Silicon wafer holding device and cleaning system

Abstract

The utility model relates to a kind of silicon wafer fixing device and cleaning system, and the silicon wafer fixing device is used to fix the silicon wafer to be cleaned, the silicon wafer fixing device includes: at least two oppositely arranged clamping rollers, for clamping the silicon wafer to be cleaned, and drive silicon wafer to rotate;Flushing component, for flushing the clamping roller by cleaning liquid;Flow guide component, set on the outer circumferential surface of the clamping roller, for guiding the cleaning liquid carrying impurities after flushing the clamping roller flows along preset path;Collecting component, set below the clamping roller, for collecting the cleaning liquid carrying impurities from the flow guide component flows out.By flushing component, flow guide component and collecting component cooperate, timely clean the impurities including particulate matter etc. on roller, effectively avoid that silicon wafer is polluted again, improve the cleaning effect of silicon wafer, improve the quality of silicon wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor product manufacturing technology, and in particular to a silicon wafer fixing device and cleaning system. Background Technology

[0002] In the manufacturing process of semiconductor silicon wafers, cleaning after chemical mechanical polishing (CMP) is a crucial step. Its purpose is to remove residual slurry, particles, and metal contaminants from the silicon wafer surface. The final cleaning machine after polishing typically contains multiple functional modules, among which the brush module is mainly responsible for removing particles through physical brushing.

[0003] Existing brush modules typically use multiple (usually four) rollers to clamp and rotate silicon wafers, simultaneously brushing and spraying chemicals onto the wafer surface. However, existing roller devices have a significant drawback: during the clamping and rotation of the wafer, continuous friction occurs between the rollers and the wafer edges, generating micron- or even nanometer-sized debris. This debris accumulates on the roller surface and is then flung back onto or adheres to the wafer surface during rotation, resulting in severely excessive particle contamination on the wafer surface, directly impacting product yield. Utility Model Content

[0004] To address the aforementioned technical problems, this invention provides a silicon wafer fixing device and a cleaning system, solving the problem of silicon wafers being recontaminated during the cleaning process.

[0005] To achieve the above objectives, the technical solution adopted in this utility model embodiment is: a silicon wafer fixing device for fixing a silicon wafer to be cleaned, the silicon wafer fixing device comprising:

[0006] At least two opposing clamping rollers are used to clamp the silicon wafer to be cleaned and drive the silicon wafer to rotate.

[0007] A rinsing component is used to rinse the clamping rollers with a cleaning fluid;

[0008] A flow guiding component is disposed on the outer peripheral surface of the clamping roller to guide the cleaning fluid carrying impurities after rinsing the clamping roller to flow along a preset path.

[0009] A collection component, located below the clamping roller, is used to collect the cleaning fluid carrying impurities flowing out from the guide component.

[0010] Optionally, the flow guiding component includes a groove disposed on the outer peripheral surface of the clamping roller, the groove extending from one end of the clamping roller in the axial direction to the other end in the axial direction of the clamping roller.

[0011] Optionally, the groove is a spiral groove, which is arranged around the outer peripheral surface of the clamping roller.

[0012] Optionally, the groove has a width of 4-7 mm and a depth of 2-5 mm.

[0013] Optionally, the rinsing component includes a nozzle suspended above the clamping roller.

[0014] Optionally, the distance between the nozzle outlet and the clamping roller in the axial direction of the clamping roller is 1-2 cm.

[0015] Optionally, the collecting component includes a funnel-shaped collector located below the clamping roller, the cross-sectional area of ​​which gradually decreases along the direction away from the clamping roller.

[0016] Optionally, the collector is provided with a drain port at the end away from the clamping roller, and the collecting component further includes a drain pipe communicating with the drain port.

[0017] Optionally, the clamping roller includes a first part and a second part arranged along the axial direction of the clamping roller. Both the first part and the second part are columnar structures. The radial area of ​​the first part is smaller than the radial area of ​​the second part, such that the outer peripheral surface of the first part and the outer peripheral surface of the second part form a stepped clamping surface.

[0018] The flow guiding component is provided on the outer peripheral surface of the second part.

[0019] This invention also provides a cleaning system, including the aforementioned silicon wafer fixing device.

[0020] The beneficial effects of this invention are: by combining the rinsing component, the guiding component, and the collecting component, impurities, including particulate matter, on the roller are cleaned in a timely manner, effectively preventing the silicon wafer from being recontaminated, improving the cleaning effect of the silicon wafer, and enhancing the quality of the silicon wafer. Attached Figure Description

[0021] Figure 1 A schematic diagram showing the cleaning system in an embodiment of this utility model;

[0022] Figure 2 This is a schematic diagram showing the clamping roller in an embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0024] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0025] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0026] refer to Figure 1 and Figure 2 This embodiment provides a silicon wafer 10 fixing device for fixing a silicon wafer 10 to be cleaned. The silicon wafer 10 fixing device includes:

[0027] At least two opposing clamping rollers 1 are used to clamp the silicon wafer 10 to be cleaned and drive the silicon wafer 10 to rotate;

[0028] A rinsing component is used to rinse the clamping roller 1 with a cleaning fluid;

[0029] A flow guiding component is disposed on the outer peripheral surface of the clamping roller 1 to guide the cleaning liquid carrying impurities after rinsing the clamping roller 1 to flow along a preset path.

[0030] A collection component, located below the clamping roller 1, is used to collect the cleaning fluid carrying impurities flowing out from the guide component.

[0031] By combining rinsing components, guiding components, and collecting components, impurities, including particulate matter, on the rollers are cleaned in a timely manner, effectively preventing the silicon wafers from being recontaminated, improving the cleaning effect of the silicon wafers, and enhancing the quality of the silicon wafers.

[0032] When cleaning the silicon wafer 10, at least two of the clamping rollers 1 clamp the silicon wafer 10 together and drive it to rotate at high speed. Simultaneously, the rinsing component continuously sprays cleaning fluid onto the surface of the clamping rollers 1. The cleaning fluid immediately flushes away debris generated by the friction between the clamping rollers 1 and the silicon wafer 10, and, guided by the flow guiding component, the cleaning fluid containing debris and other impurities flows along a predetermined path. The cleaning fluid, carrying debris and other impurities, detaches from the surface of the clamping rollers 1 and is perfectly received by the collecting component directly below. This ensures that debris and other impurities no longer pose a threat of contamination to the surface of the silicon wafer 10.

[0033] In an exemplary embodiment, the number of clamping rollers 1 can be flexibly set according to actual needs. Figure 1 The device includes four clamping rollers 1, but is not limited to this. The four clamping rollers 1 are arranged symmetrically in pairs on a horizontal plane. Each clamping roller 1 is independently controlled by a drive structure, allowing for both translational and rotational motion. Translational motion is used to clamp and release the silicon wafer, while rotational motion drives the silicon wafer to rotate. The drive system typically employs a high-precision stepper motor or servo motor, coupled with an encoder to achieve closed-loop control, ensuring the accuracy of rotational speed and translational position.

[0034] In an exemplary embodiment, the clamping roller 1 includes a first part 11 and a second part 12 arranged along the axial direction of the clamping roller 1. Both the first part 11 and the second part 12 are columnar structures. The radial area of ​​the first part 11 is smaller than the radial area of ​​the second part 12, such that the outer peripheral surface of the first part 11 and the outer peripheral surface of the second part 12 form a stepped clamping surface.

[0035] The flow guiding component is provided on the outer peripheral surface of the second part 12.

[0036] The radial area of ​​the first portion 11 is smaller than that of the second portion 12, such that the outer peripheral surfaces of the first portion 11 and the second portion 12 form a stepped clamping surface. This stepped design restricts the movement of the silicon wafer in the axial direction while providing sufficient space for the flow guiding components.

[0037] In an exemplary embodiment, the flow guiding component includes a groove disposed on the outer peripheral surface of the clamping roller 1, the groove extending from one end of the clamping roller 1 in the axial direction to the other end in the axial direction of the clamping roller 1.

[0038] Specifically, the second part 12 includes a first end face close to the first part 11 and a second end face away from the first part 11 in its axial direction. The groove is provided on the outer peripheral surface of the second part 12, and one end of the groove penetrates the first end face and the other end of the groove penetrates the second end face, so that the cleaning fluid carrying impurities can flow smoothly along the groove into the collection component located below the clamping roller 1.

[0039] In an exemplary embodiment, the groove is a spiral groove that surrounds the outer peripheral surface of the clamping roller 1.

[0040] In an exemplary embodiment, the spiral direction of the spiral groove is the same as the rotation direction of the clamping roller 1, so as to facilitate the cleaning liquid carrying impurities to flow along the spiral groove to the collection component below the clamping roller 1 during the rotation of the clamping roller 1.

[0041] The design of spiral grooves can help guide fluid flow, reduce the accumulation of impurities during the flow process, and thus reduce the risk of clogging.

[0042] In an exemplary embodiment, the width of the groove is 4-7 mm and the depth is 2-5 mm. In some specific embodiments, the width of the groove can be 4 mm, 5 mm, or 7 mm, and the depth of the groove can be 2 mm, 3 mm, or 5 mm.

[0043] Preferably, the width of the groove is set to 5mm and the depth of the groove is set to 3mm.

[0044] Setting the width of the groove to 5mm provides sufficient cross-sectional area to accommodate and guide the large amount of liquid-solid mixture (water and impurities including debris) flushed from the cleaning fluid nozzle 2, avoiding the risk of poor flow or blockage due to an excessively narrow channel. At the same time, this width does not excessively weaken the structural strength and rigidity of the clamping roller 1, ensuring clamping stability.

[0045] Setting the depth of the groove to 3mm creates sufficient volume for temporary storage and transport of impurities, while ensuring that the cleaning fluid can form an effective flow layer within the groove. A depth that is too shallow may cause impurities to remain in the groove, while a depth that is too deep will similarly affect the mechanical strength of the clamping roller 1.

[0046] In an exemplary embodiment, the rinsing component includes a nozzle 2 suspended above the clamping roller 1.

[0047] For example, the rinsing component further includes a liquid storage section and a pipeline connecting the liquid storage section and the nozzle 2, and a valve may be provided on the pipeline to control the opening and closing of the nozzle 2.

[0048] For example, a pump may also be provided between the liquid storage section and the nozzle 2 to regulate the pressure of the cleaning fluid ejected from the nozzle 2.

[0049] In an exemplary embodiment, the distance between the outlet of the nozzle 2 and the clamping roller 1 in the axial direction of the clamping roller 1 is 1-2 cm.

[0050] In a specific embodiment, the distance between the outlet of the nozzle 2 and the clamping roller 1 in the axial direction of the clamping roller 1 is 1 cm or 2 cm, but is not limited to this.

[0051] In some embodiments, the distance between the outlet of the nozzle 2 and the clamping roller 1 in the axial direction of the clamping roller 1 is 1 cm. This distance ensures that the cleaning liquid column ejected from the nozzle 2 retains sufficient kinetic energy and focus when it reaches the surface of the clamping roller 1, effectively impacting and removing debris and other impurities adhering to the surface of the clamping roller 1. If the distance between the outlet of the nozzle 2 and the clamping roller 1 in the axial direction of the clamping roller 1 is too large, it will cause the water column to diverge, pressure to decrease, and insufficient rinsing force; if the distance between the outlet of the nozzle 2 and the clamping roller 1 in the axial direction of the clamping roller 1 is too small, it may cause droplet splashing, interfering with the cleaning of other areas of the silicon wafer 10, or even causing unnecessary resistance to the rotation of the clamping roller 1.

[0052] In an exemplary embodiment, the spray direction of the nozzle 2 can be flexibly set according to actual needs. For example, the spray direction of the nozzle 2 forms an acute angle (e.g., 15°-45°) with the end face of the clamping roller 1 in the axial direction, and its landing point is precisely aligned with the entrance area or wall of the groove. This directional design ensures that the flushing force is maximized to "pry" the debris away from the surface of the clamping roller 1 and directly "sweep" it into the groove, which is the "garbage channel," achieving precise and efficient connection of debris from its generation location to its transfer path.

[0053] In an exemplary embodiment, the cleaning fluid sprayed by the nozzle 2 may be ultrapure water, but is not limited thereto.

[0054] In an exemplary embodiment, the collecting component includes a funnel-shaped collector 31 located below the clamping roller 1, the cross-sectional area of ​​which gradually decreases along a direction away from the clamping roller 1.

[0055] In an exemplary embodiment, the outline diameter of the opening at the end of the collector 31 near the clamping roller 1 is larger than the projected diameter of the clamping roller 1 on the horizontal plane. That is, the orthographic projection of the clamping roller 1 on the corresponding collector 31 falls completely into the collector 31. This design ensures that droplets and debris thrown out or dripping from any position in the spiral groove can be completely captured without any leakage.

[0056] The conical sidewall of the collector 31 can guide the cleaning fluid carrying impurities to flow smoothly to the outlet at the bottom, avoiding the cleaning fluid from stagnating on the inner wall of the collector 31.

[0057] The conical sidewall of the collector 31 effectively suppresses and absorbs splashes that may occur when droplets impact, preventing splashed droplets from carrying impurities and bouncing back to the silicon wafer 10 or other parts of the equipment, causing secondary pollution.

[0058] In an exemplary embodiment, the cone angle of the collector 31 is between 60° and 90° to achieve optimal fluid guidance and splash prevention.

[0059] In an exemplary embodiment, the collector 31 is made of a transparent, chemically inert material (such as PMMA, PTFE, or transparent PVC) to facilitate observation of the flow of liquid inside the collector 31 and to perform visual inspection.

[0060] In an exemplary embodiment, the inner wall of the collector 31 is coated with a hydrophobic coating to avoid cleaning fluid residue.

[0061] In an exemplary embodiment, a drain port is provided at the end of the collector 31 away from the clamping roller 1, and the collecting component further includes a drain pipe 32 communicating with the drain port.

[0062] In an exemplary embodiment, the drain port of the collector 31 and the drain pipe 32 are sealed together by a sealing connector to prevent liquid leakage.

[0063] In an exemplary embodiment, each of the clamping rollers 1 is provided with a corresponding collector 31, and the bottom of each collector 31 is connected to a corresponding drain pipe 32. The ends of the multiple drain pipes 32 that are away from the corresponding collectors 31 converge and are connected to a main pipe.

[0064] refer to Figure 1 The present invention also provides a cleaning system, including the aforementioned silicon wafer 10 fixing device.

[0065] For example, the cleaning system further includes a cleaning brush 20 for cleaning the silicon wafer 10 held between the plurality of clamping rollers 1.

[0066] In an exemplary embodiment, the cleaning system includes two cleaning brushes 20, which are located on opposite sides of the silicon wafer 10 when cleaning the silicon wafer 10, so as to clean both surfaces of the silicon wafer 10 simultaneously.

[0067] The following points need to be explained:

[0068] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0069] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0070] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0071] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A silicon wafer fixing device for fixing a silicon wafer to be cleaned, characterized in that, The silicon wafer fixing device includes: At least two opposing clamping rollers are used to clamp the silicon wafer to be cleaned and drive the silicon wafer to rotate. A rinsing component is used to rinse the clamping rollers with a cleaning fluid; A flow guiding component is disposed on the outer peripheral surface of the clamping roller to guide the cleaning fluid carrying impurities after rinsing the clamping roller to flow along a preset path. A collection component, located below the clamping roller, is used to collect the cleaning fluid carrying impurities flowing out from the guide component.

2. The silicon wafer fixing device according to claim 1, characterized in that, The clamping roller includes a first part and a second part arranged along the axial direction of the clamping roller. Both the first part and the second part are columnar structures. The radial area of ​​the first part is smaller than the radial area of ​​the second part, such that the outer peripheral surface of the first part and the outer peripheral surface of the second part form a stepped clamping surface. The flow guiding component is provided on the outer peripheral surface of the second part.

3. The silicon wafer fixing device according to claim 2, characterized in that, The flow guiding component includes a groove disposed on the outer peripheral surface of the clamping roller, the groove extending from one end of the clamping roller in the axial direction to the other end in the axial direction of the clamping roller.

4. The silicon wafer fixing device according to claim 3, characterized in that, The groove is a spiral groove, which is arranged around the outer circumferential surface of the clamping roller.

5. The silicon wafer fixing device according to claim 4, characterized in that, The groove has a width of 4-7mm and a depth of 2-5mm.

6. The silicon wafer fixing device according to claim 1, characterized in that, The rinsing component includes a nozzle suspended above the clamping roller.

7. The silicon wafer fixing device according to claim 6, characterized in that, The distance between the nozzle outlet and the clamping roller in the axial direction of the clamping roller is 1-2 cm.

8. The silicon wafer fixing device according to claim 1, characterized in that, The collecting component includes a funnel-shaped collector located below the clamping roller, the cross-sectional area of ​​which gradually decreases along the direction away from the clamping roller.

9. The silicon wafer fixing device according to claim 8, characterized in that, The collector is provided with a drain port at the end away from the clamping roller, and the collecting component also includes a drain pipe communicating with the drain port.

10. A cleaning system, characterized in that, Includes the silicon wafer fixing device according to any one of claims 1-9.

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