IGBT substrate needle fin heat dissipation structure and equidistance limiting forming mechanism frame thereof

Abstract

The utility model discloses a kind of IGBT substrate needle fin heat dissipation structure and equidistance limiting forming mechanism frame, and it is related to IGBT substrate technical field.The utility model includes bottom plate, and equidistance adjusting mechanism and forming mechanism are arranged on the bottom plate.The utility model is equipped with equidistance adjusting mechanism, under the cooperation of articulated block one and articulated block two, electric push rod one can be driven to drive adjusting rod to produce rotation in the top of adjusting rod located in middle, and then make multiple rollers slide and produce displacement in the inner wall of adjusting rod, and then drive multiple sliders to be displaced on the outer wall of slide bar, so that multiple sliders are simultaneously close to each other or away from each other, the spacing between multiple sliders is equidistance adjusted and limited, by this accurate and efficient adjusting mode, the forming position of multiple groups of fin needles on IGBT substrate can be accurately set according to different requirements, and it provides strong guarantee for producing high-quality IGBT product meeting diversification requirements.

Description

Technical Field

[0001] This utility model belongs to the field of IGBT substrate technology, and in particular relates to an IGBT substrate pin fin heat dissipation structure and its equidistant limiting forming mechanism frame. Background Technology

[0002] As a core component in new energy vehicles, industrial frequency converters, and other fields, IGBTs are becoming increasingly lightweight, miniaturized, and integrated with technological advancements. The increase in power density leads to a surge in heat flux density. Traditional indirect liquid cooling methods, which rely on thermal grease, suffer from high thermal resistance and long-term aging and failure, making it difficult to meet heat dissipation requirements. In contrast, direct liquid cooling solutions with integrated pin-fin substrates can significantly increase the heat exchange area (e.g., the heat dissipation area can be up to 8 times that of traditional planar substrates), effectively improving heat dissipation efficiency. However, the spacing and size consistency of the pin fins are crucial to the heat dissipation effect. Existing cold forging, injection molding, and other forming processes are prone to problems such as uneven pin fin spacing and positional deviations.

[0003] In the production and manufacturing of IGBT substrates, traditional methods make it difficult to accurately adjust the forming positions of multiple sets of pins according to different product requirements, which is difficult to meet the high precision requirements of modern electronic manufacturing processes. Moreover, traditional adjustment methods are inefficient and cannot quickly and accurately adjust the forming positions of multiple sets of pins, which seriously affects production progress and product quality. Utility Model Content

[0004] The purpose of this utility model is to provide an IGBT substrate pin fin heat dissipation structure and its equidistant positioning and forming mechanism frame. By setting an equidistant adjustment mechanism, it solves the problem that in the production and manufacturing of IGBT substrates, it is difficult to accurately adjust the forming position of multiple sets of pins according to different product requirements in the traditional way, which makes it difficult to meet the high precision requirements of modern electronic manufacturing processes.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is an IGBT substrate pin fin heat dissipation structure and its equidistant limiting and forming mechanism frame, including a base plate, on which an equidistant adjustment mechanism and a forming mechanism are provided;

[0007] The equidistant adjustment mechanism includes an outer frame fixedly connected to the top of the base plate. Several sliding rods are fixedly connected to the inner wall of the outer frame. Sliding blocks are slidably connected to the outer walls of two corresponding sliding rods. The middle sliding block is fixedly connected to the outer walls of the two sliding rods. An adjustment rod is rotatably connected to the top of the middle sliding block. Rollers are rotatably connected to the tops of the other four sliding blocks. The four rollers are slidably connected to the inner walls of the adjustment rods. A hinge block one is rotatably connected to the inner wall of the outer frame. An electric push rod one is fixedly connected to the side of the hinge block one away from the outer frame. A hinge block two is fixedly connected to the output end of the electric push rod one. The hinge block two is rotatably mounted on the top of the adjustment rod.

[0008] Furthermore, each of the sliders is fixedly connected to a telescopic rod at its bottom end, and an upper template is fixedly connected to the end of each telescopic rod away from the slider.

[0009] Furthermore, the top of the base plate is provided with a plurality of lower mold bases, the bottom of the plurality of lower mold bases are slidably connected to the top of the base plate, and the top of the plurality of lower mold bases are fixedly connected with two connecting rods, and the plurality of connecting rods are slidably inserted through the plurality of upper mold plates respectively.

[0010] Furthermore, springs are wound around the outer walls of several of the connecting rods, with one end of the spring fixedly connected to the bottom of the upper template and the other end of the spring fixedly connected to the top of the lower mold base.

[0011] Furthermore, the forming mechanism includes a support plate fixedly connected to the top of the base plate, an electric push rod II fixedly connected to the top of the support plate, and a movable frame fixedly connected to the output end of the electric push rod II.

[0012] Furthermore, a pressure plate is fixedly connected to the bottom of the movable frame, and the pressure plate is located between the slider and the upper template.

[0013] Furthermore, the pressure plate has several grooves, the inner diameter of each groove being wider than the outer diameter of each telescopic rod, and the bottom of the pressure plate is in contact with the top of the upper template.

[0014] Furthermore, an IGBT substrate is disposed between the upper mold plate and the lower mold base, and the IGBT substrate is placed on top of several lower mold bases.

[0015] This utility model has the following beneficial effects:

[0016] 1. By incorporating an equidistant adjustment mechanism, with the cooperation of hinge block one and hinge block two, the electric push rod one can be driven to rotate the adjustment rod at the top of the adjustment rod located in the middle. This causes multiple rollers to slide and displace on the inner wall of the adjustment rod, thereby causing multiple sliders to displace equally on the outer wall of the slider. This allows the multiple sliders to move closer or further apart simultaneously, and the spacing between the multiple sliders can be adjusted and limited equidistantly. Through this precise and efficient adjustment method, the forming positions of multiple sets of pins on the IGBT substrate can be accurately set according to different requirements, providing a strong guarantee for producing high-quality IGBT products that meet diverse requirements.

[0017] 2. By setting up a forming mechanism, after adjusting the spacing between multiple lower mold bases and the upper mold plate, the electric push rods on the support plate can be driven to move the bottom end of the moving frame and the pressure plate downward. Multiple telescopic rods pass through multiple grooves on the pressure plate, so that the pressure plate fits against the top of the upper mold plate and presses the upper mold plate downward. After the IGBT substrate is placed between the upper mold plate and the lower mold base, the upper mold plate and the lower mold base cooperate to extrude and form multiple sets of fins on the IGBT substrate. Multiple springs cooperate with each other. After extrusion and forming, the upper mold plate moves upward to reset, and the forming process of the IGBT substrate is successfully completed. This lays a good foundation for subsequent product processing and application, and further ensures the high-quality output of IGBT products.

[0018] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the adjusting rod of this utility model;

[0022] Figure 3 This is a schematic diagram of the upper template of this utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the IGBT substrate of this utility model;

[0024] Figure 5 for Figure 2 A magnified structural diagram of point A in the middle.

[0025] The attached diagram lists the components represented by each number as follows:

[0026] 1. Base plate; 2. Equidistant adjustment mechanism; 3. Forming mechanism; 4. IGBT substrate; 21. Outer frame; 22. Slide rod; 23. Slider; 24. Adjusting rod; 25. Roller; 26. Hinge block one; 27. Electric push rod one; 28. Hinge block two; 29. ​​Telescopic rod; 291. Upper template; 292. Lower mold base; 293. Connecting rod; 294. Spring; 31. Support plate; 32. Electric push rod two; 33. Moving frame; 34. Pressure plate; 35. Groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-5 As shown, this utility model is an IGBT substrate pin fin heat dissipation structure and its equidistant limiting forming mechanism frame, including a base plate 1, on which an equidistant adjustment mechanism 2 and a forming mechanism 3 are provided;

[0029] The equidistant adjustment mechanism 2 includes an outer frame 21 fixedly connected to the top of the base plate 1. Several sliding rods 22 are fixedly connected to the inner wall of the outer frame 21. Sliding blocks 23 are slidably connected to the outer walls of two corresponding sliding rods 22. The middle sliding block 23 is fixedly connected to the outer walls of the two sliding rods 22. An adjusting rod 24 is rotatably connected to the top of the middle sliding block 23. Rollers 25 are rotatably connected to the tops of the other four sliding blocks 23. The four rollers 25 are slidably connected to the inner walls of the adjusting rods 24. A hinge block 26 is rotatably connected to the inner wall of the outer frame 21. An electric push rod 27 is fixedly connected to the side of the hinge block 26 away from the outer frame 21. A hinge block 28 is fixedly connected to the output end of the electric push rod 27. 8 is rotatably mounted on the top of the adjusting rod 24. The bottom ends of several sliders 23 are all fixedly connected to telescopic rods 29. The ends of several telescopic rods 29 away from the sliders 23 are all fixedly connected to upper templates 291. Several lower mold bases 292 are provided on the top of the base plate 1. The bottom of several lower mold bases 292 is slidably connected to the top of the base plate 1. Two connecting rods 293 are fixedly connected to the top of several lower mold bases 292. Several connecting rods 293 slide through several upper templates 291 respectively. Springs 294 are wound around the outer walls of several connecting rods 293. One end of the spring 294 is fixedly connected to the bottom of the upper template 291, and the other end of the spring 294 is fixedly connected to the top of the lower mold base 292.

[0030] The forming mechanism 3 includes a support plate 31 fixedly connected to the top of the base plate 1. An electric push rod 32 is fixedly connected to the top of the support plate 31. A movable frame 33 is fixedly connected to the output end of the electric push rod 32. A pressure plate 34 is fixedly connected to the bottom of the movable frame 33. The pressure plate 34 is located between the slider 23 and the upper template 291. Several grooves 35 are provided on the pressure plate 34. The inner diameter of the grooves 35 is larger than the outer diameter of the telescopic rods 29. The bottom of the pressure plate 34 is in contact with the top of the upper template 291. An IGBT substrate 4 is provided between the upper template 291 and the lower mold base 292. The IGBT substrate 4 is placed on top of the lower mold bases 292.

[0031] One specific application of this embodiment is as follows: In modern electronic manufacturing processes, the production of IGBT substrate 4 requires extremely high precision, especially the forming positions of multiple sets of pins, which need to be precisely adjusted according to different product requirements. To meet this critical requirement, an equidistant adjustment mechanism 2 is provided. With the cooperation of hinge block 1 26 and hinge block 28, the electric push rod 1 27 can be driven to rotate the adjustment rod 24 at the top of the adjustment rod 24 located in the middle. This causes multiple rollers 25 to slide and displace on the inner wall of the adjustment rod 24, thereby causing multiple sliders 23 to move equally on the outer wall of the slide rod 22. This allows multiple sliders 23 to move closer or further away from each other simultaneously, and the distance between multiple sliders 23 is equidistantly adjusted and limited. Through this precise and efficient adjustment method, the forming positions of multiple sets of pins on the IGBT substrate 4 can be precisely set according to different requirements, providing a strong guarantee for producing high-quality IGBT products that meet diverse requirements.

[0032] By setting a forming mechanism 3, after adjusting the spacing between multiple lower mold bases 292 and upper mold plate 291, the electric push rod 32 on the support plate 31 can be driven to move the bottom end of the moving frame 33 and the pressure plate 34 downward. Multiple telescopic rods 29 pass through multiple grooves 35 on the pressure plate 34, so that the pressure plate 34 fits against the top of the upper mold plate 291 and presses the upper mold plate 291 downward. After the IGBT substrate 4 is placed between the upper mold plate 291 and the lower mold base 292, the upper mold plate 291 and the lower mold base 292 cooperate to extrude and form multiple sets of fins on the IGBT substrate 4. Multiple springs 294 cooperate with each other. After extrusion and forming, the upper mold plate 291 moves upward to reset, and the forming process of the IGBT substrate 4 is successfully completed, laying a good foundation for subsequent product processing and application, and further ensuring the high-quality output of IGBT products.

[0033] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0034] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A heat dissipation structure for an IGBT substrate with pin fins and its equidistant positioning and forming mechanism, characterized in that: Includes a base plate (1), on which an equidistant adjustment mechanism (2) and a forming mechanism (3) are provided; The equidistant adjustment mechanism (2) includes an outer frame (21) fixedly connected to the top of the base plate (1). Several sliding rods (22) are fixedly connected to the inner wall of the outer frame (21). Sliding blocks (23) are slidably connected to the outer walls of two corresponding sliding rods (22). The middle sliding block (23) is fixedly connected to the outer walls of the two sliding rods (22). An adjustment rod (24) is rotatably connected to the top of the middle sliding block (23). The tops of the other four sliding blocks (23) are... Each of the four rollers (25) is rotatably connected to the inner wall of the adjusting rod (24). The inner wall of the outer frame (21) is rotatably connected to a hinge block (26). An electric push rod (27) is fixedly connected to the side of the hinge block (26) away from the outer frame (21). The output end of the electric push rod (27) is fixedly connected to a hinge block (28). The hinge block (28) is rotatably mounted on the top of the adjusting rod (24).

2. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 1, characterized in that, Each of the sliders (23) has a telescopic rod (29) fixedly connected to its bottom end, and an upper template (291) is fixedly connected to one end of each telescopic rod (29) away from the slider (23).

3. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 2, characterized in that, The top of the base plate (1) is provided with a plurality of lower mold bases (292), the bottom of the plurality of lower mold bases (292) is slidably connected to the top of the base plate (1), and the top of the plurality of lower mold bases (292) is fixedly connected with two connecting rods (293), and the plurality of connecting rods (293) are slidably inserted through the plurality of upper mold plates (291).

4. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 3, characterized in that, The outer walls of several of the connecting rods (293) are wound with springs (294), one end of the springs (294) is fixedly connected to the bottom of the upper template (291), and the other end of the springs (294) is fixedly connected to the top of the lower mold base (292).

5. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 4, characterized in that, The forming mechanism (3) includes a support plate (31) fixedly connected to the top of the base plate (1), and an electric push rod (32) is fixedly connected to the top of the support plate (31). The output end of the electric push rod (32) is fixedly connected to a movable frame (33).

6. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 5, characterized in that, A pressure plate (34) is fixedly connected to the bottom of the movable frame (33), and the pressure plate (34) is located between the slider (23) and the upper template (291).

7. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 6, characterized in that, The pressure plate (34) has several grooves (35), the inner diameter of each groove (35) is larger than the outer diameter of each telescopic rod (29), and the bottom of the pressure plate (34) is in contact with the top of the upper template (291).

8. The IGBT substrate pin-fin heat dissipation structure and its equidistant limiting forming mechanism according to claim 7, characterized in that, An IGBT substrate (4) is disposed between the upper template (291) and the lower mold base (292), and the IGBT substrate (4) is placed on top of several lower mold bases (292).

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