High-efficiency heat-dissipation automobile ECU connector

Abstract

This utility model relates to the field of automotive electronic controller technology and discloses a high-efficiency heat dissipation automotive ECU connector, including an upper housing, a lower housing, a circuit board, and a connector connected to the circuit board. The upper and lower housings enclose an installation space. Supporting platforms are provided on both sides of the inner side of the lower housing, and the lower surface of the circuit board abuts against the planar support surface of the supporting platform. A lower heat dissipation part corresponding to the position of the supporting platform is provided on the outer side of the lower housing, and an upper heat dissipation part is provided on the outer side of the upper housing. The supporting platforms provide planar support for the circuit board and transfer the heat generated by the circuit board through the lower housing to the corresponding lower heat dissipation part; heat within the installation space can also be transferred through the upper housing to the upper heat dissipation part, allowing both the upper and lower housings to participate in heat dissipation.

Description

Technical Field

[0001] This utility model belongs to the field of automotive electronic component technology, specifically relating to a high-efficiency heat dissipation automotive ECU connector. Background Technology

[0002] Automotive electronic control units (ECUs) are used to collect vehicle sensor signals and control the engine, motor, or other actuators according to preset control strategies. Existing ECU controllers typically include an upper housing, a lower housing, a circuit board, and connectors for connecting the circuit board. The upper and lower housings enclose a space for mounting the circuit board and electronic components. To facilitate the assembly, mounting, and maintenance of the controller, existing technologies have improved the housing connection structure, circuit board positioning structure, and connector mounting structure. For example, Chinese utility model patent CN211630547U discloses an automotive ECU controller that improves installation stability and assembly convenience through the overlapping structure of the upper and lower housings, mounting ears, and the cooperation between the ribs and the circuit board grooves; Chinese utility model patent CN220476081U discloses an automotive motor controller housing that improves the stability of the housing connection and ease of disassembly and assembly through the hinged and fastening structure of the cover and mounting shell.

[0003] When an ECU controller is operating, its circuit board and electronic components continuously generate heat. However, the relatively enclosed space inside the housing makes it difficult for this heat to dissipate quickly. Existing controllers typically dissipate heat by using heat sinks, fins, grilles, or fans on one side of the housing. However, this heat dissipation is mainly concentrated in a localized area of ​​the housing, limiting the overall cooling capacity. Heat generated by the circuit board can easily accumulate inside the housing, especially during prolonged vehicle operation or in high ambient temperatures. This can lead to increased internal temperatures and affect the stability of the circuit board and electronic components. Therefore, there is an urgent need to improve existing technology to address the problems of limited heat dissipation range and low overall cooling efficiency caused by the difficulty in effectively dissipating heat from the housing in current ECU controllers. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-efficiency heat dissipation automotive ECU connector to solve the problem that the heat dissipation of the existing ECU controller is mainly concentrated in the local housing area, and the heat inside the housing is not easy to dissipate to the outside in a timely manner.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A high-efficiency heat dissipation automotive ECU connector includes an upper housing, a lower housing, a circuit board, and a connector connected to one side of the circuit board. The upper housing and the lower housing are connected and enclose an installation space. The circuit board is disposed within the installation space, and the connector extends at least partially out of the installation space. Support platforms are formed on both sides of the inner surface of the lower housing. The circuit board is fixedly mounted on the support platforms. The upper surface of the support platforms is a planar support surface. The lower surface of the circuit board is in contact with the upper surface of the support platforms. The outer surface of the lower housing has a lower heat dissipation part corresponding to the position of the support platforms, and the outer surface of the upper housing has an upper heat dissipation part.

[0006] Preferably, the lower heat dissipation section includes a plurality of spaced heat dissipation fins, which are respectively disposed in corresponding areas on the outer surface of the lower housing of the two supporting platforms.

[0007] Furthermore, the circuit board has a first positioning hole, the support platform is provided with a first positioning post, and the circuit board is fixedly installed on the support platform by a first fastener that passes through the first positioning hole and is fixedly connected to the first positioning post.

[0008] More specifically, a heat-conducting layer is provided between the circuit board and the supporting platform.

[0009] Furthermore, a lower cavity is formed between the two supporting platforms, opposite to the lower surface of the circuit board, for wiring and airflow. An upper cavity for wiring and airflow is formed between the inner side of the upper housing and the circuit board. The upper cavity and the lower cavity are located on both sides of the circuit board and are interconnected. The upper heat dissipation part is distributed on the left and right sides of the outer surface of the upper housing to dissipate heat in the upper cavity to indirectly dissipate heat for the circuit board, and includes several heat dissipation fins that protrude outward from the outer surface of the upper housing.

[0010] Furthermore, the upper housing is provided with a second positioning post on its edge, and the lower housing is provided with a plurality of second positioning holes at corresponding locations on its edge. The second fasteners are inserted into the corresponding second positioning holes and connected to the second positioning post to fix the upper housing and the lower housing together.

[0011] More specifically, both the upper housing and the lower housing are thermally conductive metal housings.

[0012] This utility model discloses a high-efficiency heat dissipation automotive ECU connector. Its core feature is that the lower housing provides planar support for the circuit board via support platforms on both sides, with a lower heat dissipation section located on the outer side of the support platforms, and an upper heat dissipation section located on the outer side of the upper housing. During circuit board operation, some of the heat generated can be transferred from the support platforms to the lower housing, and then dissipated to the outside air through the lower heat dissipation section; heat within the installation space can also be transferred to the upper heat dissipation section via the upper housing. Thus, both the upper and lower housings can participate in heat dissipation, reducing the concentration of heat on one side of the housing. The support platforms form a stable supporting plane for the circuit board, maintaining contact between the circuit board and the lower housing while fixing the circuit board, allowing heat to be transferred outwards along the housing structure. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective.

[0015] Figure 3 This is a cross-sectional view of the overall structure of this utility model.

[0016] Figure 4 This is an exploded view of the overall structure of this utility model.

[0017] Figure 5 This is an exploded view of the overall structure of this utility model from another perspective.

[0018] The following are the markings in the attached diagram: 10. Upper housing; 11. Upper heat dissipation unit; 12. Second positioning post; 20. Lower housing; 21. Supporting platform; 22. Lower heat dissipation unit; 23. First positioning post; 24. Second positioning hole; 30. Circuit board; 31. First positioning hole; 40. Connector; 50. Installation space; 51. Lower cavity; 52. Upper cavity; 61. First fastener; 62. Second fastener. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0020] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] The circuit board and electronic components of the ECU controller generate heat during operation. When the internal space of the housing is relatively enclosed, the heat is mainly dissipated through conduction within the housing and heat exchange between the outer surface of the housing and the outside air. If the heat dissipation structure is only distributed on one side of the housing, the area of ​​the housing involved in heat dissipation is limited, and heat in the installation space tends to accumulate on the side without a heat dissipation structure.

[0022] Based on this, this utility model embodiment provides a high-efficiency heat dissipation automotive ECU connector. For example... Figures 1 to 5 As shown, the automotive ECU connector includes an upper housing 10, a lower housing 20, a circuit board 30, and a connector 40. The upper housing 10 covers the lower housing 20 and together they enclose an installation space 50. The circuit board 30 is housed within the installation space 50, and the connector 40 is connected to one side of the circuit board 30. A portion of the connector 40 is located within the installation space 50, while another portion extends outward through corresponding openings formed by the upper housing 10 and the lower housing 20 for connection to the vehicle wiring harness.

[0023] like Figures 3 to 5 As shown, the side of the lower housing 20 facing the circuit board 30 is the inner surface, and the side of the lower housing 20 away from the circuit board 30 is the outer surface. Two support platforms 21 protrude into the mounting space 50 from the inner surface of the lower housing 20, respectively. These two support platforms 21 are spaced apart and support the two sides of the lower surface of the circuit board 30. The upper surface of the support platform 21 is a planar support surface, which can conform to and abut against the corresponding area of ​​the lower surface of the circuit board 30.

[0024] In this embodiment, the contact refers to the contact between the supporting area on the lower surface of the circuit board 30 and the upper surface of the supporting platform 21 after the circuit board 30 is installed. The two can be in direct contact, or a thermally conductive layer (not shown in the figure) with a thickness that can deform appropriately with assembly pressure can be placed between them. The supporting platform 21 can extend along the length of the circuit board 30, or it can be formed into a segmented platform according to the shape of the circuit board 30 and the distribution of components, as long as it can provide planar support for the circuit board 30 with a certain area.

[0025] The outer surface of the lower housing 20 is provided with a lower heat dissipation section 22, which corresponds one-to-one with the two supporting platforms 21 in spatial position. Specifically, the lower heat dissipation section 22 is correspondingly disposed on the back side of the supporting platform 21 on the outer surface of the lower housing 20, so that a direct heat transfer path is formed between the supporting platform 21 and the lower heat dissipation section 22. The outer surface of the upper housing 10 is provided with an upper heat dissipation section 11. Both the lower heat dissipation section 22 and the upper heat dissipation section 11 are used to increase the contact area between the corresponding housing and the external air. The upper housing 10 and the lower housing 20 can be made of a material with thermal conductivity, so that the heat in the installation space 50 can be transferred to the housing and dissipated outward by the heat dissipation structure on the outside of the housing.

[0026] When the circuit board 30 is in operation, heat transferred from its lower surface or interior to the support area can be transferred to the lower housing 20 via the support platform 21. Since the lower heat dissipation part 22 is located on the outer side of the lower housing 20 corresponding to the support platform 21, heat can continue to be transferred to the lower heat dissipation part 22 after passing through the support platform 21 and the housing wall of the lower housing 20. Heat generated by the air in the mounting space 50 and by electronic components near the upper housing 10 can be transferred to the upper heat dissipation part 11 via the upper housing 10. The upper and lower housings participate in heat exchange separately, which expands the heat dissipation area outside the housing and reduces the situation where heat is mainly concentrated on one side of the housing.

[0027] The support platform 21 also provides planar support for the circuit board 30. Compared to the use of columnar support pillars to support the circuit board 30 in the prior art, the support platform 21 in this embodiment is a continuous or segmented plane that conforms to the lower surface of the circuit board 30. This increases the effective support area of ​​the circuit board 30 on the lower housing 20, making the installation of the circuit board 30 more stable and avoiding localized stress concentration or shaking caused by vibration. More importantly, since the lower heat dissipation part 22 is correspondingly located on the back of the support platform 21, the support platform 21 is designed to have both structural support and heat conduction functions. The heat received by the circuit board 30 by the support platform 21 can be directly and quickly transferred to the corresponding lower heat dissipation part 22 and dissipated outwards. In this process, the planar structure of the support platform 21 itself establishes a highly efficient heat dissipation band with the shortest conduction path for heat. The circuit board 30 is held on the support platform 21 by the first fastener 61, making the installation between the circuit board 30 and the support platform 21 more stable. This contact state serves both to support the circuit board 30 and to provide a physical contact path for heat transfer between the circuit board 30 and the lower housing 20.

[0028] The present invention further proposes that the lower heat dissipation part 22 includes a plurality of spaced heat dissipation fins, and the plurality of heat dissipation fins are respectively disposed in corresponding areas on the outer surface of the lower housing 20 of the two supporting platforms 21.

[0029] The heat dissipation fins protrude outward from the outer surface of the lower housing 20, with gaps between adjacent fins allowing external air to pass through. The heat dissipation fins can extend along the length or width of the lower housing 20. Two support platforms 21 each correspond to a set of heat dissipation fins, with each set of fins located on the back side of the corresponding support platform 21. The corresponding area can be the orthographic projection range of the support platform 21 onto the outer surface of the lower housing 20, or it can include the housing area surrounding and continuously connected to that orthographic projection range.

[0030] In one specific implementation, the lower housing 20 is integrally formed from a thermally conductive metal material. The supporting platform 21 protrudes upward from the inner surface of the lower housing 20, and the lower heat dissipation part 22 protrudes downward from the outer surface of the lower housing 20. The supporting platform 21 and the corresponding heat dissipation fins are located on opposite sides of the shell wall of the lower housing 20, and there is no separating assembly interface between them. After heat enters the lower housing 20 through the supporting platform 21, it can be transferred to multiple heat dissipation fins through the shell wall, and heat exchange occurs between the surface of the heat dissipation fins and the outside air.

[0031] After the heat dissipation fins are correspondingly arranged on the back side of the support platform 21, the heat transferred to the support platform 21 can reach the lower heat dissipation part 22 more quickly through the lower shell 20 and dissipate outward.

[0032] The present invention further proposes that the circuit board 30 has a first positioning hole 31, the support platform 21 is provided with a first positioning post 23, and the circuit board 30 is fixedly installed on the support platform 21 by a first fastener 61 that passes through the first positioning hole 31 and is fixedly connected to the first positioning post 23.

[0033] like Figures 3 to 5 As shown, the first positioning post 23 is disposed on the support platform 21, and the position of the first positioning post 23 corresponds to the first positioning hole 31 on the circuit board 30. When installing the circuit board 30, first align the first positioning hole 31 with the first positioning post 23, and then place the circuit board 30 on the two support platforms 21. The first fastener 61 passes through the first positioning hole 31 and is connected to the first positioning post 23, so that the circuit board 30 is constrained towards the support platform 21.

[0034] In one specific implementation, the first positioning post 23 is a columnar structure formed on the support platform 21, with a threaded hole inside. The first fastener 61 is a screw. After passing through the first positioning hole 31, the screw is screwed into the threaded hole of the first positioning post 23. The head of the screw presses against the upper surface of the circuit board 30 or a washer, keeping the lower surface of the circuit board 30 in contact with the upper surface of the support platform 21. Multiple first positioning posts 23 can be provided and distributed on the two support platforms 21 to restrict the translation and rotation of the circuit board 30 within the installation space 50.

[0035] The engagement of the first positioning post 23 and the first positioning hole 31 determines the mounting position of the circuit board 30 relative to the lower housing 20, while the first fastener 61 holds the circuit board 30 on the support platform 21. When vibrations occur during vehicle operation, the fastening structure restricts the displacement of the circuit board 30 relative to the support platform 21 and maintains contact between the lower surface of the circuit board 30 and the planar support surface. This stable contact prevents the formation of a large air gap between the circuit board 30 and the support platform 21, allowing heat transferred through the contact area to continuously enter the lower housing 20 and further transfer to the lower heat dissipation section 22.

[0036] The present invention further proposes a preferred embodiment in which a heat-conducting layer (not shown in the figure) is provided between the circuit board 30 and the support platform 21.

[0037] The thermally conductive layer can be made of thermally conductive grease, thermally conductive pads, or phase-change thermally conductive materials. During assembly, the thermally conductive layer fills the tiny gap between the lower surface of the circuit board 30 and the upper surface of the support platform 21. Since the upper surface of the support platform 21 is flat, the thermally conductive layer can be evenly distributed between the two. As an alternative embodiment, if there are uneven component leads on the lower surface of the circuit board 30, those skilled in the art can replace the thermally conductive layer with thermally conductive potting compound to achieve more comprehensive filling. The thermally conductive layer further reduces the thermal resistance between the heat-generating surfaces, eliminates the microscopic contact thermal resistance caused by machining errors, and allows heat to be conducted more smoothly through the thermally conductive layer to the support platform 21, and then dissipated by the lower heat dissipation part 22, ensuring heat dissipation redundancy for the connector under extreme operating conditions.

[0038] The present invention further proposes that a lower cavity 51 is formed between the two supporting platforms 21, which is opposite to the lower surface of the circuit board 30 and is used for wiring and airflow. An upper cavity 52 is formed between the inner side of the upper housing 10 and the circuit board 30, which is used for wiring and airflow. The upper cavity 52 and the lower cavity 51 are located on both sides of the circuit board 30 and are interconnected. The upper heat dissipation part 11 is distributed on the left and right sides of the outer surface of the upper housing 10 and includes a number of heat dissipation fins that protrude outward from the outer surface of the upper housing 10.

[0039] like Figures 3 to 5 As shown, two support platforms 21 are spaced apart, maintaining a gap between the area of ​​the lower housing 20 located between the two support platforms 21 and the lower surface of the circuit board 30. This gap forms a lower cavity 51. The lower cavity 51 can accommodate wiring, solder joints, or electronic components on the lower surface of the circuit board 30, and can also provide passage for the connection lines between the connector 40 and the circuit board 30. The inner surface of the upper housing 10 maintains a gap with the upper surface of the circuit board 30, forming an upper cavity 52 to accommodate electronic components and wiring mounted on the upper surface of the circuit board 30.

[0040] In this embodiment, the upper cavity 52 and the lower cavity 51 can be interconnected through a pre-reserved gap between the periphery of the circuit board 30 and the inner walls of the upper housing 10 and the lower housing 20. If the circuit board 30 is provided with process holes or vent holes, the upper and lower cavities can also be connected through the corresponding holes. The airflow caused by temperature changes in different areas inside the housing can disperse heat within the installation space 50 and transfer it to the upper housing 10 and the lower housing 20 respectively.

[0041] In one specific implementation, the upper heat dissipation section 11 is disposed on the left and right sides of the outer surface of the upper housing 10, with multiple spaced heat dissipation fins formed on each side. The heat dissipation fins can be integrally formed protruding from the outer surface of the upper housing 10, with gaps between adjacent heat dissipation fins communicating with the external environment. After the inner side of the upper housing 10 absorbs heat from the upper cavity 52, the heat can be transferred to the upper heat dissipation section 11 through the upper housing 10.

[0042] As an alternative embodiment, those skilled in the art can adjust the distribution area of ​​the upper heat dissipation part 11 according to the position of the connector 40, the mounting ear, and the vehicle mounting space. For example, the upper heat dissipation part 11 can be disposed in the middle and both sides of the upper housing 10, as long as the heat dissipation area of ​​the outer surface of the upper housing 10 can be increased. The lower cavity 51 and the upper cavity 52 can also be interconnected through a single-sided gap or multiple local gaps around the periphery of the circuit board 30. As a preferred embodiment, those skilled in the art can also open ventilation holes on the side walls of the lower housing 20 or the upper housing 10 to further enhance the convection efficiency of the airflow channel.

[0043] This structure, where the upper and lower cavities are interconnected and extend through both sides, allows the gas within the entire installation space 50 to flow. Combined with the heat dissipation fins of the housing 10 and the upper heat dissipation part 11, it can continuously output the heat generated by the circuit board 30 to the outside, effectively preventing localized high temperatures caused by heat accumulation inside the device.

[0044] The present invention further proposes that the edge of the upper housing 10 is provided with a second positioning post 12, and the corresponding edge of the lower housing 20 is provided with a plurality of second positioning holes 24. The second fasteners 62 are respectively inserted into the corresponding second positioning holes 24 and connected to the second positioning post 12 to fix the upper housing 10 and the lower housing 20 together.

[0045] like Figure 4 and Figure 5 As shown, the second positioning posts 12 are spaced apart along the edge of the upper housing 10, and the second positioning holes 24 are opened at the edge of the lower housing 20 corresponding to the positions of the second positioning posts 12. After the upper housing 10 is closed onto the lower housing 20, the second positioning posts 12 are aligned with the second positioning holes 24, and the second fastener 62 passes through the second positioning holes 24 from one side of the lower housing 20 and is connected to the second positioning posts 12.

[0046] In one specific implementation, the second positioning post 12 has a threaded connection hole inside, and the second fastener 62 is a screw. Multiple second fasteners 62 are distributed along the periphery of the upper housing 10 and the lower housing 20, pressing the upper housing 10 and the lower housing 20 together. The opposite edges of the upper and lower housings can be provided with mutually cooperating stop structures to help determine the relative position of the two housings.

[0047] After the upper housing 10 and the lower housing 20 are stably connected, the relative positions of the two housings are not easily changed by vehicle vibration, and the internal structure of the mounting space 50 can remain stable. For structures that transfer heat through the housings, the stable assembly of the upper and lower housings can avoid large assembly gaps at the edges of the housings and maintain the predetermined positional relationship of the upper heat dissipation part 11, the lower heat dissipation part 22, and the internal circuit board 30. The second positioning post 12 and the second positioning hole 24 can also provide a positional reference during the assembly process, making it easy to align the mounting holes of the upper housing 10 and the lower housing 20.

[0048] The present invention further proposes that both the upper shell 10 and the lower shell 20 are thermally conductive metal shells.

[0049] The heat-conducting metal shell can be made of aluminum alloy, magnesium alloy, or other metal materials that meet the requirements for shell strength and thermal conductivity. The upper shell 10 and the lower shell 20 can be formed by die casting, stamping, machining, or a combination of the above processes. The upper heat dissipation part 11 can be integrally formed with the upper shell 10, and the lower heat dissipation part 22 and the supporting platform 21 can be integrally formed with the lower shell 20.

[0050] The metallic material can diffuse the heat transferred from the mounting space 50 and the circuit board 30 along the housing to the upper heat dissipation part 11 and the lower heat dissipation part 22. When the supporting platform 21, the lower housing 20 and the lower heat dissipation part 22 are integrally formed, there is no obvious partition formed by non-thermal conductive connectors between the three, which is conducive to maintaining a continuous heat transfer structure.

[0051] In this high-efficiency heat dissipation automotive ECU connector, the circuit board 30 receives and outputs electrical signals through the connector 40 during operation. Part of the heat generated by the circuit board 30 is transferred to the lower housing 20 via the support platform 21, and dissipated outwards by the lower heat dissipation part 22 located on the corresponding outer area of ​​the support platform 21. Part of the heat within the mounting space 50 is transferred to the upper heat dissipation part 11 via the upper housing 10, where it exchanges heat with the outside air. The support platform 21 forms a planar support for the circuit board 30 through a flat support surface and remains in contact with the circuit board 30 under the action of the first fastener 61, allowing the support platform 21 to simultaneously bear the functions of mounting support and heat transfer for the circuit board 30. The upper heat dissipation part 11 and the lower heat dissipation part 22 respectively increase the heat dissipation area of ​​the upper housing 10 and the lower housing 20, enabling both housings to participate in heat dissipation.

[0052] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heat dissipation automotive ECU connector, comprising an upper housing (10), a lower housing (20), a circuit board (30), and a connector (40) connected to one side of the circuit board (30), wherein the upper housing (10) and the lower housing (20) are connected and enclose to form an installation space (50), the circuit board (30) is disposed within the installation space (50), and the connector (40) extends at least partially out of the installation space (50), characterized in that, The inner surface of the lower housing (20) has two support platforms (21) formed on both sides. The circuit board (30) is fixedly installed on the support platform (21). The upper surface of the support platform (21) is a planar support surface. The lower surface of the circuit board (30) is in contact with the upper surface of the support platform (21). The outer surface of the lower housing (20) is provided with a lower heat dissipation part (22) corresponding to the position of the support platform (21). The outer surface of the upper housing (10) is provided with an upper heat dissipation part (11).

2. The high-efficiency heat dissipation automotive ECU connector according to claim 1, characterized in that, The lower heat dissipation part (22) includes a plurality of spaced heat dissipation fins, which are respectively disposed in the corresponding areas of the two supporting platforms (21) on the outer surface of the lower housing (20).

3. The high-efficiency heat dissipation automotive ECU connector according to claim 2, characterized in that, The circuit board (30) has a first positioning hole (31), the support platform (21) is provided with a first positioning post (23), and the circuit board (30) is fixedly installed on the support platform (21) by a first fastener (61) that passes through the first positioning hole (31) and is fixedly connected to the first positioning post (23).

4. The high-efficiency heat dissipation automotive ECU connector according to claim 3, characterized in that, A heat-conducting layer is provided between the circuit board (30) and the supporting platform (21).

5. A high-efficiency heat dissipation automotive ECU connector according to claim 2, characterized in that, A lower cavity (51) for wiring and airflow is formed between the two supporting platforms (21) and opposite to the lower surface of the circuit board (30). An upper cavity (52) for wiring and airflow is formed between the inner side of the upper housing (10) and the circuit board (30). The upper cavity (52) and the lower cavity (51) are located on both sides of the circuit board (30) and are interconnected. The upper heat dissipation part (11) is distributed on the left and right sides of the outer surface of the upper housing (10) to dissipate the heat in the upper cavity (52) to indirectly dissipate heat for the circuit board (30). It includes a number of heat dissipation fins that protrude outward from the outer surface of the upper housing (10).

6. A high-efficiency heat dissipation automotive ECU connector according to any one of claims 1 to 5, characterized in that, The upper housing (10) is provided with a second positioning post (12) on its edge, and the lower housing (20) is provided with a plurality of second positioning holes (24) at the corresponding positions on its edge. The second fasteners (62) are inserted into the corresponding second positioning holes (24) and connected to the second positioning post (12) to fix the upper housing (10) and the lower housing (20) together.

7. A high-efficiency heat dissipation automotive ECU connector according to claim 6, characterized in that, Both the upper shell (10) and the lower shell (20) are thermally conductive metal shells.

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