A Mini LED composite encapsulation film and encapsulation structure

Abstract

The utility model provides a kind of Mini LED composite encapsulation adhesive film and packaging structure, the Mini LED composite encapsulation adhesive film includes the color layer, semi-cured adhesive film layer and nano-imprint hardening layer stacked in turn;The other side surface of semi-cured adhesive film layer on the nano-imprint hardening layer is nano-imprint surface, and the first nano-imprint structure is on the nano-imprint surface.The composite encapsulation adhesive film provided by the utility model can significantly improve the Mini LED display effect by nano-imprint structure and composite layer structure design, and has fingerprint and scratch-proof effect, realizing the multifunctional integration of Mini LED packaging.

Description

Technical Field

[0001] This utility model belongs to the field of display technology, specifically relating to a Mini LED composite encapsulation film and encapsulation structure. Background Technology

[0002] Mini LED, as a new generation of display technology, can be mainly divided into Mini LED backlight chips and Mini LED direct-display chips according to their application. Among them, Mini LED direct-display (also known as Mini RGB) technology uses RGB three-primary-color chips to achieve self-emissive display. With its advantages such as high brightness, high contrast, and long lifespan, it has become the preferred solution for ultra-large-size applications such as commercial displays of 110 inches and above, outdoor displays, and high-end conferences.

[0003] One of the core aspects of Mini LED direct-view display technology lies in the packaging process, which directly affects the reliability, optical performance, and production cost of the display module. Traditional packaging processes primarily rely on the selection of packaging materials, typically employing two-component epoxy adhesives or epoxy plastic encapsulation through molding. However, with the market's pursuit of higher resolution, the pixel pitch of direct-view displays is continuously shrinking (P≤0.9mm), placing higher demands on packaging technology. Traditional packaging processes, limited by their fluidity, curing stress, packaging efficiency, and curing precision, are increasingly showing their inadequacies in miniaturized packaging, easily leading to problems such as incomplete filling, poor hermeticity, and decreased reliability, making it difficult to meet the stringent requirements of current Mini LED direct-view displays.

[0004] To improve packaging efficiency and consistency, the industry has begun exploring and using pre-fabricated encapsulating films as a novel packaging solution. Currently, most publicly available technologies utilize colorless and transparent film materials, completing the packaging of multiple chips in a single process through hot pressing, significantly improving production efficiency. However, this type of transparent film solution has significant drawbacks: First, it cannot avoid the strong reflection of light from the dense metal wiring on the Mini LED chip substrate, leading to problems such as glare, halo, and uneven brightness in the display, severely affecting display contrast and visual consistency. Second, its function is limited, only providing basic protection and sealing. After molding and packaging, to meet the application requirements of terminal display products, it is often necessary to additionally laminate multiple layers of functional films such as anti-glare, anti-reflection, and hardening films. This not only increases the number of process steps and complexity but also drives up the overall cost and poses a risk of interlayer peeling.

[0005] Therefore, there is a need to develop an encapsulating film that integrates multiple functions such as anti-glare and encapsulation. Utility Model Content

[0006] The purpose of this invention is to provide a Mini LED composite encapsulation film and encapsulation structure that integrates multiple functions such as anti-glare, encapsulation, and improved color uniformity.

[0007] To achieve the objective of this utility model, the following technical solution is adopted:

[0008] In a first aspect, the present invention provides a Mini LED composite encapsulation film, the Mini LED composite encapsulation film comprising a coloring layer, a semi-cured film layer and a nanoimprint hardening layer stacked sequentially; the other side surface of the nanoimprint hardening layer opposite to the semi-cured film layer is a nanoimprint surface, and the nanoimprint surface has a first nanoimprint structure.

[0009] The composite encapsulation film provided by this utility model has a colored layer on the side adjacent to the Mini LED chip, which can effectively block the metal wiring on the substrate and solve the problem of uneven display of Mini LED display caused by metal wiring reflection. The outer surface of the composite encapsulation film is provided with a nanoimprint hardening layer with a nanoimprint structure. The nanoimprint structure makes the composite encapsulation film matte and frosted, eliminating specular luminescence. The specific combination with the color layer can significantly improve the screen display effect and also has an anti-fingerprint effect. At the same time, the nanoimprint hardening layer has high hardness (>80D) and can also make the display scratch-resistant. It realizes the multi-functional integration of Mini LED encapsulation and the encapsulation process is simple and convenient.

[0010] Preferably, the first nanoimprint structure is an array of hemispherical grooves.

[0011] Preferably, the surface roughness Ra of the nanoimprint surface is 1.2-1.8, for example, it can be 1.2, 1.3, 1.4, 1.5, 1.6, 1.7 or 1.8, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0012] Preferably, the nanoimprint curing layer includes at least one of an acrylate nanoimprint adhesive layer, an epoxy nanoimprint adhesive layer, or a polyurethane nanoimprint adhesive layer.

[0013] Preferably, the nanoimprint hardening layer is a cured layer or a semi-cured layer.

[0014] Preferably, the thickness of the nanoimprint hardening layer is 10-30 μm, for example, it can be 10 μm, 15 μm, 20 μm, 25 μm or 30 μm, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0015] Preferably, the semi-cured adhesive film layer includes at least one of an epoxy adhesive film layer, an acrylate adhesive film layer, an epoxy-acrylate adhesive film layer, or an organosilicon film layer.

[0016] The thickness of the semi-cured adhesive film layer is 50-100μm, for example, it can be 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0017] Preferably, the coloring layer comprises at least one of a black modified epoxy film layer, a black modified acrylate film layer, a black modified epoxy-acrylate film layer, or a black modified silicone film layer.

[0018] The coloring layer can be a film layer with the same or different resin type as the semi-cured adhesive layer.

[0019] The coloring layer optimizes the uniformity of ink color in Mini LED display panels, improving the contrast and anti-glare effect of direct-view modules. Existing technologies mostly use a black thin-film substrate layer to achieve uniform ink color, but due to significant differences in modulus, heat resistance, and other properties between the substrate layer and the adhesive layer, delamination and peeling are prone to occur, and subsequent heat lamination can easily produce wrinkles. This invention uses a black modified epoxy adhesive film layer, which provides better interlayer adhesion with the semi-cured adhesive film layer and the nano-imprinted hardening layer, and also offers better filling performance for the Mini LED chip.

[0020] Preferably, the thickness of the coloring layer is 50-150μm, for example, it can be 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm or 150μm, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0021] By optimizing the coloring layer and its thickness, the light transmittance of the coloring layer is controlled to be 50-60% to achieve the best color rendering effect.

[0022] Preferably, the thickness of the coloring layer is less than the height of the Mini LED chip.

[0023] Preferably, the Mini LED composite encapsulation film further includes: a nanoimprint release film layer disposed on the outside of the nanoimprint hardening layer, wherein the surface of the nanoimprint release film layer adjacent to the nanoimprint hardening layer has a second nanoimprint structure, and the first nanoimprint structure and the second nanoimprint structure cooperate with each other.

[0024] Preferably, a light release film layer is provided on the outer side of the coloring layer.

[0025] Secondly, this utility model provides a Mini LED packaging structure, the Mini LED packaging structure comprising: a substrate having a Mini LED chip and the Mini LED composite encapsulating film described in the first aspect; the Mini LED composite encapsulating film is laminated to the side of the substrate having the Mini LED chip.

[0026] Preferably, the thickness of the coloring layer is less than or equal to the height of the Mini LED chip, the coloring layer is adhered to the substrate, and the coloring layer is made to show through the top surface or top surface and part of the sidewall of each Mini LED chip, and to be in contact with the semi-cured adhesive film layer.

[0027] By controlling the thickness of the coloring layer to allow the Mini LED chip to show through, it is possible to achieve metal wiring shielding while avoiding the impact of the coloring layer on the chip's luminous efficiency.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The composite encapsulation film provided by this utility model, through the design of nanoimprint structure and composite layer structure, can significantly improve the display effect of Mini LED, and has anti-fingerprint and anti-scratch effects, realizing the multi-functional integration of Mini LED encapsulation. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the Mini LED composite encapsulation film provided in Example 1;

[0031] Figure 2 This is a schematic diagram of the Mini LED packaging structure provided in Example 1;

[0032] Figure 3 This is a schematic diagram of the Mini LED packaging structure provided in Example 4;

[0033] Among them, 1 is the nanoimprint release film layer; 2 is the nanoimprint hardening layer; 3 is the semi-cured adhesive film layer; 4 is the coloring layer; 5 is the light release film layer; 6 is the substrate; and 7 is the Mini LED chip. Detailed Implementation

[0034] It should be understood that in the description of this utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0037] Example 1

[0038] This embodiment provides a method such as Figure 1 The Mini LED composite encapsulation film shown includes a coloring layer 4, a semi-cured film layer 3, and a nano-imprinted hardening layer 2 stacked sequentially.

[0039] The nanoimprinting hardening layer 2 is an acrylic nanoimprinting adhesive layer with a thickness of 20 μm. The other side of the nanoimprinting hardening layer 2 opposite to the semi-cured adhesive film layer 3 is a nanoimprinting surface. The nanoimprinting surface has a first nanoimprinting structure with an array of hemispherical grooves. The surface roughness Ra of the nanoimprinting surface is 1.5.

[0040] The semi-cured adhesive film layer 3 is an epoxy adhesive film layer with a thickness of 80μm.

[0041] Coloring layer 4 is a black modified epoxy film layer with a thickness of 70μm.

[0042] The outer side of the nanoimprinted hardening layer 2 is provided with a nanoimprinted release film layer 1. The surface of the nanoimprinted release film layer 1 adjacent to the nanoimprinted hardening layer 2 has a second nanoimprinted structure. During the encapsulation and curing process, the nanoimprinted release film layer transfers the nanoimprinted structure to the surface of the nanoimprinted hardening layer. The first nanoimprinted structure matches the second nanoimprinted structure.

[0043] A light release film layer 5 is provided on the outer side of the coloring layer 4.

[0044] This embodiment also provides a method such as Figure 2 The Mini LED packaging structure shown includes: a substrate with a Mini LED chip and the Mini LED composite encapsulation film.

[0045] After removing the release film layers on both sides of the Mini LED composite encapsulation film, it is laminated onto the side of the substrate 6 containing the Mini LED chip 7.

[0046] The Mini LED chip 7 has a height of 85μm. The thickness of the coloring layer 4 is less than the height of the Mini LED chip 7. The coloring layer 4 is attached to the surface of the substrate 6. The top surface and part of the sidewalls of the Mini LED chip 7 show through the coloring layer 4 and are in contact with the semi-cured adhesive film layer.

[0047] The packaging method of the Mini LED packaging structure includes:

[0048] After removing the release film from the Mini LED composite encapsulation film, the coloring layer is bonded to the substrate at a bonding pressure of 0.7 MPa and a bonding temperature of 80°C. Then, it is cured at 130°C for 2 hours. After complete curing, the nano-imprint release film is removed to complete the encapsulation.

[0049] Example 2

[0050] This embodiment provides a Mini LED composite encapsulation film, which includes a coloring layer, a semi-cured film layer, and a nano-imprinted hardening layer stacked sequentially.

[0051] The nanoimprinting hardening layer is an epoxy nanoimprinting adhesive layer with a thickness of 10 μm. The other side of the nanoimprinting hardening layer relative to the semi-cured adhesive film layer is a nanoimprinting surface. The nanoimprinting surface has a first nanoimprinting structure with an array of hemispherical grooves. The surface roughness Ra of the nanoimprinting surface is 1.2.

[0052] The semi-cured adhesive film layer is an acrylic adhesive film layer with a thickness of 100μm.

[0053] The coloring layer is a black modified epoxy film layer with a thickness of 50μm.

[0054] A nanoimprint release film is provided on the outer side of the nanoimprint curing layer. The surface of the nanoimprint release film adjacent to the nanoimprint curing layer has a second nanoimprint structure. During the encapsulation and curing process, the nanoimprint release film transfers the nanoimprint structure to the surface of the nanoimprint curing layer. The first nanoimprint structure matches the second nanoimprint structure.

[0055] A light release film layer is provided on the outer side of the coloring layer.

[0056] This embodiment also provides a Mini LED packaging structure, which includes: a substrate with a Mini LED chip and the Mini LED composite encapsulation film.

[0057] After removing the release film layers on both sides of the Mini LED composite encapsulation film, it is laminated onto the side of the substrate containing the Mini LED chip.

[0058] The Mini LED chip has a height of 85μm. The thickness of the coloring layer is less than the height of the Mini LED chip. The coloring layer is attached to the surface of the substrate. The top surface and part of the sidewalls of the Mini LED chip show through the coloring layer and are in contact with the semi-cured adhesive film layer.

[0059] Example 3

[0060] This embodiment provides a Mini LED composite encapsulation film, which includes a coloring layer, a semi-cured film layer, and a nano-imprinted hardening layer stacked sequentially.

[0061] The nanoimprint curing layer is an epoxy nanoimprint adhesive layer with a thickness of 30 μm. The other side of the nanoimprint curing layer relative to the semi-cured adhesive film layer is a nanoimprint surface. The nanoimprint surface has a first nanoimprint structure with an array of hemispherical grooves. The surface roughness Ra of the nanoimprint surface is 1.8.

[0062] The semi-cured adhesive film layer is an acrylic adhesive film layer with a thickness of 50μm.

[0063] The coloring layer is a black modified epoxy film layer with a thickness of 85μm.

[0064] A nanoimprint release film is provided on the outer side of the nanoimprint curing layer. The surface of the nanoimprint release film adjacent to the nanoimprint curing layer has a second nanoimprint structure. During the encapsulation and curing process, the nanoimprint release film transfers the nanoimprint structure to the surface of the nanoimprint curing layer. The first nanoimprint structure matches the second nanoimprint structure.

[0065] A light release film layer is provided on the outer side of the coloring layer.

[0066] This embodiment also provides a Mini LED packaging structure, which includes: a substrate with a Mini LED chip and the Mini LED composite encapsulation film.

[0067] After removing the release film layers on both sides of the Mini LED composite encapsulation film, it is laminated onto the side of the substrate containing the Mini LED chip.

[0068] The Mini LED chip has a height of 85μm, and the thickness of the coloring layer is equal to the height of the Mini LED chip. The coloring layer is attached to the surface of the substrate, and the top surface of the Mini LED chip shows through the coloring layer, which is in contact with the semi-cured adhesive film layer.

[0069] Example 4

[0070] This embodiment provides a Mini LED composite encapsulation film. Compared with Embodiment 1, the thickness of the coloring layer is set to 150μm, and the rest are the same as in Embodiment 1.

[0071] This embodiment also provides a method such as Figure 3 The Mini LED packaging structure shown includes a substrate with a Mini LED chip and a Mini LED composite encapsulating film. Compared to Example 1, the thickness of the coloring layer is greater than that of the Mini LED chip, and the Mini LED chip is completely encapsulated in the coloring layer; otherwise, it is the same as Example 1.

[0072] Comparative Example 1

[0073] This comparative example provides a Mini LED composite encapsulation film, which, compared to Example 1, does not have a coloring layer, but is otherwise the same as Example 1.

[0074] This comparative example also provides a Mini LED packaging structure, which includes: a substrate with a Mini LED chip and the Mini LED composite encapsulating film. Compared to Example 1, the semi-cured encapsulating film layer is directly bonded to the substrate; all other aspects are the same as in Example 1.

[0075] Comparative Example 2

[0076] This comparative example provides a Mini LED composite encapsulation film. Compared with Example 1, the nanoimprint hardening layer of equal thickness is replaced with a hardening layer. That is, no nanoimprint structure is provided on the hardening layer. Correspondingly, the nanoimprint release film on the outside of the nanoimprint hardening layer is replaced with a light release film without a nanoimprint structure. All other aspects are the same as in Example 1.

[0077] This comparative example also provides a Mini LED packaging structure, which includes: a substrate with a Mini LED chip and the Mini LED composite encapsulation film, and the composite structure is the same as that in Example 1.

[0078] The packaged Mini LEDs provided in the examples and comparative examples were tested for reflection and color uniformity.

[0079] The test method was as follows: the packaged Mini LED direct-view screen was powered on and the light emission of the chip was visually observed. The results are shown in Table 1.

[0080] Table 1

[0081]

[0082] As shown in Table 1, encapsulating the Mini LED module with the encapsulating film provided by this invention can effectively improve its color difference problem, effectively improve display contrast, reduce surface gloss of the module, and achieve good display effect. Furthermore, by controlling the thickness of the coloring layer, the luminous efficiency of the chip is not affected while achieving metal wiring shielding.

[0083] In summary, the composite encapsulation film provided by this utility model, through the design of nanoimprint structure and composite layer structure, can significantly improve the display effect of Mini LED, and has anti-fingerprint and anti-scratch effects, realizing the multi-functional integration of Mini LED encapsulation.

[0084] The above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model fall within the protection and disclosure scope of the present utility model.

Claims

1. A Mini LED composite encapsulation film, characterized in that, The Mini LED composite encapsulation film includes a coloring layer, a semi-cured film layer, and a nanoimprinting hardening layer stacked sequentially; the other side of the nanoimprinting hardening layer opposite to the semi-cured film layer is a nanoimprinting surface, and the nanoimprinting surface has a first nanoimprinting structure.

2. The Mini LED composite encapsulation film according to claim 1, characterized in that, The first nanoimprint structure is an array of hemispherical grooves.

3. The Mini LED composite encapsulation film according to claim 1, characterized in that, The surface roughness Ra of the nanoimprint surface is 1.2-1.

8.

4. The Mini LED composite encapsulation film according to claim 1, characterized in that, The nanoimprinting hardening layer includes at least one of an acrylate nanoimprinting adhesive layer, an epoxy nanoimprinting adhesive layer, or a polyurethane nanoimprinting adhesive layer. The thickness of the nanoimprint hardening layer is 10-30 μm.

5. The Mini LED composite encapsulation film according to claim 1, characterized in that, The semi-cured adhesive film layer includes at least one of epoxy adhesive film layer, acrylate adhesive film layer, epoxy-acrylate adhesive film layer or silicone film layer; The thickness of the semi-cured adhesive film layer is 50-100μm.

6. The Mini LED composite encapsulation film according to claim 1, characterized in that, The coloring layer includes at least one of a black modified epoxy film layer, a black modified acrylate film layer, a black modified epoxy-acrylate film layer, or a black modified silicone film layer. The thickness of the coloring layer is 50-150 μm.

7. The Mini LED composite encapsulation film according to claim 6, characterized in that, The thickness of the coloring layer is less than the height of the Mini LED chip.

8. The Mini LED composite encapsulation film according to claim 1, characterized in that, The Mini LED composite encapsulation film further includes: a nanoimprint release film layer disposed on the outside of the nanoimprint hardening layer, wherein the surface of the nanoimprint release film layer adjacent to the nanoimprint hardening layer has a second nanoimprint structure, and the first nanoimprint structure matches the second nanoimprint structure; and a light release film layer disposed on the outside of the coloring layer.

9. A Mini LED packaging structure, characterized in that, The Mini LED packaging structure includes: a substrate having a Mini LED chip and a Mini LED composite encapsulating film as described in any one of claims 1-8; the Mini LED composite encapsulating film is laminated to the side of the substrate having the Mini LED chip.

10. The Mini LED packaging structure according to claim 9, characterized in that, The thickness of the coloring layer is less than or equal to the height of the Mini LED chip. The coloring layer is attached to the substrate, so that the top surface or top surface and part of the sidewall of each Mini LED chip show through the coloring layer and are in contact with the semi-cured adhesive film layer.

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