Semiconductor wafer chuck

Abstract

The utility model provides a kind of semiconductor wafer chuck, semiconductor processing technical field.The semiconductor wafer chuck includes rotary chuck and multiple clamping claws installed in the edge of the rotary chuck, the clamping claw includes multiple fixed clamping claws and multiple movable clamping claws;The movable clamping claw includes clamping seat, clamping piece, lifting rod, the lifting rod is arranged at the bottom surface center of the clamping seat, and the lifting rod top is fixedly connected with the clamping seat bottom surface, and the lifting rod is used for the lifting of the movable clamping claw;Rotary chuck lower surface is also provided with elastic component, and the elastic component includes end plate, screw rod, spring, movable rod, connecting pipe.The application can be conveniently taken and placed wafer by setting liftable movable clamping claw and elastic component, solve the problem that mechanical hand is easily damaged rotary chuck when taking and placing wafer in semiconductor processing process;It can also provide stable clamping, reduce the wear of wafer, improve processing accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a semiconductor wafer chuck. Background Technology

[0002] In semiconductor manufacturing, wafers undergo multiple processes such as thin film deposition, etching, and polishing to ultimately form the final product. Therefore, wafers need to be transferred from carriers to different processing stages. Furthermore, each processing stage may involve contact with a large number of particles, necessitating cleaning of the wafer after each process to maintain a clean surface. The cleaning process typically involves a robotic arm transferring the wafer to be cleaned into a cleaning device. After cleaning, the robotic arm then picks up the wafer and transfers it to the next workstation.

[0003] During wafer fabrication, wafers need to be picked up and transferred multiple times using robotic arms. To facilitate wafer picking, a certain distance must be maintained between the wafer and the upper surface of the chuck to reduce damage caused by the robotic arm contacting the chuck. However, if the distance between the wafer and the chuck is too large, the centrifugal force will be too great during high-speed rotation. This requires increasing the clamping force of the clamping mechanism to ensure that the wafer does not shift or detach during high-speed rotation. However, excessive clamping force will lead to accelerated wear on the wafer edges.

[0004] Therefore, there is currently a lack of wafer chucks that can easily pick up and stably hold wafers. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a semiconductor wafer chuck that can at least solve some of the problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A semiconductor wafer chuck includes: a rotary chuck and a plurality of jaws mounted on the edge of the rotary chuck for clamping the wafer; a through hole is formed in the center of the rotary chuck.

[0007] Optionally, the jaws include multiple fixed jaws and multiple movable jaws, with the fixed jaws and movable jaws spaced apart from each other.

[0008] Optionally, the number of fixed jaws and movable jaws is the same. It is understood that the number of fixed jaws and movable jaws can be adjusted according to actual conditions. By selecting a reasonable number of fixed jaws and movable jaws, the reliability of wafer clamping can be maintained. Preferably, the rotary chuck is provided with 3 movable jaws and 3 fixed jaws, with the fixed jaws and movable jaws symmetrically spaced.

[0009] Optionally, the movable jaw includes a jaw base, a clamping member, and a lifting rod; the jaw base abuts against the rotary chuck, and the clamping member is movably connected to the jaw base for clamping the wafer; the lifting rod is located at the center of the bottom surface of the jaw base, and the top of the lifting rod is fixedly connected to the bottom surface of the jaw base, and the lifting rod is used for lifting the movable jaw; the rotary chuck is provided with a movable jaw mounting hole, which is a through hole on the upper and lower surfaces, and the diameter of the movable jaw mounting hole is smaller than the diameter of the jaw base and is adapted to the diameter of the lifting rod.

[0010] Optionally, the surface of the fixed jaw is used to support the wafer, and the height of the fixed jaw is consistent with the height of the mounting base of the movable jaw to ensure that the wafer is placed stably.

[0011] Optionally, a fixed sleeve is fixedly connected to the lower surface of the rotary chuck. The fixed sleeve has a through hole that penetrates the upper and lower surfaces and communicates with the mounting hole of the movable jaw. The diameter of the through hole is the same as that of the mounting hole of the movable jaw. The lifting rod is sleeved in the through hole of the fixed sleeve and the mounting hole of the movable jaw, and can move up and down.

[0012] Optionally, the movable claw further includes a driving component, which is located below the lifting rod and fixedly connected to the bottom of the lifting rod; the lifting rod moves up and down within the mounting holes of the fixed sleeve and the movable claw under the action of the driving component 340.

[0013] Optionally, a wear-resistant sleeve is also provided between the fixed sleeve and the lifting rod, and between the movable claw mounting hole and the lifting rod. The wear-resistant sleeve is made of wear-resistant materials such as PTFE, which can reduce the friction between the lifting rod and the fixed sleeve and the movable claw mounting hole, and improve the service life.

[0014] Optionally, a compression spring is also fixedly sleeved on the outer peripheral wall of the lifting rod, with the upper end of the compression spring fixedly connected to the bottom end of the fixed sleeve and a top plate provided at the lower end of the compression spring.

[0015] Understandably, when the lifting rod moves upward, the compression spring moves upward under the action of the lifting rod. However, the compression spring is compressed under the action of the fixed sleeve, which can limit the lifting rod. In addition, the setting of the compression spring can also play a certain buffering role, preventing the lifting rod from moving instantaneously due to the start and stop of the drive mechanism, which would have a certain impact on the wafer and cause damage to the wafer.

[0016] Optionally, the clamping member is provided with a contact surface for clamping the wafer, and a guide groove extending to the bottom of the clamping member is provided below the contact surface. The guide groove facilitates the smooth discharge of the liquid and avoids liquid residue accumulation at the contact point between the back of the wafer and the card holder.

[0017] Optionally, the clamping member is further provided with a rotary mounting hole, and a matching rotary shaft is provided on the chuck. The rotary shaft is inserted into the rotary mounting hole to movably connect the clamping member to the chuck. The clamping member can rotate around the rotary shaft to clamp the wafer. It is understood that the rotary chuck has a notch on its edge, which matches the lower end of the clamping member, allowing the clamping member to rotate at the notch.

[0018] Optionally, the lower surface of the rotary chuck is further provided with an elastic component, which is disposed on the outside of the fixed sleeve and is used to provide an elastic clamping force for the clamping member to hold the wafer. It is understood that "outer side" refers to the distance from the center of the rotary chuck; the area furthest from the rotary chuck is considered the outer side.

[0019] Optionally, the elastic component includes an end plate, a screw, a spring, a movable rod, and a connecting tube; The end plate is L-shaped, with its short limb fixedly connected to the bottom of the rotating chuck, and its long limb having a threaded hole. The screw is movably connected to the end plate through the threaded hole. The connecting tube is fixedly connected to the long limb of the end plate, and the screw is movably embedded in it; The spring is fixedly connected to the inner wall of the connecting tube on the side near the long limb of the end plate, and the movable rod is fixedly connected to the end of the spring away from the long limb of the end plate. The movable rod slides left and right inside the connecting tube through the spring. The end of the movable rod away from the long limb of the end plate abuts against the clamping member.

[0020] Understandably, by turning the screw, the screw compresses the spring, thereby driving the movable rod to move outward (i.e. away from the rotating chuck). The movable rod presses the lower end of the clamping member outward, causing it to rotate outward, while the upper end of the clamping member rotates inward to press the wafer, thus providing the movable jaw with greater clamping force and achieving stable clamping.

[0021] Compared with the prior art, the beneficial effects of this utility model include at least one of the following: The semiconductor wafer chuck of this application, by setting up liftable movable jaws and elastic components, can facilitate the picking and placing of wafers, solving the problem that the rotating chuck is easily damaged when the robot picks and places wafers during semiconductor processing; it can also provide stable clamping, ensuring that the wafer will not deviate during high-speed rotation, reducing wear on the wafer and improving processing accuracy. Attached Figure Description

[0022] Figure 1 This is a top view of the semiconductor wafer chuck provided in an embodiment of this application; Figure 2 This is a cross-sectional view of the semiconductor wafer chuck in an unclamped state provided in an embodiment of this application; Figure 3This is a cross-sectional view of the semiconductor wafer chuck in the clamped state provided in the embodiments of this application; Figure 4 It is the elastic component provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the active gripper provided in the embodiment of this application; Figure 6 This is a schematic diagram of the structure of the fixing claw provided in an embodiment of this application; Explanation of reference numerals in the attached figures: Wafer-000, Rotary chuck-100, Movable jaw mounting hole-101, Fixed sleeve-102, Fixed jaw-200, Movable jaw-300, Card holder-310, Clamping component-320, Lifting rod-330, Drive component-340, Compression spring-331, Top plate-332, Abutting surface-321, Rotary mounting hole-322, Elastic component-400, End plate-410, Screw-420, Connecting tube-430, Spring-440, Movable rod-450. Detailed Implementation

[0023] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0025] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In this utility model, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] like Figure 1-6 As shown, a semiconductor wafer chuck includes: a rotary chuck 100 and a plurality of jaws mounted on the edge of the rotary chuck 100, the jaws being used to clamp the wafer 000; a through hole is formed in the center of the rotary chuck.

[0029] The chuck includes multiple fixed chucks 200 and multiple movable chucks 300, with the fixed chucks 200 and movable chucks 300 spaced apart from each other.

[0030] Optionally, the rotary chuck 100 is provided with multiple fixed jaws 200 and movable jaws 300, and the number of fixed jaws 200 and movable jaws 300 is the same. It is understood that the number of fixed jaws 200 and movable jaws 300 can be adjusted according to actual conditions. By selecting a reasonable number of fixed jaws 200 and movable jaws 300, the reliability of wafer clamping can be maintained. Preferably, the rotary chuck 100 is provided with 3 movable jaws 300 and 3 fixed jaws 200, and the fixed jaws 200 and movable jaws 300 are symmetrically arranged at intervals.

[0031] Optionally, the movable jaw includes a jaw base 310, a clamping member 320, and a lifting rod 330; the jaw base 310 abuts against the rotary chuck 100, and the clamping member 320 is movably connected to the jaw base 310 for clamping the wafer; the lifting rod 330 is located at the center of the bottom surface of the jaw base 310, and the top of the lifting rod 330 is fixedly connected to the bottom surface of the jaw base 310, and the lifting rod 330 is used for lifting and lowering the movable jaw 300; the rotary chuck 100 is provided with a movable jaw mounting hole 101, which is a through hole on the upper and lower surfaces, and the diameter of the movable jaw mounting hole 101 is smaller than the diameter of the jaw base 310 and is adapted to the diameter of the lifting rod 330.

[0032] Optionally, the surface of the fixed jaw 200 is used to support the wafer, and the height of the fixed jaw 200 is the same as the height of the mounting base of the movable jaw 300 to ensure that the wafer is placed stably.

[0033] Optionally, a fixed sleeve 102 is fixedly connected to the lower surface of the rotary chuck 100. The fixed sleeve 102 has a through hole that penetrates the upper and lower surfaces and communicates with the movable claw mounting hole 101. The diameter of the through hole is the same as that of the movable claw mounting hole 101. The lifting rod 330 is sleeved in the fixed sleeve 102 and the movable claw mounting hole 101 and can move up and down.

[0034] It is understandable that the diameter of the movable jaw mounting hole 101 on the rotary chuck 100 is compatible with the through hole of the fixed sleeve 102 and the lifting rod 330. This means that the lifting rod 330 can be fitted into the fixed sleeve 102 and the movable jaw mounting hole 101 and move up and down inside, thereby controlling the lifting and lowering of the chuck seat. In addition, the dimensions of the movable jaw mounting hole 101, the fixed sleeve 102, and the lifting rod can be adjusted according to actual conditions. By reasonably setting their dimensions to adapt to the size of the semiconductor wafer chuck, specific details will not be elaborated here.

[0035] Optionally, the movable claw 300 also includes a drive component 340, which is located below the lifting rod 330 and is fixedly connected to the bottom of the lifting rod 330. Under the action of the drive component 340, the lifting rod 330 moves up and down within the fixed sleeve 102 and the movable claw mounting hole 101.

[0036] Optionally, a wear-resistant sleeve is also provided between the fixed sleeve 102 and the lifting rod 330, and between the movable claw mounting hole 101 and the lifting rod 330. The wear-resistant sleeve is made of wear-resistant materials such as PTFE, which can reduce the friction between the lifting rod 330 and the fixed sleeve 102 and the movable claw mounting hole 101, and improve the service life.

[0037] Optionally, a compression spring 331 is also fixedly sleeved on the outer peripheral wall of the lifting rod 330. The upper end of the compression spring 331 is fixedly connected to the bottom end of the fixed sleeve 102, and a top plate 332 is provided at the lower end of the compression spring 331. It can be understood that when the lifting rod 330 moves upward, the compression spring 331 moves upward under the action of the lifting rod 330. However, under the action of the fixed sleeve 102, the compression spring 331 is compressed, which can limit the lifting rod 330. In addition, the setting of the compression spring 331 can also play a certain buffering role, avoiding the instantaneous movement of the lifting rod 330 caused by the start and stop of the drive mechanism, which would cause a certain impact on the wafer and damage it.

[0038] Optionally, the clamping member 320 is provided with an abutment surface 321 for clamping the wafer, and a guide groove extending to the bottom end of the clamping member 321 is provided below the abutment surface.

[0039] Optionally, the clamping member 320 is further provided with a rotary mounting hole 322, and a matching rotary shaft is provided on the chuck 310. The rotary shaft is inserted into the rotary mounting hole 322 to movably connect the clamping member to the chuck. The clamping member can rotate around the rotary shaft to clamp the wafer. Understandably, the rotary chuck has a notch on its edge that matches the lower end of the clamping member, allowing the clamping member to rotate at the notch.

[0040] Optionally, the lower surface of the rotary chuck 100 is further provided with an elastic component 400, which is disposed on the outside of the fixed sleeve and is used to provide an elastic clamping force for the clamping member to clamp the wafer. It can be understood that the outside is defined in terms of distance from the center of the rotary chuck 100, and the location away from the rotary chuck 100 is the outside.

[0041] Optionally, the elastic component 400 includes an end plate 410, a screw 420, a connecting tube 430, a spring 440, and a movable rod 450; The end plate 410 is L-shaped. The short limb of the end plate 410 is fixedly connected to the bottom of the rotary chuck 100. The long limb of the end plate 410 is provided with threaded holes. The screw 420 is movably connected to the end plate 410 through the threaded holes. The connecting tube 430 is fixedly connected to the long limb of the end plate 410, and the screw 420 is movably embedded in it; Spring 440 is fixedly connected to the inner wall of connecting tube 430 on the side near the long limb of end plate 410, and movable rod 450 is fixedly connected to the end of spring 440 away from the long limb of end plate 410. Movable rod 450 slides left and right inside connecting tube 430 through spring 440. The end of the movable rod 450 away from the end plate 420 abuts against the clamping member 320.

[0042] Understandably, by turning the screw, the screw compresses the spring, thereby driving the movable rod to move outward (i.e. away from the rotating chuck). The movable rod presses the lower end of the clamping member outward, causing it to rotate outward, while the upper end of the clamping member rotates inward to press the wafer, thus providing the movable jaw with greater clamping force and achieving stable clamping.

[0043] Understandably, due to the movable connection between the movable jaw 300 and the rotary chuck 100, the dynamic stability of the movable jaw is lower than that of the fixed connection, thus reducing clamping stability to some extent. During high-speed rotation, the movable jaw 300 is susceptible to equipment vibration and airflow disturbances, which may cause micro-vibrations in the wafer, affecting processing accuracy. Therefore, this application incorporates an elastic component to press the lower end of the clamping element on the movable jaw, thereby pressing the upper end of the rotatable clamping element against the wafer, increasing the clamping force on the wafer, and maintaining stability during high-speed rotation, thus improving clamping stability. Moreover, under normal conditions, the jaw of the movable jaw rests against the rotary chuck under gravity, and the elastic component acts on the clamping element to clamp the wafer, allowing the wafer to rotate at high speed. When the movable jaw rises, the clamping element disengages from the push-pull rod in the elastic component, and the clamping element no longer applies clamping force to the wafer, leaving the wafer in a released state. Furthermore, a certain distance exists between the wafer and the rotary chuck, facilitating the robotic arm's gripping of the wafer.

[0044] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A semiconductor wafer chuck, characterized in that, The chuck includes a rotary chuck and multiple jaws mounted on the edge of the rotary chuck. The jaws include multiple fixed jaws and multiple movable jaws. Each movable jaw includes a jaw base, a clamping element, and a lifting rod. The lifting rod is located at the center of the bottom surface of the jaw base, and its top is fixedly connected to the bottom surface of the jaw base. The lifting rod is used for raising and lowering the movable jaw. The lower surface of the rotary chuck is also provided with an elastic component, which includes an end plate, a screw, a spring, a movable rod, and a connecting tube.

2. A semiconductor wafer chuck according to claim 1, characterized in that, The card holder abuts against the rotating chuck; the clamping member is movably connected to the card holder and is used to clamp the wafer.

3. A semiconductor wafer chuck according to claim 2, characterized in that, The rotary chuck is provided with a movable jaw mounting hole, which is a through hole that penetrates the upper and lower surfaces. The diameter of the movable jaw mounting hole is smaller than the diameter of the chuck seat and is adapted to the diameter of the lifting rod.

4. A semiconductor wafer chuck according to claim 3, characterized in that, The lower surface of the rotary chuck is fixedly connected to a fixed sleeve. The fixed sleeve has a through hole that penetrates the upper and lower surfaces and communicates with the mounting hole of the movable jaw. The diameter of the through hole is the same as that of the mounting hole of the movable jaw. The lifting rod is sleeved in the fixed sleeve and the mounting hole of the movable jaw and can move up and down in the fixed sleeve and the mounting hole of the movable jaw.

5. A semiconductor wafer chuck according to claim 4, characterized in that, The movable claw also includes a driving component, which is fixedly connected to the bottom of the lifting rod.

6. A semiconductor wafer chuck according to claim 5, characterized in that, A wear-resistant sleeve is also fitted between the fixed sleeve and the lifting rod, and between the movable claw mounting hole and the lifting rod.

7. A semiconductor wafer chuck according to claim 6, characterized in that, A compression spring is also fixedly sleeved on the outer peripheral wall of the lifting rod. The upper end of the compression spring is fixedly connected to the bottom end of the fixed sleeve, and a top plate is provided at the lower end of the compression spring.

8. A semiconductor wafer chuck according to claim 1, characterized in that, The clamping member is also provided with a rotating mounting hole, and the card holder is provided with a matching rotating shaft. The rotating shaft is inserted into the rotating mounting hole to movably connect the clamping member to the card holder. The clamping member can rotate around the rotating shaft to clamp the wafer.

9. A semiconductor wafer chuck according to claim 8, characterized in that, The elastic component is disposed on the outside of the fixed sleeve and is used to provide the clamping member with an elastic clamping force to clamp the wafer.

10. A semiconductor wafer chuck according to claim 9, characterized in that, The end plate is L-shaped, with its short limb fixedly connected to the bottom of the rotating chuck. A threaded hole is provided on the long limb of the end plate, through which the screw is movably connected to the end plate. The connecting tube is fixedly connected to the long limb of the end plate, and the screw is movably embedded within it. The spring is fixedly connected to the inner wall of the connecting tube on the side near the long limb of the end plate, and the movable rod is fixedly connected to the end of the spring away from the long limb of the end plate. The movable rod slides left and right inside the connecting tube via the spring. The end of the movable rod away from the long limb of the end plate abuts against the clamping member.

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