A multi-specification wafer adaptive clamp

Abstract

This utility model relates to the field of semiconductor manufacturing equipment, and more particularly to a multi-specification wafer adaptive clamp, comprising a base, with cylinders mounted at both ends of the base. The piston rods of the cylinders face the center and are connected to mounting seats. Two push plates are rotatably connected to opposite sides of the two mounting seats. Gears are connected to the rotating shafts of the push plates and the mounting seats. Two gears within the mounting seats mesh with each other. Pressure sensors are mounted on the side of each push plate that contacts the wafer. A connecting seat is rotatably connected within the mounting seats, and the connecting seat is connected to the top of one of the gears. A locking component is provided within the mounting seats to restrict the rotation of the connecting seat. Through the rotatable connection between the meshing gears within the mounting seats and the push plates, the two push plates are mirror-symmetrically adjusted. Combined with the spline connection to the key of the connecting seat, a transmission locking structure is formed, achieving the purpose of adaptive clamping of multi-specification wafers.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment, and in particular to a multi-specification wafer adaptive fixture. Background Technology

[0002] As a core material in the semiconductor industry, wafers are typically made of high-purity semiconductor materials such as single-crystal silicon, gallium arsenide, and gallium nitride. They are circular or near-circular thin-film structures with diameters ranging from a few millimeters to over 300 millimeters, and are widely used in integrated circuit manufacturing, photovoltaic cells, LED chips, and other fields. Since wafer processing precision directly affects the performance of the final device, its surface flatness, edge morphology, and positioning accuracy must reach micrometer-level or even nanometer-level standards. This places extremely high demands on the positioning and clamping technologies of each process step in the manufacturing process.

[0003] In the wafer manufacturing process, centering and positioning are crucial for ensuring processing accuracy. Existing production equipment typically employs a mechanical centering mechanism, which uses symmetrically arranged arc-shaped clamps on both sides to move synchronously towards the center, achieving centering by utilizing the contact between the inner arc surface of the clamps and the edge of the wafer. These mechanisms often rely on cylinders or motors to drive the clamping plate movement, and use force or displacement sensors to control the clamping force and position to prevent overpressure damage to the wafer. This technical solution can achieve stable positioning in a single-specification wafer production line and is widely used in core process equipment such as cutting, grinding, and polishing.

[0004] However, because the curvature and spacing of the curved clamps need to match specific wafer sizes, production lines for wafers of different specifications require clamp assemblies of corresponding sizes. When the production line switches wafer specifications, the clamps must be manually replaced and the alignment parameters readjusted, resulting in extended equipment downtime, reduced production efficiency, and additional fixture inventory costs. Utility Model Content

[0005] To overcome the shortcomings of poor specification adaptability, this utility model provides a multi-specification wafer adaptive fixture, which aims to solve the above-mentioned shortcomings.

[0006] A multi-specification wafer adaptive fixture includes a base, with cylinders mounted at both ends of the base. The piston rods of the cylinders face the center and are connected to mounting seats. Two push plates are rotatably connected to the opposing sides of the two mounting seats. Gears are connected to the rotating shafts of the push plates and the mounting seats. Two gears inside the mounting seats mesh with each other. Pressure sensors are mounted on the side of the push plates that contacts the wafer. A connecting seat is rotatably connected inside the mounting seats and is connected to the top of one of the gears. A locking component is provided inside the mounting seats to restrict the rotation of the connecting seat.

[0007] To further explain, the locking assembly includes a guide rod, a fixing plate is connected to the top of the mounting base, the upper part of the guide rod is slidably connected to the fixing plate, a spline is connected to the lower end of the guide rod, the spline is keyed to the connecting seat, and a return spring is sleeved on the upper part of the guide rod, one end of the return spring is connected to the fixing plate, and the other end is connected to the guide rod.

[0008] To further explain, each of the two mounting bases has a limiting plate connected to one end facing the other, and the limiting plate is located between the two push plates.

[0009] To further explain, a locking block is slidably connected to the top surface of the fixing plate, and the locking block is in a limiting engagement with the top of the guide rod.

[0010] To further explain, the top outer ring of the guide rod is surrounded by a rubber ring.

[0011] To further explain, an auxiliary rod is connected to the top of the end of the push plate away from the mounting base.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. By rotating the gears that mesh with each other in the mounting base and the push plate, the two push plates are adjusted in a mirror symmetrical manner. Combined with the spline and the key connection of the connecting base, a transmission locking structure is formed to achieve the purpose of adaptive clamping of multi-specification wafers.

[0014] 2. The cylinder pushes the mounting base to move towards the center. With the contact between the push plate and the edge of the wafer and the feedback from the pressure sensor, the push plates on both sides move inward synchronously until all pressure sensors detect the preset contact force, thereby realizing the automatic centering and positioning function of the wafer, and ultimately ensuring that the wafer is stably processed in the center area of ​​the base. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a cross-sectional view of the mounting structure of the pressure sensor and push plate of this utility model.

[0017] Figure 3 This is a schematic diagram of the installation structure of the spline and guide rod of this utility model.

[0018] The markings in the attached diagram are as follows: 1: base, 2: cylinder, 3: mounting base, 4: push plate, 5: pressure sensor, 6: gear, 7: connecting base, 8: fixing plate, 9: spline, 10: guide rod, 11: return spring, 12: limit plate, 13: locking block, 14: rubber ring, 15: auxiliary rod. Detailed Implementation

[0019] The present invention will now be described more fully below with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and to fully convey the scope of the invention to those skilled in the art.

[0020] Example: A multi-specification wafer adaptive fixture, such as Figures 1-3 As shown, the device includes a base 1, a cylinder 2, a mounting base 3, a push plate 4, a pressure sensor 5, a gear 6, a connecting seat 7, and a locking assembly. Cylinders 2 are mounted on both the left and right ends of the base 1. The piston rods of the cylinders 2 face the center and are connected to the mounting bases 3. Two push plates 4 are rotatably connected to the opposite sides of the two mounting bases 3. Gears 6 are connected to the shafts connecting the push plates 4 and the mounting bases 3. The two gears 6 inside the mounting bases 3 mesh with each other, allowing the push plates 4 to rotate symmetrically via the meshing of the gears 6, ensuring the symmetry of the clamping action on both sides. A pressure sensor 5 is mounted on the side of the push plate 4 that contacts the wafer. The pressure sensor 5 can provide real-time feedback of the contact force and set a pressure threshold through the control system to prevent overpressure damage to the wafer. A connecting seat 7 is rotatably connected inside the mounting base 3, and the connecting seat 7 is connected to the top of one of the gears 6. A locking assembly is provided inside the mounting base 3 to restrict the rotation of the connecting seat 7.

[0021] like Figure 2 and Figure 3 As shown, the locking assembly includes a fixing plate 8, a spline 9, a guide rod 10, and a return spring 11. The top of the mounting base 3 is connected to the fixing plate 8. The upper part of the guide rod 10 is slidably connected to the fixing plate 8, and the lower end of the guide rod 10 is connected to the spline 9. The spline 9 is keyed to the connecting base 7. The spline 9 adopts a multi-stage tooth structure to adapt to the clamping angle requirements of common wafer specifications such as 6-inch, 8-inch, and 12-inch. The upper part of the guide rod 10 is fitted with a return spring 11. One end of the return spring 11 is connected to the fixing plate 8, and the other end is connected to the guide rod 10.

[0022] like Figure 1 As shown, it also includes a limiting plate 12. The two mounting bases 3 are connected to the opposite ends of the limiting plate 12. The limiting plate 12 is located between the two push plates 4. The limiting plate 12 restricts the push plates 4 from rotating too much inward and prevents the edge of the push plate 4 from contacting the center area of ​​the wafer when clamped.

[0023] like Figure 2 and Figure 3 As shown, it also includes a locking block 13. The locking block 13 is slidably connected to the top surface of the fixing plate 8. The locking block 13 is in a limiting fit with the top of the guide rod 10. The locking block 13 cooperates with the interlayer space at the top of the guide rod 10 through the top protrusion to temporarily fix the height of the guide rod 10.

[0024] like Figure 2and Figure 3 As shown, it also includes a rubber ring 14. The guide rod 10 is surrounded by a rubber ring 14 on its top outer ring. The rubber ring 14 is made of flexible rubber material, which produces elastic deformation when squeezed, increasing the friction between the operator's fingers and the top of the guide rod 10.

[0025] like Figure 1 and Figure 2 As shown, it also includes an auxiliary rod 15. The top of the push plate 4 away from the mounting base 3 is connected to the auxiliary rod 15 to improve grip stability and facilitate the operator to fine-tune the clamping angle.

[0026] After the wafer is delivered to the central positioning area of ​​base 1, the piston rod of cylinder 2 extends outward simultaneously, pushing the mounting seats 3 on both sides to move smoothly towards the center along the guide rail of base 1. During the movement of mounting seat 3, the rotating push plate 4 at its front end gradually approaches the edge of the wafer. When one push plate 4 first contacts the wafer, the contact force pushes the wafer to the opposite side. As mounting seat 3 continues to advance, the remaining push plates 4 contact the edge of the wafer in sequence until the pressure sensors 5 installed on the inner side of all push plates 4 detect the contact pressure of the preset threshold. At this time, the control system determines that the wafer has completed horizontal centering positioning. Subsequently, the piston rod of cylinder 2 retracts, driving the mounting seat 3 and push plate 4 back to the initial position. The wafer remains stably in the central area of ​​base 1 due to inertia and surface friction, completing the centering operation.

[0027] When the production line needs to switch to different wafer specifications, the operator first pinches the rubber ring 14 at the top of the guide rod 10, and then pulls the guide rod 10 upward. The guide rod 10 slides smoothly along the guide hole of the fixing plate 8, while compressing the reset spring 11 sleeved on it, allowing it to store elastic potential energy. After the guide rod 10 is raised to the preset height, the locking block 13 is pushed horizontally, and the limiting protrusion at the top of the locking block 13 is inserted into the interlayer space at the top of the guide rod 10. At this time, the guide rod 10 is temporarily fixed and cannot fall. At this time, the spline 9 moves upward with the guide rod 10 and completely disengages from the keyway at the top of the connecting seat 7, releasing the rotation restriction on the connecting seat 7, allowing the connecting seat 7 to rotate freely. The operator can manually rotate any push plate 4. When the push plate 4 rotates, it drives the gear 6 on its shaft to rotate synchronously. Since the two gears 6 in the same mounting seat 3 mesh with each other, the push plates 4 on both sides rotate in a mirror symmetrical manner, ensuring the symmetry of the push plates 4 after adjustment. During the rotation, the multi-stage tooth structure of the spline 9 can achieve precise positioning at different angles, adapting to various wafer specifications. After adjustment, pull the locking block 13 in the opposite direction to disengage it from the guide rod 10. The reset spring 11 releases its elastic potential energy, pushing the guide rod 10 down to reset. The spline 9 is reinserted into the keyway of the connecting seat 7, restricting the rotation of the connecting seat 7 and the push plate 4, thus completing the specification adaptation of the fixture.

[0028] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation in order to cover all variations and equivalent structures and functions.

Claims

1. A multi-specification wafer adaptive fixture, characterized in that: The device includes a base (1), on which cylinders (2) are installed at both ends. The piston rods of the cylinders (2) face the center and are connected to mounting seats (3). Two push plates (4) are rotatably connected to the opposite sides of the two mounting seats (3). The shaft connecting the push plates (4) and the mounting seats (3) is connected to gears (6). The two gears (6) inside the mounting seats (3) mesh with each other. Pressure sensors (5) are installed on the side of the push plates (4) that contacts the wafer. A connecting seat (7) is rotatably connected inside the mounting seats (3). The connecting seat (7) is connected to the top of one of the gears (6). A locking component that restricts the rotation of the connecting seat (7) is provided inside the mounting seats (3).

2. The multi-specification wafer adaptive fixture according to claim 1, characterized in that: The locking assembly includes a guide rod (10), a fixing plate (8) is connected to the top of the mounting base (3), the upper part of the guide rod (10) is slidably connected to the fixing plate (8), the lower end of the guide rod (10) is connected to a spline (9), the spline (9) is keyed to the connecting base (7), and a return spring (11) is sleeved on the upper part of the guide rod (10). One end of the return spring (11) is connected to the fixing plate (8), and the other end is connected to the guide rod (10).

3. The multi-specification wafer adaptive fixture according to claim 2, characterized in that: Each of the two mounting bases (3) is connected to a limiting plate (12) at one end facing each other, and the limiting plate (12) is located between the two push plates (4).

4. A multi-specification wafer adaptive fixture according to claim 3, characterized in that: The top surface of the fixing plate (8) is slidably connected to a locking block (13), which is in a limiting fit with the top of the guide rod (10).

5. A multi-specification wafer adaptive fixture according to claim 4, characterized in that: The guide rod (10) is surrounded by a rubber ring (14) on its top outer ring.

6. A multi-specification wafer adaptive fixture according to claim 5, characterized in that: An auxiliary rod (15) is connected to the top of the end of the push plate (4) away from the mounting base (3).

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