A semiconductor device clamping fixture

Abstract

The utility model relates to technical field of semiconductor device processing device, specifically disclose a kind of semiconductor device clamping fixing device, including support, rotary drive module, clamping module, clamping module includes rotating seat, four push mechanisms of supporting platform, push driving mechanism, reset mechanism, the push mechanism includes sliding seat, slider, push piece, four push pieces are formed around clamping area;After semiconductor device is placed in the clamping area on supporting platform, four push mechanisms are driven simultaneously by push driving mechanism and move towards supporting platform direction, sliding seat is slid along radial direction, make the push piece on slider synchronous to center move, clamp semiconductor device, realize automatic centering positioning;Rotary drive module can drive entire clamping module to rotate to adjust the angle of semiconductor device, simultaneously, by replacing different specifications push piece or adjusting the radial position of slider on sliding seat, different model size semiconductor device can be adapted to clamp.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing equipment technology, and in particular to a semiconductor device clamping and fixing device. Background Technology

[0002] After semiconductor devices (such as electronic components with model numbers DFN / QFN) are manufactured, they are usually transferred to a vibratory feeder. The vibratory feeder neatly and orderly feeds out the disordered semiconductor devices one by one. Then, a gripping mechanism transfers the semiconductor devices to the clamping and fixing device of the machine for positioning, so that the subsequent suction cup can accurately grasp the center of the semiconductor device, which is conducive to subsequent processes such as testing, marking, and packaging.

[0003] Existing semiconductor device clamping and fixing devices, such as the rotary positioning device for semiconductor device processing disclosed in Chinese Patent Publication No. CN105470185B, include a motor, a rotary disk fixedly connected to the output shaft of the motor, and a motor fixing structure fixedly connected to the end face of the output shaft of the motor. A sliding plate is also provided between the motor fixing structure and the rotary disk. The sliding plate is connected to the motor fixing structure and is tightly fitted to the rotary disk. The rotary disk is provided with a first fixing seat and a second fixing seat. The rotary disk is provided with a first air hole at the mounting position of the first fixing seat and a second air hole at the mounting position of the second fixing seat. An air guide channel is provided inside the sliding plate and is connected to an external air source. Both the first air hole and the second air hole are connected to the air guide channel.

[0004] The aforementioned rotary positioning device for semiconductor device processing has a first fixed seat and a second fixed seat that are fixed by screws or other workpieces and cannot move. The semiconductor device needs to be precisely placed between the first fixed seat and the second fixed seat, and automatic centering and clamping positioning cannot be achieved. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a semiconductor device clamping and fixing device to solve the above problems.

[0006] A semiconductor device clamping and fixing device includes a bracket, a rotary drive module fixed on the bracket, and a clamping module connected to the output end of the rotary drive module. The clamping module includes a rotating base, a support platform fixed at the middle of the upper end of the rotating base, four pushing mechanisms arranged around the support platform and movable radially therearound, a pushing drive mechanism for simultaneously driving the four pushing mechanisms to move toward the support platform, and a reset mechanism for driving the pushing mechanisms to move away from the support platform. Each pushing mechanism includes a sliding base, a slider fixed on the sliding base by a locking assembly and whose position can be adjusted radially along the support platform, and a pushing member detachably fixed to one end of the slider. The four pushing members surround the support platform to form a clamping area for clamping semiconductor devices.

[0007] Specifically, the rotary drive module includes a motor fixed on the bracket, a large pulley connected to the output shaft of the motor, a small pulley rotatably mounted on the bracket via a rotating shaft, a transmission belt connecting the large pulley and the small pulley, and a mounting base coaxial with the rotating shaft. The rotary base is detachably fixed to the mounting base by fastening screws.

[0008] Specifically, the lower end of the rotating base is provided with hollow grooves on both sides, and the bottom of the hollow groove is provided with positioning holes for the fastening screws to be installed.

[0009] Specifically, the rotating seat is provided with four movable slots, one of the sliding seats moves within one of the movable slots, the inner side of the movable slot is provided with a limiting hole, the sliding seat is provided with a limiting rod that cooperates with the limiting hole, and the reset mechanism includes a spring sleeved on the limiting rod and located between the sliding seat and the inner wall of the movable slot.

[0010] Specifically, the support platform has a cavity on its inner side, a number of air holes communicating with the cavity on its top surface, and an air pipe connector communicating with the cavity on its side. The air pipe connector is connected to a vacuum pumping device through a pipe.

[0011] Specifically, the pushing drive mechanism includes a cylinder fixed to the outer side of the rotating seat and an annular pressure plate connected to the output end of the cylinder. The sliding seat has an inclined guide surface at the end away from the support platform. The annular pressure plate surrounds the four sliding seats and abuts against the inclined guide surface.

[0012] Specifically, the sliding seat is provided with a groove extending radially along the support platform, the locking assembly includes a hexagonal nut and a locking screw, the hexagonal nut is disposed in the groove, the top of the groove is provided with a waist-shaped hole that runs vertically through it, the slider is provided with a mounting hole, and the locking screw passes downward through the mounting hole and the waist-shaped hole and is threadedly connected to the hexagonal nut.

[0013] Specifically, the bracket is equipped with a protective cover for covering the rotary drive module.

[0014] The beneficial effects of this utility model are:

[0015] The semiconductor device clamping and fixing device of this application, after the semiconductor device is placed in the clamping area of ​​the support platform, a push-drive mechanism simultaneously drives four push mechanisms to move towards the support platform, causing the sliding seat to slide radially, thereby causing the push members fixed on the slider to move synchronously towards the center, applying force evenly from all sides to clamp the semiconductor device, achieving automatic centering and positioning; after positioning is completed, the push-drive mechanism resets, and the reset mechanism drives the push mechanisms to move away from the support platform, causing the push members to release the semiconductor device, facilitating the subsequent precise pick-up and transfer by the rotary suction nozzle mechanism; in addition, the rotary drive module can drive the entire clamping module to rotate to adjust the angle of the semiconductor device, and by replacing different specifications of push members or adjusting the radial position of the slider on the sliding seat, it can be adapted to clamp semiconductor devices of different sizes. Attached Figure Description

[0016] Figure 1 A perspective view of the semiconductor device clamping and fixing device of this application without the protective cover;

[0017] Figure 2 This is a perspective view of the semiconductor device clamping and fixing device of this application;

[0018] Figure 3 This is a perspective view of the clamping module of this application;

[0019] Figure 4 for Figure 3 Enlarged view of section B;

[0020] Figure 5 This is a top view of the clamping module of this application;

[0021] Figure 6 for Figure 5 Sectional view along line AA;

[0022] Figure 7 This is an exploded view of the pressing mechanism of this application;

[0023] Figure 8 This is a 3D view of semiconductor processing equipment.

[0024] The attached figures are labeled as follows: bracket 10, protective cover 11, rotary drive module 20, motor 21, large pulley 22, small pulley 23, transmission belt 24, mounting base 25, clamping module 30, rotating base 31, hollow groove 311, positioning hole 312, movable groove 313, limiting hole 314, support platform 32, cavity 321, air hole 322, pushing mechanism 33, sliding base 331, limiting rod 3311, inclined guide surface 3312, sliding groove 3313, waist-shaped hole 3314, locking assembly 332, hexagonal nut 3321, locking screw 3322, slider 333, mounting hole 3331, pushing component 334, pushing drive mechanism 34, cylinder 341, annular pressure plate 342, reset mechanism 35, air pipe connector 323, semiconductor device 40, semiconductor processing equipment 50, machine base 51, vibratory plate 52. Detailed Implementation

[0025] This utility model provides a semiconductor device clamping and fixing device. To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0026] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0027] Please refer to Figure 8 The semiconductor device clamping and fixing device in this embodiment can be installed in the semiconductor processing equipment 50, specifically on the machine base 51, and located on the discharge end side of the vibratory feeder 52.

[0028] Please refer to Figures 1 to 7The semiconductor device clamping and fixing device of this embodiment includes a bracket 10, a rotary drive module 20 fixed on the bracket 10, and a clamping module 30 connected to the output end of the rotary drive module 20. The clamping module 30 includes a rotating seat 31, a support platform 32 fixed at the middle of the upper end of the rotating seat 31, four pushing mechanisms 33 arranged around the support platform 32 and movable radially therearound, a pushing drive mechanism 34 for simultaneously driving the four pushing mechanisms 33 to move toward the support platform 32, and a reset mechanism 35 for driving the pushing mechanisms 33 to move away from the support platform 32. The pushing mechanism 33 includes a sliding seat 331, a slider 333 fixed on the sliding seat 331 by a locking assembly 332 and whose position can be adjusted radially along the support platform 32, and a pushing member 334 detachably fixed to one end of the slider 333. The four pushing members 334 surround the support platform 32 to form a clamping area for clamping the semiconductor device 40.

[0029] After the semiconductor device 40 is placed in the clamping area on the support platform 32, the push drive mechanism 34 simultaneously drives four push mechanisms 33 to move towards the support platform 32, causing the sliding seat 331 to slide radially. This causes the push members 334 fixed on the slider 333 to move synchronously towards the center, applying force evenly from all sides to clamp the semiconductor device 40, achieving automatic centering and positioning. After positioning, the push drive mechanism 34 resets, and the reset mechanism 35 drives the push mechanisms 33 to move away from the support platform 32, causing the push members 334 to release the semiconductor device 40, facilitating the subsequent precise suction and transfer by the rotary nozzle mechanism. In addition, the rotary drive module 20 can drive the entire clamping module 30 to rotate to adjust the angle of the semiconductor device 40. At the same time, by replacing push members 334 of different specifications or adjusting the radial position of the slider 333 on the sliding seat 331, it can adapt to clamp semiconductor devices 40 of different sizes.

[0030] like Figure 1 As shown, the rotary drive module 20 includes a motor 21 fixed on the bracket 10, a large pulley 22 connected to the output shaft of the motor 21, a small pulley 23 rotatably mounted on the bracket 10 via a rotating shaft, a transmission belt 24 connecting the large pulley 22 and the small pulley 23, and a mounting base 25 coaxially driven with the rotating shaft. The rotating base 31 is detachably fixed to the mounting base 25 by fastening screws. When it is necessary to rotate and adjust the angle of the clamping module 30, the motor 21 drives the large pulley 22 to rotate, and the transmission belt 24 drives the small pulley 23. The small pulley 23 and the mounting base 25 are driven by the same rotating shaft, thereby driving the clamping module 30 to rotate. The structure is ingenious.

[0031] like Figure 2 As shown, the bracket 10 is provided with a protective cover 11 for covering the rotary drive module 20 to prevent dust accumulation on the rotary drive module 20.

[0032] Please refer to Figure 3 The rotating base 31 has hollowed-out grooves 311 on both sides of its lower end. The bottom of the hollowed-out grooves 311 has positioning holes 312 for fastening screws. By fixing with fastening screws, the rotating base 31 and the mounting base 25 can be quickly installed, and the structure is firm after installation.

[0033] Please refer to Figure 5 and Figure 6 The rotating seat 31 is provided with four movable slots 313, and a sliding seat 331 moves within one movable slot 313. The inner side of the movable slot 313 is provided with a limiting hole 314. The sliding seat 331 is provided with a limiting rod 3311 that cooperates with the limiting hole 314. By setting the limiting rod 3311 and the limiting hole 314, the sliding seat 331 can be restricted to sliding only along the radial direction of the support platform 32. Moreover, two limiting rods 3311 and two limiting holes 314 are set at the same position of the movable slot 313, making the sliding process smoother. The reset mechanism 35 includes a spring sleeved on the limiting rod 3311 and located between the sliding seat 331 and the inner wall of the movable slot 313. The spring force is used for mechanical reset, realizing rapid reset. Moreover, the spring has low cost, which can reduce equipment cost.

[0034] Please refer to Figure 4 and Figure 6 The support platform 32 has a cavity 321 on its inner side, and a number of air holes 322 communicating with the cavity 321 on its top surface. The side surface of the support platform 32 has an air pipe connector 323 communicating with the cavity 321. The air pipe connector 323 is connected to a vacuum device through a pipe. When the semiconductor device 40 is placed in the clamping area, the vacuum device can be activated. The vacuum device will create a negative pressure in the cavity 321 by pumping air. The air holes 322 will be used to adsorb the bottom surface of the semiconductor device 40 above it, preventing it from loosening. When the semiconductor device 40 needs to be marked or other processes, the marking accuracy can be guaranteed by strictly limiting the height of the semiconductor device 40.

[0035] Please refer to Figure 3The push drive mechanism 34 includes a cylinder 341 fixed on the outer side of the rotating seat 31 and an annular pressure plate 342 connected to the output end of the cylinder 341. The sliding seat 331 has an inclined guide surface 3312 at the end away from the support platform 32. The annular pressure plate 342 surrounds the four sliding seats 331 and abuts against the inclined guide surface 3312. When clamping and positioning are required, cylinder 341 drives the annular pressure plate 342 to move upward. The annular pressure plate 342 acts on the inclined guide surface 3312 of the sliding seat 331. Due to the guiding effect of the inclined guide surface 3312, the upward thrust of the annular pressure plate 342 is converted into a resultant force that drives the sliding seat 331 to move radially toward the center of the support platform 32. This simultaneously drives the four pressing mechanisms 33 to move inward synchronously, causing the pressing component 334 to clamp the semiconductor device 40. This design only requires two cylinders 341 in conjunction with the annular pressure plate 342 and the inclined guide surface 3312 structure to achieve precise synchronous driving of the four pressing mechanisms 33. The structure is ingenious and the power transmission is efficient and reliable, effectively simplifying the device and ensuring the synchronicity and accuracy of the centering and positioning.

[0036] Please refer to Figure 7 The sliding seat 331 has a groove 3313 extending radially along the support platform 32. The locking assembly 332 includes a hexagonal nut 3321 and a locking screw 3322. The hexagonal nut 3321 is located in the groove 3313. The top of the groove 3313 has a through-hole 3314. The slider 333 has a mounting hole 3331. The locking screw 3322 passes through the mounting hole 3331 and the through-hole 3314 and is threadedly connected to the hexagonal nut 3321. When it is necessary to adjust the radial position of the pusher 334 relative to the center of the support platform 32, the locking screw 3322 is loosened. At this time, the hexagonal nut 3321 can move along the groove 3313. The support platform 32 slides freely in the radial direction, driving the slider 333 and the pusher 334 fixed on it to move to the required position. Then, the locking screw 3322 is tightened, and the slider 333 is pressed and fixed on the sliding seat 331 by the locking force of the locking screw 3322 and the hexagonal nut 3321. This structure utilizes the space provided by the waist-shaped hole 3314 when the locking screw 3322 is loose, so that the slider 333 can flexibly and smoothly adjust its radial position along the slide groove 3313, thereby easily changing the size of the clamping area to adapt to semiconductor devices 40 of different specifications, and can achieve a stable and reliable locking fixation after adjustment, ensuring stability during the clamping process.

[0037] The preferred embodiments of this utility model have been described in detail above. However, this invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this invention.

Claims

1. A semiconductor device clamping and fixing device, characterized in that, The system includes a bracket (10), a rotary drive module (20) fixed on the bracket (10), and a clamping module (30) connected to the output end of the rotary drive module (20). The clamping module (30) includes a rotating base (31), a support platform (32) fixed at the middle of the upper end of the rotating base (31), four pushing mechanisms (33) arranged around the support platform (32) and movable radially therearound, a pushing drive mechanism (34) for simultaneously driving the four pushing mechanisms (33) to move toward the support platform (32), and a clamping module (30) for using a clamping module (30) to clamp the rotating base (10). The reset mechanism (35) that drives the pushing mechanism (33) to move away from the support platform (32) includes a sliding seat (331), a slider (333) fixed to the sliding seat (331) by a locking assembly (332) and whose position can be adjusted radially along the support platform (32), and a pushing member (334) detachably fixed to one end of the slider (333). The four pushing members (334) surround the support platform (32) to form a clamping area for clamping the semiconductor device (40).

2. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The rotary drive module (20) includes a motor (21) fixed on the bracket (10), a large pulley (22) connected to the output shaft of the motor (21), a small pulley (23) rotatably mounted on the bracket (10) via a rotating shaft, a transmission belt (24) connecting the large pulley (22) and the small pulley (23), and a mounting base (25) coaxially driven with the rotating shaft. The rotary base (31) is detachably fixed to the mounting base (25) by fastening screws.

3. The semiconductor device clamping and fixing device according to claim 2, characterized in that, The rotating base (31) has hollowed-out grooves (311) on both sides of its lower end, and a positioning hole (312) is provided at the bottom of the hollowed-out groove (311). The positioning hole (312) is used for installing the fastening screw.

4. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The rotating seat (31) is provided with four movable slots (313), and one sliding seat (331) moves within one of the movable slots (313). The inner side of the movable slot (313) is provided with a limiting hole (314), and the sliding seat (331) is provided with a limiting rod (3311) that cooperates with the limiting hole (314). The reset mechanism (35) includes a spring sleeved on the limiting rod (3311) and located between the sliding seat (331) and the inner wall of the movable slot (313).

5. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The support platform (32) has a cavity (321) inside, and its top surface has a plurality of air holes (322) communicating with the cavity (321). Its side surface has an air pipe connector (323) communicating with the cavity (321). The air pipe connector (323) is connected to the vacuum device through a pipe.

6. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The pushing drive mechanism (34) includes a cylinder (341) fixed on the outer side of the rotating seat (31) and an annular pressure plate (342) connected to the output end of the cylinder (341). The sliding seat (331) has an inclined guide surface (3312) at the end away from the support platform (32). The annular pressure plate (342) surrounds the four sliding seats (331) and abuts against the inclined guide surface (3312).

7. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The sliding seat (331) is provided with a groove (3313) extending radially along the support platform (32). The locking assembly (332) includes a hexagonal nut (3321) and a locking screw (3322). The hexagonal nut (3321) is located in the groove (3313). The top of the groove (3313) is provided with a waist-shaped hole (3314) that runs vertically through it. The slider (333) is provided with a mounting hole (3331). The locking screw (3322) passes through the mounting hole (3331) and the waist-shaped hole (3314) and is threadedly connected to the hexagonal nut (3321).

8. The semiconductor device clamping and fixing device according to claim 1, characterized in that, The bracket (10) is provided with a protective cover (11) for covering the rotary drive module (20).

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