Busbar assembly and photovoltaic module

Abstract

The embodiment of the present application provides a busbar assembly and a photovoltaic module, and relates to the technical field of photovoltaic power generation. The busbar assembly is used in the photovoltaic module, and the photovoltaic module comprises a first solder strip. The busbar assembly comprises a busbar body, a first solder layer and a second solder layer. The first solder layer is arranged on one side of the busbar body along the thickness direction of the busbar body, and the second solder layer is arranged on the side of the busbar body, which is away from the first solder layer, along the thickness direction of the busbar body. The first solder layer is used for welding with the first solder strip, and the thickness of the first solder layer is greater than the thickness of the second solder layer. The embodiment of the present application sets the thickness of the first solder layer to be greater than the thickness of the second solder layer, so that the welding reliability between the busbar assembly and the first solder strip can be improved, and thus the reliability of the photovoltaic module is improved. Moreover, the thickness of the busbar assembly can be small, the stress generated by the solar cell under the extrusion of the busbar assembly is reduced, and the risk of solar cell fragmentation is reduced.

Description

Technical Field

[0001] Embodiments of this application relate to the technical field of photovoltaic power generation, and more particularly to a busbar module and a photovoltaic module. Background Technology

[0002] A photovoltaic module includes a solar cell, a busbar assembly, and a solder strip. The busbar assembly is located on the side where the back surface of the solar cell is located, and the solder strip connects the busbar assembly and the solar cell.

[0003] Typically, the welding reliability between the solder strip and the busbar assembly is poor, which affects the reliability of the photovoltaic module. Utility Model Content

[0004] Embodiments of this application disclose a busbar assembly and a photovoltaic module for improving the welding reliability between the busbar assembly and the solder strip.

[0005] On one hand, embodiments of this application provide a busbar assembly for use in a photovoltaic module, the photovoltaic module including a first solder strip. The busbar assembly includes a busbar body, a first solder layer, and a second solder layer. The first solder layer is disposed on one side of the busbar body along the thickness direction. The second solder layer is disposed on the side of the busbar body away from the first solder layer along the thickness direction. The first solder layer is used for soldering with the first solder strip, and the thickness of the first solder layer is greater than the thickness of the second solder layer.

[0006] In some possible implementations, the ratio of the thickness of the first solder layer to the thickness of the second solder layer is greater than or equal to 3.

[0007] In some possible implementations, the thickness of the first solder layer ranges from 25 micrometers to 45 micrometers.

[0008] In some possible implementations, the thickness of the second solder layer ranges from 5 micrometers to 15 micrometers.

[0009] In some possible implementations, the photovoltaic module further includes multiple solar cells arranged in multiple rows along a first direction and multiple columns along a second direction. Multiple solar cells arranged in a single column are connected to form a solar cell string. The busbar assembly is connected to the multiple solar cell strings via a first solder strip. The first and second directions are perpendicular. The ratio of the width of the busbar assembly along the first direction to the thickness of the busbar assembly is greater than or equal to 50.

[0010] In some possible implementations, the busbar assembly further includes a third solder layer and a fourth solder layer. The third solder layer is disposed on one side of the busbar body along a first direction and is connected to the first solder layer and the second solder layer. The fourth solder layer is disposed on the side of the busbar body away from the third solder layer along the first direction and is connected to the first solder layer and the second solder layer.

[0011] In some possible implementations, the width of the busbar assembly along the first direction ranges from 7.95 mm to 10.05 mm.

[0012] In some possible implementations, the thickness of the busbar body ranges from 0.07 mm to 0.12 mm.

[0013] In some possible implementations, the thickness of the busbar assembly ranges from 0.11 mm to 0.16 mm.

[0014] On the other hand, embodiments of this application provide a photovoltaic module. The photovoltaic module includes a solar cell, a busbar assembly as described above, and a first solder strip. The solar cell includes a light-receiving surface and a back-lighting surface disposed opposite each other along its thickness direction. The busbar assembly is disposed on the side of the solar cell where the back-lighting surface is located, and the first solder layer is located on the side of the busbar body away from the solar cell. One end of the first solder strip is connected to the light-receiving surface of the solar cell, and the other end of the first solder strip is soldered to the first solder layer.

[0015] In some possible implementations, the first solder layer includes a horizontal portion and a protrusion. The horizontal portion is located on one side of the busbar body, and the protrusion is located on the side of the busbar body away from the horizontal portion and connected to the horizontal portion. The first solder strip is located within the protrusion, or the first solder strip is located within both the horizontal portion and the protrusion. Along the direction from the horizontal portion to the protrusion, the area of ​​the closed pattern enclosed by the outer contour of the protrusion gradually decreases.

[0016] In some possible implementations, the photovoltaic module also includes an insulating strip disposed between the busbar module and the solar cell, the insulating strip comprising an insulating material.

[0017] In summary, the embodiments of this application have at least the following beneficial effects: In the embodiments of this application, the first solder layer is used for soldering with the first solder strip. The thickness of the first solder layer is set to be greater than the thickness of the second solder layer, so that the thickness of the first solder layer can be larger, thereby improving the solder melting effect of the first solder layer and the coverage effect of the first solder layer on the first solder strip during the soldering process. This can improve the soldering reliability of the busbar module and the first solder strip, reduce the risk of poor soldering between the busbar module and the first solder strip, and improve the reliability of the photovoltaic module.

[0018] Furthermore, improving the welding reliability of the busbar assembly and the first solder strip also helps to reduce the resistance between the busbar assembly and the first solder strip, thereby reducing the internal current loss of the photovoltaic module and improving the output power of the photovoltaic module.

[0019] In addition, the thickness of the first solder layer is set to be greater than that of the second solder layer, so that the thickness of the second solder layer can be smaller, thereby reducing the thickness of the busbar assembly, reducing the stress generated by the solar cell under the squeezing action of the busbar assembly, and reducing the risk of solar cell breakage.

[0020] Furthermore, the smaller thickness of the busbar assembly can reduce the impact of the busbar assembly on other components of the photovoltaic module (such as the bonding between the first cover plate and the solar cells). Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a photovoltaic module provided in some embodiments of this application; Figure 2 Side views of photovoltaic modules provided in some embodiments of this application; Figure 3 This is a schematic diagram showing the connection relationship of solar cells provided in some embodiments of this application; Figure 4 This is a schematic diagram of the structure of a busbar assembly provided in some embodiments of this application; Figure 5 This is a schematic diagram showing the positional relationship between the busbar assembly, the first solder strip, and the solar cell provided in some embodiments of this application; Figure 6 A schematic diagram showing the positional relationship between the busbar assembly, the first solder strip, and the solar cell provided in other embodiments of this application; Figure 7 This is a schematic diagram showing the positional relationship between a solar cell, a first solder layer, and a first solder strip, provided for some embodiments of this application.

[0023] Explanation of reference numerals in the attached figures: 100 - Busbar assembly, 111 - First solder layer, 1111 - Horizontal section, 1112 - Protrusion, 112 - Second solder layer, 113 - Third solder layer, 114 - Fourth solder layer, 115 - Busbar body, 200 - Photovoltaic module, 201 - First solder strip, 202 - Second solder strip, 210 - Solar cell, 210a - Solar cell string, 211 - Light-receiving surface, 212 - Backlighting surface, 220 - Insulating strip, 221 - First buffer layer, 222 - Second buffer layer, 223 - Substrate 231-First cover plate, 232-Second cover plate, 241-First adhesive film, 242-Second adhesive film, 301-Solder head, D1-Thickness of the first solder layer 111, D2-Thickness of the second solder layer 112, D3-Thickness of the busbar body 115, D4-Thickness of the busbar assembly 100, H1-Width of the busbar assembly 100 along the first direction X, H2-Width of the busbar body 115 along the first direction X, X-First direction, Y-Second direction, Z-Thickness direction of the busbar body 115. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In this application, the terms "upper," "left," "right," "front," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0026] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0027] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0028] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0029] Figure 1 The diagram shows the structure of a photovoltaic module provided in some embodiments of this application. Figure 2 This is a side view of a photovoltaic module provided for some embodiments of this application. It will be understood that, in order to simplify the structure of the drawings, Figure 2 Only one solar cell 210 is shown in the image.

[0030] like Figure 1 and Figure 2 As shown, an embodiment of this application provides a photovoltaic module 200, which can be understood to convert light energy into electrical energy to realize photovoltaic power generation.

[0031] In some examples, the photovoltaic module 200 includes solar cells 210, which are capable of converting light energy into electrical energy. The number of solar cells 210 can be multiple, such as... Figure 1 As shown, multiple solar cells 210 can be arranged in multiple rows along the first direction X and in multiple columns along the second direction Y. The first direction X and the second direction Y are perpendicular.

[0032] The first direction X and the second direction Y can be perpendicular or approximately perpendicular. That is, the angle between the first direction X and the second direction Y can be 90°, 88°, or 89°, etc.

[0033] Understandably, in order to simplify the structure of the attached figures, Figure 1 Only four solar cells 210 are shown in the illustration, and the embodiments of this application do not limit the number of solar cells 210.

[0034] Continue to refer to Figure 1 In some examples, multiple solar cells 210 arranged in a row are connected to form a solar cell string 210a. Understandably, there are multiple solar cell strings 210a, which are spaced apart along the second direction Y.

[0035] Figure 3 This diagram illustrates the connection relationships of solar cells provided in some embodiments of this application. In some examples, such as... Figure 3 As shown, the solar cell 210 includes a light-receiving surface 211 and a back-lighting surface 212 disposed opposite to each other along the thickness direction. Understandably, the light-receiving surface 211 is used to receive light, and the back-lighting surface 212 is away from the light source.

[0036] For example, the solar cell 210 may include a silicon wafer and an electrode. The electrode is disposed on one side of the silicon wafer along the thickness direction and is connected to the silicon wafer. The electrode is used to transmit the current generated by the silicon wafer. The side where the electrode is located is the light-receiving surface 211 of the solar cell 210, and the side away from the electrode is the back-lighting surface 212 of the solar cell 210.

[0037] The photovoltaic module 200 may include a second solder strip 202, which is capable of connecting two solar cells 210 arranged adjacent to each other along a first direction X. For example, Figure 3 As shown, in two solar cells 210 arranged adjacent to each other along the first direction X, one end of the second solder strip 202 can be connected to the light-receiving surface 211 (e.g., an electrode) of one solar cell 210, and the other end of the second solder strip 202 can be connected to the backlight surface 212 of the other solar cell 210.

[0038] There can be multiple second solder strips 202. Any one of the second solder strips 202 can connect two solar cells 210 that are arranged adjacently along the first direction X, so that multiple solar cells 210 arranged in a row can be connected to form a solar cell string 210a.

[0039] For example, the second solder strip 202 can be a cylindrical or near-cylindrical structure, or the second solder strip 202 can be other regular or irregular shapes. The embodiments of this application do not further limit the shape of the second solder strip 202.

[0040] Continue to refer to Figure 1 Two solar cells 210 arranged adjacent to each other along the first direction X can be connected by at least two second solder strips 202, which can be spaced apart along the second direction Y.

[0041] In some examples, such as Figure 2 As shown, the photovoltaic module 200 may also include a busbar assembly 100 and a first solder strip 201, that is, the busbar assembly 100 can be used in the photovoltaic module 200.

[0042] The busbar assembly 100 is located on the side where the back surface 212 of the solar cell 210 is located. The busbar assembly 100 is connected to multiple solar cell strings 210a via a first solder strip 201.

[0043] like Figure 2 As shown, the first solder strip 201 can be bent and extended. For example, one end of the first solder strip 201 can be connected to the side of the busbar assembly 100 away from the solar cell 210, and the other end of the first solder strip 201 can extend to the light-receiving surface 211 of the solar cell 210 located at the end of the solar cell string 210a, and be connected to the light-receiving surface 211 (e.g., the electrode) of the solar cell 210.

[0044] There can be multiple first solder strips 201, and multiple first solder strips 201 can be spaced apart along the second direction Y. A solar cell string 210a can be connected to the busbar assembly 100 through at least two first solder strips 201.

[0045] For example, the first solder strip 201 can be cylindrical or approximately cylindrical, or it can be other regular or irregular shapes. The embodiments of this application do not further limit the shape of the first solder strip 201. The shape and quantity of the first solder strip 201 can be the same as or different from the shape and quantity of the second solder strip 202.

[0046] The busbar assembly 100 can be connected to an external load (such as a power grid or electrical equipment) so that the electrical energy converted from multiple solar cell strings 210a can be transmitted to the outside through the busbar assembly 100.

[0047] For example, the way in which the busbar assembly 100 is positioned on the side where the back surface 212 of the solar cell 210 is located is called a busbar assembly folding.

[0048] Understandably, by placing the busbar assembly 100 on the side where the backlight surface 212 of the solar cell 210 is located, the busbar assembly 100 does not need to occupy additional space in the XY plane (the plane containing the first direction X and the second direction Y), which is beneficial to increasing the area of ​​the solar cell 210 in the XY plane, thereby increasing the output power of the photovoltaic module 200.

[0049] For example, placing the busbar assembly 100 on the side where the backlight surface 212 of the solar cell 210 is located can increase the screen ratio of the solar cell 210 (the ratio of the area of ​​the solar cell 210 in the XY plane to the area of ​​the photovoltaic module 200 in the XY plane) by about 1% and increase the power of the photovoltaic module 200 by about 5 watts (unit: W).

[0050] Figure 4 This is a schematic diagram of the structure of a busbar assembly provided in some embodiments of this application. In some examples, such as... Figure 4 As shown, the busbar assembly 100 includes a busbar body 115, a first solder layer 111, and a second solder layer 112.

[0051] The material of the busbar body 115 may include copper to improve the conductivity of the busbar body 115. Alternatively, the material of the busbar body 115 may also include other metals or alloys. The embodiments of this application do not further limit the material of the busbar body 115.

[0052] The materials of the first solder layer 111 and the second solder layer 112 may include tin and lead, or the materials of the first solder layer 111 and the second solder layer 112 may also include other metals. The materials of the first solder layer 111 and the second solder layer 112 may be the same or different. The embodiments of this application do not further limit the materials of the first solder layer 111 and the second solder layer 112.

[0053] Continue to refer to Figure 4 The first solder layer 111 is disposed on one side of the busbar body 115 along the thickness direction Z, and the second solder layer 112 is disposed on the side of the busbar body 115 away from the first solder layer 111 along the thickness direction Z.

[0054] Understandably, the thickness direction Z of the busbar body 115 is perpendicular or approximately perpendicular to the plane containing the first direction X and the second direction Y (the XY plane). That is, the angle between the thickness direction Z of the busbar body 115 and the XY plane can be 90°, 88°, or 89°, etc. The thickness direction Z of the busbar body 115 and the thickness direction of the solar cell 210 are in the same direction.

[0055] In some examples, the first solder layer 111 is used to solder to the first solder strip 201. That is, one end of the first solder strip 201 can be connected to the light-receiving surface 211 of the solar cell 210, and the other end of the first solder strip 201 can be soldered to the first solder layer 111. After the busbar assembly 100 is folded, the first solder layer 111 is located on the side of the busbar body 115 away from the solar cell 210.

[0056] Figure 5 This is a schematic diagram showing the positional relationship between the busbar assembly, the first solder strip, and the solar cell provided in some embodiments of this application. Figure 6 This is a schematic diagram showing the positional relationship of the busbar assembly, the first solder strip, and the solar cell provided in other embodiments of this application. It can be understood that... Figure 5 This diagram illustrates the positional relationship between the busbar assembly 100, the first welding strip 201, the solar cell 210, and the welding head before the busbar assembly 100 is folded. Figure 6 This is a schematic diagram showing the positional relationship between the busbar assembly 100, the first welding strip 201, and the solar cell 210 after the busbar assembly 100 is folded.

[0057] Before folding the busbar assembly 100 to the side where the back surface 212 of the solar cell 210 is located, the busbar assembly 100 and the first solder strip 201 need to be soldered together.

[0058] Understandably, the welding head 301 is typically positioned on the side where the back surface 212 of the solar cell 210 is located. To prevent the first welding strip 201 from being located between the busbar body 115 and the solar cell 210 after the busbar assembly 100 is folded over, the first welding strip 201 needs to be placed on the side of the busbar assembly 100 away from the welding head 301, such as... Figure 5 As shown, the first solder strip 201 is placed on the side where the first solder layer 111 is located, and the solder head 301 contacts the second solder layer 112 to solder the first solder layer 111 and the first solder strip 201.

[0059] After welding is completed, the busbar assembly 100 can be folded to the side where the back surface 212 of the solar cell 210 is located, such as... Figure 6 As shown, this is so that the first solder strip 201 and the first solder layer 111 can be located on the side of the busbar body 115 away from the solar cell 210, so as to avoid the first solder strip 201 squeezing the solar cell 210 and causing the solar cell 210 to break.

[0060] However, the contact between the solder head 301 and the second solder layer 112 to solder the first solder layer 111 and the first solder strip 201 increases the risk of poor soldering between the busbar assembly 100 and the first solder strip 201, affecting the welding reliability between the busbar assembly 100 and the first solder strip 201, and thus affecting the reliability of the photovoltaic module 200.

[0061] Based on this, in the embodiments of this application, such as Figure 4 As shown, the thickness D1 of the first solder layer 111 is greater than the thickness D2 of the second solder layer 112.

[0062] Understandably, the first solder layer 111 is used to solder with the first solder strip 201. The thickness D1 of the first solder layer 111 is set to be greater than the thickness D2 of the second solder layer 112, so that the thickness D1 of the first solder layer 111 can be larger, which improves the solder melting effect of the first solder layer 111 and the covering effect of the first solder layer 111 on the first solder strip 201 during the soldering process. This can improve the soldering reliability of the busbar module 100 and the first solder strip 201, reduce the risk of poor soldering between the busbar module 100 and the first solder strip 201, and improve the reliability of the photovoltaic module 200.

[0063] Furthermore, improving the welding reliability of the busbar assembly 100 and the first solder strip 201 also helps to reduce the resistance between the busbar assembly 100 and the first solder strip 201, thereby reducing the internal current loss of the photovoltaic module 200 and improving the output power of the photovoltaic module 200.

[0064] In addition, the thickness D1 of the first solder layer 111 is set to be greater than the thickness D2 of the second solder layer 112, so that the thickness D2 of the second solder layer 112 can be smaller, thereby making the thickness D4 of the busbar assembly 100 smaller, reducing the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, and reducing the risk of the solar cell 210 breaking.

[0065] Furthermore, the smaller thickness D4 of the busbar assembly 100 can also reduce the impact of the busbar assembly 100 on other components of the photovoltaic module 200 (such as the bonding between the first cover plate 231 and the solar cell 210).

[0066] In some examples, the ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 is greater than or equal to 3.

[0067] Understandably, in the embodiments of this application, the thickness D1 of the first solder layer 111 and the thickness D2 of the second solder layer 112 are the thicknesses of the first solder layer 111 and the second solder layer 112 before the first solder strip 201 and the busbar assembly 100 are soldered.

[0068] The ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 is greater than or equal to 3, which allows the thickness D1 of the first solder layer 111 to be larger, thereby improving the welding reliability of the busbar assembly 100 and the first solder strip 201, reducing the risk of poor soldering between the busbar assembly 100 and the first solder strip 201, and improving the reliability of the photovoltaic module 200.

[0069] Furthermore, the ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 is greater than or equal to 3, which allows the thickness D2 of the second solder layer 112 to be smaller, thereby allowing the thickness D4 of the busbar assembly 100 to be smaller. This reduces the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, reduces the risk of the solar cell 210 breaking, and reduces the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0070] For example, the ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 can be 4, 5 or 6, etc. The embodiments of this application do not further limit the ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112.

[0071] In some examples, such as Figure 4 As shown, the thickness D1 of the first solder layer 111 ranges from 25 micrometers (unit: μm) to 45 micrometers.

[0072] For example, the thickness D1 of the first solder layer 111 can be 28μm, 32μm, 35μm or 40μm, etc. The embodiments of this application do not further limit the value of the thickness D1 of the first solder layer 111.

[0073] Setting the thickness D1 of the first solder layer 111 to a range of 25 micrometers to 45 micrometers can prevent the thickness of the first solder layer 111 from being too small (e.g., less than 25 μm), so that the first solder layer 111 can meet the welding requirements, improve the solder melting effect of the first solder layer 111 during the welding process and the covering effect of the first solder layer 111 on the first solder strip 201, thereby improving the welding reliability between the busbar assembly 100 and the first solder strip 201.

[0074] Furthermore, by setting the thickness D1 of the first solder layer 111 to a range of 25 micrometers to 45 micrometers, the thickness of the first solder layer 111 can be avoided to be too large (e.g., greater than 45 μm), so that the thickness D4 of the busbar assembly 100 can be smaller, thereby reducing the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, reducing the risk of the solar cell 210 breaking, and reducing the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0075] In some examples, such as Figure 4 As shown, the thickness D2 of the second solder layer 112 ranges from 5 micrometers to 15 micrometers.

[0076] For example, the thickness D2 of the second solder layer 112 can be 8μm, 10μm or 12μm, etc. The embodiments of this application do not further limit the value of the thickness D2 of the second solder layer 112.

[0077] Setting the thickness D2 of the second solder layer 112 to a range of 5 micrometers to 15 micrometers can prevent the thickness of the second solder layer 112 from being too small (e.g., less than 5 μm), so that the heat generated by the solder head 301 can be transferred to the first solder layer 111 through the second solder layer 112, which is beneficial to improving the solder melting effect of the first solder layer 111, thereby improving the welding reliability between the busbar assembly 100 and the first solder strip 201.

[0078] Furthermore, by setting the thickness D2 of the second solder layer 112 to a range of 5 micrometers to 15 micrometers, the thickness of the second solder layer 112 can be avoided to be too large (e.g., greater than 15 μm), so that the thickness D4 of the busbar assembly 100 can be smaller, thereby reducing the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, reducing the risk of the solar cell 210 breaking, and reducing the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0079] In some examples, such as Figure 4 As shown, the thickness D3 of the busbar body 115 ranges from 0.07 mm to 0.12 mm.

[0080] For example, the thickness D3 of the busbar body 115 can be 0.09mm, 0.1mm or 0.11mm, etc. The embodiments of this application do not further limit the value of the thickness D3 of the busbar body 115.

[0081] Setting the thickness D3 of the busbar body 115 to a range of 0.07 mm to 0.12 mm can prevent the thickness of the busbar body 115 from being too small (e.g., less than 0.07 mm), thus ensuring the conductivity of the busbar body 115.

[0082] Furthermore, by setting the thickness D3 of the busbar body 115 to a range of 0.07 mm to 0.12 mm, the thickness of the busbar body 115 can be avoided to be too large (e.g., greater than 0.12 mm), so that the thickness D4 of the busbar assembly 100 can be smaller. This reduces the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, reduces the risk of the solar cell 210 breaking, and also reduces the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0083] In some examples, the thickness D4 of the busbar assembly 100 ranges from 0.11 mm to 0.16 mm.

[0084] Understandably, the thickness D4 of the busbar assembly 100 is the sum of the thickness D1 of the first solder layer 111, the thickness D2 of the second solder layer 112, and the thickness D3 of the busbar body 115.

[0085] For example, the thickness D4 of the busbar assembly 100 can be 0.12mm, 0.14mm or 0.15mm, etc. The embodiments of this application do not further limit the value of the thickness D4 of the busbar assembly 100.

[0086] Setting the thickness D4 of the busbar assembly 100 to a range of 0.11 mm to 0.16 mm can prevent the thickness D4 of the busbar assembly 100 from being too small (e.g., less than 0.11 mm), thus ensuring the conductivity of the busbar assembly 100 and the welding reliability between the busbar assembly 100 and the first solder strip 201.

[0087] Furthermore, setting the thickness D4 of the busbar assembly 100 to a range of 0.11 mm to 0.16 mm can prevent the thickness D4 of the busbar assembly 100 from being too large (e.g., greater than 0.16 mm), reduce the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, reduce the risk of the solar cell 210 breaking, and reduce the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0088] In some examples, the ratio of the thickness D4 of the busbar assembly 100 to the sum of the thickness D1 of the first solder layer 111 and the thickness D2 of the second solder layer 112 can be in the range of 2.5 to 5.

[0089] For example, the thickness D4 of the busbar assembly 100 can be 0.15 mm, the sum of the thickness D1 of the first solder layer 111 and the thickness D2 of the second solder layer 112 can be 0.04 mm, and the ratio of the thickness D4 of the busbar assembly 100 to the sum of the thickness D1 of the first solder layer 111 and the thickness D2 of the second solder layer 112 can be 3.75. Alternatively, the ratio of the thickness D4 of the busbar assembly 100 to the sum of the thickness D1 of the first solder layer 111 and the thickness D2 of the second solder layer 112 can also be 4. The embodiments of this application do not further limit this.

[0090] Figure 7 This is a schematic diagram showing the positional relationship between a solar cell, a first solder layer, and a first solder strip, provided for some embodiments of this application.

[0091] In some examples, such as Figure 7 As shown, after the first solder layer 111 and the first solder strip 201 are soldered, the first solder layer 111 includes a horizontal portion 1111 and a protrusion 1112. The horizontal portion 1111 is located on one side of the busbar body 115, and the protrusion 1112 is located on the side of the busbar body 115 away from the horizontal portion 1111 and connected to the horizontal portion 1111. The first solder strip 201 is located within the protrusion 1112, or the first solder strip 201 is located within both the horizontal portion 1111 and the protrusion 1112.

[0092] Understandably, after the first solder strip 201 and the first solder layer 111 are soldered, an alloy, such as a tin-copper alloy, can be formed between the first solder strip 201 and the first solder layer 111. That is, after the first solder strip 201 and the first solder layer 111 are soldered, the first solder layer 111 may include not only tin and lead, but also a tin-copper alloy.

[0093] For example, the first solder strip 201 may be located only within the protrusion 1112, that is, the protrusion 1112 covers the first solder strip 201. Alternatively, the first solder strip 201 may be located within the horizontal portion 1111 and the protrusion 1112, that is, the horizontal portion 1111 and the protrusion 1112 together cover the first solder strip 201.

[0094] Continue to refer to Figure 7 In some examples, along the direction from the horizontal portion 1111 to the protrusion 1112, the area of ​​the closed shape enclosed by the outer contour of the protrusion 1112 gradually decreases.

[0095] Understandably, the protrusion 1112 can cover at least a portion of the first solder strip 201. Along the direction from the horizontal portion 1111 to the protrusion 1112, the area of ​​the closed pattern enclosed by the outer contour of the protrusion 1112 gradually decreases, ensuring the covering effect of the first solder layer 111 on the first solder strip 201, improving the connection reliability between the protrusion 1112 and the horizontal portion 1111, and thus improving the welding reliability of the first solder strip 201 and the busbar assembly 100, reducing the risk of cold solder joints between the first solder strip 201 and the busbar assembly 100.

[0096] Refer again Figure 4 In some examples, the busbar assembly 100 further includes a third solder layer 113 and a fourth solder layer 114. The third solder layer 113 is disposed along a first direction X on one side of the busbar body 115 and is connected to the first solder layer 111 and the second solder layer 112. The fourth solder layer 114 is disposed along the first direction X on the side of the busbar body 115 away from the third solder layer 113 and is connected to the first solder layer 111 and the second solder layer 112.

[0097] The materials of the third solder layer 113 and the fourth solder layer 114 may include tin and lead, or the materials of the third solder layer 113 and the fourth solder layer 114 may also include other metals. The materials of the third solder layer 113 and the fourth solder layer 114 may be the same or different.

[0098] Along the first direction X, the thicknesses of the third solder layer 113 and the fourth solder layer 114 can be the same or different. The embodiments of this application do not further limit the materials and thicknesses of the third solder layer 113 and the fourth solder layer 114.

[0099] By adopting the above configuration, the first solder layer 111, the second solder layer 112, the third solder layer 113 and the fourth solder layer 114 can be arranged along the periphery of the busbar body 115 and cover the busbar body 115, thereby reducing the risk of oxidation of the busbar body 115 and ensuring the conductivity of the busbar body 115.

[0100] In some examples, the ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D4 of the busbar assembly 100 is greater than or equal to 50.

[0101] For example, the ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D4 of the busbar assembly 100 can be 55, 60 or 80, etc. The embodiments of this application do not further limit the ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D4 of the busbar assembly 100.

[0102] The ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D4 of the busbar assembly 100 is set to be greater than or equal to 50. This allows for a larger width of the busbar assembly 100 along the first direction X, which increases the area of ​​the busbar assembly 100 in the XY plane, reduces the stress generated on the solar cell 210 under the compression of the busbar assembly 100, and lowers the risk of the solar cell 210 breaking. Furthermore, this allows for a smaller thickness D4 of the busbar assembly 100, which helps to reduce the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0103] For example, the width H1 of the busbar assembly 100 along the first direction X can be set to twice the width of the original busbar assembly along the first direction X, and the thickness D4 of the busbar assembly 100 can be set to half the thickness of the original busbar assembly.

[0104] This ensures that the cross-sectional area of ​​the busbar assembly 100 in the XZ plane (the plane containing the first direction X and the thickness direction Z of the busbar assembly 100) is equal to the cross-sectional area of ​​the original busbar assembly in the XZ plane. The length of the busbar assembly 100 along the second direction Y is also equal to the length of the original busbar assembly along the second direction Y, thus ensuring that the volume of the busbar assembly 100 is equal to the volume of the original busbar assembly.

[0105] In other words, by adopting the above configuration, the area of ​​the busbar assembly 100 in the XY plane can be increased to twice the area of ​​the original busbar assembly in the XY plane without changing the volume. This helps to reduce the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100 and reduce the risk of the solar cell 210 breaking.

[0106] In some examples, such as Figure 4 As shown, the width H1 of the busbar assembly 100 along the first direction X ranges from 7.95 mm to 10.05 mm.

[0107] For example, the width H1 of the busbar assembly 100 along the first direction X can be 8mm, 9mm or 10mm, etc. The embodiments of this application do not further limit the value of the width H1 of the busbar assembly 100 along the first direction X.

[0108] Setting the width H1 of the busbar assembly 100 along the first direction X to a range of 7.95 mm to 10.05 mm can avoid the width H1 of the busbar assembly 100 along the first direction X being too small (e.g., less than 7.95 mm), ensuring the area of ​​the busbar assembly 100 in the XY plane, which helps to reduce the stress generated by the solar cell 210 under the squeezing action of the busbar assembly 100, and reduces the risk of the solar cell 210 breaking.

[0109] Furthermore, by setting the width H1 of the busbar assembly 100 along the first direction X to a range of 7.95 mm to 10.05 mm, the value of the width H1 of the busbar assembly 100 along the first direction X can be avoided to be too large (for example, greater than 10.05 mm), thereby reducing the impact of the busbar assembly 100 on other components of the photovoltaic module 200.

[0110] Understandably, the embodiments of this application do not further limit the value of the width H2 of the busbar body 115 along the first direction X.

[0111] The dimensions and materials of the busbar assembly 100 in some embodiments of this application are illustrated below.

[0112] In some examples, the width H1 of the busbar assembly 100 along the first direction X can range from 7.95 mm to 8.05 mm, and the thickness D4 of the busbar assembly 100 can range from 0.14 mm to 0.16 mm. The thickness D3 of the busbar body 115 can range from 0.1 mm to 0.12 mm.

[0113] For example, the width H1 of the busbar assembly 100 along the first direction X can be 8 mm, the thickness D3 of the busbar body 115 can be 0.15 mm, and the ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D3 of the busbar body 115 can be 53.33.

[0114] The busbar body 115 can be made of Tu1 grade copper substrate, with a copper content greater than or equal to 99.97%, an oxygen content less than or equal to 0.0002%, and a resistivity less than or equal to 0.017241 Ω×mm² / m (unit: ohm × millimeter square meter / meter). The resistivity of the busbar assembly 100 can be less than or equal to 0.0280 Ω×mm² / m.

[0115] The first solder layer 111 and the second solder layer 112 can be made of tin-lead alloy, wherein the mass percentage of tin can be 60% and the mass percentage of lead can be 40%. The thickness D1 of the first solder layer 111 can range from 25μm to 35μm, and the thickness D2 of the second solder layer 112 can range from 5μm to 15μm. The ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 can be 3:1.

[0116] In other examples, the width H1 of the busbar assembly 100 along the first direction X can range from 9.95 mm to 10.05 mm, and the thickness D4 of the busbar assembly 100 can range from 0.11 mm to 0.13 mm. The thickness D3 of the busbar body 115 can range from 0.07 mm to 0.09 mm.

[0117] For example, the width H1 of the busbar assembly 100 along the first direction X can be 10 mm, the thickness D3 of the busbar body 115 can be 0.12 mm, and the ratio of the width H1 of the busbar assembly 100 along the first direction X to the thickness D3 of the busbar body 115 can be 83.33.

[0118] The busbar body 115 can be made of Tu1 grade copper substrate, with a copper content greater than or equal to 99.97%, an oxygen content less than or equal to 0.0002%, and a resistivity less than or equal to 0.017241 Ω×mm² / m (unit: ohm × millimeter square meter / meter). The resistivity of the busbar assembly 100 can be less than or equal to 0.0280 Ω×mm² / m.

[0119] The first solder layer 111 and the second solder layer 112 can be made of tin-lead alloy, wherein the mass percentage of tin can be 60% and the mass percentage of lead can be 40%. The thickness D1 of the first solder layer 111 can range from 25μm to 35μm, and the thickness D2 of the second solder layer 112 can range from 5μm to 15μm. The ratio of the thickness D1 of the first solder layer 111 to the thickness D2 of the second solder layer 112 can be 3:1.

[0120] Understandably, the busbar assembly 100, busbar body 115, first solder layer 111 and second solder layer 112, etc., may also be other sizes than those described above. The busbar assembly 100 may also include other materials than those described above, and the mass ratio between different materials may also be other ratios than those described above. The embodiments of this application do not further limit this.

[0121] like Figure 2 and Figure 6In some examples, the photovoltaic module 200 also includes an insulating strip 220 disposed between the busbar module 100 and the solar cell 210, the insulating strip 220 comprising an insulating material.

[0122] Understandably, the insulating strip 220 includes insulating material and serves as an insulator. The insulating strip 220 is disposed between the solar cell 210 and the busbar assembly 100, so that the insulating strip 220 can isolate the busbar assembly 100 and the solar cell 210, reducing the risk of short circuit between the busbar assembly 100 and the solar cell 210.

[0123] For example, the orthographic projection of the busbar assembly 100 onto the solar cell 210 can fall within the range of the orthographic projection of the insulating strip 220 onto the solar cell 210, thereby improving the insulation effect of the insulating strip 220 on the solar cell 210 and the busbar assembly 100.

[0124] For example, such as Figure 2 As shown, the insulating strip 220 may include a substrate 223, a first buffer layer 221, and a second buffer layer 222.

[0125] The material of the substrate 223 may include polyethylene terephthalate (PET). Alternatively, the substrate 223 may also include other insulating materials; the embodiments of this application do not further limit the material of the substrate 223.

[0126] The first buffer layer 221 is stacked along the thickness direction of the substrate 223 on one side of the substrate 223. The second buffer layer 222 is stacked along the thickness direction of the substrate 223 on the side of the substrate 223 away from the first buffer layer 221. It can be understood that the thickness direction of the substrate 223 and the thickness direction Z of the busbar body 115 are in the same direction.

[0127] For example, the material of the buffer layer (including the first buffer layer 221 and the second buffer layer 222) may include ethylene vinyl acetate (EVA), or the buffer layer may also include other materials. The embodiments of this application do not further limit the material of the buffer layer. The materials of the first buffer layer 221 and the second buffer layer 222 may be the same or different.

[0128] The first buffer layer 221 and the second buffer layer 222 can absorb the squeezing force exerted by the busbar assembly 100 on the solar cell 210, thus playing a buffering role and reducing the risk of the solar cell 210 breaking.

[0129] Continue to refer to Figure 2In some examples, the photovoltaic module 200 also includes a first cover plate 231 and a first encapsulating film 241. A portion of the first cover plate 231 is attached to the back surface 212 of the solar cell 210 via the first encapsulating film 241.

[0130] The first cover plate 231 may be a glass cover plate. The material of the first adhesive film 241 may include at least one of ethylene vinyl acetate copolymer (EVA) and polyolefin elastomer (POE). The first adhesive film 241 may be a single-layer structure or a multi-layer laminated structure composed of different materials. The embodiments of this application do not further limit the material and specific form of the first adhesive film 241.

[0131] For example, the first cover plate 231 can be attached to the back surface 212 of the busbar assembly 100, the insulating strip 220 and the solar cell 210 by the first adhesive film 241, so that the first cover plate 231 can protect the solar cell 210, the busbar assembly 100, the insulating strip 220 and the solder strips (including the first solder strip 201 and the second solder strip 202).

[0132] like Figure 2 As shown, the photovoltaic module 200 may also include a second cover plate 232 and a second encapsulant film 242, with the second cover plate 232 attached to the light-receiving surface 211 of the solar cell 210 via the second encapsulant film 242.

[0133] The second cover plate 232 can be a glass cover plate. The material of the second adhesive film 242 can include at least one of ethylene vinyl acetate copolymer (EVA) and polyolefin elastomer (POE). The second adhesive film 242 can be a single-layer structure or a multi-layer laminated structure composed of different materials. The embodiments of this application do not further limit the material and specific form of the second adhesive film 242. The material and structure of the first adhesive film 241 can be the same as or different from the material and structure of the second adhesive film 242.

[0134] Understandably, the second cover plate 232 is attached to the light-receiving surface 211 of the solar cell 210 through the second adhesive film 242, so that the second cover plate 232 can protect the solar cell 210 and the solder ribbons (including the first solder ribbon 201 and the second solder ribbon 202).

[0135] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A busbar assembly, characterized in that, For use in photovoltaic modules, the photovoltaic modules including a first solder strip; The busbar assembly includes: Busbar body; The first solder layer is disposed on one side of the busbar body along the thickness direction of the busbar body; The second solder layer is disposed along the thickness direction of the busbar body on the side of the busbar body away from the first solder layer; The first solder layer is used for soldering with the first solder strip, and the thickness of the first solder layer is greater than the thickness of the second solder layer.

2. The busbar assembly according to claim 1, characterized in that, The ratio of the thickness of the first solder layer to the thickness of the second solder layer is greater than or equal to 3.

3. The busbar assembly according to claim 1, characterized in that, The thickness of the first solder layer ranges from 25 micrometers to 45 micrometers.

4. The busbar assembly according to claim 1, characterized in that, The thickness of the second solder layer ranges from 5 micrometers to 15 micrometers.

5. The busbar assembly according to claim 1, characterized in that, The photovoltaic module also includes multiple solar cells, which are arranged in multiple rows along a first direction and in multiple columns along a second direction. The multiple solar cells arranged in a column are connected to form a solar cell string. The busbar assembly is connected to the multiple solar cell strings through the first solder strip. The first direction and the second direction are perpendicular. The ratio of the width of the busbar assembly along the first direction to the thickness of the busbar assembly is greater than or equal to 50.

6. The busbar assembly according to claim 5, characterized in that, Also includes: The third solder layer is disposed on one side of the busbar body along the first direction and is connected to the first solder layer and the second solder layer; The fourth solder layer is disposed along the first direction on the side of the busbar body away from the third solder layer, and is connected to the first solder layer and the second solder layer.

7. The busbar assembly according to claim 5, characterized in that, The width of the busbar assembly along the first direction ranges from 7.95 mm to 10.05 mm.

8. The busbar assembly according to claim 5, characterized in that, The thickness of the busbar body ranges from 0.07 mm to 0.12 mm.

9. The busbar assembly according to any one of claims 1 to 8, characterized in that, The thickness of the busbar assembly ranges from 0.11 mm to 0.16 mm.

10. A photovoltaic module, characterized in that, include: A solar cell includes a light-receiving surface and a back-lighting surface arranged opposite each other along the thickness direction; The busbar assembly as described in any one of claims 1 to 9 is disposed on the side where the back surface of the solar cell is located, and the first solder layer is located on the side of the busbar body away from the solar cell; The first solder strip has one end connected to the light-receiving surface of the solar cell, and the other end of the first solder strip is soldered to the first solder layer.

11. The photovoltaic module according to claim 10, characterized in that, The first solder layer includes a horizontal portion and a protruding portion. The horizontal portion is located on one side of the busbar body, and the protruding portion is located on the side of the busbar body away from the horizontal portion and connected to the horizontal portion. The first solder strip is located inside the protruding portion, or the first solder strip is located inside both the horizontal portion and the protruding portion. Along the direction from the horizontal portion to the protruding portion, the area of ​​the closed shape enclosed by the outer contour of the protruding portion gradually decreases.

12. The photovoltaic module according to claim 10 or 11, characterized in that, Also includes: An insulating strip is disposed between the busbar assembly and the solar cell, the insulating strip comprising an insulating material.

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