Optical computing chip wafer carrier

Abstract

The device is a kind of optical computing chip wafer carrier, relating to the field of semiconductor testing. It includes a carrier main frame, a cavity and a mounting cavity are arranged in the frame and are independent of each other along the height, a wafer bearing unit is arranged on the outer periphery of the rotating main shaft rotating in the cavity, the main shaft extends to the mounting cavity and is connected with an intermittent driving mechanism, the intermittent driving assembly is provided with a locking mechanism, the bottom end of the frame has a supporting leg, and one side has a door plate. The device can isolate driving interference, accurately adjust and lock the angle of the wafer, improve the bearing efficiency and maintenance convenience, and meet the high-precision testing requirements of the optical computing chip wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a wafer carrier for optical computing chips. Background Technology

[0002] In the research and development and production of optical computing chips, wafer testing is a key link to ensure chip performance and yield. It has extremely high requirements for the stability of the testing environment, wafer carrying capacity and workstation alignment accuracy. However, current wafer carriers on the market generally suffer from several technical shortcomings: On the one hand, the drive mechanism (such as motors and transmission components) of the carrier is not effectively isolated from the wafer carrying space. Mechanical vibrations and component wear debris generated during the drive process can directly interfere with the wafer testing environment, leading to test data deviations and making it difficult to meet the high-precision testing requirements of optical computing chips. On the other hand, the existing carriers have simple wafer carrying structure designs, mostly single-layer or with a small number of carrying positions, which can only carry a small number of wafers at a time, resulting in low testing efficiency and failing to meet the high-efficiency testing requirements of large-scale mass production scenarios. At the same time, the angle adjustment mechanism of most carriers is difficult to achieve precise intermittent rotation, making it difficult to stably align the wafer with the test station, and lacks a reliable locking mechanism. After the wafer reaches the target angle, it is easy for the angle to deviate due to external forces or vibrations, further affecting the testing stability. In addition, some carriers also have problems such as inconvenient wafer handling, poor overall placement stability, and difficult internal maintenance, which seriously restrict the smoothness and reliability of the optical computing chip wafer testing process. Therefore, we propose an optical computing chip wafer carrier. Utility Model Content

[0003] In view of the problems existing in the prior art, this utility model is proposed.

[0004] To solve the above technical problems, this utility model provides the following technical solution: a wafer carrier for optical computing chips, including a main frame of the carrier, a cavity is formed in the main frame of the carrier, a rotating spindle is rotatably arranged in the cavity, and a plurality of wafer carrying units are arranged in a circular array on the outer periphery of the rotating spindle; The main frame of the carrier also has an installation cavity, which is independent of the cavity and is distributed sequentially from high to low along the height direction of the main frame of the carrier. The end of the rotating spindle facing the installation cavity extends through the inner wall of the main frame of the carrier into the installation cavity. An intermittent drive mechanism is provided in the installation cavity. The intermittent drive mechanism is connected to the rotating spindle and is used to adjust the angle orientation of several wafer carrier units on the rotating spindle. The intermittent drive assembly is provided with a locking mechanism for locking or unlocking the intermittent drive assembly. Preferably, the intermittent transmission assembly includes an intermittent transmission mechanism, which includes an intermittent transmission turntable coaxially and fixedly connected to one end of the rotating main shaft that passes through the inner wall of the main frame of the carrier. The intermittent transmission turntable has a plurality of locking and positioning grooves evenly opened along the axis, and the other side of the intermittent transmission turntable is rotatably connected to the mounting cavity through a rotating shaft. A motor is also fixedly installed inside the mounting cavity. A drive turntable is fixedly installed on the drive end of the motor. An intermittent push block is coaxially fixed on the drive turntable. An arc-shaped notch is opened on the intermittent drive block to cooperate with the rotation of the intermittent drive turntable without limiting its position. The locking mechanism is installed on the drive turntable and is used to cooperate with the locking positioning groove to achieve coupling or disengagement. Preferably, the locking mechanism includes a receiving hole opened on the drive turntable, and a limiting partition is provided in the receiving hole from top to bottom along the height direction. Both limiting partitions are provided with through holes, and the through hole on the limiting partition with higher height is larger and is used to allow the locking pin to enter the receiving hole. A locking transmission rod is slidably provided in the through hole of the lower limiting partition. One end of the locking transmission rod is fixedly connected to one end of the locking pin. A return spring is sleeved on the outer periphery of the locking transmission rod. The return spring is located between the two limiting partitions. The bottom of the receiving hole is provided with an electromagnetic attractor. The electromagnetic attractor is electrically connected to an external power source through a wire. When energized, the electromagnetic attractor is magnetically connected to the locking transmission rod. Preferably, each of the wafer carrier units has a plurality of placement slots for placing wafers sequentially from high to low along the height direction. Preferably, the four corners at the bottom of the main frame of the vehicle are provided with vehicle support feet for supporting the main frame of the vehicle. Preferably, a door panel for opening or closing the cavity is hinged to one side of the main frame of the vehicle.

[0005] The beneficial effects of this utility model are: The independent and layered cavities and mounting chambers within the main frame of the carrier effectively isolate mechanical vibrations and wear interference from the intermittent drive mechanism, providing a stable environment for wafer testing and ensuring testing accuracy. The wafer carrier units arranged in a circumferential array around the rotating spindle, along with multi-layered placement slots on each unit, can simultaneously carry multiple wafers to be tested, significantly improving testing efficiency. The intermittent drive mechanism, through the cooperation of a motor, drive turntable, and intermittent push block, can drive the intermittent transmission turntable to achieve precise intermittent rotation, thereby adjusting the angle of the wafer carrier unit and ensuring that the wafer is accurately aligned with the testing station, meeting the requirements of high-precision testing. The locking mechanism, with the synergy of electromagnetic attraction and return spring, can quickly lock the intermittent transmission components after the wafer reaches the target angle, preventing angle deviation during testing and enhancing testing stability. At the same time, the carrier support feet ensure stable placement of the overall structure, while the door panel facilitates wafer loading and unloading and maintenance of the cavity interior, further improving the ease of use of the device. It comprehensively achieves an organic unity of high precision, high efficiency, high stability, and convenient use. Attached Figure Description

[0006] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 This is a schematic diagram of the electric axle measuring structure of this utility model.

[0008] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0009] Figure 3 This is a schematic diagram of the intermittent transmission component of this utility model.

[0010] Figure 4 for Figure 3 Partial cross-sectional structural diagram.

[0011] Figure 5 for Figure 4 An enlarged structural diagram of point A.

[0012] Reference numerals: 1. Main frame of the vehicle; 2. Support leg of the vehicle; 3. Door panel; 4. Rotating spindle; 5. Wafer carrier unit; 6. Intermittent transmission assembly; 601. Intermittent transmission turntable; 602. Locking positioning groove; 603. Drive turntable; 604. Intermittent push block; 605. Locking pin; 606. Electromagnetic attraction component; 607. Locking transmission rod; 608. Return spring; 609. Limiting partition. Detailed Implementation

[0013] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0014] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0015] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments. Example

[0016] Reference Figures 1-5 This is the first embodiment of the present invention, which provides an optical computing chip wafer carrier.

[0017] Specifically, in order to solve the above-mentioned technical problems, the present invention provides the following technical solution: a wafer carrier for optical computing chips, including a main frame 1, a cavity is provided in the main frame 1, a rotating spindle 4 is rotatably provided in the cavity, and a plurality of wafer carrier units 5 are arranged in a circular array on the outer periphery of the rotating spindle 4. The main frame 1 of the carrier is also provided with an installation cavity. The installation cavity is independent of the cavity and is distributed from high to low along the height direction of the main frame 1 of the carrier. The end of the rotating spindle 4 facing the installation cavity extends through the inner wall of the main frame 1 into the installation cavity. An intermittent drive mechanism is provided in the installation cavity. The intermittent drive assembly is connected to the rotating spindle 4 and is used to adjust the angle orientation of several wafer carrier units 5 on the rotating spindle 4. The intermittent drive assembly 6 is provided with a locking mechanism for locking or unlocking the intermittent drive assembly 6. The system uses the main frame 1 of the carrier as its core, with independent cavities and mounting cavities arranged along its height. A rotating spindle 4 is rotatably mounted in the upper cavity, with several wafer carrier units 5 arranged in a circular array around its outer periphery. The lower mounting cavity contains an intermittent drive mechanism and a locking mechanism. The end of the rotating spindle 4 facing the mounting cavity passes through the inner wall of the main frame 1 and is connected to the intermittent drive mechanism. During operation, the intermittent drive mechanism outputs intermittent power to drive the rotating spindle 4 to rotate step by step, thereby adjusting the angle of the wafer carrier unit 5 so that the wafer to be tested is accurately aligned with the test station. When the wafer carrier unit 5 reaches the target angle, the locking mechanism locks the intermittent transmission component 6 to ensure angle stability during the test. At the same time, the design of the upper and lower independent cavities can avoid the drive mechanism from interfering with the test accuracy, achieving the synergy of accurate testing and stable positioning. Furthermore, the intermittent transmission assembly 6 includes an intermittent transmission mechanism, which includes an intermittent transmission turntable 601 that is coaxially fixedly connected to one end of the rotating main shaft 4 through the inner wall of the main frame 1 of the carrier. The intermittent transmission turntable 601 has a plurality of locking and positioning grooves 602 evenly opened along the axis. The other side of the intermittent transmission turntable 601 is rotatably connected to the mounting cavity through a rotating shaft. A motor is also fixedly installed in the mounting cavity. A drive turntable 603 is fixedly installed on the drive end of the motor. An intermittent push block 604 is coaxially fixedly installed on the drive turntable 603. An arc-shaped notch is opened on the intermittent push block 604 to cooperate with the intermittent transmission turntable 601 to rotate without limiting its position. A locking mechanism is provided on the drive turntable 603 and is used to cooperate with the locking and positioning grooves 602 to achieve coupling or disengagement. The drive turntable 603 is rotated by a motor, which in turn drives the coaxially fixed intermittent push block 604 to rotate synchronously. The arc-shaped notch on the intermittent push block 604, while rotating with the drive turntable 603, does not limit the movement of the intermittent drive turntable 601 when the notch aligns with it. The non-notch portion interacts with the intermittent drive turntable 601, pushing it to rotate around its axis by a certain angle. Because the intermittent drive turntable 601 is coaxially fixed with the rotating spindle 4, the rotating spindle 4 rotates synchronously with the intermittent drive turntable 601, thereby driving the wafer carrier unit 5 to complete one angle adjustment. Since several locking and positioning grooves 602 are evenly distributed along the axis of the intermittent drive turntable 601, each rotation of the intermittent push block 604 pushes the intermittent drive turntable 601 to rotate by an angle corresponding to the spacing of one locking and positioning groove 602, thus forming intermittent rotation. Simultaneously, the locking mechanism on the drive turntable 603 operates synchronously with the drive turntable 603: when the intermittent transmission turntable 601 completes angle adjustment and is in a stationary state, the locking mechanism couples with the corresponding locking positioning groove 602 to lock the intermittent transmission turntable 601 to maintain angle stability; just before the intermittent push block 604 is about to push the intermittent transmission turntable 601 to rotate again, the locking mechanism disengages from the locking positioning groove 602, releasing the lock to allow the intermittent transmission turntable 601 to rotate, thereby realizing the intermittent precise adjustment and stable locking of the wafer carrier unit 5 angle; Furthermore, the locking mechanism includes a receiving hole on the drive turntable 603. Within the receiving hole, from top to bottom, are successively positioned limiting partitions 609. Both limiting partitions 609 have through holes. The through hole on the higher limiting partition 609 is larger, allowing the locking pin 605 to enter the receiving hole. A locking transmission rod 607 is slidably positioned within the through hole of the lower limiting partition 609. One end of the locking transmission rod 607 is fixedly connected to one end of the locking pin 605. A return spring 608 is sleeved on the outer periphery of the locking transmission rod 607, located between the two limiting partitions 609. An electromagnetic attraction component 606 is provided at the bottom of the receiving hole. The electromagnetic attraction component 606 is electrically connected to an external power source via a wire. In the energized state, the electromagnetic attraction component 606 is magnetically connected to the locking transmission rod 607. The locking and unlocking are achieved through the coordinated action of electromagnetic control and elastic reset. Two limiting partitions 609 within the receiving hole form a limiting structure, and a reset spring 608 is positioned between the two limiting partitions 609, applying an upward elastic force to the locking transmission rod 607. When the electromagnetic attractor 606 is not energized, the spring force of the return spring 608 pushes the locking transmission rod 607 to slide upward along the through hole of the lower limiting partition 609, causing the locking pin 605 fixed thereto to move upward synchronously. The locking pin 605 passes through the large through hole of the upper limiting partition 609 and extends out of the receiving hole, coupling with the locking positioning groove 602 on the intermittent transmission turntable 601, thereby locking the intermittent transmission turntable 601 and restricting its rotation. When the electromagnetic attractor 606 is energized, it generates a magnetic attraction force, which overcomes the spring force of the return spring 608 and attracts the locking transmission rod 607 downward. The locking transmission rod 607 drives the locking pin 605 to retract into the receiving hole, and the locking pin 605 disengages from the locking positioning groove 602, releasing the lock on the intermittent transmission turntable 601. At this time, the intermittent transmission turntable 601 can rotate under the push of the intermittent push block 604. By controlling the on / off state of the electromagnetic attraction component 606, the coupling / disengagement switching between the locking mechanism and the locking positioning groove 602 is realized, and precise locking and rotation adjustment are achieved in conjunction with intermittent transmission; Furthermore, each wafer carrier unit 5 is provided with several placement slots for placing wafers in sequence from high to low along the height direction. The four corners of the bottom end of the carrier main frame 1 are provided with carrier support feet 2 for supporting the carrier main frame 1 itself. A door panel 3 for opening or closing the cavity is hinged to one side of the carrier main frame 1. In summary, this test vehicle has a main frame 1 as its core, with independent cavities and mounting cavities inside. A rotating spindle 4 within each cavity has several wafer carrier units 5 arranged around its periphery. The spindle 4 extends into the mounting cavity and connects to an intermittent drive mechanism. The mounting cavity also includes a locking mechanism. The intermittent drive mechanism uses a motor to drive a drive turntable 603, which in turn drives an intermittent transmission turntable 601 with a locking positioning groove 602 to rotate intermittently, thus adjusting the angle between the rotating spindle 4 and the wafer carrier units 5. The locking mechanism uses an electromagnetic attraction component 606 to control the coupling / disengagement of the locking pin 605 with the locking positioning groove 602, completing locking and unlocking. The overall independent chamber design avoids interference, and the combination of intermittent drive and locking functions enables precise adjustment and stable testing of the wafer carrier units 5.

[0018] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A wafer carrier for optical computing chips, comprising a main frame (1) and an intermittent transmission assembly (6), wherein a cavity is provided in the main frame (1), a rotating spindle (4) is rotatably provided in the cavity, and a plurality of wafer carrier units (5) are arranged in a circular array on the outer periphery of the rotating spindle (4). The main frame (1) of the vehicle is also provided with an installation cavity. The installation cavity is independent of the cavity and is distributed from high to low along the height direction of the main frame (1). The end of the rotating spindle (4) facing the installation cavity extends through the inner wall of the main frame (1) into the installation cavity. An intermittent drive mechanism is provided in the installation cavity. The intermittent drive mechanism is connected to the rotating spindle (4) and is used to adjust the angle orientation of several wafer carrier units (5) on the rotating spindle (4). The intermittent transmission assembly (6) is provided with a locking mechanism for locking or unlocking the intermittent transmission assembly (6).

2. The optical computing chip wafer carrier according to claim 1, characterized in that, The intermittent transmission assembly (6) includes an intermittent transmission mechanism, which includes an intermittent transmission turntable (601) that is coaxially fixedly connected to one end of the rotating main shaft (4) through the inner wall of the main frame (1) of the vehicle. The intermittent transmission turntable (601) is provided with a plurality of locking and positioning grooves (602) evenly distributed along the axis. The other side of the intermittent transmission turntable (601) is rotatably connected to the mounting cavity through a rotating shaft. A motor is also fixedly installed inside the mounting cavity. A drive turntable (603) is fixedly installed on the drive end of the motor. An intermittent push block (604) is coaxially fixed on the drive turntable (603). An arc-shaped notch is opened on the intermittent drive block (604) to cooperate with the intermittent transmission turntable (601) to rotate without limiting its position. The locking mechanism is installed on the drive turntable (603) and is used to cooperate with the locking positioning groove (602) to achieve coupling or disengagement.

3. The optical computing chip wafer carrier according to claim 1, characterized in that, The locking mechanism includes a receiving hole opened on the drive turntable (603). The receiving hole is provided with limiting partitions (609) arranged sequentially from top to bottom along the height direction. Both limiting partitions (609) are provided with through holes. The through hole on the limiting partition (609) located at the higher height is larger and is used to allow the locking pin (605) to enter the receiving hole. A locking transmission rod (607) is slidably provided in the through hole of the lower limiting partition (609). One end of the locking transmission rod (607) is fixedly connected to one end of the locking pin (605). A return spring (608) is sleeved on the outer periphery of the locking transmission rod (607). The return spring (608) is located between the two limiting partitions (609). The bottom end of the receiving hole is provided with an electromagnetic attractor (606). The electromagnetic attractor (606) is electrically connected to an external power source through a wire. When energized, the electromagnetic attractor (606) is magnetically connected to the locking transmission rod (607).

4. A wafer carrier for optical computing chips according to any one of claims 1-3, characterized in that, Each wafer carrier unit (5) has several placement slots for placing wafers sequentially from high to low along the height direction.

5. The optical computing chip wafer carrier according to claim 4, characterized in that, The vehicle body frame (1) is provided with vehicle support feet (2) at the four corners of its bottom end.

6. The optical computing chip wafer carrier according to claim 5, characterized in that, The main frame (1) of the vehicle is hinged to one side with a door panel (3) for opening or closing the cavity.

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