Semiconductor heat dissipation efficiency improving device

Abstract

The utility model relates to the technical field of heat dissipation device, concretely to a kind of semiconductor heat dissipation efficiency improving device, including shell and exhaust fan, the two ports of shell are all open settings, the inside of shell is provided with nickel-titanium alloy sheet, the nickel-titanium alloy sheet is set in one opening of shell, the inside of shell is provided with support assembly, the support assembly is used to nickel-titanium alloy sheet bracing force, make it deform, this semiconductor heat dissipation efficiency improving device, by first motor cooperation multiple first support roller and second support roller, so that nickel-titanium alloy sheet moves on the surface of first support roller and second support roller, when nickel-titanium alloy sheet is under external force, make it heat release, when external force on nickel-titanium alloy sheet disappears, nickel-titanium alloy sheet absorbs heat at this time, to absorb the heat generated by semiconductor chip, to adopt active semiconductor heat dissipation mode to improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, specifically a semiconductor heat dissipation efficiency improvement device. Background Technology

[0002] Semiconductors are key materials whose conductivity at room temperature is between that of conductors and insulators. Their core components are elements such as silicon and germanium or related compounds. They are the core foundation of modern electronic devices. They have unique properties and can precisely change their conductivity by doping with impurities or applying an electric field, thereby realizing core functions such as switching and amplification. However, semiconductors generate heat when current flows through them, and high temperatures can seriously affect their performance or even damage the devices. Therefore, heat dissipation is a critical aspect of semiconductor applications.

[0003] In practical applications, the common method for semiconductor heat dissipation is fan cooling, which involves passing the semiconductor through a heat dissipation cavity formed by fans. Essentially, this relies on passive convection heat transfer through gas flow to dissipate the heat generated by the semiconductor chip. However, this method is easily affected by the inherent low thermal conductivity and low specific heat capacity of air, which can affect the heat dissipation effect. Furthermore, due to the passive heat convection method, the heat dissipation efficiency is relatively low. Therefore, we propose a semiconductor heat dissipation efficiency improvement device. Utility Model Content

[0004] The technical problem to be solved by this application is that the heat dissipation efficiency is relatively low due to passive heat convection.

[0005] To solve the above-mentioned technical problems, this application provides a semiconductor heat dissipation efficiency improvement device, including a housing and an exhaust fan. Both ports of the housing are open. A nickel-titanium alloy thin plate is disposed inside the housing. The nickel-titanium alloy thin plate is disposed at one of the openings of the housing. A support component is disposed inside the housing. The support component is used to tighten and apply force to the nickel-titanium alloy thin plate to deform it. A heat sink is connected to one side of the outer casing, and a flow guiding component is provided inside the heat sink.

[0006] In some embodiments, a first motor is mounted on the outer surface of the housing. The first motor is used to drive the support assembly. The support assembly includes a first support roller and a second support roller. The first support roller is disposed on the side of the second support roller facing the inside of the housing. There are several first support rollers arranged alternately from top to bottom. There are two second support rollers arranged parallel to each other. The first motor is connected to one of the first support rollers.

[0007] In some embodiments, the airflow guiding assembly includes a plurality of vertically rotatable shafts disposed inside the heat sink, and an airflow guiding plate is sleeved on the outer surface of the shafts.

[0008] In some embodiments, the plurality of rotating shafts rotatably penetrate the top outer surface of the housing, and a first gear is mounted on the top outer surface of the plurality of rotating shafts. A rack is movably meshed on one side of the plurality of first gears, and teeth are provided on both sides of the rack. When the rack moves, it drives the first gear to rotate, thereby causing the rotating shaft to adjust the guiding angle of the guide plate.

[0009] In some embodiments, a transmission assembly is provided on the top outer surface of the housing on one side of the rack, the transmission assembly being used to drive the rack to reciprocate.

[0010] In some embodiments, a protective shell is installed on the top outer surface of the housing, and the transmission assembly includes a second motor installed on the top inner wall of the protective shell. Two support shafts are rotatably connected to the top outer surface of the housing. The output end of the second motor is connected to one of the support shafts. A first incomplete gear and a second incomplete gear are respectively sleeved on the outer surfaces of the two support shafts. A second gear is sleeved on the outer surfaces of both support shafts. The outer surfaces of the two second gears are movably meshed. The first incomplete gear and the second incomplete gear alternately mesh with the rack.

[0011] In some embodiments, the tooth pin angle range of the surfaces of the first incomplete gear and the second incomplete gear is 120°. When the first incomplete gear meshes with the rack, the second incomplete gear is disengaged from the rack. When the second incomplete gear meshes with the rack, the first incomplete gear is disengaged from the rack.

[0012] In some embodiments, a heat insulation plate is provided on the inner wall of the housing between the upper and lower inner walls of the nickel-titanium alloy sheet.

[0013] In some embodiments, rectangular holes are provided on both sides of the protective shell along the length of the rack, and the size of the rectangular holes is larger than the lateral cross-sectional size of the rack.

[0014] In some embodiments, a groove is formed on the top outer surface of the housing, and a slider is connected to the bottom outer surface of the rack, with the slider slidably connected to the inside of the groove.

[0015] This utility model has at least the following beneficial effects: In this invention, a first motor, in conjunction with multiple first and second support rollers, causes a nickel-titanium alloy sheet to move on the surfaces of the first and second support rollers. When the nickel-titanium alloy sheet is subjected to external force, it releases heat. When the external force on the nickel-titanium alloy sheet disappears, the nickel-titanium alloy sheet absorbs heat, thereby absorbing the heat generated by the semiconductor chip. This active semiconductor heat dissipation method improves heat dissipation efficiency.

[0016] In this invention, the heat generated by the nickel-titanium alloy sheet is guided by a guide plate, and the rack moves back and forth within a certain range by a second motor in conjunction with a second gear, a first incomplete gear, and a second incomplete gear. The rack, in conjunction with the first motor, causes the rotating shaft to drive the guide plate to rotate within a certain angle range, so that the guide plate is in a dynamic adjustment state, allowing the heat generated by the nickel-titanium alloy sheet to be dissipated in all directions, avoiding the existence of heat dissipation dead zones. Attached Figure Description

[0017] Figure 1 This is a first-view structural diagram of the present invention; Figure 2 This is a schematic diagram of the second-view structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the outer shell of this utility model; Figure 4 This is a side sectional view of the protective shell of this utility model. Figure 5 This is a top-view cross-sectional structural diagram of the protective shell of this utility model.

[0018] In the diagram: 1. Outer shell; 2. Heat sink; 3. Nickel-titanium alloy sheet; 4. Support assembly; 41. First support roller; 42. Second support roller; 5. First motor; 6. Exhaust fan; 7. Guide assembly; 71. Rotating shaft; 72. Guide plate; 8. First gear; 9. Rack; 10. Transmission assembly; 101. First incomplete gear; 102. Second motor; 103. Second gear; 104. Second incomplete gear. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: Please refer to Figures 1-5This utility model provides a technical solution: a semiconductor heat dissipation efficiency improvement device, including a housing 1 and an exhaust fan 6. Both ports of the housing 1 are open. A nickel-titanium alloy thin plate 3 is disposed inside the housing 1. The nickel-titanium alloy thin plate 3 is disposed at one of the openings of the housing 1. A support component 4 is disposed inside the housing 1. The support component 4 is used to tighten and apply force to the nickel-titanium alloy thin plate 3 to deform it. When the surface of the nickel-titanium alloy thin plate 3 is subjected to force, it releases heat. When the external force on the surface of the nickel-titanium alloy thin plate 3 disappears, it absorbs heat, thereby absorbing the heat generated by the semiconductor chip. A heat dissipation hood 2 is connected to one side of the housing 1. A flow guiding component 7 is disposed inside the heat dissipation hood 2. The exhaust fan 6 discharges the heat released by the nickel-titanium alloy thin plate 3. Specifically, the support component 4 applies force to the nickel-titanium alloy thin plate 3 and conveys it. When the surface of the nickel-titanium alloy thin plate 3 is subjected to force, it releases heat, which is discharged by the exhaust fan 6. When the external force on the surface of the nickel-titanium alloy thin plate 3 disappears, it absorbs heat. The side of the nickel-titanium alloy thin plate 3 corresponds to the semiconductor chip side, and it absorbs the heat generated by the semiconductor chip when absorbing heat. Nickel-titanium alloys exhibit a significant elasto-thermal effect. Their working principle is based on the release and absorption of heat energy during phase transformation. When nickel-titanium alloys undergo martensitic transformation under stress, heat is absorbed or released. For example, stretching the alloy induces a martensitic transformation that releases heat, while unloading and restoring the alloy to its original state results in heat absorption.

[0021] Example 2: Please refer to Figures 1-5 This utility model provides a technical solution: a first motor 5 is installed on the outer surface of the outer shell 1. The first motor 5 is used to drive the support assembly 4. The support assembly 4 includes a first support roller 41 and a second support roller 42. The first support roller 41 is disposed on the side of the second support roller 42 facing the inside of the outer shell 1. There are several first support rollers 41 arranged alternately from top to bottom. There are two second support rollers 42 arranged parallel to each other. The first motor 5 is connected to one of the first support rollers 41. Specifically, the first motor 5 drives one of the first support rollers 41 to rotate, thereby driving the nickel-titanium alloy sheet 3 to rotate. The surfaces of the first support roller 41 and the second support roller 42 travel along the path of the first support roller 41 and the second support roller 42. When the nickel-titanium alloy sheet 3 moves to the multiple sets of first support rollers 41, it changes its path back and forth under the guidance of the multiple first support rollers 41. The nickel-titanium alloy sheet 3 releases internal heat under external force. When the nickel-titanium alloy sheet 3 moves between the multiple sets of second support rollers 42, the external force applied to the nickel-titanium alloy sheet 3 disappears. At this time, the nickel-titanium alloy sheet 3 absorbs heat, thereby absorbing the heat generated by the semiconductor chip, thus improving the heat dissipation efficiency by adopting an active semiconductor heat dissipation method.

[0022] Example 3: Please refer to Figures 1-5This utility model provides a technical solution: the heat released by the nickel-titanium alloy thin plate 3 is guided by the flow guiding component 7 to completely dissipate the heat and prevent the formation of heat dissipation dead zones. The flow guiding component 7 includes multiple vertically rotating shafts 71 inside the heat dissipation cover 2. The outer surface of the rotating shafts 71 is fitted with flow guiding plates 72. Specifically, when the exhaust fan 6 discharges the heat released by the nickel-titanium alloy thin plate 3, the hot air is guided by multiple flow guiding plates 72 so that the heat between the exhaust fan 6 and the nickel-titanium alloy thin plate 3 is dissipated in all directions, preventing the formation of heat dissipation dead zones.

[0023] Example 4: Please refer to Figures 1-5 This utility model provides a technical solution: multiple rotating shafts 71 rotatably penetrate the top outer surface of the outer casing 1. Each of the multiple rotating shafts 71 has a first gear 8 mounted on its top outer surface. A rack 9 is movably meshed on one side of each of the first gears 8. Teeth are provided on both sides of the rack 9. When the rack 9 moves, it drives the first gears 8 to rotate, causing the rotating shafts 71 to adjust the guiding angle of the guide plate 72. A transmission assembly 10 is provided on the top outer surface of the outer casing 1, located on one side of the rack 9. The transmission assembly 10 is used to drive the rack 9 to reciprocate. A protective shell is installed on the top outer surface of the outer casing 1. The transmission assembly 10 covers... The enclosure includes a second motor 102 installed on the inner wall of the top of the protective shell. Two support shafts are rotatably connected to the outer surface of the top of the outer shell 1. The output end of the second motor 102 is connected to one of the support shafts. A first incomplete gear 101 and a second incomplete gear 104 are respectively fitted onto the outer surfaces of the two support shafts. A second gear 103 is fitted onto the outer surfaces of both support shafts. The outer surfaces of the two second gears 103 are movably meshed. The first incomplete gear 101 and the second incomplete gear 104 alternately mesh with the rack 9. Specifically, the dimensions and gear types of the two second gears 103 are... The numbers are completely consistent. The second motor 102 operates, driving the corresponding support shaft to rotate. The support shaft drives the first incomplete gear 101 and the second gear 103 on it to rotate. The second gear 103 drives another gear 103 to rotate, causing the two support shafts to rotate in different directions. When the first incomplete gear 101 meshes with the rack 9, the rotation of the first incomplete gear 101 causes the rack 9 to move linearly. The rack 9 drives the first gear 8, causing the rotating shaft 71 to rotate. This, in turn, causes the rotating shaft 71 to drive the guide plate 72 to rotate, adjusting the guide angle. When the first incomplete gear 101 disengages from the surface of the rack 9, the second incomplete gear 104 rotates, causing it to mesh with the surface of the rack 9. This causes the second incomplete gear 104 to move the rack 9 to the other side, resulting in the rack 9 reciprocating. As the rack 9 reciprocates, the first gear 8 rotates repeatedly, causing the shaft 71 to reciprocate within a certain range, thus rotating the guide plate 72. This keeps the guide plate 72 in a dynamically adjustable state, allowing the heat generated by the nickel-titanium alloy thin plate 3 to dissipate in all directions, avoiding any heat dissipation dead zones.

[0024] Example 5: Please refer to Figures 1-5 This utility model provides a technical solution: the angle range of the tooth pins on the surfaces of the first incomplete gear 101 and the second incomplete gear 104 is 120°. When the first incomplete gear 101 meshes with the rack 9, the second incomplete gear 104 is in a disengaged state from the rack 9. When the second incomplete gear 104 meshes with the rack 9, the first incomplete gear 101 is in a disengaged state from the rack 9. Specifically, the diameters of the first incomplete gear 101 and the second incomplete gear 104 are the same and the number of teeth is exactly the same. Furthermore, the installation positions of the first incomplete gear 101 and the second incomplete gear 104 must meet the requirement that after the first incomplete gear 101 disengages from the surface of the rack 9, the support shaft needs to rotate a certain angle to allow the second incomplete gear 104 to mesh with the rack 9. This method can avoid the phenomenon of tooth jamming caused by the first incomplete gear 101 and the second incomplete gear 104 meshing with the rack 9 at the same time.

[0025] Example 6: Please refer to Figures 1-5 This utility model provides a technical solution: a heat insulation plate is provided on the inner wall of the outer shell 1 between the upper and lower inner walls of the nickel-titanium alloy thin plate 3. Specifically, the heat insulation plate blocks the heat released by the nickel-titanium alloy thin plate 3, reducing the heat dissipated to the heat-absorbing end of the nickel-titanium alloy thin plate 3.

[0026] Example 7: Please refer to Figures 1-5 The present invention provides a technical solution: rectangular holes are provided on both sides of the protective shell along the length direction of the rack 9. The size of the rectangular holes is larger than the lateral cross-sectional size of the rack 9. Specifically, the rectangular holes provide a channel for the movement of the rack 9. When the rack 9 moves back and forth, one end of the rack 9 passes through the rectangular holes and passes through the protective shell.

[0027] Example 8: Please refer to Figures 1-5 The present invention provides a technical solution: a groove is provided on the top outer surface of the outer shell 1, and a slider is connected to the bottom outer surface of the rack 9. The slider is slidably connected to the inside of the groove. Specifically, when the rack 9 moves, the slider slides inside the groove, thereby guiding the movement of the rack 9 and making the rack 9 move linearly under the force.

[0028] Based on the above embodiments, the following is the complete working principle of the above embodiments: In use, the first motor 5 drives one of the first support rollers 41 to rotate, thereby causing the nickel-titanium alloy sheet 3 to move along the path of the first support rollers 41 and the second support rollers 42 on the surface of the first support rollers 41 and the second support rollers 42. When the nickel-titanium alloy sheet 3 moves to the multiple sets of first support rollers 41, it changes its path back and forth under the guidance of the multiple first support rollers 41. The nickel-titanium alloy sheet 3 releases internal heat under external force and is discharged by the exhaust fan 6. When the nickel-titanium alloy sheet 3 moves between the multiple sets of second support rollers 42, the external force applied to the nickel-titanium alloy sheet 3 disappears. At this time, the nickel-titanium alloy sheet 3 absorbs heat, thereby absorbing the heat generated by the semiconductor chip, thereby improving the heat dissipation efficiency by adopting an active semiconductor heat dissipation method.

[0029] When the exhaust fan 6 discharges the heat released from the nickel-titanium alloy sheet 3, multiple guide plates 72 guide the hot air, ensuring that the heat between the exhaust fan 6 and the nickel-titanium alloy sheet 3 is dissipated in all directions, preventing the formation of heat dissipation dead zones. Simultaneously, the second motor 102 operates, driving the corresponding support shaft to rotate. The support shaft drives the first incomplete gear 101 and the second gear 103 on it to rotate. The second gear 103 drives another second gear 103 to rotate, causing the two support shafts to rotate in different directions. When the first incomplete gear 101 meshes with the rack 9, the rotation of the first incomplete gear 101 drives the rack 9 to move linearly. The rack 9 then drives the first gear 8... The rotating shaft 71 rotates, causing the guide plate 72 to rotate and adjust the guide angle. When the first incomplete gear 101 disengages from the surface of the rack 9, the second incomplete gear 104 rotates and engages with the surface of the rack 9, causing the rack 9 to move to the other side. This causes the rack 9 to reciprocate. As the rack 9 reciprocates, the first gear 8 rotates repeatedly, causing the rotating shaft 71 to reciprocate within a certain range and rotate the guide plate 72. This keeps the guide plate 72 in a dynamic adjustment state, allowing the heat generated by the nickel-titanium alloy thin plate 3 to be dissipated in all directions, avoiding any heat dissipation dead zones.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A semiconductor heat dissipation efficiency improvement device, comprising a housing (1) and an exhaust fan (6), characterized in that: Both ports of the outer shell (1) are open. A nickel-titanium alloy thin plate (3) is provided inside the outer shell (1). The nickel-titanium alloy thin plate (3) is located at one of the openings of the outer shell (1). A support component (4) is provided inside the outer shell (1). The support component (4) is used to tighten and apply force to the nickel-titanium alloy thin plate (3) to deform it. The outer shell (1) is connected to a heat sink (2) on one side, and a flow guiding component (7) is provided inside the heat sink (2).

2. The semiconductor heat dissipation efficiency improvement device according to claim 1, characterized in that: A first motor (5) is installed on the outer surface of the outer shell (1). The first motor (5) is used to drive the support assembly (4) to transmit power. The support assembly (4) includes a first support roller (41) and a second support roller (42). The first support roller (41) is disposed on the side of the second support roller (42) facing the inside of the outer shell (1). There are several first support rollers (41) arranged alternately from top to bottom. There are two second support rollers (42) arranged in parallel from top to bottom. The first motor (5) is connected to one of the first support rollers (41).

3. The semiconductor heat dissipation efficiency improvement device according to claim 1, characterized in that: The flow guiding assembly (7) includes a plurality of vertically rotating shafts (71) disposed inside the heat sink (2), and the outer surface of the shafts (71) is fitted with flow guiding plates (72).

4. The semiconductor heat dissipation efficiency improvement device according to claim 3, characterized in that: Multiple rotating shafts (71) rotate through the top outer surface of the outer casing (1). A first gear (8) is installed on the top outer surface of each of the multiple rotating shafts (71). A rack (9) is movably meshed on one side of each of the multiple first gears (8). Teeth are provided on both sides of the rack (9). When the rack (9) moves, it drives the first gear (8) to rotate, causing the rotating shaft (71) to adjust the guiding angle of the guide plate (72).

5. The semiconductor heat dissipation efficiency improvement device according to claim 4, characterized in that: A transmission assembly (10) is provided on the top outer surface of the housing (1) on one side of the rack (9), and the transmission assembly (10) is used to drive the rack (9) to reciprocate.

6. The semiconductor heat dissipation efficiency improvement device according to claim 5, characterized in that: The outer surface of the outer shell (1) is fitted with a protective shell. The transmission assembly (10) includes a second motor (102) installed on the inner wall of the top of the protective shell. The outer surface of the outer shell (1) is rotatably connected to two support shafts. The output end of the second motor (102) is connected to one of the support shafts. The outer surfaces of the two support shafts are respectively fitted with a first incomplete gear (101) and a second incomplete gear (104). The outer surfaces of the two support shafts are fitted with a second gear (103). The outer surfaces of the two second gears (103) are movably meshed. The first incomplete gear (101) and the second incomplete gear (104) alternately mesh with the rack (9).

7. The semiconductor heat dissipation efficiency improvement device according to claim 6, characterized in that: The tooth pin angle range on the surfaces of the first incomplete gear (101) and the second incomplete gear (104) is 120°. When the first incomplete gear (101) meshes with the rack (9), the second incomplete gear (104) is in a disengaged state from the rack (9). When the second incomplete gear (104) meshes with the rack (9), the first incomplete gear (101) is in a disengaged state from the rack (9).

8. The semiconductor heat dissipation efficiency improvement device according to claim 1, characterized in that: The inner wall of the outer shell (1) is provided with a heat insulation plate between the upper and lower inner walls of the nickel-titanium alloy thin plate (3).

9. The semiconductor heat dissipation efficiency improvement device according to claim 6, characterized in that: Rectangular holes are provided on both sides of the protective shell along the length of the rack (9), and the size of the rectangular holes is larger than the lateral cross-sectional size of the rack (9).

10. The semiconductor heat dissipation efficiency improvement device according to claim 4, characterized in that: The top outer surface of the outer shell (1) is provided with a sliding groove, and the bottom outer surface of the rack (9) is connected to a slider, which is slidably connected to the inside of the sliding groove.

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