Semiconductor cleaning apparatus

Abstract

The utility model relates to a kind of semiconductor cleaning device, and the high precision, high uniformity cleaning of wafer is realized by the cooperation of multiple mechanisms. The device is mainly composed of a cleaning tank, a lifting mechanism, a cleaning frame and a cleaning mechanism. The lifting mechanism is driven by an electric cylinder, and cooperates with the sliding fit of the cover plate and the support. It can drive the cleaning frame to lift smoothly, ensuring the wafer to be accurately immersed or separated from the cleaning tank. The cleaning frame adopts a modular design of T-shaped frame and adapter frame. The wafer is fixed in the slot, and the two can be connected detachably. It can adapt to different specifications of wafers, improve the flexibility of operation. In the cleaning mechanism, the motor one drives multiple shafts to rotate synchronously through the transmission wheel set, so that the brush rod cleans the wafer. At the same time, the cylinder can adjust the position of the brush rod. In addition, the reciprocating mechanism at the bottom of the cover plate drives the cleaning frame to reciprocate in rotation through the motor two, further improving the cleaning uniformity, reducing the cleaning dead angle, and avoiding interference with the surrounding structure, ensuring the safety of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning, and in particular to a semiconductor cleaning device. Background Technology

[0002] During the dicing, grinding, and transport processes, wafers are highly susceptible to the adhesion of particulate impurities, organic contaminants, metal ions, and other pollutants to their surfaces. If these contaminants are not thoroughly removed, they can lead to serious problems such as short circuits and device failures. Therefore, wafer cleaning is considered a critical step in the semiconductor manufacturing process to ensure product quality.

[0003] Wafers are typically fixed in baskets or tanks, resulting in small gaps between adjacent wafers. This makes it difficult for cleaning fluid to fully penetrate the gaps, leading to contaminant residue, especially at the wafer edges and back, where cleaning blind spots are easily formed. On the other hand, some devices enhance the cleaning effect through ultrasonic vibration, but high-frequency vibration may damage the delicate structure of the wafer surface, especially for thin ultra-thin wafers, where the risk of damage is more significant, and the actual effect is not as good as conventional mechanical cleaning. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a semiconductor cleaning device.

[0005] The semiconductor cleaning device provided by this utility model adopts the following technical solution:

[0006] A semiconductor cleaning apparatus includes a cleaning tank, a lifting mechanism, a cleaning frame, and a cleaning mechanism. The lifting mechanism is mounted on the cleaning tank and drives the cleaning frame to move up and down. Several support blocks are provided on the side wall of the cleaning tank. The cleaning mechanism includes a cylinder, a connecting frame, a motor, a push plate, a transmission wheel assembly, a sliding bearing, a rotating shaft, and a brush rod. The cylinder is located at the bottom of the cleaning tank, and its output end is connected to the connecting frame. The motor and the push plate are both fixed to the connecting frame. Several rotating shafts are rotatably connected to the push plate. The output end of the motor is connected to the transmission wheel assembly, which drives the rotating shafts to rotate synchronously. The rotating shafts pass through the support blocks and the cleaning tank. The sliding bearing is sleeved on the outside of each rotating shaft. Several cavities are provided inside the support blocks, and the sliding bearing slides into the cavities. The end of each rotating shaft is connected to a brush rod, the diameter of which is smaller than that of the rotating shaft, and the brush rod is provided with bristles.

[0007] Optionally, a fixing ring is provided on the outside of the sliding bearing, and a limiting groove is formed on the outer wall of the fixing ring. A limiting protrusion is provided in the cavity of the support block, and the limiting protrusion is embedded in the limiting groove.

[0008] Optionally, at least two sliding bearings are provided on the rotating shaft.

[0009] Optionally, a sealing ring is provided on the outer wall of the support block.

[0010] Optionally, the lifting mechanism includes an electric cylinder, a bracket, a seat support, and a cover plate. The seat support is disposed on the outer wall of the cleaning tank, the bracket is disposed on the seat support, the cylinder is fixed on the bracket, the output end of the electric cylinder is connected to the cover plate, the bottom of the cover plate is connected to the cleaning rack, the cover plate is slidably engaged with the bracket, and the wafer spacing is fixed on the cleaning rack.

[0011] Optionally, it also includes a reciprocating mechanism, which includes a second motor, a disc, a column, and a docking component. The disc is fixed below the bracket by the column, the second motor is fixed on the disc, the output end of the second motor passes through the disc and connects to the docking component, the docking component is detachably connected to the cleaning rack, and the second motor performs 85° forward and reverse rotation.

[0012] Optionally, the cleaning rack includes a T-shaped frame and an adapter frame. The inner walls of both the T-shaped frame and the adapter frame are provided with a plurality of slots, which are spaced apart. The wafer is inserted into the slot. The T-shaped frame is provided with a sliding groove, and the sliding groove and the end of the T-shaped frame are provided with docking holes. The docking parts are detachably connected to the docking holes by bolts.

[0013] Optionally, four sets of cleaning mechanisms and support blocks are provided, and the four sets of cleaning mechanisms and support blocks are arranged in a ring array along the cleaning tank.

[0014] In summary, this utility model has at least one of the following beneficial technical effects:

[0015] 1. The electric cylinder moves the cleaning frame into the cleaning tank. At this time, the pneumatic cylinder drives the connecting frame to move horizontally. The push plate on the connecting frame drives the rotating shaft to move to the axis of the cleaning tank. Since the part of the rotating shaft inside the support block is equipped with a sliding bearing, the fixing ring on the outer wall of the sliding bearing and the limiting protrusion in the cavity of the support block form a radial lock. Therefore, the sliding bearing can slide in the cavity. The rotating shaft moves the brush rod at the end to the interval of the wafer. The bristles on the brush rod abut against the bottom wall of the wafer. The first motor is started. The first motor drives several rotating shafts to rotate synchronously through the transmission wheel set. The rotating shaft, the push plate and the sliding bearing chamber are rotatably connected. Therefore, the brush rod at the end can rotate to achieve the brushing of the bottom wall of the wafer.

[0016] 2. After the bottom wall of the wafer is cleaned, the cylinder drives the connecting frame to move away from the axis of the cleaning tank. The rotating shaft drives the brush rod to move, and the brush rod retracts into the cavity of the support block. At this time, the electric cylinder precisely controls the cleaning frame to descend by the height of one brush rod diameter. The cylinder drives the connecting frame to retract, and the brush rod continues to be inserted into the wafer gap. At this time, the bristles on the brush rod abut against the upper wall of the wafer, thereby achieving cleaning of both sides of the wafer.

[0017] 3. A reciprocating mechanism is provided at the bottom of the cover plate. The reciprocating mechanism includes a second motor, a disc, a column, and a docking component. The disc is fixed below the bracket by the column. The second motor is fixed on the disc. The output end of the second motor passes through the disc and connects to the docking component. The docking component is detachably connected to the cleaning frame. The second motor rotates in both directions at 85°. In this way, during the rotation, different areas of the wafer surface can alternately contact the brush bristles and the cleaning fluid flow, avoiding insufficient cleaning in certain areas due to a fixed angle. Furthermore, the centrifugal force and shear force generated by the reciprocating rotation can help to flush away the tiny particles attached to the wafer surface. Combined with the physical friction of the brush bristles, this improves the efficiency of contaminant removal. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a semiconductor cleaning device.

[0019] Figure 2 yes Figure 1 Enlarged view of part A in the middle.

[0020] Figure 3 This is a schematic diagram showing the positions of the lifting mechanism, reciprocating mechanism, and cleaning rack.

[0021] Figure 4 This is an exploded view of the cleaning rack.

[0022] Figure 5 This is a schematic diagram of a rotating shaft and a sliding bearing.

[0023] Figure 6 This is a schematic diagram of the drive wheel assembly, brush rod, and cleaning frame.

[0024] Explanation of reference numerals in the attached drawings: 1. Cleaning tank; 2. Lifting mechanism; 21. Electric cylinder; 22. Bracket; 23. Seat support; 24. Cover plate; 3. Cleaning mechanism; 31. Pneumatic cylinder; 32. Connecting frame; 33. Motor 1; 34. Push plate; 35. Transmission wheel set; 36. Sliding bearing; 37. Rotating shaft; 38. Fixing ring; 381. Limiting groove; 39. Brush rod; 391. Brush bristles; 4. Support block; 41. Sealing ring; 5. Reciprocating mechanism; 51. Motor 2; 52. Disc; 53. Column; 54. Connecting part; 6. Cleaning rack; 61. T-shaped frame; 62. Adapter frame; 63. Slot; 64. Slide groove; 7. Wafer. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] Furthermore, "several" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] This utility model discloses a semiconductor cleaning apparatus. (Refer to...) Figure 1-6 A semiconductor cleaning apparatus includes a cleaning tank 1, a lifting mechanism 2, a cleaning frame 6, and a cleaning mechanism 3. The lifting mechanism 2 is mounted on the cleaning tank 1 and drives the cleaning frame 6 to move up and down. The lifting mechanism 2 includes an electric cylinder 21, a bracket 22, a seat support 23, and a cover plate 24. The seat support 23 is mounted on the outer wall of the cleaning tank 1, the bracket 22 is mounted on the seat support 23, and a cylinder 31 is fixed on the bracket 22. The output end of the electric cylinder 21 is connected to the cover plate 24, and the bottom of the cover plate 24 is connected to the cleaning frame 6. The cover plate 24 and the bracket 22 are slidably engaged. Wafers 7 are fixed at intervals on the cleaning frame 6. The cleaning frame 6 includes a T-shaped frame 61 and an adapter frame 62. The inner walls of the T-shaped frame 61 and the adapter frame 62 are provided with a plurality of slots 63, which are spaced apart. Wafers 7 are inserted into the slots 63. The T-shaped frame 61 is provided with a sliding groove 64, and the sliding groove 64 and the end of the T-shaped frame 61 are provided with docking holes. The docking parts 54 are detachably connected to the docking holes by bolts.

[0029] The outer wall of the cleaning tank 1 is provided with several support blocks 4. The cleaning mechanism 3 includes a cylinder 31, a connecting frame 32, a motor 33, a push plate 34, a transmission wheel set 35, a sliding bearing 36, a rotating shaft 37, and a brush rod 39. The cylinder 31 is located at the bottom of the cleaning tank 1, and the output end of the cylinder 31 is connected to the connecting frame 32. The motor 33 and the push plate 34 are both fixed on the connecting frame 32. Several rotating shafts 37 are rotatably connected to the push plate 34. The output end of the motor 33 is connected to the transmission wheel set 35, and the transmission wheel set 35 drives several rotating shafts 37 synchronously. Rotation involves several rotating shafts 37 passing through the support block 4 and the cleaning tank 1. Sliding bearings 36 are fitted around the outside of the rotating shafts 37. The support block 4 has several cavities inside, with the sliding bearings 36 slidingly engaging with the cavities. A brush rod 39 is connected to the end of the rotating shaft 37. The diameter of the brush rod 39 is smaller than that of the rotating shaft 37, and bristles 391 are provided on the brush rod 39. A fixing ring 38 is provided outside the sliding bearing 36. A limiting groove 381 is formed on the outer wall of the fixing ring 38. A limiting protrusion is provided inside the cavity of the support block 4, and the limiting protrusion is embedded in the limiting groove 381.

[0030] With this design, the electric cylinder 21 moves the cleaning rack 6 into the cleaning tank 1. At this time, the cylinder 31 drives the connecting frame 32 to move horizontally. The push plate 34 on the connecting frame 32 drives the rotating shaft 37 to move towards the axis of the cleaning tank 1. Since the rotating shaft 37 is provided with a sliding bearing 36 on the outside of the part inside the support block 4, the fixing ring 38 on the outer wall of the sliding bearing 36 and the limiting protrusion of the cavity inside the support block 4 form a radial lock. Therefore, the sliding bearing 36 can slide in the cavity. The rotating shaft 37 moves the brush rod 39 at the end to the interval of the wafer 7. The bristles 391 on the brush rod 39 abut against the bottom wall of the wafer 7. The motor 33 is started. The motor 33 drives several rotating shafts 37 to rotate synchronously through the transmission wheel set 35. The rotating shaft 37, the push plate 34 and the sliding bearing 36 are rotatably connected. Therefore, the brush rod 39 at the end can rotate to achieve brushing of the bottom wall of the wafer 7.

[0031] After the bottom wall of wafer 7 is cleaned, cylinder 31 drives connecting frame 32 to move away from the axis of cleaning tank 1. Rotating shaft 37 drives brush rod 39 to move. Brush rod 39 is partially retracted into the cavity of support block 4. At this time, electric cylinder 21 precisely controls cleaning frame 6 to descend by the diameter of brush rod 39. Cylinder 31 drives connecting frame 32 to retract. Brush rod 39 continues to be inserted into the gap of wafer 7. At this time, the bristles 391 on brush rod 39 abut against the upper wall of wafer 7, thereby achieving cleaning of both sides of wafer 7.

[0032] At least two sliding bearings 36 are provided on the rotating shaft 37, so that the movement of the rotating shaft 37 will be more stable. The outer wall of the support block 4 is provided with a sealing ring 41. The sealing ring 41 can be a lip sealing ring 41 adapted to rotation and sliding. Such sealing structures are common in the market, so they will not be described in detail in this utility model.

[0033] The bottom of the cover plate 24 is provided with a reciprocating mechanism 5, which includes a second motor 51, a disc 52, a column 53, and a docking part 54. The disc 52 is fixed below the bracket 22 by the column 53. The second motor 51 is fixed on the disc 52. The output end of the second motor 51 passes through the disc 52 and is connected to the docking part 54. The docking part 54 is detachably connected to the cleaning rack 6. The second motor 51 rotates 85° in both directions. In this way, during the rotation of the wafer 7, each area of ​​its surface can alternately contact the brush bristles 391 of the brush rod 39 and the cleaning fluid flow, avoiding insufficient cleaning in some areas due to the fixed angle. In addition, the centrifugal force and shear force generated by the reciprocating rotation can help to flush away the tiny particles attached to the surface of the wafer 7. Combined with the physical friction of the brush bristles 391, the efficiency of contaminant removal is improved.

[0034] To prevent the cleaning rack 6 from touching the brush rod 39 during rotation, the forward and reverse rotation angle of motor 2 51 is set to 85 degrees.

[0035] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A semiconductor cleaning apparatus, characterized in that: The system includes a cleaning tank (1), a lifting mechanism (2), a cleaning rack (6), and a cleaning mechanism (3). The lifting mechanism (2) is mounted on the cleaning tank (1) and drives the cleaning rack (6) to move up and down. Several support blocks (4) are provided on the side wall of the cleaning tank (1). The cleaning mechanism (3) includes a cylinder (31), a connecting frame (32), a motor (33), a push plate (34), a transmission wheel set (35), a sliding bearing (36), a rotating shaft (37), and a brush rod (39). The cylinder (31) is located at the bottom of the cleaning tank (1), and the output end of the cylinder (31) is connected to the connecting frame (32). The motor (33) and the push plate (34) are both fixed on the bottom wall. On the connecting frame (32), a plurality of rotating shafts (37) are rotatably connected to the push plate (34). The output end of the motor (33) is connected to the transmission wheel set (35). The transmission wheel set (35) drives the plurality of rotating shafts (37) to rotate synchronously. The plurality of rotating shafts (37) pass through the support block (4) and the cleaning tank (1). The rotating shaft (37) is fitted with a sliding bearing (36). The support block (4) has a plurality of cavities inside. The sliding bearing (36) slides with the cavities. The end of the rotating shaft (37) is connected to the brush rod (39). The diameter of the brush rod (39) is smaller than that of the rotating shaft (37). The brush rod (39) is provided with bristles (391).

2. The semiconductor cleaning apparatus according to claim 1, characterized in that: The sliding bearing (36) is provided with a fixing ring (38) on its outside. The outer wall of the fixing ring (38) is provided with a limiting groove (381). The cavity of the support block (4) is provided with a limiting protrusion, which is embedded in the limiting groove (381).

3. The semiconductor cleaning apparatus according to claim 2, characterized in that: At least two sliding bearings (36) are provided on the rotating shaft (37).

4. The semiconductor cleaning apparatus according to claim 1, characterized in that: The outer wall of the support block (4) is provided with a sealing ring (41).

5. A semiconductor cleaning apparatus according to claim 1, characterized in that: The lifting mechanism (2) includes an electric cylinder (21), a bracket (22), a seat support (23), and a cover plate (24). The seat support (23) is disposed on the outer wall of the cleaning tank (1). The bracket (22) is disposed on the seat support (23). The cylinder (31) is fixed on the bracket (22). The output end of the electric cylinder (21) is connected to the cover plate (24). The bottom of the cover plate (24) is connected to the cleaning rack (6). The cover plate (24) and the bracket (22) are slidably engaged. The wafers (7) are fixed at intervals on the cleaning rack (6).

6. A semiconductor cleaning apparatus according to claim 5, characterized in that: It also includes a reciprocating mechanism (5), which includes a second motor (51), a disc (52), a column (53), and a docking part (54). The disc (52) is fixed below the bracket (22) by the column (53). The second motor (51) is fixed on the disc (52). The output end of the second motor (51) passes through the disc (52) and is connected to the docking part (54). The docking part (54) is detachably connected to the cleaning rack (6). The second motor (51) rotates 85° in both directions.

7. A semiconductor cleaning apparatus according to claim 6, characterized in that: The cleaning rack (6) includes a T-shaped frame (61) and an adapter frame (62). The inner walls of the T-shaped frame (61) and the adapter frame (62) are provided with a plurality of slots (63). The plurality of slots (63) are spaced apart. The wafer (7) is inserted into the slot (63). The T-shaped frame (61) is provided with a sliding groove (64). The sliding groove (64) and the end of the T-shaped frame (61) are provided with docking holes. The docking part (54) is detachably connected to the docking hole by bolts.

8. A semiconductor cleaning apparatus according to claim 1, characterized in that: The cleaning mechanism (3) and the support block (4) are each provided in four sets, and the four sets of the cleaning mechanism (3) and the support block (4) are arranged in a ring array along the cleaning tank (1).

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