Curing device

Abstract

The application relates to a solidification device. When a silicon wafer is deformed due to thermal stress caused by a heating unit, the conveying roller is connected to a floating unit, can float in the vertical direction relative to the mounting base, that is, adaptively adjust the height, adapt to the deformation of the silicon wafer, provide an elastic supporting force through the floating unit, buffer the thermal pressure applied by the first heating module, reduce the risk of broken pieces caused by excessive contact force, and compensate for unevenness or fluctuation in the conveying process, ensure the contact stability of the silicon wafer and the heating unit, and ensure the solidification effect. In addition, the first heating module is driven to be close to or away from the conveying roller through the lifting assembly, the distance between the first heating module and the silicon wafer can be flexibly adjusted, the problem of uneven heating is solved, the slurry can be uniformly heated and solidified, and the solidification quality is ensured.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to curing devices. Background Technology

[0002] Silicon wafers are the core material in the production of photovoltaic cells. Fabricating grid lines is a crucial step in the process. Silicon wafers with grid lines are then assembled into complete photovoltaic modules through subsequent encapsulation and other processes, which are then used in various solar photovoltaic power generation systems.

[0003] One method for fabricating gate lines on silicon wafers is to use a curing device to cure the paste on the gate lines. The curing device is equipped with a heating unit, which heats and cures the paste.

[0004] In related technologies, this type of curing device increases the risk of silicon wafer fragmentation. Utility Model Content

[0005] Therefore, it is necessary to provide a curing device that addresses the high risk of fragmentation associated with existing curing devices.

[0006] A curing apparatus, the curing apparatus comprising:

[0007] The mounting base is equipped with multiple floating units;

[0008] The drive unit includes a drive component and a transmission component connected to the drive component, wherein the transmission component is connected to the floating unit;

[0009] The conveying unit includes a plurality of conveying rollers arranged along the conveying direction; one end of each conveying roller is connected to the transmission assembly along the axial direction, the transmission assembly being used to transmit the rotational power of the drive assembly to the conveying roller; at least a portion of the other ends of each conveying roller along the axial direction are connected to the floating unit, so that both the conveying rollers and the transmission assembly can move relative to the mounting base in the vertical direction.

[0010] A heating unit is connected to the mounting base; the heating unit includes a lifting assembly and a first heating module connected to the lifting assembly, the lifting assembly being used to drive the first heating module closer to or further away from the conveyor roller.

[0011] In one embodiment, the first heating module is configured with a through hole, the opening of which faces the conveying roller.

[0012] In one embodiment, the curing apparatus further includes an air supply component that communicates with the through hole.

[0013] In one embodiment, the floating unit includes a fixed frame, a floating seat, and an elastic element; the fixed frame has an inner cavity, at least a portion of which is located within the inner cavity; the elastic element is connected between the floating seat and the cavity wall; the floating seat is rotatably connected to the transmission assembly or the conveying roller.

[0014] In one embodiment, the fixed frame is further provided with a guide member, and the floating seat is slidably connected to the guide member.

[0015] In one embodiment, the fixed frame is configured with a positioning part, the guide is configured as a guide shaft, the guide shaft is engaged with the positioning part, and the elastic element is sleeved on the guide shaft.

[0016] In one embodiment, the floating unit further includes a first limiting member connected to the fixed frame, the first limiting member having a limiting protrusion for abutting against the guide shaft.

[0017] In one embodiment, the floating unit further includes a second limiting member connected to the fixed frame and located between the floating seat and the inner cavity wall.

[0018] In one embodiment, the transmission assembly includes a transmission shaft, a plurality of slave transmission components, and a plurality of master transmission components sleeved on the transmission shaft; the transmission shaft is connected to the drive assembly and rotatably connected to the floating unit.

[0019] The multiple main drive components and the multiple slave drive components are connected in a one-to-one transmission connection; the multiple slave drive components are connected in a one-to-one connection with the multiple conveying rollers.

[0020] In one embodiment, the main transmission component is a first helical gear, the driven component is a second helical gear, the first helical gear and the second helical gear mesh and drive each other, and the axial directions of the first helical gear and the second helical gear intersect.

[0021] In one embodiment, a buffer is connected between the lifting assembly and the first heating module.

[0022] In one embodiment, the curing apparatus further includes a leveling member connected to the first heating module, the leveling member being used to adjust the levelness of the first heating module.

[0023] In one embodiment, the lifting assembly includes a lifting drive, a first transmission module, and a first lifting module. The lifting drive is connected to the first transmission module, the first transmission module is connected to the first lifting module, and the first heating module is connected to the first lifting module.

[0024] In one embodiment, the heating unit further includes a plurality of second heating modules connected to the mounting base, the second heating modules being located on one side of the conveying roller along the conveying direction; the second heating modules and the first heating modules are spaced apart along the vertical direction.

[0025] Taking the curing of slurry on a silicon wafer as an example, the aforementioned curing device, when the silicon wafer deforms due to thermal stress from being heated by the heating unit, allows the conveying rollers, connected to the floating unit, to float vertically relative to the mounting base. This adaptively adjusts the height to accommodate the wafer's deformation. The floating unit provides elastic support to buffer the thermal pressure applied by the first heating module, reducing the risk of breakage due to excessive contact force. It also compensates for unevenness or fluctuations during transport, ensuring stable contact between the silicon wafer and the heating unit and guaranteeing the curing effect. Furthermore, by using a lifting assembly to move the first heating module closer to or further away from the conveying rollers, the distance between the first heating module and the silicon wafer can be flexibly adjusted, thus solving the problem of uneven heating and ensuring uniform curing of the slurry, guaranteeing curing quality. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a perspective view of a curing apparatus provided in an embodiment of this application.

[0028] Figure 2 for Figure 1 A magnified view of point A in the curing apparatus shown.

[0029] Figure 3 for Figure 1 A top view of the curing apparatus shown.

[0030] Figure 4 for Figure 1 Left view of the curing apparatus shown.

[0031] Figure 5 for Figure 4A schematic diagram of the floating unit in the curing device shown.

[0032] Figure 6 for Figure 5 An exploded view of the floating unit in the curing apparatus shown.

[0033] Figure 7 for Figure 1 A schematic diagram of the heating unit in the curing apparatus shown.

[0034] Figure 8 for Figure 7 A bottom view of the heating unit in the curing apparatus shown.

[0035] Figure 9 for Figure 7 Side view of the curing apparatus shown.

[0036] Figure 10 for Figure 1 A schematic diagram of the conveying unit in the curing apparatus shown.

[0037] Reference numerals: 100, Mounting base; 200, Floating unit; 210, Fixed frame; 211, Inner cavity; 212, Positioning part; 220, Floating seat; 230, Elastic element; 240, Guide element; 250, First limiting element; 251, Limiting protrusion; 260, Second limiting element; 310, Drive assembly; 320, Transmission assembly; 321, Drive shaft; 322, Main transmission element; 323, Slave transmission element; 330, Universal joint coupling 400, Conveying unit; 410, Conveying roller; 500, Heating unit; 510, Lifting assembly; 511, Lifting drive component; 512, First transmission module; 513, First lifting module; 514, First guide module; 515, Adapter plate; 520, First heating module; 521, Through hole; 530, Buffer component; 540, Horizontal adjustment component; 550, Second heating module; 560, Insulation layer; 600, Air supply assembly. Detailed Implementation

[0038] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0044] As mentioned in the background section, in the prior art, a curing apparatus is generally used to cure the paste on the grid lines. The curing apparatus includes a rigid roller for supporting the silicon wafer and a heating unit for hot-pressing the silicon wafer. The inventors of this application have discovered that when the silicon wafer deforms due to heat, for example, the contact force between the upward-facing area of ​​the silicon wafer and the heating unit increases, for example, exceeding 20N, which exceeds the yield strength limit of the silicon wafer, thus causing problems such as fragmentation.

[0045] Based on this, one embodiment of this application provides a curing apparatus that can mitigate the risk of fragmentation during the hot pressing process. The curing apparatus provided in one embodiment of this application will now be described in detail with reference to the accompanying drawings.

[0046] Figure 1 This is a perspective view of a curing apparatus provided in an embodiment of this application. (See attached image.) Figure 1 As shown, a curing apparatus provided in one embodiment of this application includes a mounting base 100, a drive unit, a conveying unit 400, and a heating unit 500. The mounting base 100 is provided with a plurality of floating units 200. The drive unit includes a drive assembly 310 and a transmission assembly 320 connected to the drive assembly 310, and the transmission assembly 320 is connected to the floating units 200. The conveying unit 400 includes a plurality of conveying rollers 410 arranged along the conveying direction. One end of the conveying roller 410 along the axial direction is connected to the transmission assembly 320, and the transmission assembly 320 is used to transmit the rotational power of the drive assembly 310 to the heating unit 500. The conveyor rollers 410 enable multiple conveyor rollers 410 to rotate around their own axes, thereby conveying the conveyed components such as silicon wafers; at least some of the conveyor rollers 410 are connected to the other end of the axial direction to the floating unit 200, so that both the conveyor rollers 410 and the transmission assembly 320 can move vertically relative to the mounting base 100; the heating unit 500 is connected to the mounting base 100; the heating unit 500 includes a lifting assembly 510 and a first heating module 520 connected to the lifting assembly 510, the lifting assembly 510 being used to drive the first heating module 520 closer to or further away from the conveyor rollers 410.

[0047] Taking the curing of slurry on a silicon wafer as an example, the aforementioned curing apparatus uses a conveying unit 400 to transport the silicon wafer coated with slurry to below the heating unit 500. A lifting assembly 510 drives the first heating module 520 to descend, bringing it into contact with the silicon wafer and heating and curing the slurry on the wafer. During this process, when the silicon wafer deforms due to thermal stress from the heating unit 500, the conveying roller 410, connected to the floating unit 200, can float vertically relative to the mounting base 100, adaptively adjusting its height to accommodate the wafer's deformation. The floating unit 200 provides elastic support to buffer and absorb the thermal pressure applied by the first heating module 520, reducing the risk of breakage due to excessive contact force. It also compensates for unevenness or fluctuations during transport, ensuring stable contact between the silicon wafer and the heating unit 500 and guaranteeing the curing effect. In addition, by driving the first heating module 520 closer to or further away from the conveying roller 410 through the lifting component 510, the distance between the first heating module 520 and the silicon wafer can be flexibly adjusted, thereby solving the problem of uneven heating, ensuring that the slurry can be heated and cured evenly, and guaranteeing the curing quality.

[0048] Figure 10 for Figure 1 A schematic diagram of the conveying unit 400 in the curing apparatus shown. Figure 10 In the embodiment shown in the accompanying drawings, assuming the conveying direction is from left to right, the two leftmost conveying rollers 410 and the two rightmost conveying rollers 410 can be directly rotatably mounted on the mounting base 100, that is, without connecting to the floating unit 200. The conveying rollers 410 at this position serve as a transition. When the silicon wafer is located on the conveying roller 410 at this position, it is not directly below the heating unit 500, that is, it is not in the heating and curing area. Therefore, the floating unit 200 can be omitted, and the conveying rollers 410 only serve a conveying function. Of course, in other embodiments, the floating unit 200 can also be connected to each conveying roller 410.

[0049] Figure 7 for Figure 1 A schematic diagram of the heating unit 500 in the curing apparatus shown. Figure 8 for Figure 7 A bottom view of the heating unit 500 in the curing apparatus shown. (See also...) Figure 7 and Figure 8 As shown, in one embodiment, the first heating module 520 is configured with a through hole 521, the opening of which faces the conveying roller 410. By providing the through hole 521 in the first heating module 520, negative pressure is prevented from forming between the silicon wafer and the first heating module 520, thereby preventing the risk of the silicon wafer being negatively attracted to the first heating module 520 when it is raised, and reducing the risk of fragmentation caused by the silicon wafer falling.

[0050] In some embodiments, multiple through holes 521 can be provided, and the multiple through holes 521 can be evenly distributed at intervals on the first heating module 520 to reduce the possibility of the silicon wafer being attracted by negative pressure. In some embodiments, the through holes 521 can penetrate the first heating module 520 in a vertical direction, that is, the axis of the through hole 521 is parallel to the vertical direction. In some embodiments, the through holes 521 can also penetrate the first heating module 520 in an inclined direction, that is, the axis of the through hole 521 forms an angle with the vertical direction.

[0051] See Figure 1 and Figure 8 As shown, in one embodiment, the curing apparatus further includes a gas supply component 600, which communicates with the through-hole 521. In some embodiments, when the first heating module 520 is about to rise, the gas supply component 600 blows a protective gas, such as nitrogen, onto the silicon wafer through the through-hole 521. This not only prevents the silicon wafer from adhering to the first heating module 520 but also provides an anti-oxidation effect. In some embodiments, the gas supply component 600 may include a gas source and a delivery pipe. One end of the delivery pipe is connected to the gas source, and the other end is connected to the through-hole 521, thereby delivering gas to the through-hole 521 and blowing it out through the through-hole 521. The gas source may be a compressed air cylinder, an air compressor, or other gas storage and supply equipment.

[0052] In some embodiments, the gas supply assembly 600 further includes a gas distributor comprising a plurality of output branches, each output branch being connected to a through-hole 521 in a one-to-one correspondence, thereby delivering gas to each through-hole 521 through the plurality of output branches. In some embodiments, the gas supply assembly 600 may further include a flow control module for precisely controlling the gas flow rate blown onto the silicon wafer. In some embodiments, the gas supply assembly 600 may further include a pressure regulating module for regulating the gas output pressure to ensure that the gas is blown onto the silicon wafer at an appropriate pressure.

[0053] In some embodiments, the first heating module 520 may be a heating element, a heating tube, or a heating rod, etc. (See also...) Figure 7 As shown, in some embodiments, the first heating module 520 is covered with an insulation layer 560, which effectively reduces the transfer of heat to the external environment and reduces energy waste. In some embodiments, the first heating module 520 is also provided with a shell, which can be made of stainless steel. The shell provides physical protection for the first heating module 520, preventing it from being hit or squeezed by external objects and from the intrusion of impurities such as dust and moisture.

[0054] Figure 2 for Figure 1 A magnified view of point A in the curing apparatus shown. Figure 3 for Figure 1 A top view of the curing apparatus shown. (See also...) Figures 2 to 3 As shown, in one embodiment, the transmission assembly 320 includes a transmission shaft 321, a plurality of driven components 323, and a plurality of main transmission components 322 sleeved on the transmission shaft 321. The transmission shaft 321 is connected to the drive assembly 310 and rotatably connected to the floating unit 200. The plurality of main transmission components 322 and the plurality of driven components 323 are connected in a one-to-one transmission connection. The plurality of driven components 323 are connected in a one-to-one connection to the plurality of conveying rollers 410. The rotational power of the drive assembly 310 is transmitted to the main transmission components 322 through the transmission shaft 321, and then to the driven components 323, thereby driving the conveying rollers 410 to rotate. With this configuration, the movement of the plurality of conveying rollers 410 can be achieved with only one transmission shaft 321 and one drive assembly 310.

[0055] See Figures 2 to 3 As shown, in one embodiment, the main drive component 322 is a first helical gear, and the driven component 323 is a second helical gear. The first and second helical gears mesh and drive each other, and their axial directions intersect. With this arrangement, even if the conveyor roller 410 expands due to heat, causing the second helical gear to extend adaptively, the meshing transmission effect of the first and second helical gears can be guaranteed, thereby ensuring the stability of the rotational power transmission to the conveyor roller 410 and reducing the risk of jamming. In some embodiments, both the first and second helical gears can be 45-degree helical gears. In some embodiments, the conveyor roller 410 has a 0.6 mm telescopic space along its own axial direction, meaning that the deformed conveyor roller 410 can extend or retract by 0.6 mm.

[0056] In some embodiments, the conveying roller 410 can be rotatably connected to the mounting base 100 via a bearing. That is, the mounting base 100 is provided with a plurality of mounting grooves, the outer ring of the bearing is connected to the groove wall of the mounting groove, and the inner ring of the bearing is rotatably connected to the conveying roller 410.

[0057] In other embodiments, the transmission assembly 320 may include a transmission belt that is connected to a plurality of conveying rollers 410, for example, by frictional transmission. The drive assembly 310 drives the transmission belt to reciprocate along the conveying direction, and the transmission belt drives the plurality of conveying rollers 410 to rotate synchronously to realize the conveying operation.

[0058] Figure 4 for Figure 1 Left view of the curing apparatus shown. Figure 5 for Figure 4 A schematic diagram of the floating unit 200 in the curing device shown. Figure 6 for Figure 5 An exploded view of the floating unit 200 in the curing apparatus shown. (See attached image.) Figures 4 to 6As shown, in one embodiment, the floating unit 200 includes a fixed frame 210, a floating seat 220, and an elastic member 230. The fixed frame 210 has an inner cavity 211, and at least a portion of the floating seat 220 is located within the inner cavity 211. By having the floating seat 220 at least partially located within the inner cavity 211 of the fixed frame 210, the space occupied by both is reduced. The elastic member 230 is connected between the floating seat 220 and the cavity wall of the inner cavity 211, such as the bottom wall of the inner cavity 211. The floating seat 220 is used for rotatable connection with the transmission assembly 320 or the conveying roller 410.

[0059] Understandably, before the conveyor roller 410 contacts the silicon wafer, the elastic element 230 can be in a compressed state. That is, under the gravity of the conveyor roller 410 or the transmission assembly 320, the floating seat 220 will move downward, thereby compressing the elastic element 230, so that the elastic element 230 can provide a certain supporting force to the conveyor roller 410 and offset the weight of the conveyor roller 410 itself. When the conveyor roller 410 contacts the silicon wafer, the compression of the elastic element 230 further increases. In some embodiments, the floating seat 220 can be a bearing seat, with a bearing mounted on the conveyor roller 410 or the transmission shaft 321, and the bearing installed in the bearing seat. In some embodiments, the floating seat 220 is approximately U-shaped, with its protrusion located at the bottom. The protrusion maintains a certain vertical gap between the floating seat 220 and the cavity wall of the inner cavity 211, which can prevent the elastic element 230 from failing.

[0060] Understandably, silicon wafers of different thicknesses have different yield strengths. Therefore, the compression amount of the elastic element 230 can be controlled according to the corresponding thickness of the silicon wafer, thereby controlling the elastic support force of the elastic element 230 to keep the silicon wafer contact force between 10N and 15N, making it lower than the critical breaking force and reducing the risk of fragmentation. In some embodiments, the elastic element 230 can be a high-temperature resistant spring.

[0061] See Figures 4 to 6 As shown, in one embodiment, the fixed frame 210 is further provided with a guide member 240, and the floating seat 220 is slidably connected to the guide member 240. By providing the guide member 240, the movement of the floating seat 220 is guided, making the movement direction of the floating seat 220 more controllable.

[0062] See Figures 4 to 6 As shown, in one embodiment, the fixing frame 210 is configured with a positioning part 212, the guide member 240 is configured as a guide shaft, the guide shaft is engaged with the positioning part 212, and the elastic member 230 is sleeved on the guide shaft. The positioning part 212 positions the guide member 240, ensuring the reliability of the guide member 240's fixation. In some embodiments, the positioning part 212 can be a positioning groove with one end open, and the guide shaft can be engaged in the positioning groove through the opening.

[0063] See Figures 4 to 6 As shown, in one embodiment, the floating unit 200 further includes a first limiting member 250, which is connected to the fixed frame 210. For example, in the embodiment shown in the figures, both the first limiting member 250 and the fixed frame 210 are provided with connecting holes. Fasteners, such as screws, can be used to pass through the connecting holes to fix the two together. The first limiting member 250 has a limiting protrusion 251, which abuts against the guide shaft. The limiting protrusion 251 closes the opening of the positioning groove, thereby preventing the guide shaft from detaching from the fixed frame 210.

[0064] See Figures 4 to 6 As shown, in one embodiment, the floating unit 200 further includes a second limiting member 260, which is connected to the fixed frame 210 and located between the floating seat 220 and the cavity wall of the inner cavity 211. The upper end of the elastic member 230 abuts against the lower end of the floating seat 220, and the lower end of the elastic member 230 abuts against the upper end of the second limiting member 260. The second limiting member 260 and the floating seat 220 cooperate to limit the elastic member 230, ensuring the reliability of the floating support. Simultaneously, by adjusting the installation height of the second limiting member 260, the initial deformation of the elastic member 230 can be controlled, thereby controlling the initial supporting force of the elastic member 230, thus adapting to silicon wafers of different thicknesses or sizes.

[0065] Figure 9 for Figure 7 Side view of the curing apparatus shown. (See also...) Figure 9 As shown, in one embodiment, a buffer 530 is connected between the lifting assembly 510 and the first heating module 520. By providing the buffer 530, installation and movement errors can be compensated for, and impact forces can be buffered, reducing vibration transmission. In some embodiments, the buffer 530 can be an elastic element 230, such as a spring, rubber, or a pneumatic buffer 530.

[0066] See Figure 7As shown, in one embodiment, the lifting assembly 510 includes a lifting drive component 511, a first transmission module 512, and a first lifting module 513. The lifting drive component 511 is connected to the first transmission module 512, the first transmission module 512 is connected to the first lifting module 513, and the first heating module 520 is connected to the first lifting module 513. The lifting drive component 511 and the first transmission module can be arranged horizontally. The power of the lifting drive component 511 is transmitted to the first lifting module 513 through the first transmission module, which can reduce the space occupied by the lifting assembly 510 in the vertical direction. For example, in the embodiment shown in the figures, the lifting drive component 511 can be a horizontally arranged rotary drive component such as a motor, the first transmission module can be a worm gear structure or a gear transmission structure, and the first lifting module can be a lead screw and nut mechanism.

[0067] See Figure 7 As shown, in some embodiments, the output end of the first lifting module 513 can be connected to an adapter plate 515, which is connected to the first heating module 520. The first lifting module 513 drives the adapter plate 515 to rise or fall, causing the first heating module 520 to move synchronously. In some embodiments, a first guide module 514 is provided on the mounting base 100. The first guide module 514 can be a guide rail slider mechanism, with the adapter plate 515 connected to the slider. The guide rail slider mechanism guides the lifting and lowering movement of the adapter plate 515, i.e., the first heating module 520.

[0068] like Figure 4 As shown, in some embodiments, the drive assembly 310 may include a main drive component, which is a rotary drive component. The main drive component and the aforementioned transmission shaft 321 can be connected via a universal joint coupling 330. The universal joint coupling 330 allows for a certain angular deviation and axial displacement between the output shaft of the rotary drive component and the transmission shaft 321. This avoids the situation where the power gets stuck after the floating roller and the transmission shaft 321 are displaced, ensuring the stability of the power output. In some embodiments, the rotary drive component can be a motor, which is connected to the transmission shaft 321 via the universal joint coupling 330, thereby transmitting rotational power to the universal joint coupling 330 and then to the transmission shaft 321.

[0069] In some embodiments, the drive assembly 310 may further include a second transmission module, with the main drive component connected to the second transmission module. The output end of the second transmission module is connected to the drive shaft 321 via a universal joint coupling 330, and the main drive component transmits rotational power to the drive shaft 321 through the second transmission module. This configuration allows the main drive component to be arranged on the same side as the drive shaft 321, thereby reducing the space occupied by the curing device along the conveying direction.

[0070] In some embodiments, the second transmission module can be a gear transmission module, such as a bevel gear module composed of two bevel gears, or a helical gear module composed of two meshing helical gears. In some embodiments, the second transmission module can also be a belt transmission module, or a worm gear transmission module, etc. The specific structure can be referred to the prior art, and will not be described in detail here. Of course, the number of second transmission modules can be set according to actual needs. For example, the number of second transmission modules is two, and the two second transmission modules are arranged sequentially between the main drive member and the transmission shaft 321. The main drive member can be arranged along the direction of gravity, and its output end is connected to one of the second transmission modules, such as a bevel gear module, thereby converting the rotational power of the main drive member in the vertical direction into rotational power in the conveying direction; then, through the other second transmission module, such as a belt transmission module, the rotational power on one side is transmitted to the transmission shaft 321 on the other side.

[0071] See Figure 7 As shown, in one embodiment, the curing apparatus further includes a horizontal adjustment member 540 connected to the first heating module 520. The horizontal adjustment member 540 is used to adjust the horizontality of the first heating module 520. By adjusting the horizontality of the first heating module 520, the parallelism between the first heating module 520 and the silicon wafer is ensured, thereby ensuring the heating uniformity of the silicon wafer. In some embodiments, the horizontal adjustment member 540 can be an adjusting screw, one end of which is connected to the aforementioned adapter plate 515, and the other end is threaded to the first heating module 520. By rotating the adjusting screw, the first heating module 520 can be moved up or down. Understandably, multiple horizontal adjustment members 540 can be provided, and the multiple horizontal adjustment members 540 are evenly distributed around the first heating module 520 at intervals.

[0072] See Figure 10 As shown, in one embodiment, the heating unit 500 further includes a plurality of second heating modules 550 connected to the mounting base 100. The second heating modules 550 are located on one side of the conveying roller 410 along the conveying direction; the second heating modules 550 and the first heating module 520 are spaced apart in the vertical direction. That is, the first heating module 520 is used to cure the paste on the upper surface of the silicon wafer, and the second heating module 550 is used to cure the paste on the lower surface of the silicon wafer, so that the silicon wafer is heated evenly, which is beneficial to improving the curing quality of the gate lines. In some embodiments, the second heating module 550 can be a cast copper heater, which has high heating efficiency and good temperature uniformity.

[0073] Taking the curing device described above, with a vertical distance of 2 mm between the first heating module 520 and the conveying roller 410 as an example, the first heating module 520 and the second heating module 550 are preheated to a preset temperature, for example, 320 degrees Celsius, and the temperature remains stable. Before the silicon wafer enters the conveying roller 410 and the heating unit 500, the gas supply component 600 can blow out nitrogen gas to prevent oxidation. When the silicon wafer enters directly below the heating unit 500, for example, when the center of the silicon wafer is basically collinear with the center of the heating unit 500, the drive component 310 stops moving, and the conveying roller 410 stops conveying. The lifting component 510 drives the first heating module 520 to move downward by 3 mm. Under the action of the floating unit 200, the conveying roller 410 and the silicon wafer move downward by 1 mm as a whole. At this time, the silicon wafer is subjected to an elastic support force of approximately 14 N provided by the floating unit 200, i.e., the elastic element 230. After a preset heating time, such as 7 seconds, the lifting assembly 510 moves the first heating module 520 upward by 3 mm, and the conveying roller 410 connected to the floating unit 200 returns to its original position. One second before the lifting assembly 510 stops moving upward, a protective gas, such as nitrogen, can be introduced through the gas supply assembly 600 to prevent the silicon wafer from adhering to the first heating module 520. Then, the drive assembly 310 and the transmission assembly 320 continue to operate, causing the silicon wafer to leave the heating zone.

[0074] During this curing process, when the silicon wafer is heated and deformed, for example, when the contact force between the heated area and the first heating module 520 increases, the direction of the contact force is downward. Since the conveying roller 410 is connected to the floating unit 200, the conveying roller 410 and the silicon wafer can be adaptively moved downward, that is, the height is adaptively adjusted to prevent the deformed area from being subjected to a large contact force and reduce the risk of fragmentation caused by excessive contact force.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A curing device, characterized in that, The curing device includes: The mounting base (100) is provided with multiple floating units (200); The drive unit includes a drive assembly (310) and a transmission assembly (320) connected to the drive assembly (310), and the transmission assembly (320) is connected to the floating unit (200); The conveying unit (400) includes a plurality of conveying rollers (410) arranged along the conveying direction; one axial end of each conveying roller (410) is connected to the transmission assembly (320), which transmits the rotational power of the drive assembly (310) to the conveying roller (410); at least a portion of the other axial end of each conveying roller (410) is connected to the floating unit (200) so that both the conveying roller (410) and the transmission assembly (320) are movable relative to the mounting base (100) in the vertical direction. A heating unit (500) is connected to the mounting base (100); the heating unit (500) includes a lifting assembly (510) and a first heating module (520) connected to the lifting assembly (510), the lifting assembly (510) being used to drive the first heating module (520) closer to or further away from the conveying roller (410).

2. The curing apparatus according to claim 1, characterized in that, The first heating module (520) is configured with a through hole (521) with the opening of the through hole (521) facing the conveying roller (410).

3. The curing apparatus according to claim 2, characterized in that, The curing device further includes an air supply component (600) which is connected to the through hole (521).

4. The curing apparatus according to claim 1, characterized in that, The floating unit (200) includes a fixed frame (210), a floating seat (220), and an elastic element (230); The fixed frame (210) has an inner cavity (211), at least a portion of which is located in the inner cavity (211); the floating seat (220) is rotatably connected to the transmission assembly (320) or the conveying roller (410); the elastic element (230) is connected between the floating seat (220) and the cavity wall of the inner cavity (211).

5. The curing apparatus according to claim 4, characterized in that, The fixed frame (210) is also provided with a guide (240), and the floating seat (220) is slidably connected to the guide (240).

6. The curing apparatus according to claim 5, characterized in that, The fixed frame (210) is configured with a positioning part (212), the guide member (240) is configured as a guide shaft, the guide shaft is engaged with the positioning part (212), and the elastic member (230) is sleeved on the guide shaft.

7. The curing apparatus according to claim 6, characterized in that, The floating unit (200) further includes a first limiting member (250), which is connected to the fixed frame (210). The first limiting member (250) has a limiting protrusion (251) for abutting against the guide shaft. And / or, the floating unit (200) further includes a second limiting member (260), which is connected to the fixed frame (210) and is located between the floating seat (220) and the cavity wall of the inner cavity (211).

8. The curing apparatus according to claim 1, characterized in that, The transmission assembly (320) includes a transmission shaft (321), a plurality of slave transmission components (323), and a plurality of master transmission components (322) sleeved on the transmission shaft (321); the transmission shaft (321) is connected to the drive assembly (310) and rotatably connected to the floating unit (200); The multiple main drive components (322) and multiple slave drive components (323) are connected in a one-to-one transmission connection; the multiple slave drive components (323) are connected in a one-to-one connection with the multiple conveying rollers (410).

9. The curing apparatus according to claim 8, characterized in that, The main transmission component (322) is a first helical gear, and the driven component (323) is a second helical gear. The first helical gear and the second helical gear mesh and transmit power, and the axial directions of the first helical gear and the second helical gear intersect.

10. The curing apparatus according to claim 1, characterized in that, A buffer (530) is connected between the lifting assembly (510) and the first heating module (520); And / or, the curing apparatus further includes a leveling member (540) connected to the first heating module (520), the leveling member (540) being used to adjust the levelness of the first heating module (520); And / or, the lifting assembly (510) includes a lifting drive (511), a first transmission module (512) and a first lifting module (513), wherein the lifting drive (511) is connected to the first transmission module (512), the first transmission module (512) is connected to the first lifting module (513), and the first heating module (520) is connected to the first lifting module (513); And / or, the heating unit (500) further includes a plurality of second heating modules (550) connected to the mounting base (100), the second heating modules (550) being located on one side of the conveying roller (410) along the conveying direction; the second heating modules (550) and the first heating modules (520) are spaced apart along the vertical direction.

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