A heat dissipation device

Abstract

The utility model provides a kind of heat dissipation device, including at least two heat exchange plates of being arranged side by side along the length direction of the heat dissipation device, heat exchange plate includes the liquid inlet for injecting cooling medium, condensing area, evaporation area and one-way flow channel group, condensing area includes at least one first flow channel cavity being communicated with liquid inlet;Evaporation area includes second flow channel cavity being communicated with first flow channel cavity;One-way flow channel group includes straight flow channel, first return flow channel, second return flow channel, one-way flow channel group is arranged between evaporation area and condensing area, the import of straight flow channel is communicated with first flow channel cavity, the outlet of straight flow channel is communicated with second flow channel cavity.The heat dissipation device provided by implementation provides the advantages that installation is convenient, and application range is wide, can satisfy the heat dissipation scene of electronic equipment small space, in the case of same specification, the degree of integration is higher, and the heat dissipation efficiency is better.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device. Background Technology

[0002] Existing heat dissipation devices employ separate heat dissipation components and heat exchange components for heat exchange. Most commercially available finned heat dissipation devices increase the number and length of heat sinks to enlarge the heat dissipation area, thereby improving heat dissipation efficiency. This is visually reflected in the "thickness-to-height ratio" of the heat dissipation device, i.e., the ratio of the thickness to the height of the heat sink fins. However, with the increasing integration and lightweighting of electronic devices, internal space is limited. Therefore, heat dissipation devices must be small in size and have high heat dissipation efficiency, making the method of increasing the "thickness-to-height ratio" to improve heat dissipation efficiency no longer practically advantageous. Furthermore, due to the specific structure of their heat exchange and heat dissipation components, existing heat dissipation devices require specific installation locations within electronic devices to ensure their heat dissipation effect, causing inconvenience to the functional design of electronic devices. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation device that is easy to install and can improve heat exchange efficiency.

[0004] To solve the above technical problems, this utility model provides a heat dissipation device, characterized in that it includes at least two heat exchange plates arranged side by side along the length direction of the heat dissipation device, the heat exchange plates comprising:

[0005] A liquid inlet, which is used to inject cooling medium;

[0006] A condensation zone, the condensation zone including at least one first flow channel cavity communicating with the liquid inlet;

[0007] An evaporation zone, wherein the evaporation zone includes a second flow channel cavity communicating with the first flow channel cavity;

[0008] A unidirectional flow channel group, comprising a direct flow channel, a first return flow channel, and a second return flow channel, wherein the unidirectional flow channel group is disposed between the evaporation zone and the condensation zone, the inlet of the direct flow channel is connected to the first flow channel cavity, and the outlet of the direct flow channel is connected to the second flow channel cavity.

[0009] The structure of the direct flow channel, the first return flow channel, and the second return flow channel ensures that the flow rate of the cooling medium is accelerated and that there is no backflow from the evaporation zone to the condensation zone, thereby ensuring the heat exchange reliability of the heat exchange plate.

[0010] Preferably, the first return channel is located on the side of the heat exchange plate near the liquid inlet, and the second return channel is located on the side of the heat exchange plate away from the liquid inlet.

[0011] Preferably, the condensation zone includes at least two first heat sinks with honeycomb structures, and the first flow channel cavity is arranged around the first heat sink.

[0012] Preferably, the evaporation zone includes at least two uniformly arranged second heat sinks, which are arranged sequentially and uniformly and spaced apart from the second flow channel cavities, with the spaced second flow channel cavities located on the same straight line.

[0013] Preferably, the system further includes a mounting beam, the mounting beam having mounting grooves corresponding to the number of heat exchange plates, the heat exchange plates being inserted into the mounting grooves.

[0014] Preferably, the mounting beam is located at the junction of the first return channel and the second return channel.

[0015] Preferably, the direct current channel is horizontally arranged along the condensation zone toward the evaporation zone; the liquid inlet is filled with cooling medium, and the liquid level of the cooling medium is higher than the height of the direct current channel.

[0016] Preferably, a transition zone is further provided between the condensation zone and the evaporation zone. The transition zone is located above the heat exchange plate plane of the unidirectional flow channel assembly, and a second flow channel cavity is provided between the transition zone and the evaporation zone.

[0017] Preferably, it further includes a housing, which is symmetrically arranged along the mounting beam and covers the condensation zone and the evaporation zone.

[0018] Preferably, the housing and the heat exchange plate are fixed together by nuts.

[0019] This utility model provides a heat dissipation device that, by setting a direct flow channel, a first return flow channel, and a second return flow channel between the condensation zone and the evaporation zone, connects the direct flow channel to the first flow channel cavity of the condensation zone and the second flow channel cavity of the evaporation zone. The arrangement of the first and second return flow channels ensures that the cooling medium does not flow backward during the heat exchange process. This mode ensures the heat exchange reliability of the heat exchange plate and further improves the heat dissipation efficiency of the heat dissipation device. Due to this specific structural design, the heat dissipation device is easy to install and can be adapted to various heat dissipation scenarios of electronic equipment. Attached Figure Description

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0021] Figure 1 A schematic diagram of a heat dissipation device provided for an embodiment of this utility model.

[0022] Figure 2 A schematic diagram of a heat dissipation device structure provided for an embodiment of this utility model. Figure 1 .

[0023] Figure 3 for Figure 2 A magnified view of a portion of the image.

[0024] Figure 4 A schematic diagram of a heat dissipation device structure provided for an embodiment of this utility model. Figure 2 .

[0025] Figure 5 A schematic diagram of a heat exchange plate structure provided for an embodiment of this utility model.

[0026] Figure 6 for Figure 5 A magnified view of a portion of the image.

[0027] Explanation of icon numbers:

[0028] 100-Heat dissipation device; 10-Heat exchange plate; 1-Liquid inlet; 2-Condensation zone; 21-First flow channel cavity; 22-First heat sink; 3-Evaporation zone; 31-Second flow channel cavity; 32-Second heat sink; 4-Transition zone; 40-Unidirectional flow channel group; 401-Direct flow channel; 402-First return flow channel; 403-Second return flow channel; 5-Mounting beam; 51-Mounting groove; 6-Shell; 7-Nut. Detailed Implementation

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] To keep the drawings concise, only the parts relevant to this invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0031] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0035] See Figure 1-3 The embodiment provides a heat dissipation device that employs a phase change heat dissipation mode to cool electronic devices, adapting to the lightweight design of electronic devices. The heat dissipation device includes at least two heat exchange plates 10 arranged side-by-side along the length of the device. The heat exchange plates 10 are stacked and can perform both condensation and evaporation functions, ensuring that the cooling medium circulates within the heat exchange plates 10, thereby achieving heat exchange. See also... Figure 5 The heat exchange plate 10 is provided with a condensation zone 2 and an evaporation zone 3. A liquid inlet 1 is used to inject cooling medium. The liquid inlet 1 is located in the condensation zone 2 and communicates with a first flow channel cavity 21 in the condensation zone 2. The condensation zone 2 has at least one first flow channel cavity 21. The evaporation zone 3 has a second flow channel cavity 31 communicating with the first flow channel cavity 21. In this embodiment, the cooling medium in the first flow channel cavity 21 and the second flow channel cavity 31 flows to each other to achieve heat exchange. To avoid a decrease in the efficiency of the cooling medium during the heat exchange process between the condensation zone 2 and the evaporation zone 3, a unidirectional flow channel group 40 is provided between the condensation zone 2 and the evaporation zone 3. The unidirectional flow channel group 40 includes a direct flow channel 401, a first return flow channel 402, and a second return flow channel 403. The inlet of the direct flow channel 401 communicates with the first flow channel cavity 21, and the outlet of the direct flow channel 401 communicates with the second flow channel cavity 31. The unidirectional flow channel group 40 prevents the cooling medium from flowing back from the evaporation zone 3 to the condensation zone 2. The cooling medium in the condensation zone 2 flows from the unidirectional return channel group to the evaporation zone 3. The evaporation zone 3 absorbs the heat of the electronic equipment. The cooling medium in the second flow channel cavity 31 vaporizes and absorbs heat, and is then transported to the first flow channel cavity 21 through the flow channel connected to the second flow channel cavity 31. It liquefies in the condensation zone 2 and enters the first flow channel cavity 21, thus realizing the heat exchange process.

[0036] In a specific implementation, the direct flow channel 401 is horizontally arranged along the direction from the condensation zone 2 to the evaporation zone 3. Cooling medium is injected into the first flow channel cavity 21 through the liquid inlet 1. The liquid level of the cooling medium is higher than the setting height of the direct flow channel 401. When the cooling medium is set at this height, it can be ensured that under the pressure difference in the first flow channel cavity 21 and the second flow channel cavity 31, the amount of cooling medium vaporized in the evaporation zone 3 and the amount of cooling medium liquefied in the condensation zone 2 remain balanced when the cooling medium flows from the first flow channel cavity 21 to the second flow channel cavity 31, thereby ensuring the reliability of heat dissipation. The first return flow channel 402 is arranged on the side of the heat exchange plate 10 near the liquid inlet 1, and the second return flow channel 403 is arranged on the side of the heat exchange plate 10 away from the liquid inlet 1. Both the first return flow channel 402 and the second return flow channel 403 are curved flow channels.

[0037] To ensure the complete liquefaction of the vaporized cooling medium, the condensation zone 2 is equipped with at least two first heat sinks 22 with honeycomb structures. First flow channel cavities 21 surround the first heat sinks 22, allowing the cooling medium to circulate through the first flow channel cavities 21 and exchange heat through the first heat sinks 22, which increase the heat dissipation area of ​​the cooling medium. The evaporation zone 3 includes at least two uniformly arranged second heat sinks 32. The second heat sinks 32 are sequentially and uniformly spaced from the second flow channel cavities 31, which are located on the same straight line. This arrangement allows the vaporized cooling medium to quickly flow through the second flow channel cavities 31 to the first flow channel cavity 21 for liquefaction, thereby accelerating the heat exchange rate.

[0038] See Figure 6 In a preferred embodiment, a transition zone 4 is further provided between the condensation zone 2 and the evaporation zone 3. The transition zone 4 is located above the position of the unidirectional flow channel group 40 on the plane of the heat exchange plate 10. A second flow channel cavity 31 is also provided between the transition zone 4 and the evaporation zone 3 to allow the vaporized cooling medium to be quickly transferred to the condensation zone 2. The transition zone 4 is provided with at least one unidirectional flow channel group 40. The height of the cooling medium injected into the heat exchange plate 10 is higher than the direct flow channel 401 in the unidirectional flow channel group 40 closest to the liquid inlet 1. It should be noted that the transition zone 4 needs to be provided with both the unidirectional flow channel group 40 and the second flow channel cavity 31 to ensure the reliability of heat exchange between the cooling medium in the condensation zone 2 and the evaporation zone 3.

[0039] See Figure 3 , Figure 4In addition, the heat dissipation device is also provided with a mounting beam 5. The mounting beam 5 includes mounting grooves 51 corresponding to the number of heat exchange plates 10. The heat exchange plates 10 are interposed in the mounting grooves 51. The mounting beam 5 is located in the transition zone 4, at the junction of the first return channel 402 and the second return channel 403. It should be noted that in this embodiment, the areas corresponding to the heat exchange zone and the condensation zone 2 on the heat exchange plate 10 are the same. The transition zone 4 is located in the middle of the heat exchange plate 10, and the unidirectional flow channel group 40 is located in the center of the heat exchange plate 10. At this time, the mounting beam 5 is located at the junction of the first return channel 402 and the second return channel 403. A shell 6 is also provided on the outer periphery of the heat exchange plate 10. The shell 6 is symmetrically arranged along the mounting beam 5, covering the condensation zone 2 and the evaporation zone 3. The shell 6 and the heat exchange plate 10 are fixed by nuts 7 to prevent the heat exchange plate 10 from deforming during installation and affecting the heat exchange effect.

[0040] This utility model provides a heat dissipation device that, by setting a unidirectional flow channel group 40, ensures that the cooling medium, when flowing between the condensation zone 2 and the evaporation zone 3, can only be transferred unidirectionally from the condensation zone 2 to the evaporation zone 3. This avoids the situation where the cooling medium backflows, causing a decrease in the heat dissipation efficiency of the heat exchange plate 10. A direct flow channel 401, a first return flow channel 402, and a second return flow channel 403 are provided. The direct flow channel 401 is connected to the first flow channel cavity 21 of the condensation zone 2 and the second flow channel cavity 31 of the evaporation zone 3. The first return flow channel 402 and the second return flow channel 403 ensure that the cooling medium does not flow backwards during the heat exchange process, guaranteeing the heat exchange reliability of the heat exchange plate 10 and further improving the heat dissipation efficiency of the heat dissipation device. Due to this specific structural design, the installation angle of the heat sink will not affect its heat dissipation effect in various heat dissipation scenarios of electronic equipment, making it applicable to a wider range of scenarios.

[0041] It will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention cover modifications and variations falling within the scope of the appended claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that, The device includes at least two heat exchange plates arranged side-by-side along the length of the heat dissipation device, the heat exchange plates comprising: A liquid inlet, which is used to inject cooling medium; A condensation zone, the condensation zone including at least one first flow channel cavity communicating with the liquid inlet; An evaporation zone, wherein the evaporation zone includes a second flow channel cavity communicating with the first flow channel cavity; A unidirectional flow channel group, comprising a direct flow channel, a first return flow channel, and a second return flow channel, wherein the unidirectional flow channel group is disposed between the evaporation zone and the condensation zone, the inlet of the direct flow channel is connected to the first flow channel cavity, and the outlet of the direct flow channel is connected to the second flow channel cavity.

2. The heat dissipation device as described in claim 1, characterized in that, The first return channel is located on the side of the heat exchange plate near the liquid inlet, and the second return channel is located on the side of the heat exchange plate away from the liquid inlet.

3. A heat dissipation device as described in claim 2, characterized in that, The condensation zone includes at least two honeycomb-structured first heat sinks, with the first flow channel cavity surrounding the first heat sink.

4. A heat dissipation device as described in claim 3, characterized in that, The evaporation zone includes at least two uniformly arranged second heat sinks, which are arranged sequentially and evenly and spaced apart from the second flow channel cavities, with the spaced second flow channel cavities located on the same straight line.

5. A heat dissipation device as described in claim 4, characterized in that, It also includes mounting beams, which have mounting slots corresponding to the number of heat exchange plates, and the heat exchange plates are inserted into the mounting slots.

6. A heat dissipation device as described in claim 5, characterized in that, The mounting beam is located at the junction of the first return channel and the second return channel.

7. A heat dissipation device as described in claim 6, characterized in that, The direct current channel is horizontally arranged along the condensation zone toward the evaporation zone; the liquid inlet is filled with cooling medium, and the liquid level of the cooling medium is higher than the height of the direct current channel.

8. A heat dissipation device as described in claim 7, characterized in that, A transition zone is provided between the condensation zone and the evaporation zone. The transition zone is located above the heat exchange plate plane of the unidirectional flow channel assembly. The transition zone and the evaporation zone are provided with a second flow channel cavity that communicates with each other.

9. A heat dissipation device as described in claim 8, characterized in that, It also includes a housing, which is symmetrically arranged along the mounting beam and covers the condensation zone and the evaporation zone.

10. A heat dissipation device as described in claim 9, characterized in that, The shell and the heat exchange plate are fixed together by nuts.

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