Wafer flipping and transferring mechanism

Abstract

The utility model relates to wafer production field, concretely is a kind of wafer turnover transmission mechanism. It includes frame, linear conveying module and turnover mechanism;Linear conveying module is horizontally arranged on frame;Turnover mechanism is provided with two groups, and one group of turnover mechanism is arranged on frame, and another group of turnover mechanism is driven by linear conveying module to move along straight line, and turnover mechanism includes turnover subassembly and the drive subassembly of the drive turnover subassembly overturn, and turnover subassembly includes the rotary frame with taking and placing mouth, two placing seats symmetrically arranged in rotary frame, and the limiting component that realizes anti-drop limit or release limit by blocking in taking and placing mouth or moving away from taking and placing mouth. The utility model can limit by limiting component to wafer overturning process, and release limit after overturning in place.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing, and in particular to a wafer flipping and transport mechanism. Background Technology

[0002] Currently, in semiconductor wafer cleaning, for large-sized wafers such as 8-inch and 12-inch wafers, when they are transferred from the FOUP (Front Opening Unified Pod) to the tank cleaning machine, a flipping mechanism is needed to change the wafer from a horizontal to a vertical position in order to meet the requirements of the tank cleaning machine for wafer placement.

[0003] However, when the existing flipping mechanism is in operation, the wafer is not effectively limited, which easily leads to the wafer slipping out and falling. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a wafer flipping and transfer mechanism that can limit the wafer flipping process through a limiting component and release the limiting after the flipping is in place.

[0005] The technical solution of this utility model is a wafer flipping and transfer mechanism, including a frame, a linear conveying module and a flipping mechanism; the linear conveying module is horizontally arranged on the frame; there are two sets of flipping mechanisms, one set of flipping mechanisms is arranged on the frame, and the other set of flipping mechanisms is driven by the linear conveying module to move along a straight line. The flipping mechanism includes a flipping component and a driving component for flipping the flipping component. The flipping component includes a rotating frame with a pick-and-place port, two placement seats symmetrically arranged in the rotating frame, and a limiting component that achieves anti-detachment or release of the limit by blocking the pick-and-place port or moving away from the pick-and-place port.

[0006] Preferably, the limiting component includes a transverse cylinder disposed on the side of the rotating frame, a connecting plate driven by the transverse cylinder to move linearly, and a stop bar disposed on the connecting plate. The stop bar prevents detachment when it blocks the pick-up and put-out port, and releases the limiting when it is removed from the pick-up and put-out port.

[0007] Preferably, the baffle is made of polyetheretherketone (PEEK).

[0008] Preferably, the placement base includes a placement platform one and a placement platform two. The placement platform one is disposed on the inner side of the rotating frame, and the placement platform two is disposed at an angle at the end of the placement platform one away from the pick-up and drop-off port of the rotating frame. Both the placement platform one and the placement platform two have placement slots for placing wafers. Multiple placement slots are distributed side by side, and the placement slots on the placement platform one and the placement platform two correspond one-to-one.

[0009] Preferably, the opening of the placement groove is flared.

[0010] Preferably, the drive assembly includes two rotating shafts respectively disposed on both sides of the rotating frame, a mounting base for rotating the rotating shafts, and a power assembly disposed on the mounting base and driving one of the rotating shafts to rotate.

[0011] Preferably, two sets of fiber optic sensors are arranged side by side on the mounting base, and two baffles are installed at different positions on the rotating frame, with one of the two baffles blocking one set of fiber optic sensors.

[0012] Preferably, in the flipping mechanism driven by the linear conveying module, baffles are provided on both sides of the mounting base, and two sets of slotted photoelectric switches corresponding to the two baffles are arranged side by side on the frame.

[0013] Compared with existing technologies, this invention has the following beneficial technical effects: In this invention, multiple wafers are inserted laterally into multiple placement slots of two placement seats using an external robotic arm. At this time, the stop bar in the limiting component is not blocking the pick-up / placement port of the rotating frame. After multiple wafers are inserted, the stop bar in the limiting component blocks the pick-up / placement port. Then, the rotating frame is driven to rotate by the drive component, and the stop bar can limit the wafer flipping process to prevent the wafer from slipping out and falling. The servo motor can ensure the accuracy of the rotation angle of the flipping mechanism through the signal feedback from the fiber optic sensor, thereby ensuring the accuracy of the wafer switching from a horizontal to a vertical state. The linear conveying module can realize the precise switching of the flipping mechanism between two horizontal positions through the signal feedback from the slotted photoelectric switch. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model; Figure 2 This is a schematic diagram of the flipping mechanism; Figure 3 This is a schematic diagram of a structure in which multiple wafers are placed between two sets of placement seats.

[0015] Reference numerals: 1. Frame; 2. Mounting base; 3. Rotating frame; 4. Placement base; 41. Placement platform one; 42. Placement platform two; 5. Stop bar; 6. Connecting plate; 7. Transverse cylinder; 8. Baffle plate; 9. Fiber optic sensor; 10. Power assembly; 11. Baffle plate; 12. Slotted photoelectric switch; 13. Linear conveyor module. Detailed Implementation

[0016] Example 1: As Figures 1-3 As shown, the wafer flipping and transfer mechanism proposed in this embodiment includes a frame 1, a linear transport module 13, and a flipping mechanism.

[0017] The linear conveyor module 13 is horizontally mounted on the frame 1. The linear conveyor module 13 adopts the existing structure and mainly includes a conveyor motor and a guide rail. It is driven by the conveyor motor, and the moving end can drive the target moving structure to move linearly. It is guided by the guide rail.

[0018] like Figure 1 As shown, two sets of flipping mechanisms are provided. One set of flipping mechanisms is mounted on the frame 1, and the other set is driven by the linear conveyor module 13 to move along a straight line. Each flipping mechanism includes a flipping component and a drive component that drives the flipping component to flip. The flipping component includes a rotating frame 3 with a pick-and-place port, two placement seats 4 symmetrically arranged within the rotating frame 3, and a limiting component that prevents or releases the limiting by blocking or moving away from the pick-and-place port. The wafer is placed inside the rotating frame 3 through the pick-and-place port and placed on the placement seat 4. The limiting component blocks the pick-and-place port, preventing the wafer from falling when the drive component drives the flipping component to rotate.

[0019] The limiting assembly includes a transverse cylinder 7 mounted on the side of the rotating frame 3, a connecting plate 6 driven by the transverse cylinder 7 for linear movement, and a stop bar 5 mounted on the connecting plate 6. The transverse cylinder 7 drives the connecting plate 6 to move linearly, and the connecting plate 6 drives the stop bar 5 to move back and forth linearly. The stop bar 5 is made of polyetheretherketone (PEEK) material, which will not damage the wafer during limiting. The stop bar 5 prevents detachment when it is in the pick-up / placement port and releases the limiting effect when it is removed from the pick-up / placement port.

[0020] like Figure 2 and Figure 3 As shown, the placement base 4 includes a placement stage 41 and a placement stage 42. Placement stage 41 is disposed on the inner side of the rotating frame 3, and placement stage 42 is disposed at an angle at the end of placement stage 41 away from the loading / unloading port of the rotating frame 3. Both placement stage 41 and placement stage 42 have placement slots for placing wafers. Multiple placement slots are arranged side by side, and the placement slots on placement stage 41 and placement stage 42 correspond one-to-one. That is, a single wafer is placed in the two corresponding placement slots on placement stage 41 and placement stage 42. Multiple rows of placement slots can hold multiple wafers side by side. The opening of the placement slot is flared to facilitate the placement of wafers.

[0021] The drive assembly includes two rotating shafts respectively disposed on both sides of the rotating frame 3, mounting bases 2 for rotating the shafts, and a power assembly 10 disposed on the mounting bases 2 and driving one of the rotating shafts to rotate. The power assembly 10 includes a servo motor, a reducer, and a coupling. The reducer is disposed on the mounting base 2, and the servo motor is disposed on the reducer. The output end of the servo motor is connected to the input end of the reducer, and the output end of the reducer motor is connected to the rotating shaft via the coupling. When the servo motor is running, it drives the rotating frame 3 to rotate, which in turn drives the inner placement seat 4 to rotate, thereby realizing the rotation of the wafer and flipping it from a horizontal to a vertical position. One set of flipping mechanisms has mounting bases 2 disposed on the frame 1, while another set has mounting bases 2 disposed on the moving end of the linear conveyor module 13, which provides linear drive. The two mounting bases 2 are at the same height.

[0022] In this embodiment, multiple wafers are inserted laterally into multiple placement slots of two placement seats 4 using an external robotic arm. At this time, the stop bar 5 in the limiting component is not blocking the pick-up / placement port of the rotating frame 3. After multiple wafers are inserted, the stop bar 5 in the limiting component blocks the pick-up / placement port. Then, the rotating frame 3 is driven to rotate 90 degrees by the driving component, and the stop bar 5 can limit the wafer flipping process to prevent the wafer from slipping out and falling. When it is necessary to release the stop bar 5, the connecting plate 6 is moved by the transverse cylinder 7 to move the stop bar 5 and remove it from the pick-up / placement port. For the two sets of flipping mechanisms, one set of flipping mechanisms can be used to switch the wafer between horizontal and vertical states, and the other set of flipping mechanisms can not only be used to switch the wafer between horizontal and vertical states, but also adjust the horizontal position through the linear conveyor module 13.

[0023] Example 2: Figures 1-3 As shown in this embodiment, a wafer flipping and transfer mechanism is proposed. Compared to Embodiment 1, in this embodiment, two sets of fiber optic sensors 9 are arranged side by side on the mounting base 2, and two baffles 8 are installed in a staggered manner on the rotating frame 3. One of the two baffles 8 blocks one set of fiber optic sensors 9, that is, when one baffle 8 blocks one set of fiber optic sensors 9, the other baffle 8 does not block the other set of fiber optic sensors 9. When the rotating frame 3 rotates 90 degrees, it will drive the two baffles 8 to rotate 90 degrees, switching from the state where one baffle 8 blocks one set of fiber optic sensors 9 to the state where the other baffle 8 blocks the other set of fiber optic sensors 9. The fiber optic sensors 9 feed back the detection signal to the central controller, which controls the servo motor to stop rotating, thereby ensuring the accuracy of the angle rotation, and thus ensuring the accuracy of the wafer switching from a horizontal state to a vertical state. Effective closed-loop control is achieved through signal feedback.

[0024] like Figure 1As shown, in the flipping mechanism driven by the linear conveyor module 13, baffles 11 are provided on both sides of the mounting base 2, and two sets of slotted photoelectric switches 12 corresponding to the two baffles 11 are arranged side by side on the frame 1. When the flipping mechanism is driven to move linearly by the linear conveyor module 13, the mounting base 2 in the flipping mechanism will drive the two baffles 11 on both sides to move. When one baffle 11 moves away from the slotted photoelectric switch 12 on one side, and the baffle 11 on the other side moves to the other set of slotted photoelectric switches 12, it indicates that the flipping mechanism has moved and transmitted to the correct position, thereby realizing the switching of the flipping mechanism between two horizontal positions and ensuring transmission accuracy. The slotted photoelectric switches 12 are communicatively connected to the central controller and can send a signal to the central controller when triggered by the baffle 11. The central controller then controls the linear conveyor module 13 to stop driving, ensuring the position switching accuracy of the flipping mechanism.

[0025] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A wafer flipping and transmission mechanism, characterized in that, include: Rack (1); A linear conveyor module (13) is horizontally mounted on the frame (1); The flipping mechanism is provided in two sets. One set of flipping mechanism is set on the frame (1), and the other set of flipping mechanism is driven by the linear conveying module (13) to move along a straight line. The flipping mechanism includes a flipping component and a driving component for flipping the flipping component. The flipping component includes a rotating frame (3) with a pick-up and put-out port, two placement seats (4) symmetrically arranged in the rotating frame (3), and a limiting component that achieves anti-detachment limit or release limit by blocking the pick-up and put-out port or moving away from the pick-up and put-out port.

2. The wafer flipping and transmission mechanism according to claim 1, characterized in that, The limiting assembly includes a transverse cylinder (7) disposed on the side of the rotating frame (3), a connecting plate (6) driven by the transverse cylinder (7) and moving linearly, and a stop bar (5) disposed on the connecting plate (6). The stop bar (5) prevents detachment when it is blocked at the pick-up and put-out port, and releases the limit when it is removed from the pick-up and put-out port.

3. The wafer flipping and transmission mechanism according to claim 2, characterized in that, The baffle (5) is made of polyetheretherketone.

4. The wafer flipping and transmission mechanism according to claim 1, characterized in that, The placement base (4) includes a placement platform one (41) and a placement platform two (42). The placement platform one (41) is set on the inner side of the rotating frame (3), and the placement platform two (42) is set at an angle at the end of the placement platform one (41) away from the pick-up and drop-off port of the rotating frame (3). Both the placement platform one (41) and the placement platform two (42) have placement slots for placing wafers. Multiple placement slots are distributed side by side, and the placement slots on the placement platform one (41) and the placement platform two (42) correspond one to one.

5. A wafer flipping and transmission mechanism according to claim 4, characterized in that, The opening of the placement slot is flared.

6. The wafer flipping and transmission mechanism according to claim 1, characterized in that, The drive assembly includes two rotating shafts respectively disposed on both sides of the rotating frame (3), a mounting base (2) for rotating the rotating shafts, and a power assembly (10) disposed on the mounting base (2) and driving one rotating shaft to rotate.

7. A wafer flipping and transmission mechanism according to claim 6, characterized in that, Two sets of fiber optic sensors (9) are arranged side by side on the mounting base (2), and two baffles (8) are installed on the rotating frame (3) in a staggered manner. One of the two baffles (8) blocks one set of fiber optic sensors (9).

8. A wafer flipping and transmission mechanism according to claim 7, characterized in that, In the flipping mechanism driven by the linear conveying module (13), baffles (11) are provided on both sides of the mounting base (2), and two sets of slotted photoelectric switches (12) corresponding to the two baffles (11) are arranged side by side on the frame (1).

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