An automatic flipping and loading structure for semiconductor cleaning carriers

Abstract

This utility model discloses an automatic tilting and loading structure for semiconductor cleaning carriers, including a mounting frame and a guide groove on its top. A servo motor is fixedly mounted on the right side of the mounting frame. The output shaft of the servo motor passes through and extends into the interior of the guide groove. A lead screw is connected to the output shaft of the servo motor, and a bearing seat is threaded onto the lead screw. A rotating shaft is rotatably connected to the inner wall of the bearing seat. A tilting motor is fixedly mounted on the front side of the bearing seat, and the output shaft of the tilting motor is connected to the rotating shaft. An electric push rod is fixedly mounted on the rotating shaft. This utility model's automatic tilting and loading structure for semiconductor cleaning carriers adjusts the working radius and fine-tunes the position using a servo motor, selects a suitable gripper using a switching motor, and achieves the tilting of the carrier through the tilting motor and the rotating shaft, thus completing the automatic tilting and loading operation for semiconductor cleaning carriers of different materials.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, and more specifically, to an automatic flipping and loading structure for a semiconductor cleaning carrier. Background Technology

[0002] In semiconductor manufacturing, cleaning is a crucial step that directly impacts the performance and yield of semiconductor devices. To ensure effective cleaning, semiconductors typically require placement in specialized cleaning carriers. However, several issues remain to be addressed in the loading process of these semiconductor cleaning carriers.

[0003] Traditional semiconductor cleaning carrier loading methods mostly rely on manual operation. Manual loading is not only inefficient and unable to meet the demands of large-scale production, but it is also susceptible to human factors such as operator fatigue and mood, leading to inaccurate loading positions and unstable carrier placement, which in turn affects the subsequent cleaning quality. Furthermore, manual operation poses certain safety hazards, such as the possibility of injury to operators from contact with cleaning solutions and other chemicals.

[0004] While some existing automated loading equipment improves loading efficiency to some extent, its functionality is relatively limited. These devices often only perform simple linear loading and cannot rotate the cleaning carrier. However, in actual semiconductor cleaning processes, some processes require the carrier to be loaded at specific angles or orientations, or the carrier needs to be rotated during cleaning to ensure thorough cleaning of all parts. Existing equipment cannot meet these diverse process requirements, limiting further optimization and improvement of semiconductor cleaning processes.

[0005] Furthermore, semiconductor cleaning carriers made of different materials, such as glass and metal, require different clamping methods. Glass carriers have relatively fragile surfaces, necessitating clamping methods that won't cause scratches or damage; while metal carriers are typically heavier, requiring stable clamping methods. Most existing loading equipment only supports a single clamping method and cannot flexibly switch according to the carrier's material. This leads to situations where clamping is insecure or the carrier is damaged when handling carriers of different materials. Utility Model Content

[0006] In view of the problems existing in the prior art, the purpose of this utility model is to provide an automatic flipping and feeding structure for semiconductor cleaning carriers, which can complete the automatic flipping and feeding operation of semiconductor cleaning carriers of different materials, improve production efficiency, and solve the problems in the background technology.

[0007] To achieve the above objectives, the present invention adopts the following technical solution;

[0008] An automatic flipping and loading structure for a semiconductor cleaning carrier includes a mounting frame and a guide groove formed on its top. A servo motor is fixedly mounted on the right side of the mounting frame. The output shaft of the servo motor passes through and extends into the interior of the guide groove. A lead screw is connected to the output shaft of the servo motor. A bearing seat is threaded onto the lead screw. A rotating shaft is rotatably connected to the inner wall of the bearing seat. A flipping motor is fixedly mounted on the front side of the bearing seat. The output shaft of the flipping motor is connected to the rotating shaft. An electric push rod is fixedly mounted on the rotating shaft. A clamping assembly is fixedly mounted on the output end of the electric push rod.

[0009] The clamping assembly includes a mounting frame, which is fixedly mounted on the output end of the electric push rod. A switching motor is fixedly mounted on the front of the mounting frame, and a switching seat is fixedly mounted on the output shaft of the switching motor. The switching seat is rotatably connected to the inner wall of the mounting frame, and a vacuum gripper and an electromagnetic gripper are fixedly mounted on the left and right sides of the switching seat, respectively.

[0010] As a further description of the above technical solution: guide blocks are fixedly connected to both sides of the bearing seat, and the guide blocks are slidably connected to the inner wall of the guide groove.

[0011] As a further description of the above technical solution: the top of the mounting bracket is provided with evenly distributed scale marks, which are located on the front of the support.

[0012] As a further description of the above technical solution: an industrial camera is fixedly mounted on the mounting frame, and the industrial camera is located on the back of the switching base.

[0013] As a further description of the above technical solution: a speed reducer is fixedly installed on the front of the bearing seat, and both the tilting motor and the rotating shaft are connected to the speed reducer.

[0014] Compared with existing technologies, the advantages of this utility model are:

[0015] This utility model discloses an automatic flipping and loading structure for semiconductor cleaning carriers. The structure adjusts the working radius and fine-tunes the position using a servo motor, selects the appropriate gripper by switching motors, and flips the carrier through a flipping motor and a rotating shaft to complete the automatic flipping and loading operation for semiconductor cleaning carriers of different materials. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a side sectional view of the bearing seat structure of this utility model;

[0018] Figure 3This is a three-dimensional structural diagram of the clamping component of this utility model.

[0019] Explanation of the labels in the diagram:

[0020] 1. Mounting bracket; 2. Guide groove; 3. Servo motor; 4. Lead screw; 5. Bearing seat; 6. Rotary shaft; 7. Tilting motor; 8. Electric push rod; 9. Clamping assembly; 901. Mounting frame; 902. Switching motor; 903. Switching seat; 904. Vacuum gripper; 905. Electromagnetic gripper; 10. Guide block; 11. Scale markings; 12. Industrial camera; 13. Reducer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model;

[0022] Please see Figures 1-3 In this utility model, an automatic flipping and feeding structure for a semiconductor cleaning carrier includes a mounting frame 1 and a guide groove 2 formed on its top. A servo motor 3 is fixedly installed on the right side of the mounting frame 1. The output shaft of the servo motor 3 passes through and extends into the interior of the guide groove 2. A lead screw 4 is connected to the output shaft of the servo motor 3. A bearing seat 5 is threadedly connected to the lead screw 4. A rotating shaft 6 is rotatably connected to the inner wall of the bearing seat 5. A flipping motor 7 is fixedly installed on the front side of the bearing seat 5. The output shaft of the flipping motor 7 is connected to the rotating shaft 6. An electric push rod 8 is fixedly installed on the rotating shaft 6. A clamping assembly 9 is fixedly installed on the output end of the electric push rod 8.

[0023] The clamping assembly 9 includes a mounting frame 901, which is fixedly mounted on the output end of the electric push rod 8. A switching motor 902 is fixedly mounted on the front of the mounting frame 901. A switching seat 903 is fixedly mounted on the output shaft of the switching motor 902. The switching seat 903 is rotatably connected to the inner wall of the mounting frame 901. Vacuum grippers 904 and electromagnetic grippers 905 are fixedly mounted on the left and right sides of the switching seat 903, respectively.

[0024] Guide blocks 10 are fixedly connected to both sides of the bearing seat 5, and the guide blocks 10 are slidably connected to the inner wall of the guide groove 2; a reducer 13 is fixedly installed on the front of the bearing seat 5, and the flip motor 7 and the rotating shaft 6 are both connected to the reducer 13.

[0025] The vacuum gripper 904 and the electromagnetic gripper 905 are both commonly used components. The vacuum gripper 904 is mainly composed of a suction cup, a vacuum generator, a connecting tube, and a gripper bracket. It will not scratch or damage the surface of the glass carrier and can ensure the integrity of the carrier. It is suitable for glass semiconductor cleaning carriers with high surface quality requirements. The electromagnetic gripper 905 is composed of an electromagnet, an iron core, a gripper body, and a control circuit. It can stably grip heavy metal carriers and is simple to operate with a fast response speed.

[0026] When it is necessary to load the semiconductor cleaning carrier, the operator starts the servo motor 3. The output shaft of the servo motor 3 rotates, which drives the lead screw 4 connected to it to rotate. The rotation of the lead screw 4 causes the carrier 5 to move linearly along the guide groove 2, thereby adjusting the position of the carrier 5, realizing the adjustment of the working radius, and can be fine-tuned to achieve a suitable loading position.

[0027] After the carrier 5 is moved to the appropriate position, select the appropriate gripper according to the material of the semiconductor cleaning carrier. If it is a glass semiconductor cleaning carrier, since it has high requirements for surface quality, it is necessary to avoid scratching or damage. At this time, start the switching motor 902. The output shaft of the switching motor 902 drives the switching seat 903 to rotate on the inner wall of the mounting frame 901, rotating the vacuum gripper 904 to the appropriate working position. It will not scratch or damage the surface of the glass carrier, and can ensure the integrity of the carrier. Start the electric push rod 8. The output end of the electric push rod 8 extends, driving the mounting frame 901 and the vacuum gripper 904 to approach the glass carrier. The vacuum gripper 904 works to clamp the glass carrier.

[0028] If the semiconductor cleaning carrier is made of metal, it needs to be held stably due to its weight. Similarly, start the switching motor 902 to rotate the electromagnetic gripper 905 to the working position. The electromagnetic gripper 905 is composed of an electromagnet, an iron core, a gripper body and a control circuit. It can stably hold heavy metal carriers and is easy to operate with a fast response speed. Start the electric push rod 8 to bring the electromagnetic gripper 905 close to the metal carrier and clamp it.

[0029] When it is necessary to flip the carrier, the flipping motor 7 is started. Since both the flipping motor 7 and the rotating shaft 6 are connected to the reducer 13, the reducer 13 can adjust the output speed and torque of the flipping motor 7, so that the rotating shaft 6 can rotate smoothly. The rotation of the rotating shaft 6 drives the electric push rod 8 and the clamping assembly 9 to rotate as a whole, thereby realizing the flipping of the clamped semiconductor cleaning carrier to meet different feeding requirements.

[0030] In this invention, the automatic flipping and loading structure of the semiconductor cleaning carrier adjusts the working radius and fine-tunes the position by using the servo motor 3, selects the appropriate gripper by using the switching motor 902, and realizes the flipping of the carrier by using the flipping motor 7 and the rotating shaft 6, thereby completing the automatic flipping and loading operation of semiconductor cleaning carriers of different materials.

[0031] Please see Figure 1 The mounting bracket 1 has evenly distributed scale lines 11 on its top, and the scale lines 11 are located on the front of the bearing seat 5.

[0032] In this invention, when adjusting the position of the bearing seat 5, the position can be initially estimated based on the position of the scale mark 11, thereby reducing the number of operation steps.

[0033] Please see Figure 1 and 3 An industrial camera 12 is fixedly mounted on the mounting frame 901, and the industrial camera 12 is located on the back of the switching base 903.

[0034] In this invention, before clamping the semiconductor cleaning carrier, the industrial camera 12 can capture the carrier pattern, thereby obtaining and saving the image for subsequent use.

[0035] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. An automatic flipping and loading structure for a semiconductor cleaning carrier, comprising a mounting frame (1) and a guide groove (2) formed on its top, characterized in that: A servo motor (3) is fixedly installed on the right side of the mounting bracket (1). The output shaft of the servo motor (3) passes through and extends into the interior of the guide groove (2). A lead screw (4) is connected to the output shaft of the servo motor (3). A bearing seat (5) is threaded onto the lead screw (4). A rotating shaft (6) is rotatably connected to the inner wall of the bearing seat (5). A flip motor (7) is fixedly installed on the front side of the bearing seat (5). The output shaft of the flip motor (7) is connected to the rotating shaft (6). An electric push rod (8) is fixedly installed on the rotating shaft (6). A clamping assembly (9) is fixedly installed on the output end of the electric push rod (8). The clamping assembly (9) includes a mounting frame (901), which is fixedly mounted on the output end of the electric push rod (8). A switching motor (902) is fixedly mounted on the front of the mounting frame (901), and a switching seat (903) is fixedly mounted on the output shaft of the switching motor (902). The switching seat (903) is rotatably connected to the inner wall of the mounting frame (901). Vacuum grippers (904) and electromagnetic grippers (905) are fixedly mounted on the left and right sides of the switching seat (903), respectively.

2. The automatic flipping and feeding structure for a semiconductor cleaning carrier according to claim 1, characterized in that: Guide blocks (10) are fixedly connected to both sides of the bearing seat (5), and the guide blocks (10) are slidably connected to the inner wall of the guide groove (2).

3. The automatic flipping and loading structure for a semiconductor cleaning carrier according to claim 1, characterized in that: The top of the mounting bracket (1) is provided with evenly distributed scale lines (11), which are located on the front of the support base (5).

4. The automatic flipping and feeding structure for a semiconductor cleaning carrier according to claim 1, characterized in that: An industrial camera (12) is fixedly mounted on the mounting frame (901), and the industrial camera (12) is located on the back of the switching base (903).

5. The automatic flipping and loading structure for a semiconductor cleaning carrier according to claim 1, characterized in that: A speed reducer (13) is fixedly installed on the front of the bearing seat (5), and the flipping motor (7) and the rotating shaft (6) are both connected to the speed reducer (13).

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