A mold type LED packaging support and LED lamp bead

Abstract

The utility model discloses a mould type LED packaging support and LED lamp pearl. Among them, including: plastic support and metal baseplate, plastic support is covered in the metal baseplate, and forms the bowl cup of bottom having baseplate area, the isolated area, still includes mould, the mould is arranged in the bowl cup, and the bottom of mould and the metal baseplate between bowl cup exposed form the clearance, and the clearance is filled with liquid adhesive, and the liquid adhesive forms the dam after solidification, and the dam is used for blocking white glue or fluorescent powder glue, the outer circumferential surface of mould extends and is provided with a plurality of support rods to the inner circumferential surface of bowl cup, and the free end of support rod abuts to the inner circumferential surface of bowl cup, the dam can directly block the white glue that bowl cup side wall spray flows to the chip area, avoids white glue covering chip electrode, soldering point and luminous surface, solves the problem of the lamp pearl " dead light " of the prior art because of white glue flow, poor contact and luminous efficiency attenuation.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a mold-type LED packaging bracket and LED beads. Background Technology

[0002] In the field of LED lighting and display, LED packaging brackets and LED chips based on these brackets are core components that determine the optical performance, reliability, and production efficiency of products. With the expansion of new application scenarios such as Mini / Micro LED and multi-color zone displays, the market demand for the zoned functionality of LED chips is becoming increasingly stringent. For example, achieving precise matching of phosphors with different color temperatures and concentrations within the same bracket cup, local anti-sulfurization protection, or independent optical control of multiple chips are required. However, current LED packaging technology and production equipment are unable to meet these requirements, specifically exhibiting the following three key technical deficiencies: Firstly, phosphor dispensing cannot achieve precise application to specific small areas: In current LED packaging production, the phosphor dispensing machine's operation mode is limited to dispensing the entire area of ​​the bracket cup in a single operation. The dispensing path and range are determined by the equipment's inherent program and the overall structure of the bracket cup, making it impossible to perform targeted dispensing for specific small areas within the cup, such as the optical area corresponding to a local chip or a specific wavelength matching area, according to product design requirements. This global dispensing mode prevents the partitioning of different phosphor formulations and concentrations within the same bracket, directly limiting the zoned optical performance design of LED chips and making it difficult to meet the production needs of new products such as multi-color zoned displays and local color temperature adjustment.

[0003] Secondly, white glue spraying can easily cause chip contamination, leading to product defects: In the white glue (used for reflection) spraying process of LED packaging, when existing spraying equipment operates using a full-area spraying method, due to the fluidity of the white glue itself and the lack of effective physical barriers within the bracket cup, the sprayed white glue easily flows along the inner wall or bottom surface of the cup to the chip's electrodes, light-emitting areas, or soldering points, causing defects such as chip short circuits, luminous efficiency degradation, or soldering failures. To solve this problem, additional processes such as white glue drip detection and local wiping cleaning are required in production, which not only reduces production efficiency but also increases labor costs and the risk of secondary chip damage, making it difficult to guarantee stable control of product yield.

[0004] Third, regional separation requires customized new brackets, which are costly and lack flexibility: When a product needs to be separated into multiple independent functional areas within the same bracket cup, such as to achieve isolation of different phosphor areas or chip protection areas, the existing technical solution is usually to customize a new bracket cup structure for specific partition requirements. The development of a new bracket requires redesigning the mold, processing and debugging the mold, conducting sample verification and production line adaptation. The whole process consumes a lot of manpower, material resources and time. Moreover, customized brackets are only applicable to a single product model and cannot flexibly adapt to product iterations with different partition requirements, resulting in extended production cycles, high R&D costs, and difficulty in meeting the market's demand for rapid product updates.

[0005] In summary, as LED products develop towards higher precision and multi-zone design, the problems of inaccurate zoning with dispensing, chip contamination during spraying, and high cost and lack of flexibility in area separation in existing technologies are becoming increasingly prominent. The limitations of production equipment and processes have become key bottlenecks restricting the performance upgrade and production efficiency improvement of LED packaging products. There is an urgent need for an LED packaging technology solution that can achieve precise zoning, avoid chip contamination, and adapt to different zoning requirements at low cost, in order to break through the current production technology barriers. Utility Model Content

[0006] To address the problems existing in the prior art, this utility model provides a mold-type LED packaging bracket and LED beads, which can effectively solve the problems existing in the prior art.

[0007] The technical solution of this utility model is: According to one aspect of the present invention, the invention includes: a plastic support and a metal substrate, wherein the plastic support covers the metal substrate and forms a bowl with a substrate area and a separating band at the bottom; and a mold is also included; the mold is disposed inside the bowl, and a gap is formed between the bottom of the mold and the exposed metal substrate inside the bowl, the gap being filled with liquid adhesive, which, after curing, forms a dam to block white glue or fluorescent powder adhesive; a plurality of support rods are provided extending from the outer peripheral surface of the mold toward the inner peripheral surface of the bowl, and the free ends of the support rods abut against the inner peripheral surface of the bowl.

[0008] Furthermore, the mold is a square-shaped frame.

[0009] Furthermore, the inner circumferential surface of the bowl / cup is provided with a first positioning groove, and the support rod is placed in the first positioning groove.

[0010] Furthermore, after the dam is formed, the mold is either retained inside the bowl or removed from the bowl.

[0011] Furthermore, the liquid adhesive is an anti-vulcanizing adhesive.

[0012] Furthermore, the isolation strip protrudes from the substrate area, and when the mold abuts against the isolation strip, the gap is formed between the bottom of the mold and the exposed metal substrate inside the bowl.

[0013] Furthermore, the isolation strip is provided with at least one second positioning groove, and the mold is positioned and placed in the second positioning groove.

[0014] Furthermore, the mold is made of metal, glass, or plastic.

[0015] According to another aspect of the present invention, an LED bead includes a first fluorescent layer, a molded LED packaging bracket as described above, and a reflective layer. White glue is applied between the dam and the inner circumferential surface of the bowl, and the white glue forms a reflective layer after curing. The surface of the reflective layer is a sloping surface.

[0016] Furthermore, a chip is installed inside the dam, and a fluorescent adhesive is filled inside the bowl. After the fluorescent adhesive is cured, a first fluorescent layer is formed.

[0017] By adopting the above technical solution, the beneficial effects of this utility model compared with the prior art are as follows: Firstly, by setting a mold inside the cup, liquid adhesive is filled into the gap between the bottom of the mold and the metal substrate to form a dam. This dam directly blocks the white adhesive sprayed on the side wall of the cup from flowing into the chip area, preventing the white adhesive from covering the chip electrodes, solder points, and light-emitting surface. This solves the problems of "dead" LEDs, poor contact, and luminous efficiency decay caused by white adhesive flow in existing technologies. The support rod extending from the outer periphery of the mold abuts against the inner circumference of the cup, fixing the position of the mold inside the cup and preventing mold displacement or shaking. This ensures that the thickness of the dam is consistent and the barrier effect is stable after it is formed, avoiding dam failure due to mold displacement. There is no need to add additional white adhesive drip detection, local wiping and cleaning processes, shortening the production cycle and reducing labor input. At the same time, it avoids secondary damage such as scratches and electrode damage to the chip surface during wiping, significantly improving product yield and reducing production costs and material waste. The design of the mold and dam does not damage the basic structure of the original packaging bracket. Instead, it optimizes the packaging process through physical barrier, ensuring the overall structural stability and functional integrity of the LED packaging bracket.

[0018] Secondly, the first positioning groove on the inner circumference of the bowl cup can position the support rod, preventing the support rod from sliding inside the bowl cup, further enhancing the fixing effect of the mold inside the bowl cup, and preventing the mold from shifting due to external vibration or subsequent process operations; at the same time, the first positioning groove can ensure that the installation height of each support rod is consistent, ensuring that the mold as a whole is in a horizontal state, making the gap between the bottom of the mold and the metal substrate uniform, thereby ensuring that the thickness of the dam is uniform after the liquid glue is filled, avoiding the dam being too thin or too thick in some places due to uneven gaps, which would affect the barrier effect or the encapsulation quality.

[0019] Third, once the dam is formed, the mold can be flexibly retained or removed, providing diverse options for LED packaging processes. When the mold is retained, its own material properties, such as the heat dissipation of metal and the light transmittance of glass, can be used to add extra functions to the packaging structure. For example, a metal mold can assist in chip heat dissipation and improve the heat dissipation performance of the LED beads. When the mold is removed, the space occupied inside the packaging structure can be reduced, leaving more space for wiring or other component installation around the chip.

[0020] Fourth, the second positioning groove on the isolation strip can position the mold to ensure accurate mold installation and prevent the mold from shifting inside the cup, ensuring that the dam can accurately surround the chip area. At the same time, the second positioning groove can restrict the movement of the mold. Together with the support rod and the inner circumference of the cup, it forms a double positioning and fixation, which further improves the stability of mold installation. Especially during the liquid glue filling and curing process, it can prevent the mold from shifting and causing deviation in the dam forming position.

[0021] Fifth, the molds can be made of various materials such as metal, glass, or plastic. Different material properties can meet different packaging requirements: metal molds have good heat dissipation performance, which can help dissipate heat from the chip and are suitable for high-power LED packaging scenarios; glass molds have good light transmittance, and if the mold is kept in the cup, it will not block the light output of the LED beads, making them suitable for scenarios with high light output efficiency requirements; plastic molds are low in cost, lightweight, and easy to process, which can reduce the overall production cost of the packaging bracket and are suitable for mass production of ordinary LED packaging scenarios, thus enriching the product's applicability and cost options. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the packaging bracket in this utility model; Figure 2 This is a schematic diagram of the structure of the packaging bracket without the mold in this utility model; Figure 3 This is a schematic diagram of the planar structure of the packaging bracket in this utility model; Figure 4 This is a cross-sectional structural diagram of the packaging bracket in this utility model; Figure 5 This is a schematic diagram of the planar structure of the encapsulation bracket forming a dam in this utility model; Figure 6 This is a schematic cross-sectional view of the dam formed inside the encapsulation bracket in this utility model. Figure 7 This is a schematic diagram of the planar structure of the encapsulation bracket with a reflective layer in this utility model; Figure 8 This is a cross-sectional view of the reflective layer disposed inside the encapsulation bracket in this utility model. Figure 9 This is a schematic diagram of the planar structure of the LED lamp bead in this utility model; Figure 10 This is a cross-sectional structural diagram of the LED lamp bead in this utility model; Figure 11 This is a schematic diagram of the structure of the first fluorescent layer, the second fluorescent layer, and the third fluorescent layer in this utility model; In the diagram: packaging bracket-100, plastic bracket-1, bowl-cup-102, substrate area-20, gap-10, first positioning groove-11, isolation strip-12, second positioning groove-120, metal substrate-2, spacer-21, mold-3, support rod-31, dam-4, reflective layer-5, first fluorescent layer-6, second fluorescent layer-7, third fluorescent layer-8, LED lamp bead-200. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are only for illustrating the present invention and do not limit the scope of the present invention. Similarly, the following embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0025] like Figures 1 to 10 As shown, this solution provides a mold-type LED packaging bracket and LED beads.

[0026] Please see Figures 1 to 8A mold-type LED packaging bracket includes a plastic bracket 1 and a metal substrate 2. The plastic bracket 1 covers the metal substrate 2 and forms a cup 102 with a substrate area 20 and an isolation strip 12 at the bottom. The isolation strip 12 extends toward the metal substrate 2 and is provided with a spacer 21, which divides the metal substrate 2 into positive and negative electrode areas. The plastic bracket 1, the isolation strip 12, and the spacer 21 are integrally formed. Preferably, the isolation strip 12 protrudes from the substrate area 20. When the mold 3 abuts against the isolation strip 12, a gap 10 is formed between the bottom of the mold 3 and the exposed metal substrate 2 inside the cup 102. The isolation strip 12 is provided with at least one second positioning groove 120, and the mold 3 is positioned in the second positioning groove 120. The second positioning groove 120 on the isolation strip 12 can position the mold 3 to ensure that the mold 3 is installed in an accurate position and to prevent the mold 3 from shifting inside the cup 102. This ensures that the dam 4 can accurately surround the chip area. At the same time, the second positioning groove 120 can restrict the movement of the mold 3. Together with the support rod 31 and the contact between the support rod 31 and the inner circumference of the cup 102, a double positioning and fixing is formed, which further improves the installation stability of the mold 3. Especially during the liquid glue filling and curing process, it can prevent the mold 3 from shifting and causing the dam 4 to deviate in the forming position.

[0027] Please see Figures 1 to 8 It also includes mold 3, which is made of metal, glass, or plastic. Different material properties can meet different packaging requirements: metal molds have good heat dissipation performance, which can help dissipate heat from the chip and are suitable for high-power LED packaging scenarios; glass molds have good light transmittance, and if mold 3 is kept inside the cup 102, it will not block the light output of the LED beads, making it suitable for scenarios with high light output efficiency requirements; plastic molds are low in cost, lightweight, and easy to process, which can reduce the overall production cost of the packaging bracket 100 and are suitable for mass production of ordinary LED packaging scenarios, thus enriching the product's applicability and cost options.

[0028] In this embodiment, the mold 3 is a U-shaped frame. In other embodiments, the mold 3 can also be circular, polygonal, or other shapes, and the shape of the mold 3 can be adjusted according to actual needs. Setting the mold 3 as a U-shaped frame can form an annular barrier area inside the bowl 102. In conjunction with the dam 4, it can surround the chip in all directions, forming complete protection around the chip. The mold 3 is set inside the bowl 102, and a gap 10 is formed between the bottom of the mold 3 and the exposed metal substrate 2 inside the bowl 102. This gap 10 is filled with liquid adhesive, preferably anti-sulfur adhesive. The use of anti-sulfur adhesive as the liquid adhesive, after curing, not only blocks the flow of white adhesive but also effectively isolates sulfides (such as hydrogen sulfide and sulfur dioxide) in the external environment from entering the bowl, preventing the metal substrate 2, chip electrodes, and other metal components from being corroded by sulfidation. This avoids problems such as decreased electrode conductivity, LED performance degradation, or failure caused by sulfidation, significantly improving the anti-sulfidation ability and service life of the LED packaging bracket 100 and subsequent LEDs, especially suitable for harsh operating environments such as humid and pollutant-rich environments.

[0029] After the liquid adhesive cures, it forms a dam 4, which prevents the white adhesive on the sidewall of the cup 102 from flowing into the chip (not shown) installed inside the cup 102. After the dam 4 is formed, the mold 3 can be retained inside the cup 102 or removed from the cup 102. The mold 3 can be flexibly retained or removed after the dam 4 is formed, providing diverse options for LED packaging processes. When the mold 3 is retained, its own material properties, such as the heat dissipation of metal and the light transmittance of glass, can be used to add additional functions to the packaging structure. For example, a metal mold can assist in chip heat dissipation and improve the heat dissipation performance of the LED bead. When the mold 3 is removed, the space occupied inside the packaging structure can be reduced, leaving more space for wiring or other components around the chip.

[0030] Please see Figures 1 to 8 A plurality of support rods 31 are provided extending from the outer peripheral surface of the mold 3 toward the inner peripheral surface of the cup 102, and the free ends of the support rods 31 abut against the inner peripheral surface of the cup 102. Preferably, the inner peripheral surface of the cup 102 is provided with a first positioning groove 11, and the support rods 31 are placed in the first positioning groove 11. The first positioning groove 11 on the inner peripheral surface of the cup 102 can position the support rods 31, preventing the support rods 31 from sliding inside the cup 102, further enhancing the fixing effect of the mold 3 inside the cup 102, and preventing the mold 3 from shifting due to external vibration or subsequent process operations; at the same time, the first positioning groove 11 can ensure that the installation height of each support rod 31 is consistent, ensuring that the mold 3 is in a horizontal state, making the gap 10 between the bottom of the mold 3 and the metal substrate 2 uniform, thereby ensuring that the thickness of the dam 4 is uniform after the liquid glue is filled, and avoiding the dam 4 being too thin or too thick in some places due to uneven gap 10, which would affect the barrier effect or the encapsulation quality.

[0031] Please see Figure 11, the surrounding dam 4 can also be used to block the phosphor adhesive. For example, when three different phosphor layers need to be filled, the second phosphor layer 7 is filled in one of the substrate regions 20, the third phosphor layer 8 is filled in another substrate region 20, and the chips at corresponding positions are covered. The first phosphor layer 6 is filled above the second phosphor layer 7 and the third phosphor layer 8, and the first phosphor layer 6 covers the second phosphor layer 7 and the third phosphor layer 8.

[0032] In other embodiments, the shape of the mold 3 can be changed according to the requirements of partitioning. For example, when it is necessary to divide into four regions for dispensing phosphor adhesive, the mold 3 can be changed into a "grid" shape, so that dispensing can be performed respectively in four regions within the surrounding dam 4.

[0033] The inside of the bowl cup 102 is divided into a plurality of independent regions through physical barrier, which effectively solves the problem in the prior art that the phosphor dispenser can only perform one-time dispensing on the entire area of the bowl cup and cannot realize partitioned arrangement of phosphors with different formulas, so that phosphor adhesives of different types can be accurately filled in each independent region without flowing and mixing with each other. It not only realizes the accurate coexistence of multiple phosphor layers in the same bowl cup 102, meets the requirements of new applications such as multi-color partition display and local color temperature adjustment, but also avoids the problems of color shift and uneven color temperature caused by color mixing of different phosphors, and ensures the optical performance purity of the phosphor layers; meanwhile, the surrounding dam 4 can be formed by the shape of the mold 3, and there is no need to customize a new bracket to realize the partitioning requirement like in the prior art, which saves a lot of labor and material costs for the design, processing and debugging of a new bracket mold and production line adaptation. Only by replacing the mold 3 with corresponding size or shape, can product iteration with different partitioning requirements be quickly adapted, and the production flexibility is greatly improved.

[0034] According to another aspect of the present invention, there is provided a method for manufacturing a mold-type LED packaging bracket, comprising the following steps: Embodiment 1, S1, adopting an injection molding process to coat the plastic raw material on the processed metal substrate 2 to form a plastic bracket 1 with a bowl cup 102, and a substrate region 20 and an isolation strip 12 protruding from the substrate region 20 are formed at the bottom of the bowl cup 102. Specifically, in step S1, the mold 3 is made of metal, and the mold 3 is a square frame; it is processed and prepared by a stamping forming process, which specifically comprises: selecting a copper alloy or aluminum alloy plate with a thickness of 0.1~0.3mm as the raw material, pre-processing a hollowed-out groove matching the support rod 31 on the plate by a laser cutting process first, then using a numerical control stamping device with an accuracy of ±0.005mm to perform stamping forming according to the square frame structure of the mold 3 and the size of the support rod 31, after stamping, an ultrasonic cleaning device is used to remove stamping debris on the surface of the mold 3, and finally a plasma polishing process is used to polish the edge of the mold 3 and the free end of the support rod 31, so that the surface roughness Ra≤0.2μm.

[0035] The stamping process using a metal mold 3, combined with laser pre-cutting and high-precision CNC stamping, allows for precise control of the dimensions of the mold 3 and support rod 31. This avoids uneven force distribution when the support rod 31 abuts against the inner circumference of the cup 102 due to length deviation. Ultrasonic cleaning and plasma polishing remove residual impurities and burrs from the stamping process, preventing the mold 3 from scratching the inner circumference of the cup 102 or the isolation strip 12 during installation. Furthermore, the high structural strength of the metal mold 3 maintains a stable shape during liquid glue filling and curing, preventing deformation of the mold 3 and uneven thickness of the gap 10, ensuring the quality of the dam 4 formation. The heat dissipation properties of the metal material also aid in subsequent chip cooling, extending the lifespan of the LED beads.

[0036] S2. Based on the size and shape of the bowl / cup 102, a mold 3 is fabricated. Several support rods 31 extend from the outer periphery of the mold 3. The surface of the mold 3 is deburred and cleaned. Specifically, in step S2, when placing the mold 3, the support rods 31 are embedded in the first positioning groove 11, and the edge of the mold 3 is embedded in the second positioning groove 120. Through the dual positioning of the first positioning groove 11 and the second positioning groove 120, the displacement of the mold 3 within the bowl / cup 102 is further restricted, preventing the mold 3 from shifting during the subsequent filling of liquid adhesive. This ensures that the thickness of the gap 10 remains consistent, thereby guaranteeing accurate liquid adhesive filling and preventing uneven thickness of the dam 4 due to mold 3 shifting.

[0037] S3, place the mold 3 inside the bowl 102, so that the mold 3 abuts against the isolation strip 12, and the free ends of several support rods 31 abut against the inner circumferential surface of the bowl 102. A gap 10 of a preset thickness is formed between the bottom of the mold 3 and the metal substrate 2. Specifically, in step S3, the diameter of the dispensing needle of the dispensing device is 0.2~0.3mm. Before dispensing, the dispensing needle is adjusted to be perpendicular to the upper surface of the mold 3, and the distance between the bottom end of the dispensing needle and the upper surface of the mold 3 is controlled at 0.1~0.2mm. The dispensing pressure is set to 0.1~0.15MPa, the dispensing speed is controlled at 5~8mm / s, and the dispensing path moves in a circular and uniform manner along the gap 10 formed between the bottom of the mold 3 and the metal substrate 2. During the process, the amount of adhesive dispensed from the dispensing needle is monitored in real time to ensure that the amount of adhesive dispensed per millimeter of path is stable at 0.05~0.08mg. The liquid adhesive is anti-vulcanizing adhesive. When filling, it starts from any end of the gap 10 and ends at the adjacent position of the starting end to form a closed loop filling. After the liquid adhesive is filled, a CCD vision inspection device is used to perform dual-view inspection of the anti-vulcanizing adhesive in the gap 10 from directly above the cup 102 and at a 45° angle to identify whether there is insufficient adhesive, overflow, air bubbles, and the degree of adhesion to the wall of the gap 10. Unqualified products with insufficient anti-vulcanizing adhesive filling, overflow of gap 10 covering the mold 3 or metal substrate 2, internal air bubble diameter ≥0.03mm, and adhesion degree less than 95% are rejected.

[0038] By vertically positioning the dispensing needle and setting a fixed spacing between them, glue displacement caused by needle tilting can be avoided, ensuring accurate injection of anti-sulfurization glue into gap 10. The circular uniform speed dispensing path and stable glue volume control ensure uniform distribution of anti-sulfurization glue within gap 10, preventing local glue shortages from affecting the barrier effect of the dam 4 or local glue overflow from contaminating the mold 3 and metal substrate 2. The closed-loop filling of anti-sulfurization glue can form a complete annular pre-dam structure, laying the foundation for subsequent curing to form a continuous and uninterrupted dam 4. Dual-view CCD visual inspection can comprehensively check for anti-sulfurization glue filling defects, especially for the blind spots of the bonding between gap 10 and mold 3 and metal substrate 2, effectively identifying bonding problems and avoiding sulfide infiltration during subsequent use due to insufficient bonding of anti-sulfurization glue. At the same time, the selection of anti-sulfurization glue enables the cured dam 4 to have both white glue barrier and anti-sulfurization functions, preventing the metal substrate 2 and chip electrodes from being corroded by sulfidation, further improving the service life and performance stability of the packaging bracket.

[0039] S4. Liquid adhesive is filled into gap 10 using a dispensing device. The amount and speed of liquid adhesive filling are controlled to prevent overflow. Specifically, in step S4, the curing process adopts a segmented curing method. The first stage curing temperature is 60~70℃, and the curing time is 30~40 minutes. The second stage curing temperature is 120~130℃, and the curing time is 60~80 minutes. The segmented curing method can prevent the liquid adhesive from generating bubbles or shrinking and deforming due to rapid heating. The first stage of low-temperature curing allows the liquid adhesive to slowly set, and the second stage of high-temperature curing ensures that the liquid adhesive is fully cured, improving the structural strength and stability of the dam 4 and preventing cracking and detachment during subsequent use, thus ensuring the long-term barrier effect of the dam 4.

[0040] Furthermore, after the cofferdam 4 has cured, the mold 3 can be retained or removed depending on the usage requirements. The flexible choice of retaining or removing the mold 3 after the cofferdam 4 has cured can meet the needs of different packaging scenarios. When removing the mold 3, a low-temperature heating-assisted removal method is used, which can avoid high-temperature damage to the cofferdam 4 and other structures of the packaging bracket, and can also remove the mold 3 by weakening the adhesive force, which facilitates the recycling and reuse of the mold 3, reduces production costs, and ensures the structural integrity of the cofferdam 4 after the mold 3 is removed.

[0041] S5, the encapsulation bracket filled with liquid adhesive is placed in a curing oven and cured according to preset temperature and time parameters, so that the liquid adhesive forms a dam 4. The dam 4 is used to prevent the white adhesive on the side wall of the cup 102 from flowing into the chip installed in the cup 102, thus obtaining the mold-type LED encapsulation bracket.

[0042] Example 2, The difference between this embodiment and Embodiment 1 is that: In step S1, the mold 3 is made of glass and is prepared by compression molding process. Specifically, it includes: selecting high borosilicate glass as raw material, heating the glass raw material to a softened state of 850~900℃, pouring it into a graphite mold with a preset mold 3 and support rod 31 shape, coating the inner surface of the mold with a boron nitride release agent with a thickness of 5~8μm, using a molding pressure of 15~20MPa for 10~15s, and demolding after the glass cools to room temperature to obtain a pre-formed glass mold 3. Then, the edges of the mold 3 and support rod 31 are finely ground with a diamond grinding wheel. After fine grinding, hydrofluoric acid solution is used for etching treatment, with the etching time controlled at 3~5min to remove the fine grinding residue and make the light transmittance of the glass mold 3 ≥92%.

[0043] The molding process of the glass mold 3 utilizes the high softening temperature of high borosilicate glass and the high-temperature resistance of graphite molds to achieve one-time molding of the mold 3, avoiding the glass breakage problem caused by traditional cutting processes. The use of boron nitride release agent ensures smooth demolding of the glass mold 3 and prevents mold adhesion from affecting structural integrity. The combination of fine grinding and hydrofluoric acid etching can improve the surface flatness and light transmittance of the glass mold 3, avoid light scattering caused by surface defects when the LED beads emit light, ensure the luminous efficiency of the beads, and the chemical stability of the glass material can prevent corrosion by sulfides during subsequent use, improving the packaging bracket's resistance to harsh environments.

[0044] Example 3, The difference between this embodiment and Embodiment 1 is that: In step S1, mold 3 is made of plastic and is prepared by injection molding process. Specifically, it includes: selecting polycarbonate or polyphenylene sulfide as plastic raw material, drying the plastic raw material to a moisture content of ≤0.05%, pouring it into the barrel of the injection molding machine, controlling the barrel temperature at 260~280℃, setting the injection mold temperature at 80~100℃, using an injection pressure of 60~80MPa to inject the molten plastic into the mold cavity of the pre-set mold 3 and support rod 31 shape, holding pressure for 15~20s, cooling for 25~30s, opening the mold and removing the part to obtain plastic mold 3. After removing the part, the gate of mold 3 is trimmed with a hot air gun. After trimming, the surface of mold 3 is sterilized by ultraviolet irradiation equipment for 5~8min.

[0045] The injection molding process of the plastic mold 3 avoids air bubbles during injection by drying the raw materials, ensuring the structural density of the mold 3 and support rod 31 and preventing liquid glue from seeping into the mold 3 and affecting the bonding strength. Precise control of the barrel and mold temperature can prevent shrinkage or warping of the plastic mold 3, ensuring that the mold 3 size matches the cup 102 and that the support rod 31 can stably abut against the inner circumference of the cup 102. Gate trimming and ultraviolet sterilization can remove residual structures from the injection molding process, preventing the trimmed gate protrusion from affecting the fit between the mold 3 and the isolation strip 12. At the same time, sterilization can prevent the growth of microorganisms on the surface of the plastic mold 3, preventing the introduction of contaminants during the subsequent LED bead encapsulation. Furthermore, the low cost and lightweight characteristics of the plastic material can reduce the overall production cost of the encapsulation bracket, making it suitable for mass production.

[0046] According to another aspect of this utility model, an LED lamp bead includes a first fluorescent layer 6, a molded LED packaging bracket as described above, and a reflective layer 5. White adhesive is applied between the dam 4 and the inner circumferential surface of the cup 102. After curing, the white adhesive forms the reflective layer 5, the surface of which is a sloped surface. A chip is assembled inside the dam 4, and phosphor adhesive is filled inside the cup 102. After curing, the phosphor adhesive forms the first fluorescent layer 6.

[0047] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A mold-type LED packaging bracket, comprising a plastic bracket (1) and a metal substrate (2), wherein the plastic bracket (1) covers the metal substrate (2) and forms a bowl (102) with a substrate area (20) and an isolation strip (12) at the bottom, characterized in that, It also includes a mold (3); the mold (3) is set inside the bowl (102), and a gap (10) is formed between the bottom of the mold (3) and the exposed metal substrate (2) inside the bowl (102). The gap (10) is filled with liquid glue, and the liquid glue forms a dam (4) after curing. The dam (4) is used to block white glue or fluorescent powder glue. A number of support rods (31) are provided on the outer peripheral surface of the mold (3) extending toward the inner peripheral surface of the bowl (102), and the free end of the support rod (31) abuts against the inner peripheral surface of the bowl (102).

2. The mold-type LED packaging bracket as described in claim 1, characterized in that, The mold (3) is a square frame.

3. The mold-type LED packaging bracket as described in claim 1, characterized in that, The inner circumferential surface of the bowl (102) is provided with a first positioning groove (11), and the support rod (31) is placed in the first positioning groove (11).

4. The mold-type LED packaging bracket as described in claim 1, characterized in that, After the dam (4) is formed, the mold (3) is retained in the bowl (102) or removed from the bowl (102).

5. The mold-type LED packaging bracket as described in claim 1, characterized in that, The liquid adhesive is an anti-vulcanizing adhesive.

6. A mold-type LED packaging bracket as described in claim 1 or 2, characterized in that, The isolation strip (12) protrudes from the substrate area (20). When the mold (3) abuts against the isolation strip (12), the gap (10) is formed between the bottom of the mold (3) and the exposed metal substrate (2) inside the bowl (102).

7. The mold-type LED packaging bracket as described in claim 6, characterized in that, The isolation strip (12) is provided with at least one second positioning groove (120), and the mold (3) is positioned in the second positioning groove (120).

8. The mold-type LED packaging bracket as described in claim 1, characterized in that, The mold (3) is made of metal, glass or plastic.

9. An LED lamp bead, comprising a first fluorescent layer (6), characterized in that, It also includes a mold-type LED packaging bracket as described in any one of claims 1 to 8, and further includes a reflective layer (5), wherein white glue is applied between the dam (4) and the inner circumferential surface of the bowl (102), and the white glue forms a reflective layer (5) after curing, and the surface of the reflective layer (5) is a sloping surface.

10. An LED lamp bead as described in claim 9, characterized in that, The dam (4) is equipped with a chip, and the bowl (102) is filled with fluorescent adhesive. After the fluorescent adhesive is cured, a first fluorescent layer (6) is formed.

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