Wafer transfer device with mobile centering structure

Abstract

The utility model provides a kind of wafer transmission device with movable centering structure, it includes support assembly component, transverse transfer assembly, horizontal shift drive assembly, vertical load support component, vertical drive assembly, wafer clamping assembly and clamping drive assembly, the device is formed mechanical hard limit by limiting side plate and clamping push plate, cooperate vacuum suction port to realize wafer centering operation, effectively eliminate wafer circle center deviation problem, realize horizontal accurate delivery by horizontal shift motor drive synchronous pulley, cooperate vertical cylinder and clamping cylinder complete vertical lifting and lateral clamping, each movement unit does not interfere with each other, significantly improve transmission efficiency, both can satisfy the stringent requirement of positioning accuracy to semiconductor detection, can also adapt to production line high-speed operation demand.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to a wafer transport device with a movable centering structure. Background Technology

[0002] Patent document CN117901145A discloses a wafer transfer device, which mainly consists of an XYZ linear module and a robotic arm. The XYZ linear module is responsible for driving the robotic arm to make precise position adjustments along the X, Y, and / or Z axes in three-dimensional space, ensuring that the robotic arm can accurately reach any designated position in the workspace. Multiple sets of buffer arm modules and connecting arm modules surround the ESC chuck, forming multiple closed motion chains. During transfer, the wafer maintains a stable position and orientation, effectively preventing slippage. The telecentric mechanism ensures that the wafer receives uniform and stable support force, improving transfer reliability. Furthermore, the design of the XYZ linear module further enhances the movement stability and accuracy of the robotic arm, enabling the wafer to move smoothly and accurately in three-dimensional space. However, this wafer transfer device uses a truss structure, which occupies a large space, and the lack of centering during wafer transfer makes it prone to connection deviations, affecting product quality and production efficiency. Therefore, it is necessary to optimize its structure to overcome the above-mentioned defects. Utility Model Content

[0003] The purpose of this invention is to provide a wafer transport device with a movable centering structure.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A wafer transport device with a movable centering structure, comprising:

[0006] A support assembly component having an assembly space;

[0007] A lateral transfer assembly is installed in a support assembly via a lateral guide structure. It has a wafer carrying space inside and the wafer is carried by the lateral transfer assembly to move laterally in the support assembly.

[0008] A transverse drive assembly is installed in the support assembly assembly and cooperates with the transverse transfer assembly, which drives the transverse transfer assembly to move laterally.

[0009] A vertical support assembly, which is installed in the support assembly via a vertical guide structure and can move vertically within the support assembly;

[0010] A vertical drive assembly is installed in the support assembly and cooperates with the vertical support assembly. The vertical drive assembly drives the vertical support assembly to move vertically.

[0011] A wafer clamping assembly is installed in a vertical carrier assembly via a lateral guide structure. It can move vertically together with the vertical carrier assembly and can also move laterally independently within the vertical carrier assembly to move closer to or further away from the lateral transfer assembly. The wafer clamping assembly performs clamping and centering operations on the wafer in the lateral transfer assembly.

[0012] A clamping drive assembly is installed in the vertical support assembly and cooperates with the wafer clamping assembly. The clamping drive assembly drives the wafer clamping assembly to move laterally.

[0013] Specifically, the supporting assembly components include:

[0014] A support base, which is arranged laterally and formed by enclosing plates;

[0015] An assembly stand is installed in a support base and arranged vertically. Lateral transfer components and vertical support components are installed in the assembly stand.

[0016] Lateral transfer components include:

[0017] A horizontal support plate is located above the assembly stand and is arranged horizontally. Its top is provided with an adsorption port connected to the vacuum equipment through a pipeline. A limiting side plate is also installed on the horizontal support plate. The limiting side plate is adapted to the shape of the wafer side. The horizontal support plate provides vertical support and adsorption positioning for the wafer, and the limiting side plate provides horizontal limiting for the wafer side.

[0018] A transverse slide rail is installed on the top of the assembly stand. The transverse seat plate moves along the transverse slide rail by means of a slider.

[0019] The lateral movement drive components include:

[0020] A transverse belt is arranged in the transverse direction. Its two ends are respectively installed in the assembly stand through synchronous pulleys. It can reciprocate in the transverse direction in the assembly stand. The transverse seat plate is connected to the transverse belt through a transition support plate and is moved together by the transverse belt.

[0021] A transverse motor is installed in the assembly frame. Its power output shaft is connected to a synchronous pulley, and the transverse motor drives the synchronous pulley and the transverse belt to rotate.

[0022] The vertical support assembly includes:

[0023] The support plate is located above the assembly stand, is arranged laterally, and is located outside the lateral support plate;

[0024] The vertical guide column is installed at the bottom of the support plate and arranged vertically. It cooperates with the support plate through a linear guide rail, so that the support plate can move along the vertical guide column in the assembly stand.

[0025] The vertical drive components include:

[0026] A vertical cylinder, the cylinder body of which is installed in the assembly stand, has a piston rod that is parallel to the vertical guide column and engages with the carrier plate, and the carrier plate is moved by the vertical cylinder.

[0027] The wafer clamping assembly includes:

[0028] A clamping base plate is located above the carrier base plate and is arranged laterally. A clamping push plate is installed on its top, which is adapted to the shape of the wafer side.

[0029] The clamping guide groove is provided in pairs. Each clamping guide groove is installed on the top of the carrier plate and is parallel to the transverse slide rail. The bottom of the clamping plate is connected to the clamping guide groove through roller bearings and can move along the clamping guide groove. The clamping push plate performs clamping and centering operation on the side of the wafer.

[0030] The clamping drive assembly includes:

[0031] A clamping cylinder has its cylinder body mounted on a support plate. Its piston rod is parallel to the clamping guide groove and engages with the clamping plate. The clamping cylinder drives the clamping plate to move.

[0032] The advantages of this utility model are:

[0033] This device forms a mechanical hard limit through the limiting side plate and the clamping push plate, and realizes the wafer centering operation in conjunction with the vacuum adsorption port, effectively eliminating the problem of wafer center offset. The horizontal transfer motor drives the synchronous pulley to achieve precise horizontal transport, and the vertical cylinder and clamping cylinder complete the vertical lifting and lateral clamping. The motion units do not interfere with each other, which significantly improves the transmission efficiency. It can not only meet the stringent requirements of semiconductor testing for positioning accuracy, but also adapt to the high-speed operation needs of the production line. Attached Figure Description

[0034] Figure 1 This is a front structural schematic diagram of the wafer transmission device with a movable centering structure proposed in this utility model;

[0035] Figure 2 This is a schematic diagram of the back structure of the wafer transfer device. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0037] like Figure 1 , Figure 2 As shown, the wafer transfer device with a movable centering structure proposed in this utility model includes a support assembly assembly, a lateral transfer assembly, a lateral drive assembly, a vertical support assembly, a vertical drive assembly, a wafer clamping assembly, and a clamping drive assembly. The support assembly assembly has an assembly space. The lateral transfer assembly is installed in the support assembly assembly through a lateral guide structure and has a wafer carrying space inside. The lateral transfer assembly carries the wafer and moves it laterally in the support assembly assembly. The lateral drive assembly is installed in the support assembly assembly and cooperates with the lateral transfer assembly. The lateral drive assembly drives the lateral transfer assembly to move laterally. The vertical support assembly is installed through a vertical guide structure. In the support assembly, it can move vertically. The vertical drive assembly is installed in the support assembly and cooperates with the vertical support assembly. The vertical drive assembly drives the vertical support assembly to move vertically. The wafer clamping assembly is installed in the vertical support assembly through the lateral guide structure. It can move vertically together with the vertical support assembly and can move laterally independently in the vertical support assembly to move closer to or away from the lateral transfer assembly. The wafer clamping assembly performs clamping and centering operations on the wafer in the lateral transfer assembly. The clamping drive assembly is installed in the vertical support assembly and cooperates with the wafer clamping assembly. The clamping drive assembly drives the wafer clamping assembly to move laterally.

[0038] In this embodiment, the support assembly assembly includes a support base 110 and an assembly stand 120. The support base is arranged horizontally and is formed by enclosing plates. The assembly stand is installed in the support base and is arranged vertically. The horizontal transfer assembly and the vertical support assembly are installed in the assembly stand.

[0039] The lateral transfer assembly includes a lateral seat plate 210 and a lateral slide rail 220. The lateral seat plate is located above the assembly stand and is arranged laterally. Its top has an adsorption port 211 connected to a vacuum device via a pipe. A limiting side plate 230 is also installed on the lateral seat plate. This limiting side plate is adapted to the shape of the wafer side. The lateral seat plate provides vertical support and adsorption positioning for the wafer, and the limiting side plate provides lateral limiting for the wafer side. The lateral slide rail is installed on the top of the assembly stand. The lateral seat plate can move along the lateral slide rail by cooperating with a slider. In this embodiment, there are three adsorption ports. In this embodiment, a pair of limiting end posts 221 are also provided on the top of the assembly stand. Each limiting end post is located at one end of the lateral slide rail and can limit the movement range of the lateral seat plate.

[0040] The transverse drive assembly includes a transverse belt 310 and a transverse motor 320. The transverse belt is arranged transversely, and its two ends are respectively installed in the assembly stand via synchronous pulleys. It can reciprocate transversely in the assembly stand. The transverse seat plate is connected to the transverse belt via a transition support plate. The transverse belt carries the transverse seat plate to move together. The transverse motor is installed in the assembly stand, and its power output shaft is connected to the synchronous pulley. The transverse motor drives the synchronous pulley and the transverse belt to rotate.

[0041] The vertical support assembly includes a support base plate 410 and a vertical guide column 420. The support base plate is located above the assembly stand, arranged horizontally, and located outside the horizontal support plate. The vertical guide column is installed at the bottom of the support base plate and arranged vertically. It cooperates with the support base plate through a linear guide rail, so that the support base plate can move along the vertical guide column in the assembly stand.

[0042] The vertical drive assembly includes a vertical cylinder 500. The cylinder body of the vertical cylinder is installed in the assembly stand. Its piston rod is parallel to the vertical guide column and engages with the carrier plate. The vertical cylinder drives the carrier plate to move.

[0043] The wafer clamping assembly includes a clamping base plate 610 and a clamping guide groove 620. The clamping base plate is located above the carrier base plate and is arranged laterally. A clamping push plate 630 is installed on its top, which is adapted to the shape of the wafer side. A pair of clamping guide grooves are provided, each clamping guide groove is installed on the top of the carrier base plate and is parallel to the transverse slide rail. The bottom of the clamping base plate cooperates with the clamping guide groove through roller bearings and can move along the clamping guide groove. The clamping push plate performs clamping and centering operations on the wafer side.

[0044] The clamping drive assembly includes a clamping cylinder 710. The cylinder body of the clamping cylinder is mounted on the carrier plate, and its piston rod is parallel to the clamping guide groove and engages with the clamping plate. The clamping cylinder drives the clamping plate to move, causing the clamping push plate to move away from or towards the wafer side. In this embodiment, a reset spring 720 is provided between the clamping plate and the carrier plate. The reset spring is parallel to the clamping guide groove and drives the clamping push plate away from the wafer side.

[0045] The wafer is first placed on the horizontal mounting plate and fixed by the vacuum adsorption port. A limiting side plate provides initial lateral positioning of the wafer. A transverse motor drives a transverse belt via a synchronous pulley, moving the horizontal mounting plate along the transverse slide rail and transporting the wafer to the vicinity of the clamping push plate. A vertical cylinder in the vertical drive assembly pushes the carrier plate upwards along the vertical guide post, aligning the clamping push plate with the wafer edge. A clamping cylinder drives the clamping plate laterally along the clamping guide groove, causing the clamping push plate to contact the wafer side and clamp it together with the limiting side plate, forcibly correcting the wafer's center. A reset spring provides rebound force after clamping, resetting the push plate and disengaging it from the wafer edge. Simultaneously, the vertical cylinder lowers the carrier plate to its initial position. The transverse motor continues to operate, driving the transverse belt via a synchronous pulley, moving the horizontal mounting plate along the transverse slide rail and transporting the wafer to the target station. The movement range is limited by the limiting end post at the top of the assembly stand. Throughout the process, the vacuum adsorption system maintains the wafer's stable position to prevent displacement during transport.

[0046] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer transport device with a movable centering structure, characterized in that, include: A support assembly component having an assembly space; A lateral transfer assembly is installed in a support assembly via a lateral guide structure. It has a wafer carrying space inside and the wafer is carried by the lateral transfer assembly to move laterally in the support assembly. A transverse drive assembly is installed in the support assembly assembly and cooperates with the transverse transfer assembly, which drives the transverse transfer assembly to move laterally. A vertical support assembly, which is installed in the support assembly via a vertical guide structure and can move vertically within the support assembly; A vertical drive assembly is installed in the support assembly and cooperates with the vertical support assembly. The vertical drive assembly drives the vertical support assembly to move vertically. A wafer clamping assembly is installed in a vertical carrier assembly via a lateral guide structure. It can move vertically together with the vertical carrier assembly and can also move laterally independently within the vertical carrier assembly to move closer to or further away from the lateral transfer assembly. The wafer clamping assembly performs clamping and centering operations on the wafer in the lateral transfer assembly. A clamping drive assembly is installed in the vertical support assembly and cooperates with the wafer clamping assembly. The clamping drive assembly drives the wafer clamping assembly to move laterally.

2. The wafer transport device with a movable centering structure according to claim 1, characterized in that, Support assembly components include: A support base, which is arranged laterally and formed by enclosing plates; An assembly stand is installed in a support base and arranged vertically. Lateral transfer components and vertical support components are installed in the assembly stand.

3. A wafer transport device with a movable centering structure according to claim 2, characterized in that, Lateral transfer components include: A horizontal support plate is located above the assembly stand and is arranged horizontally. Its top is provided with an adsorption port connected to the vacuum equipment through a pipeline. A limiting side plate is also installed on the horizontal support plate. The limiting side plate is adapted to the shape of the wafer side. The horizontal support plate provides vertical support and adsorption positioning for the wafer, and the limiting side plate provides horizontal limiting for the wafer side. A transverse slide rail is installed on the top of the assembly stand. The transverse seat plate moves along the transverse slide rail by means of a slider.

4. A wafer transport device with a movable centering structure according to claim 3, characterized in that, The lateral movement drive components include: A transverse belt is arranged in the transverse direction. Its two ends are respectively installed in the assembly stand through synchronous pulleys. It can reciprocate in the transverse direction in the assembly stand. The transverse seat plate is connected to the transverse belt through a transition support plate and is moved together by the transverse belt. A transverse motor is installed in the assembly frame. Its power output shaft is connected to a synchronous pulley, and the transverse motor drives the synchronous pulley and the transverse belt to rotate.

5. A wafer transport device with a movable centering structure according to claim 3, characterized in that, The vertical support assembly includes: The support plate is located above the assembly stand, is arranged laterally, and is located outside the lateral support plate; The vertical guide column is installed at the bottom of the support plate and arranged vertically. It cooperates with the support plate through a linear guide rail, so that the support plate can move along the vertical guide column in the assembly stand.

6. A wafer transport device with a movable centering structure according to claim 5, characterized in that, The vertical drive components include: A vertical cylinder, the cylinder body of which is installed in the assembly stand, has a piston rod that is parallel to the vertical guide column and engages with the carrier plate, and the carrier plate is moved by the vertical cylinder.

7. A wafer transport device with a movable centering structure according to claim 5, characterized in that, The wafer clamping assembly includes: A clamping base plate is located above the carrier base plate and is arranged laterally. A clamping push plate is installed on its top, which is adapted to the shape of the wafer side. The clamping guide groove is provided in pairs. Each clamping guide groove is installed on the top of the carrier plate and is parallel to the transverse slide rail. The bottom of the clamping plate is connected to the clamping guide groove through roller bearings and can move along the clamping guide groove. The clamping push plate performs clamping and centering operation on the side of the wafer.

8. A wafer transport device with a movable centering structure according to claim 7, characterized in that, The clamping drive assembly includes: A clamping cylinder has its cylinder body mounted on a support plate. Its piston rod is parallel to the clamping guide groove and engages with the clamping plate. The clamping cylinder drives the clamping plate to move.

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