, the arc surface can guide the coolant to form a more uniform and stable turbulence, rather than a turbulent flow state caused by violent impact. It can continuously and fully generate eddies and secondary flows, more effectively disturbing and destroying the laminar boundary layer close to the flow channel wall, enhancing heat exchange efficiency, and ensuring the stable performance of the core function of the turbulence protrusion. At the same time, the arc surface has no sharp edges, which can disperse the local stress caused by the coolant scouring, reduce the wear and fatigue damage of the protrusion surface, extend the overall service life of the liquid-cooled heat dissipation substrate, and ensure the stability of the long-term heat dissipation performance of the power module.
[0039] Optionally, such as Figure 1 , Figure 2 As shown, the flow channel structure 3 also includes multiple buffer protrusions 34. These buffer protrusions 34 are spaced apart on the side of the main branch 31 near the coolant outlet, which is arrayed along the first direction within the heat dissipation area 100. The cross-section of each buffer protrusion 34 is triangular. By providing spaced buffer protrusions 34 on the side of the main branch 31 near the coolant outlet, pressure fluctuations during coolant outflow can be mitigated, preventing turbulence caused by sudden changes in flow velocity at the outlet and ensuring the continuity and stability of fluid flow from the center of the flow channel to the outlet.
[0040] Optionally, such as Figure 1 , Figure 2As shown, two branch flows 32 located between two adjacent main branches 31 and within the same flow channel 200 are staggered along the second direction. By staggering the branch flows 32 between two adjacent main branches 31 and within the same flow channel 200 along the second direction, not only is the space between the branch flows 32 and the adjacent main branches 31 increased, but the branch flows 32 on the adjacent main branches 31 also overlap in space. This improves the space utilization rate within the heat dissipation area 100, allowing for more flow channel structures 3 to be installed within the heat dissipation area 100, further increasing the contact area between the coolant and the liquid-cooled heat dissipation substrate, and improving the heat dissipation effect.
[0041] Optionally, such as Figure 1 , Figure 2 As shown, each branch 32 is inclined along the coolant outflow direction. On the one hand, the inclination direction is consistent with the coolant flow direction, which can reduce the obstruction effect of the branch 32 on the fluid. Combined with the previously staggered arrangement design, it further reduces the flow resistance, making the coolant flow more smoothly in the flow channel 200, significantly increasing the flow velocity, and accelerating heat removal. On the other hand, the inclined arrangement can extend the contact path between the coolant and the branch 32, indirectly expanding the effective heat exchange area. At the same time, it can guide the coolant to flow more fully through the first turbulence protrusion 33 at the end of the branch 32, promoting the formation of turbulence more stably, strengthening the destructive effect of eddies and secondary flows on the laminar boundary layer, thus forming a synergy with the original flow channel structure 3 and turbulence design of the substrate, further improving the overall heat dissipation performance.
[0042] Optionally, such as Figure 1 , Figure 2 As shown, a transition fillet 35 is provided at the junction of the main branch 31 and the branch 32. On the one hand, this avoids the fluid vortex dead zone that is easily generated at the right angle junction, reduces the local resistance when the coolant flows, and works in conjunction with the staggered arrangement of the branch 32 and its inclined design along the outflow direction to further ensure the smooth flow of coolant in the flow channel and maintain a stable flow rate for efficient heat transfer. On the other hand, it can disperse the stress concentration at the junction, avoid structural damage such as cracking of the substrate due to thermal expansion and contraction during power module operation, and extend its service life.
[0043] Optionally, such as Figure 1 , Figure 3As shown, the enclosure structure 2 includes two first enclosure plates 21 arranged opposite each other along a first direction and two second enclosure plates 22 arranged opposite each other along a second direction. Each of the two first enclosure plates 21 has an auxiliary branch 23 extending near the main branch 31 on the inner side of the heat dissipation area 100. On one hand, this effectively solves the problem of coolant stagnation at the edges of the heat dissipation area 100. Through the guiding effect of the auxiliary branches 23, the coolant near the first enclosure plates 21 is directed to the main branch 31 and surrounding branch branches 32, avoiding the formation of dead zones. On the other hand, the auxiliary branches 23 can additionally increase the contact area between the liquid-cooled heat dissipation substrate and the coolant, expanding the heat exchange path together with the main branch 31 and branch branches 32. They can also help disturb the coolant flow in the edge area, echoing the first turbulence protrusion 33 at the end of the branch branches 32, enhancing the overall turbulence effect, and avoiding the problem of low heat dissipation efficiency due to a high laminar flow ratio in the edge area. Ultimately, this achieves a balanced improvement in the overall heat dissipation performance of the heat dissipation area 100, better adapting to the heat dissipation requirements of the power module.
[0044] Optionally, such as Figure 1 , Figure 3 As shown, the auxiliary branch 23 has a second turbulence protrusion 24 on the side opposite to the first baffle plate 21. By setting the second turbulence protrusion 24 at one end of each auxiliary branch 23, the coolant can be made to form turbulence when flowing through the edge of the heat dissipation area 100, thereby generating eddies and secondary flows, which disturb and destroy the laminar boundary layer close to the inner wall of the first baffle plate 21, and ultimately further improve the heat dissipation efficiency.
[0045] Optionally, such as Figure 1 , Figure 3 As shown, multiple auxiliary branches 23 are staggered with multiple adjacent branch branches 32 along the second direction. By staggering the multiple auxiliary branches 23 with the adjacent branch branches 32 along the second direction, the narrow flow channels or fluid collision problems that may occur when the two are arranged in parallel are avoided, and the flow space at the edge of the heat dissipation area 100 is further widened.
[0046] Optionally, such as Figure 1 , Figure 3 As shown, each auxiliary branch 23 is inclined along the coolant outflow direction. By aligning the inclination direction of the auxiliary branch 23 with the coolant flow direction and the inclination direction of the branch 32, the positive obstruction of the fluid by the auxiliary branch 23 can be reduced, thus lowering the flow resistance. Furthermore, the inclined arrangement can extend the contact path between the coolant and the auxiliary branch 23, improving the utilization rate of the heat exchange area in the edge region and enhancing heat dissipation efficiency.
[0047] In this embodiment, a power module is also provided, which includes the liquid-cooled heat dissipation substrate described above. By applying the liquid-cooled heat dissipation substrate, the power module effectively improves the heat transfer and dissipation efficiency during operation, avoiding performance degradation or malfunctions due to localized overheating, thereby ensuring long-term stable operation of the power module under high-load conditions.
[0048] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A liquid-cooled heat dissipation substrate for power modules, characterized in that, The liquid-cooled heat dissipation substrate for the power module includes: Support plate (1); Enclosure structure (2), the enclosure structure (2) is a protruding structure provided on the bearing plate (1), and a heat dissipation area (100) for coolant flow is enclosed on the side of the bearing plate (1) away from the power module; The flow channel structure (3) includes a main branch (31) and branch branches (32). Multiple main branches (31) are arrayed in the heat dissipation area (100) along a first direction to divide multiple flow channels (200) that guide the flow of coolant in the heat dissipation area (100). Each main branch (31) has multiple branch branches (32) extending into the flow channels (200) on both sides along the first direction. The cross-sectional shape of the branch branches (32) is a cone with a width that gradually decreases away from the main branch (31) in the second direction. Each branch branch (32) has a first turbulence protrusion (33) at one end away from the main branch (31). Multiple branch branches (32) located on both sides of the same main branch (31) are mirror images of each other along the second direction.
2. The liquid-cooled heat dissipation substrate for a power module according to claim 1, characterized in that, The flow channel structure (3) also includes a plurality of buffer bosses (34), which are spaced apart on the side of the main branch (31) near the coolant outlet in the heat dissipation area (100) along the first direction. The cross section of the buffer bosses (34) is triangular.
3. The liquid-cooled heat dissipation substrate for a power module according to claim 1, characterized in that, The two sets of branch branches (32) located between two adjacent main branches (31) and within the same flow channel (200) are staggered along the second direction.
4. The liquid-cooled heat dissipation substrate for a power module according to claim 1, characterized in that, Each of the branch trunks (32) is inclined along the direction of coolant outflow.
5. The liquid-cooled heat dissipation substrate for a power module according to claim 1, characterized in that, The junction of the main branch (31) and the branch (32) is provided with a transition rounded corner (35).
6. The liquid-cooled heat dissipation substrate for a power module according to claim 1, characterized in that, The enclosure structure (2) includes two first enclosure plates (21) arranged opposite to each other along the first direction and two second enclosure plates (22) arranged opposite to each other along the second direction. The two first enclosure plates (21) are provided with auxiliary branches (23) extending close to the main branch (31) on the inner side of the heat dissipation area (100).
7. The liquid-cooled heat dissipation substrate for a power module according to claim 6, characterized in that, The auxiliary branch (23) is provided with a second turbulence protrusion (24) on the side opposite to the first enclosure plate (21).
8. The liquid-cooled heat dissipation substrate for a power module according to claim 6, characterized in that, The multiple auxiliary branches (23) are staggered with the adjacent multiple branch trunks (32) along the second direction.
9. The liquid-cooled heat dissipation substrate for a power module according to claim 6, characterized in that, Each of the auxiliary branches (23) is inclined along the direction of coolant outflow.
10. A power module, characterized in that, The power module includes a liquid-cooled heat dissipation substrate for a power module as described in any one of claims 1-9.