A solder ball type LED packaging support and LED lamp bead

Abstract

The utility model discloses a kind of solder ball type LED packaging support and LED lamp pearl, it is related to LED packaging technical field, the utility model is arranged by multiple first solder ball in the partition arrangement of substrate, fill white glue between the sidewall of bowl cup and first barrier body, utilize first barrier body to block white glue flow to the LED chip of carrier area, avoid the local shielding of chip caused by colloid overflow to LED chip surface, ensure the light efficiency and yield of product.The first solder ball utilizes surface tension effect to carry out resistance flow, and the fluctuation of spraying or point gluing process of adding white glue has better inclusiveness.Even if there is a small amount of colloid overflow, as long as not touching chip, it is still qualified, which reduces the difficulty of production process and the harsh requirement to equipment precision, improves production yield and efficiency.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to a solder ball type LED packaging bracket and LED beads. Background Technology

[0002] As a key substrate structure for LED chip packaging, the LED packaging bracket primarily undertakes functions such as chip fixation, electrical connection, heat dissipation, and mechanical support. Existing LED packaging brackets lack a partition structure that can flexibly divide the internal space of the cup as needed, leading to at least the following problems: 1. When applying white glue to the cup sidewalls or isolation zone area of ​​the bracket using spraying or dispensing equipment, insufficient glue flow or process control can easily cause glue overflow onto the LED chip surface, resulting in localized chip shading, which in turn affects light extraction efficiency and product yield, creating packaging defects. 2. Because the cup lacks a partition structure, it is impossible to fill the cup with multiple phosphors in a partitioned manner. Summary of the Invention

[0003] The purpose of this utility model is to provide a solder ball type LED packaging bracket and LED beads, which aims to overcome the above-mentioned problems existing in the prior art.

[0004] To achieve this objective, the present invention provides the following technical solution: A solder ball type LED packaging bracket includes a bracket body with a cup-shaped support. The bottom of the cup has multiple substrate partitions and at least one isolation strip. Each substrate partition has a carrier area for mounting LED chips. The bracket also includes a first barrier. The surface of each substrate partition is a solderable surface, and at least one first barrier is provided on each substrate partition to block white glue or phosphor. The first barrier includes multiple first solder balls arranged in the substrate partition. Furthermore, the first barrier is used to prevent the white glue from flowing to the LED chip in the carrier area when the white glue is filled between the side wall of the bowl and the first barrier.

[0005] Furthermore, the two adjacent first solder balls are spaced apart from each other.

[0006] Furthermore, the first solder ball includes a first solder ball body and a first tail line, wherein the first tail line extends vertically upward or extends obliquely toward the side wall of the bowl / cup.

[0007] Furthermore, the gap between two adjacent first tail lines is less than or equal to 45 μm.

[0008] Furthermore, the length of the first tail wire is 20um-70um.

[0009] Furthermore, the substrate partition is provided with at least one second barrier for blocking white glue or phosphor, the second barrier being composed of a plurality of second solder balls arranged at intervals in the substrate partition.

[0010] Furthermore, the aforementioned second barrier is used to prevent the white glue from flowing to the LED chip in the carrier area when white glue is filled between the isolation strip and the second barrier.

[0011] Furthermore, the isolation strip protrudes upward from the substrate partition; the second solder ball includes a second solder ball body and a second tail line, the first tail line extending vertically upward or extending obliquely toward the isolation strip.

[0012] An LED bead includes at least one LED chip and a solder ball type LED package bracket with the structure described above, wherein the LED chip is fixed in the substrate area.

[0013] An LED bead includes at least one LED chip and a solder ball type LED package bracket with the structure described above. The LED chip is fixed in the carrier area. After the white glue filling the side wall of the cup and the first barrier is cured, a first white glue layer with a first reflective surface is formed. After the white glue filling the spacer and the second barrier is cured, a second white glue layer with a second reflective surface is formed.

[0014] An LED bead includes at least one LED chip and a solder ball type LED package bracket with the structure described above, wherein the LED chip is fixed in a carrier area; a first phosphor layer is filled inside one partition surrounded by a first barrier and a second barrier, and a second phosphor layer is filled inside the other partition surrounded by the first barrier and the second barrier.

[0015] Compared with the prior art, this utility model has the following advantages: Firstly, this invention constructs a first barrier by arranging multiple first solder balls in a partitioned manner on the substrate. This first barrier is used to block white glue or phosphor. Specifically, the first barrier can be used to block white glue, preventing it from overflowing onto the LED chip surface and causing partial chip shading, thus ensuring the light output efficiency and yield of the product. Alternatively, the first barrier can be used to fill various phosphors in a partitioned manner inside the cup. The first solder balls utilize surface tension effect to impede flow, providing better tolerance for fluctuations in the spraying or dispensing process (such as slight excess glue or slight viscosity changes). Taking the blocking of white glue as an example, even if a small amount of white glue overflows, as long as the white glue does not touch the chip, it is still acceptable. This reduces the difficulty of the production process and the stringent requirements for equipment precision, improving production yield and efficiency.

[0016] Secondly, because the metal surface of the first (or second) solder ball has a high reflectivity to light, it can act as a miniature reflector, reflecting light incident to the side a second time, causing more of it to be emitted forward. This reduces the absorption loss of light energy within the cup and helps improve the overall light extraction efficiency. The orderly arranged array of solder balls helps to make the reflected light field more uniform, improve the consistency of light output, and reduce optical defects such as glare or zebra stripes.

[0017] Thirdly, in this invention, multiple first solder balls form a stable three-dimensional anchoring structure. The subsequently filled white glue and phosphor layer encapsulate and penetrate the gaps between the solder balls, forming a mechanical interlocking effect after curing. This significantly increases the contact area and bonding force between the white glue layer, phosphor layer, and substrate partitions, effectively preventing cracking and detachment of the glue layer due to thermal expansion and contraction or external impact. Furthermore, the first solder balls, formed from solders such as tin alloys, gold-silver alloys, nickel-based alloys, or copper-based alloys, possess a certain degree of plastic deformation capability. When the packaging structure generates internal stress due to thermal cycling, the first solder balls can absorb and release the stress through their own plastic yielding, effectively mitigating stress concentration caused by the mismatch in thermal expansion coefficients between different materials, thereby protecting the LED chip and its solder joint interface and improving the reliability of the packaging.

[0018] Fourthly, in this invention, the first solder balls are typically formed from solders such as tin alloys, gold-silver alloys, nickel-based alloys, or copper-based alloys, which have good thermal conductivity. They can serve as an additional, distributed heat conduction path, more efficiently transferring the heat generated by the LED chip during operation to the underlying support body (substrate), thereby reducing the chip's junction temperature, improving the LED's luminous efficacy stability, and extending its lifespan. This is particularly important for high-power LED packaging.

[0019] Fifth, when two adjacent first solder balls (or second solder balls) are spaced apart, the narrow gap formed by the spacing can utilize the surface tension effect of the fluid to create a controllable liquid sealing barrier, thereby achieving efficient and reliable adhesive blocking function, while also having a higher tolerance for process fluctuations. Secondly, the spaced first solder balls (or second solder balls) and the cured white adhesive better form a three-dimensional mechanical interlocking structure, greatly enhancing the interfacial bonding force, effectively preventing adhesive layer delamination, and the gap also facilitates air expulsion during dispensing, ensuring dense and bubble-free adhesive filling. Furthermore, this design saves material costs and improves the reliability of the package during thermal cycling by dispersing stress.

[0020] Sixth, in this utility model, the tail line structure has positive functions. Taking the first tail line formed by the first solder ball as an example: the first tail line effectively increases the overall height of the first solder ball, thereby constructing a taller first barrier and enhancing its blocking ability against white glue or phosphor. Simultaneously, by purposefully setting the extension direction and / or length of the first tail line, the leveling and accumulation morphology of the white glue or phosphor can be guided and controlled. Taking white glue as an example, the first white glue layer formed after curing has different contour shapes, especially the first reflective surface of the first white glue layer can be controlled to have different tilt angles to meet specific light emission distribution requirements. Attached Figure Description

[0021] Figure 1 This is a top view of Embodiment 1 of the solder ball type LED packaging bracket in this utility model.

[0022] Figure 2 In this utility model, the first embodiment of the solder ball type LED packaging bracket follows... Figure 1 A schematic diagram of the cross-section at position AA. The first solder ball is not shown in the diagram.

[0023] Figure 3 In this utility model, the first embodiment of the solder ball type LED packaging bracket is... Figure 1 A magnified view of a portion of position B in the diagram.

[0024] Figure 4 This is a top view of Embodiment 2 of the solder ball type LED packaging bracket in this utility model.

[0025] Figure 5 In this utility model, embodiment two of the solder ball type LED packaging bracket is... Figure 4 A magnified view of the area at position C. Figure 6 This is a top view of Embodiment 3 of the solder ball type LED packaging bracket in this utility model.

[0026] Figure 7 In this utility model, embodiment three of the solder ball type LED packaging bracket is... Figure 6 A schematic diagram of the cross-section at position DD. The first and second solder balls are not shown in the cross-section.

[0027] Figure 8 This is a top view of an LED lamp bead according to the present invention. In this embodiment, a solder ball type LED packaging bracket is used, but the first and second white adhesive layers and the phosphor layer are not shown.

[0028] Figure 9 This utility model provides an LED lamp bead edge Figure 8 A schematic diagram of the cross-section at the EE position. The first and second solder balls are not shown in the cross-section.

[0029] Figure 10 This is a cross-sectional view of another LED lamp bead according to the present invention. The first and second solder balls are not shown in the cross-section.

[0030] Figure 11 This is a cross-sectional schematic diagram of another LED lamp bead with multiple fluorescent layers according to this utility model. The first and second solder balls are not shown in the cross-section. Detailed Implementation

[0031] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Many details are described below to provide a comprehensive understanding of this utility model; however, those skilled in the art can implement this utility model without these details.

[0032] Example 1 like Figures 1 to 3 As shown, a solder ball type LED packaging bracket includes a bracket body and a first blocking body 3-1. The bracket body has a bowl 10, and the bottom of the bowl 10 has multiple substrate partitions 20 and at least one isolation strip 11. At least one substrate partition 20 has a carrier area 201 for mounting LED chips. Specifically, the bracket body includes a plastic frame 1 and a substrate 2. The area of ​​the substrate 2 exposed at the bottom of the bowl 10 is the substrate partition 20. The substrate 2 can be a copper substrate, or other solderable metal plates, or a composite substrate with a thin layer of solderable metal such as copper or silver plated on its surface, ensuring that the surface of the substrate partition 20 is a solderable surface. Since the bracket body is a conventional component of existing LED chips, those skilled in the art can select an existing bracket body as needed, as long as the surface of the substrate partition 20 is a solderable surface. No other restrictions are placed on the specific shape or material of the bracket body.

[0033] like Figures 1 to 3 As shown, the number of substrate partitions 20 includes, but is not limited to, two, and may also be three, four, five, ... The number of substrate partitions 20 with a carrier area 201 includes, but is not limited to, two, and may also be one, three, four, five, ... The isolation bands 11 are used to separate each substrate partition 20, and the number of isolation bands 11 increases as the number of substrate partitions 20 increases. Therefore, the number of isolation bands 11 includes, but is not limited to, one, and may also be three, four, five, ...

[0034] like Figures 1 to 3As shown, the surface of the substrate partition 20 is a solderable surface, and at least one first barrier 3-1 is disposed on the substrate partition 20. Specifically, the first barrier 3-1 comprises a plurality of first solder balls 31 arranged on the substrate partition 20. The first solder balls are formed of solder such as tin alloy, gold-silver alloy, nickel-based alloy or copper-based alloy. The first barrier 3-1 can be used to block white adhesive or phosphor. Specifically, the first barrier 3-1 can be used to block white adhesive from flowing to the LED chips in the chip carrying area, so as to avoid local shielding of the chips caused by colloid overflowing to the surface of the LED chips, and ensure the light extraction efficiency and yield of the product; the first barrier 3-1 can also be used to fill a plurality of phosphors in a partitioned manner inside the bowl cup.

[0035] In the following, taking the case where the first barrier 3-1 is used to block white adhesive from flowing to the LED chips in the chip carrying area 201 when the white adhesive is filled between the side wall 101 of the bowl cup 10 and the first barrier 3-1 as an example, further details of the first barrier 3-1 are further described, and the following description also applies to blocking phosphor.

[0036] As Figures 1 to 3 shown, both of the two substrate partitions 20 are provided with one first barrier 3-1, but the number of the first barriers 3-1 is not limited to two, and may also be one, three, four or more.

[0037] As Figures 1 to 3 shown, the number, shape and length of the first barriers 3-1 can be set as required, as long as the first barrier 3-1 can block white adhesive from flowing to the LED chips in the chip carrying area 201 when the white adhesive is filled between the side wall 101 of the bowl cup 10 and the first barrier 3-1. That is, the first barrier 3-1 may be an open-loop structure, such as Figure 1 the linear shape or curved shape shown, or as Figure 6 the C-shape or L-shape shown; the first barrier 3-1 may also be a closed-loop structure, such as a square shape or an O-shape.

[0038] As Figures 1 to 3 shown, preferably, two adjacent first solder balls 31 of the first barrier 3-1 are arranged at an interval from each other. The gap between two adjacent first solder balls 31 can be set as required, as long as it is ensured that when the white adhesive is filled between the side wall 101 of the bowl cup 10 and the first barrier 3-1, the white adhesive will not flow to the LED chips in the chip carrying area 201 through the gap between two adjacent first solder balls 31, that is, the first barrier 3-1 can block the white adhesive from flowing to the LED chips in the chip carrying area 201. Of course, two adjacent first solder balls 31 of the first barrier 3-1 can also be arranged to fit each other.

[0039] As Figures 1 to 3As shown, preferably, the first solder ball 31 includes a first solder ball body 311 and a first tail line 312. The first tail line 312 extends vertically upward or extends obliquely toward the side wall of the cup 10. In this case, two adjacent first solder balls 31 are spaced apart from each other, which mainly refers to two adjacent first tail lines 312 being spaced apart from each other; two adjacent first solder ball bodies 311 can be spaced apart from each other or attached to each other.

[0040] Preferably, the gap between two adjacent first tail lines 312 is less than or equal to 45um, so as to ensure that the first blocker 3-1 can block the white glue from flowing to the LED chip in the carrier area 201.

[0041] Since the diameter of the solder ball body is usually larger than the diameter of the tail line, the distance between two adjacent first solder balls 31 in the tail line region is usually greater than the distance between them in the solder ball body. Therefore, when setting the gap between two adjacent first solder balls 31, when there is a first tail line 312, the gap setting between two adjacent first solder balls 31 refers to the gap setting between two adjacent first tail lines 312.

[0042] As the gap between two adjacent first solder balls 31 increases, the obstruction of the white glue by the first blocking body 3-1 mainly falls into the following three categories: Case (1): When the gap between two adjacent first solder balls 31 is less than or equal to the first threshold (e.g., 35 μm), under the combined action of the cohesive force (surface tension) of the white glue and its adhesion force (wetting) to the first solder ball, the white glue can be completely blocked on one side of the gap, and a liquid surface 410 is formed between the two adjacent first solder balls 31, which cannot flow to the other side facing the LED chip.

[0043] In case (2), when the gap between two adjacent first solder balls increases to between the first threshold and the second threshold (e.g., greater than 35µm and less than or equal to 45µm), a small amount of white glue will break through the surface tension constraint and flow through the gap between the two adjacent first solder balls 31 to the other side, forming a small overflow portion 411. At this time, the overflow portion 411 is limited in size and has not yet flowed to the LED chip in the substrate area 201, thus not causing functional defects.

[0044] In case (3), when the gap between two adjacent first solder balls increases further to exceed the second threshold (e.g., greater than 45µm), the amount of white glue flowing through the gap increases significantly, forming a large overflow portion. This overflow portion may extend excessively (e.g., the distance to the LED chip is less than 1µm), or even directly contact and cover the LED chip on the substrate, resulting in the adverse consequences of blocking the chip and affecting light output.

[0045] In this invention, the first blocking body 3-1 is used to block the white glue from flowing to the LED chip in the substrate area 201. Its core improvement purpose is to effectively avoid the occurrence of situation (3), that is, to prevent the white glue overflow from spreading excessively to the chip area or even covering the LED chip, thereby ensuring the light output performance and packaging yield. The complete blocking state described in situation (1) is the optimal implementation state, which can achieve precise control of the shape of the white glue and ideal flow blocking; while in the actual process, the state of slight overflow but not contacting the chip involved in situation (2) does not have a substantial impact on the function of the LED chip and is within the acceptable range of the process, and is allowed to occur.

[0046] Of course, it is also possible that the first solder ball 31 is a solder ball without a tail line; in this case, two adjacent first solder balls 31 are spaced apart from each other, specifically, two adjacent solder balls are spaced apart from each other. Preferably, the gap between two adjacent solder balls is less than or equal to 45um.

[0047] Compared to solder balls without a tail line, the first tail line 312 can effectively increase the height of the first solder ball 31, creating a taller first barrier 3-1 and enhancing the blocking effect on the white glue. Meanwhile, as... Figure 9 and Figure 8 As shown, by setting the orientation and / or length of the first tail line 312, the leveling and stacking pattern of the white glue can be guided and controlled, so that the first white glue layer 4-1 formed after curing has different contour shapes. In particular, the first reflective surface 41 of the first white glue layer 4-1 can be controlled to have different tilt angles (i.e., the angle between the first reflective surface 41 and the horizontal plane) to meet specific light distribution requirements.

[0048] Preferably, the length of the first tail line 312 is 20um-70um.

[0049] In the actual production process, an automatic wire bonding machine is used to form multiple first solder balls 31 arranged on the substrate partition 20.

[0050] Example 2 like Figures 1 to 3 As shown, the difference between Embodiment 2 and Embodiment 1 lies in the size of the slide area 201 and the distance between the edge of the slide area 201 and the side wall 101 of the bowl 10. Therefore, Embodiment 1 and Embodiment 2 use a first blocking body 3-1 with different shapes and lengths, as detailed below: like Figures 1 to 3As shown, in Embodiment 1, taking the right-side substrate area 201 as an example, since the distance between the upper and lower edges of the substrate area 201 and the upper and lower sidewalls of the bowl 10 is relatively large, when white glue is added to the upper and lower sidewalls of the bowl 10 by spraying or dispensing, the white glue is difficult to flow to the upper and lower edges of the substrate area 201. Therefore, no first barrier 3-1 is provided at the corresponding position. Conversely, since the distance between the right edge of the substrate area 201 and the right sidewall of the bowl 10 is relatively small, when white glue is added to the upper and lower sidewalls of the bowl 10 by spraying or dispensing, the white glue easily flows to the right edge of the substrate area 201. Therefore, a first barrier 3-1 is provided at the corresponding position.

[0051] like Figure 4 and Figure 5 As shown, in Embodiment 2, taking the right-side substrate area 201 as an example, since the distance between the upper, lower, and right edges of the substrate area 201 and the upper, lower, and right side walls of the bowl 10 is small, when white glue is added to the upper, lower, and right side walls of the bowl 10 by spraying or dispensing, the white glue is difficult to flow to the upper, lower, and right edges of the substrate area 201. Therefore, a first barrier 3-1 is set at the corresponding position.

[0052] Example 3 like Figures 1 to 7 As shown, the difference between Embodiment 3 and Embodiments 1 and 2 is that in Embodiment 3, the isolation strip 11 protrudes upward from the substrate partition 20, including but not limited to the surface of the protruding portion being convex arc-shaped. To prevent the white glue from flowing to the LED chip in the carrier area 201 when white glue is added to the isolation strip 11 through spraying or dispensing processes, the substrate partition 20 of Embodiment 3 is provided with at least one second barrier 3-2. Specifically, a second barrier 3-2 is provided between each of the two substrate partitions 20 and the isolation strip 11. Of course, the number, shape, and length of the second barrier 3-2 can be set as needed, as long as it can prevent the white glue from flowing to the LED chip in the carrier area 201 when white glue is filled between the substrate partition 20 and the isolation strip 11. For details, please refer to the description of the relevant settings of the first barrier in Embodiment 1, which will not be repeated here.

[0053] like Figure 6 and Figure 7As shown, the second barrier 3-2 consists of a plurality of second solder balls 32 arranged at intervals in the substrate partition 20. It is used to prevent white adhesive from flowing to the LED chip in the carrier area 201 when white adhesive is filled between the isolation strip 11 and the second barrier 3-2. Adjacent second solder balls 32 can be spaced apart or bonded together; for details, please refer to the description of the relevant arrangements for adjacent first solder balls in Embodiment 1, which will not be repeated here. Similarly, the second barrier 3-2 can be used to block white adhesive or phosphor. Specifically, the second barrier 3-2 can be used to block white adhesive from flowing to the LED chip in the carrier area, preventing partial shading of the chip due to adhesive overflow onto the LED chip surface, thus ensuring the light extraction efficiency and yield of the product; the second barrier 3-2 can also be used to fill various phosphors in a partitioned manner inside the cup.

[0054] like Figure 6 and Figure 7 As shown, the second solder ball 32 includes a second solder ball body 321 and a second tail line 322, with the first tail line 322 extending obliquely towards the isolation strip 11. Alternatively, the first tail line 322 can also extend vertically upwards. However, compared to solder balls without tail lines, the second tail line 322 not only effectively increases the height of the second solder ball 32, creating a taller second barrier 3-2 and improving the blocking effect on the white glue, but also guides and controls the leveling and accumulation pattern of the white glue by setting the orientation and / or length of the second tail line 322. This allows the second white glue layer 4-2 formed after curing to have different contour shapes, especially controlling the curvature of the second reflective surface 42 of the second white glue layer 4-2 to meet specific light emission distribution requirements. Preferably, the second solder ball is made of solder such as tin alloy, gold-silver alloy, nickel-based alloy, or copper-based alloy. For other setting parameters of the second solder ball 32, please refer to the relevant setting descriptions of the first solder ball in Embodiments 1 and 2. For example, preferably, the length of the second tail line 322 is 20um-70um. The gap between two adjacent second tail lines 322 is less than or equal to 45um. The second solder ball 32 can also be a solder ball without a tail line. In this case, two adjacent second solder balls 32 are spaced apart from each other, specifically, two adjacent solder balls are spaced apart from each other. Preferably, the gap between two adjacent solder balls is less than 45um.

[0055] Example 4 like Figures 6 to 9As shown, an LED lamp bead includes eight LED chips 5 and a solder ball-type LED package bracket. The number of LED chips 5 includes, but is not limited to, five. The bracket employs a solder ball-type LED package bracket structure as described in Embodiment 3. The bracket body has a cup 10, and the bottom of the cup 10 has two substrate partitions 20 and an isolation strip 11. The substrate carrier area 201 has a first barrier 3-1 and a second barrier 3-2, forming a closed-loop barrier. The two substrate partitions 20 have equal-load areas 201, in which the eight LED chips 5 are fixed. The LED chips 5 are electrically connected to each other and to the substrate 2 via gold wires.

[0056] Preferably, the first solder ball 31 includes a first solder ball body 311 and a first tail line 312, the upper end of the first tail line 312 being lower than the upper end of the LED chip 5. The second solder ball 32 includes a second solder ball body 321 and a second tail line 322. The upper end of the second tail line 322 is lower than the upper end of the LED chip 5.

[0057] like Figures 1 to 9 As shown, the solder ball type LED package bracket of the LED lamp bead can of course be replaced with the LED package bracket of Embodiment 1, Embodiment 2, or other shapes having the above-mentioned first barrier and / or second barrier LED chip.

[0058] like Figures 6 to 9 As shown, after the white glue filling the side wall 101 of the bowl 10 and the first barrier 3-1 cures, a first white glue layer 4-1 with a first reflective surface 41 is formed. After the white glue filling the spacer 11 and the second barrier 3-2 cures, a second white glue layer 4-2 with a second reflective surface 42 is formed.

[0059] like Figures 6 to 9 As shown, the bowl 10 is also filled with fluorescent powder, which forms a fluorescent powder layer 7 after curing.

[0060] Example 5 like Figures 6 to 10 As shown, the difference between Embodiment 5 and Embodiment 4 is that in Embodiment 5, both the first tail line 312 and the second tail line 322 extend vertically, resulting in a different tilt angle for the first reflective surface 41 and a different curvature for the second reflective surface 42 compared to Embodiment 4. Of course, the solder ball-type LED packaging bracket for this LED bead can also be replaced with Embodiment 1, Embodiment 2, or other shapes of LED packaging brackets with the aforementioned first and / or second blocking LED chips.

[0061] Example 6, like Figures 6 to 11As shown, the difference between Embodiment Six and Embodiment Four is that the fluorescent layer has three partitions. Specifically, the first fluorescent layer 71 is filled inside one partition formed by the first barrier 3-1 and the second barrier 3-2, and covers the chip 5 at the corresponding position. The second fluorescent layer 72 is filled inside the other partition formed by the first barrier 3-1 and the second barrier 3-2, and covers the chip 5 at the corresponding position. A third fluorescent layer 73 is also filled on top of the first fluorescent layer 71 and the second fluorescent layer 72.

[0062] The above are merely specific embodiments of this utility model, but the design concept of this utility model is not limited thereto. Any non-substantial modifications made to this utility model using this concept shall be considered as an infringement of the protection scope of this utility model.

Claims

1. A solder ball type LED packaging bracket, comprising a bracket body, wherein the bracket body is provided with a cup (10), the bottom of the cup (10) is provided with a plurality of substrate partitions (20) and at least one isolation strip (11), and the at least one substrate partition (20) is provided with a carrier area (201) for mounting LED chips, characterized in that: It also includes a first barrier (3-1), the surface of the substrate partition (20) is a solderable surface, and at least one first barrier (3-1) for blocking white glue or phosphor is provided on the substrate partition (20). The first barrier (3-1) includes a plurality of first solder balls (31) arranged in the substrate partition (20).

2. The solder ball type LED packaging bracket according to claim 1, characterized in that: The first solder ball (31) is used to prevent the white glue from flowing to the LED chip in the substrate area (201) when the white glue is filled between the side wall (101) of the bowl (10) and the first barrier (3-1).

3. The solder ball type LED packaging bracket according to claim 1, characterized in that: The first solder ball (31) includes a first solder ball body (311) and a first tail line (312). The first tail line (312) extends vertically upward or extends obliquely toward the side wall of the bowl (10).

4. The solder ball type LED packaging bracket according to claim 3, characterized in that: The length of the first tail line (312) is 20um-70um, and the gap between two adjacent first tail lines (312) is less than or equal to 45um.

5. A solder ball type LED packaging bracket according to any one of claims 1-4, characterized in that: The substrate partition (20) is provided with at least one second barrier (3-2) for blocking white glue or phosphor. The second barrier (3-2) is composed of a plurality of second solder balls (32) arranged at intervals in the substrate partition.

6. The solder ball type LED packaging bracket according to claim 5, characterized in that: The second solder ball (32) is used to prevent the white glue from flowing to the LED chip in the substrate area (201) when the white glue is filled between the isolation strip (11) and the second barrier (3-2).

7. The solder ball type LED packaging bracket according to claim 5, characterized in that: The isolation strip (11) protrudes upward from the substrate partition (20); the second solder ball (32) includes a second solder ball body (321) and a second tail line (322), the first tail line (322) extends vertically upward or extends obliquely toward the isolation strip (11).

8. An LED lamp bead, characterized in that: The LED package includes at least one LED chip (5) and a solder ball type LED package holder as described in any one of claims 1-7, wherein the LED chip (5) is fixed in the substrate area (201).

9. An LED lamp bead, characterized in that: The LED package includes at least one LED chip (5) and a structure as described in any one of claims 5-7. The LED chip (5) is fixed in the substrate area (201). After the white glue filling the sidewall (101) of the cup (10) and the first barrier (3-1) is cured, a first white glue layer (4-1) with a first reflective surface (41) is formed. After the white glue filling the spacer (11) and the second barrier (3-2) is cured, a second white glue layer (4-2) with a second reflective surface (42) is formed.

10. An LED lamp bead, characterized in that: The LED package includes at least one LED chip (5) and a solder ball type LED package holder as described in claim 5 or 7, wherein the LED chip (5) is fixed in the substrate area (201); a first phosphor layer (71) is filled in one of the partitions formed by the first barrier (3-1) and the second barrier (3-2), and a second phosphor layer (72) is filled in the other partition formed by the first barrier (3-1) and the second barrier (3-2).

Images