Wafer pulling device

Abstract

The utility model relates to the field of material pulling device, especially a wafer material pulling device. Including clamping group and removal module, wherein, clamping assembly has first jaw and opposite first jaw activity setting's second jaw, first jaw and second jaw cooperation are used for clamping wafer, removal module has first drive mechanism, first drive mechanism's execution end is connected with clamping assembly, and can drive clamping assembly along first direction motion, clamping assembly is connected with removal module through cantilever assembly, cantilever assembly includes the jaw connecting piece and module connecting piece of sliding connection, and jaw connecting piece is connected with clamping assembly rotation, so that clamping assembly and the execution end between removal module have different relative position and corner.

Description

Technical Field

[0001] This utility model relates to the field of wafer pulling devices, and more particularly to a wafer pulling device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer handling is a critical process. Existing wafer pulling devices typically consist of a clamping assembly and a moving module, which completes the handling by driving the grippers to hold the wafer and perform linear motion. However, such devices have the following technical drawbacks: The moving module generates vibrations and shock accelerations during startup, shutdown, or high-speed operation. These vibrations are transmitted to the clamping components, which may cause the wafer to slide or shift while clamped, resulting in a clamping position that is not as expected.

[0003] Wafers with misalignment are highly susceptible to collisions with surrounding process equipment during subsequent movement, leading to damage to valuable wafers or even equipment downtime, resulting in significant economic losses. Utility Model Content

[0004] The purpose of this invention is to provide a wafer pulling device to solve the problem in the prior art where the clamped wafer is easily deviated due to vibration.

[0005] The technical solution of this utility model is: a wafer pulling device, comprising: A clamping assembly having a first jaw and a second jaw movably disposed relative to the first jaw, the first jaw and the second jaw cooperating to clamp a wafer; The mobile module has a first driving mechanism, the execution end of which is connected to the clamping component and can drive the clamping component to move along a first direction; The clamping assembly is movably connected to the mobile module via a cantilever assembly. The cantilever assembly includes a slidably connected gripper connector and a module connector, and the gripper connector is rotatably connected to the clamping assembly, so that the clamping assembly and the execution end of the mobile module have different relative positions and rotation angles.

[0006] Preferably, the gripper connector and the module connector are connected by a speed adjustment mechanism, which can drive the gripper connector and the module connector to move relative to each other along a first direction.

[0007] Preferably, the gripper connector and the clamping assembly are rotatably connected by an angle adjustment mechanism. The angle adjustment mechanism includes a rotating shaft and a first elastic element. The first gripper and the gripper connector are rotatably connected by the rotating shaft. The first elastic element is set as a pair, and the pair of first elastic elements are coaxially arranged and do not intersect the straight line where the rotating shaft is located. Both ends of any first elastic element abut against the first gripper and the gripper connector respectively.

[0008] Preferably, the gripper connector has a receiving groove for receiving the end of the first gripper away from the second gripper, and the rotating shaft passes through the first gripper and its two ends are rotatably connected to the receiving groove, so that the first gripper and the gripper connector can rotate relative to each other.

[0009] Preferably, the speed adjustment mechanism includes a pair of guide rods arranged along a first direction. The guide rods are fixed to the module connector and slidably engaged with the gripper connector. A second elastic element is provided on the parallel guide rod. The two ends of the second elastic element abut against the gripper connector and the module connector, respectively. When the module connector has acceleration, the second elastic element deforms, so that the gripper connector can buffer the acceleration of the module connector.

[0010] Preferably, the mobile module has a second driving mechanism, which is fixed to the execution end of the first driving mechanism and can move in a second direction perpendicular to the first direction. The module connector is fixed to the execution end of the second driving mechanism via a connecting plate.

[0011] Compared with the prior art, the advantages of this utility model are: (1) By setting a cantilever assembly with a speed adjustment mechanism between the clamping assembly and the moving module, when the moving module starts or stops and generates acceleration, the second elastic element can deform and drive the gripper connector to slide relative to the module connector, forming a suspension-like system that effectively absorbs and buffers vibration and impact in the linear motion direction, preventing the wafer from shifting due to inertial force.

[0012] (2) The clamping assembly and the cantilever assembly are rotatably connected by an angle adjustment mechanism. When the clamping assembly is subjected to a slight external impact or vibration, the first gripper can rotate slightly around the pivot, and the energy is absorbed by the first elastic element through elastic deformation. This allows the clamping assembly to produce adaptive deflection when subjected to external force, and can automatically reset after the external force is removed, avoiding wafer damage or positional deviation caused by rigid impact. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a structural diagram of a wafer pulling device according to the present invention; Figure 2 This is a structural diagram of the clamping assembly described in this utility model; Figure 3 This is a structural diagram of the mobile module described in this utility model; Figure 4 This is a structural diagram of the cantilever assembly described in this utility model; The components include: 1. Clamping assembly; 11. First gripper; 12. Second gripper; 13. Clamping driver; 2. Moving module; 21. First drive mechanism; 211. Synchronous belt; 212. Synchronous pulley; 213. Drive motor; 22. Second drive mechanism; 23. Connecting plate; 3. Cantilever assembly; 31. Gripper connector; 32. Module connector; 4. Speed ​​adjustment mechanism; 41. Guide rod; 42. Second elastic element; 5. Angle adjustment mechanism; 51. Rotating shaft; 52. First elastic element; 53. Receiving groove; 54. Shaft hole; 61. Photoelectric sensor; 62. Force sensor. Detailed Implementation

[0014] The present invention will be further described in detail below with reference to specific embodiments: like Figure 1 As shown, a wafer pulling device is used for handling and pulling wafers, including a clamping assembly 1 and a moving module 2.

[0015] Among them, combined Figure 2 As shown, the clamping assembly 1 includes a first jaw 11 and a second jaw 12. The second jaw 12 is hinged to one end of the first jaw 11 and connected to a clamping driver 13. In this embodiment, the clamping driver 13 is a pen-shaped cylinder, which can drive the second jaw 12 to swing around the clamping end of the first jaw 11 to achieve wafer clamping.

[0016] Combination Figure 3 As shown, the moving module 2 includes at least a first drive mechanism 21. The execution end of the first drive mechanism 21 is connected to the clamping assembly 1 and can drive the clamping assembly 1 to move in a horizontal first direction, thereby transporting the wafer it carries. Specifically, in this embodiment, the first drive mechanism 21 includes a synchronous belt 211, a synchronous pulley 212, and a drive motor 213. Further, in a preferred embodiment of this application, a second drive mechanism 22 is also fixed on the synchronous belt 211 of the first drive mechanism 21. The second drive mechanism 22 is a cylinder and can move in a second direction perpendicular to the first direction. The clamping assembly 1 is connected to the execution end of the second drive mechanism 22 through a connecting plate 23, so that the wafer carried by the clamping assembly 1 can perform lifting and lowering actions.

[0017] To prevent the wafer from being held in a position that deviates from the expected position due to factors such as vibration after clamping, thus avoiding potential collisions with other devices during subsequent movement, the clamping assembly 1 is designed to prevent this. Figure 4 As shown, this application provides a cantilever assembly 3 between the clamping assembly 1 and the moving module 2. The cantilever assembly 3 includes a slidably connected gripper connector 31 and a module connector 32, and the gripper connector 31 is rotatably connected to the clamping assembly 1, so that the clamping assembly 1 and the execution end of the moving module 2 have different relative positions and rotation angles.

[0018] The gripper connector 31 and the module connector 32 are connected by a speed adjustment mechanism 4. The speed adjustment mechanism 4 can drive the gripper connector 31 and the module connector 32 to move relative to each other in the first direction, so that the gripping assembly 1 can buffer the acceleration brought by the moving module 2.

[0019] Specifically, the speed adjustment mechanism 4 includes a pair of guide rods 41 arranged along a first direction. The guide rods 41 are fixed to the module connector 32 and slidably engaged with the gripper connector 31. A second elastic element 42 is provided on each parallel guide rod 41, with its two ends abutting against the gripper connector 31 and the module connector 32, respectively. When the module connector 32 experiences acceleration, the second elastic element 42 deforms, acting like a suspension system, allowing the gripper connector 31 to buffer the acceleration of the module connector 32.

[0020] The gripper connector 31 is rotatably connected to the gripping assembly 1 via an angle adjustment mechanism 5. The angle adjustment mechanism 5 includes a rotating shaft 51 and a first elastic element 52. The first gripper 11 and the gripper connector 31 are rotatably connected via the rotating shaft 51. The first elastic elements 52 are configured as a pair, and the pair of first elastic elements 52 are coaxially arranged and do not intersect the straight line on which the rotating shaft 51 is located. The two ends of any first elastic element 52 respectively abut against the first gripper 11 and the gripper connector 31. Specifically, the gripper connector 31 has a receiving groove 53 at the end of the first gripper 11 away from the second gripper 12 for receiving the first gripper. The rotating shaft 51 passes through the first gripper 11, and the two ends of the rotating shaft 51 are rotatably connected to the shaft hole 54 on the receiving groove 53, so that the first gripper 11 and the gripper connector 31 can rotate relative to each other.

[0021] This configuration allows the first elastic element 52 to buffer the vibration and collision through elastic deformation when the clamping component 1 holding the wafer vibrates or slightly collides with external equipment, thus preventing the wafer from being deviated from its clamping position.

[0022] Furthermore, in combination Figure 2 and Figure 4 As shown, this application includes a photoelectric sensor 61 and a force sensor 62 for detecting the position of the wafer and the force on the gripper connector.

[0023] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A wafer pulling device, characterized in that, include: The clamping assembly (1) has a first jaw (11) and a second jaw (12) movably disposed relative to the first jaw (11), the first jaw (11) and the second jaw (12) cooperating to clamp the wafer; The mobile module (2) has a first drive mechanism (21), the execution end of the first drive mechanism (21) is connected to the clamping assembly (1), and can drive the clamping assembly (1) to move along a first direction; The clamping assembly (1) is movably connected to the moving module (2) via the cantilever assembly (3). The cantilever assembly (3) includes a slidably connected gripper connector (31) and a module connector (32). The gripper connector (31) is rotatably connected to the clamping assembly (1), so that the clamping assembly (1) and the execution end of the moving module (2) have different relative positions and rotation angles.

2. The wafer pulling device according to claim 1, characterized in that, The gripper connector (31) and the module connector (32) are connected by a speed adjustment mechanism (4), which can drive the gripper connector (31) and the module connector (32) to move relative to each other in a first direction.

3. The wafer pulling device according to claim 2, characterized in that, The gripper connector (31) is rotatably connected to the clamping assembly (1) via an angle adjustment mechanism (5). The angle adjustment mechanism (5) includes a rotating shaft (51) and a first elastic element (52). The first gripper (11) and the gripper connector (31) are rotatably connected via the rotating shaft (51). The first elastic element (52) is set as a pair, and the pair of first elastic elements (52) are coaxially arranged and do not intersect the straight line where the rotating shaft (51) is located. The two ends of any first elastic element (52) abut against the first gripper (11) and the gripper connector (31) respectively.

4. A wafer pulling device according to claim 3, characterized in that, The gripper connector (31) has a receiving groove (53) for receiving the end of the first gripper (11) away from the second gripper (12). The rotating shaft (51) passes through the first gripper (11) and the two ends of the rotating shaft (51) are rotatably connected to the receiving groove (53), so that the first gripper (11) and the gripper connector (31) can rotate relative to each other.

5. A wafer pulling device according to claim 2, characterized in that, The speed adjustment mechanism (4) includes a pair of guide rods (41) arranged along a first direction. The guide rods (41) are fixed to the module connector (32) and slide in cooperation with the gripper connector (31). The parallel guide rods (41) are provided with a second elastic element (42). The two ends of the second elastic element (42) abut against the gripper connector (31) and the module connector (32) respectively. When the module connector (32) has acceleration, the second elastic element (42) deforms, so that the gripper connector (31) can buffer the acceleration of the module connector (32).

6. A wafer pulling device according to claim 1, characterized in that, The mobile module (2) has a second drive mechanism (22), which is fixed to the execution end of the first drive mechanism (21) and can move in a second direction perpendicular to the first direction. The module connector (32) is fixed to the execution end of the second drive mechanism (22) through a connecting plate (23).

Images