A semiconductor device wafer carrier table horizontal adjustment device

Abstract

The utility model discloses a kind of semiconductor equipment wafer bearing platform horizontal adjusting device, it is related to semiconductor equipment technical field, including pedestal, the support fixed in the top of pedestal, adjusting mechanism and the testing mechanism installed in the top of support, adjusting mechanism includes bearing table, the partition support fixed in the bottom of bearing table, metal gasket fixed in the bottom of partition support, and piezoelectric ceramic installed in the top of pedestal and abuts the bottom of metal gasket, testing mechanism includes adjusting disc and at least three laser range finders installed on adjusting disc, and probe is towards the top surface of bearing table.The utility model utilizes laser range finder to detect the horizontal state of bearing table in real time, and generates deformation by piezoelectric ceramic to carry out precision compensation, solve the problem that bearing platform inclines in prior art cannot be automatically corrected, realize real-time monitoring, high-precision automatic adjustment, stable and accurate detection technical effect in the process of adjusting.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a horizontal adjustment device for a semiconductor equipment wafer carrier stage. Background Technology

[0002] In semiconductor manufacturing processes, such as photolithography, thin film deposition, and etching, the wafer stage is a core component used to support and fix the wafer. These high-precision processes place extremely stringent requirements on the surface levelness of the wafer stage. Any slight tilt will cause focal length shift, uneven exposure, and inconsistent etching depth, which will seriously affect the yield and performance of the chip.

[0003] Currently, many semiconductor equipment wafer carriers rely primarily on passive leveling during the equipment installation and commissioning phase. Technicians use precision levels, adjusting bolts, and shims to perform a one-time static leveling of the carrier. However, this static leveling method cannot cope with the dynamic changes that occur during actual operation. When semiconductor equipment is in operation, there are motor vibrations, vacuum pump operation, and thermal expansion and contraction caused by the process itself. These factors can cause small but fatal drifts in the leveling state of the carrier.

[0004] Once such horizontal drift occurs, existing support platforms generally lack real-time self-detection and automatic correction capabilities. Operators cannot know the precise status of the support platform without interrupting production, let alone perform online precision compensation. The only solution is to periodically stop the machine for maintenance, perform manual retesting and readjustment. This not only seriously reduces the operating efficiency and capacity of the equipment, but also makes it difficult for the precision of manual adjustment to meet the increasingly demanding process requirements.

[0005] Therefore, this utility model proposes a horizontal adjustment device for a semiconductor equipment wafer carrier stage to overcome the shortcomings of the prior art. Summary of the Invention

[0006] In view of the problems in the existing technology of semiconductor equipment wafer carrier stage, such as lack of real-time horizontal status detection capability and inability to automatically and precisely correct dynamic tilt generated during operation, resulting in a decrease in processing accuracy, this utility model aims to provide a semiconductor equipment wafer carrier stage horizontal adjustment device with improved structure that can effectively solve the above problems.

[0007] This utility model provides a horizontal adjustment device for a semiconductor equipment wafer carrier stage, comprising: a base and an adjustment mechanism, the adjustment mechanism including a carrier stage, multiple partition supports fixedly connected to the bottom of the carrier stage, multiple metal pads fixedly connected to the bottom of the partition supports, and multiple piezoelectric ceramics; a bracket; and a testing mechanism, the testing mechanism including an adjustment disk and a laser rangefinder.

[0008] The support frame is fixedly connected to the top of the base, and the testing mechanism is mounted on the top of the support frame. Multiple piezoelectric ceramics of the adjustment mechanism are mounted on the top of the base, and the tops of the piezoelectric ceramics abut against the bottom of the metal pads, thus supporting the platform together.

[0009] Furthermore, the laser rangefinder of the testing mechanism is mounted equidistantly in a ring on the adjustment plate, with the probe of the laser rangefinder penetrating the adjustment plate and facing the top surface of the platform. Through this structural combination of base, support, adjustment mechanism, and testing mechanism, a closed-loop adjustment system is formed that can detect the flatness of the platform in real time and provide feedback compensation through the adjustment mechanism.

[0010] Preferably, the bottom of the metal pad has a groove that matches the top contour of the piezoelectric ceramic, and the top of the piezoelectric ceramic engages within the groove. This engaging structure between the groove and the top ensures that the piezoelectric ceramic will not slip laterally during lifting, guaranteeing stable vertical force transmission and efficient response.

[0011] Preferably, in order to make the support at the bottom of the support platform more uniform and stable, two metal pads are fixedly connected to the bottom of each of the partition supports. These two metal pads correspond to two piezoelectric ceramics respectively, thereby forming a more widely distributed multi-point support matrix on the four sides of the support platform, which improves the precision and stability of adjustment.

[0012] Preferably, the side of the partition support has a through hole, which serves as a cable channel for conveniently arranging the power supply cable of the piezoelectric ceramic, avoiding cable tangling and interference, and making the internal wiring of the device neat and easy for later installation and maintenance.

[0013] Preferably, the bottom of the support platform is fixedly connected with positioning pins at the four corners, and the top of the base is provided with positioning grooves that cooperate with the positioning pins. This pin-groove cooperation structure strictly limits the horizontal movement and rotation of the support platform when the adjustment mechanism raises and lowers to adjust the height of the support platform, ensuring the purity of the adjustment action.

[0014] Preferably, the testing mechanism further includes a threaded knob, and the adjustment disc is fixed to the top of the bracket by the threaded knob. Specifically, the threaded knob passes through the adjustment disc and is threadedly connected to the top of the bracket. This connection method not only achieves a stable installation of the adjustment disc, but also allows for fine adjustment of the overall height of the adjustment disc by rotating the threaded knob.

[0015] Furthermore, a rubber pad is provided between the adjustment disc and the bracket. The rubber pad surrounds the connection of the threaded knob. Utilizing the elastic buffering properties of rubber, it effectively absorbs and isolates mechanical vibrations from the base and bracket, preventing vibrations from being transmitted to the highly sensitive laser rangefinder, thereby ensuring the stability and accuracy of the detection signal.

[0016] Preferably, the top of the base is provided with four pre-set grooves, and the piezoelectric ceramics are respectively installed in these four pre-set grooves. The pre-set grooves provide a precise installation reference and lateral limit for the piezoelectric ceramics, ensuring the accuracy and consistency of the installation positions of multiple piezoelectric ceramics, which is the basis for achieving coordinated adjustment.

[0017] 1. This utility model, by setting up a testing mechanism composed of a laser rangefinder and an adjustment mechanism composed of piezoelectric ceramics, realizes closed-loop feedback control of the level of the support platform, solves the problem that the tilt of the support platform cannot be automatically and precisely corrected in the prior art, and realizes real-time monitoring and high-precision automatic adjustment of the level of the support platform.

[0018] 2. This utility model effectively limits the horizontal displacement of the support platform during the adjustment process by setting mutually cooperating positioning pins and positioning grooves. At the same time, by setting a metal pad with a groove to engage with the top of the piezoelectric ceramic, it solves the problems of offset and unstable contact in traditional top-contact adjustment, and achieves precise adjustment action, stable support and reliable force transmission.

[0019] 3. This utility model solves the problem of vibration from equipment operation being transmitted to the detection unit and interfering with the measurement signal by setting a rubber pad between the adjustment plate on which the laser rangefinder is installed and the bracket, utilizing the elastic buffering characteristics. This achieves vibration isolation and shock reduction, and ensures accurate and reliable detection data. Attached Figure Description

[0020] Figure 1 This is a perspective view of a semiconductor equipment wafer carrier stage horizontal adjustment device proposed in this utility model; Figure 2 This is a split view of the adjustment disk in a semiconductor equipment wafer carrier stage horizontal adjustment device proposed in this utility model; Figure 3 This is an exploded view of the support stage in a semiconductor equipment wafer carrier horizontal adjustment device proposed in this utility model; Figure 4 This is a bottom view of the support stage in a semiconductor equipment wafer carrier horizontal adjustment device proposed in this utility model.

[0021] Legend: 1. Base; 2. Bracket; 3. Adjustment mechanism; 31. Placement platform; 32. Zone support; 33. Through hole; 34. Piezoelectric ceramic; 35. Metal gasket; 36. Positioning pin; 37. Positioning groove; 4. Testing mechanism; 41. Adjustment plate; 42. Laser rangefinder; 43. Rubber pad; 44. Threaded knob. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0023] Example: Please refer to Figures 1 to 4 This utility model provides a semiconductor equipment wafer carrier leveling device, which aims to solve the problem that the semiconductor equipment wafer carrier lacks an automatic and high-precision level detection and correction structure, resulting in the carrier tilting affecting the processing accuracy.

[0024] like Figure 1 As shown, the semiconductor equipment wafer carrier stage horizontal adjustment device includes a base 1, a bracket 2 fixedly connected to the top of the base 1, an adjustment mechanism 3, and a testing mechanism 4 installed on the top of the bracket 2. Reference Figure 1 , Figure 3 and Figure 4 The adjustment mechanism 3 includes a support platform 31, multiple partition supports 32 fixedly connected to the bottom of the support platform 31, multiple metal pads 35 fixedly connected to the bottom of the partition supports 32, and multiple piezoelectric ceramics 34; the side of the partition supports 32 is provided with through holes 33 for arranging the cables of the piezoelectric ceramics 34; the top of the base 1 is provided with four pre-set grooves, and the piezoelectric ceramics 34 are respectively installed in the four pre-set grooves, with the top of the piezoelectric ceramics 34 abutting against the bottom of the metal pads 35, thus supporting the support platform 31; to ensure the stability of the support platform 31 during adjustment, positioning pins 36 are fixedly connected to the four corners of the bottom of the support platform 31, and the top of the base 1 is provided with positioning grooves 37 that cooperate with the positioning pins 36; see reference. Figure 1 and Figure 2 The testing mechanism 4 includes an adjustment disk 41 and at least three laser rangefinders 42. The laser rangefinders 42 are equidistantly mounted in a ring on the adjustment disk 41. The probes of the laser rangefinders 42 penetrate the adjustment disk 41 and face the top surface of the support platform 31, for real-time detection of the horizontal state of the support platform 31. The testing mechanism 4 also includes a threaded knob 44. The adjustment disk 41 is fixed to the top of the support 2 by the threaded knob 44. The threaded knob 44 penetrates the adjustment disk 41 and is threadedly connected to the top of the support 2. A rubber pad 43 is provided at the connection between the adjustment disk 41 and the support 2 around the threaded knob 44 to reduce vibration transmission.

[0025] Please refer to Figure 1 , Figure 3 and Figure 4The partition support 32 is fixedly connected to the bottom four sides of the support platform 31, and the metal gasket 35 is fixedly connected to the bottom of the partition support 32; two metal gaskets 35 are fixedly connected to the bottom of each partition support 32; the piezoelectric ceramic 34 is installed in the four-sided preset groove opened on the top of the base 1 and vertically abuts against the bottom of the metal gasket 35; the bottom of the metal gasket 35 is provided with a groove that matches the top contour of the piezoelectric ceramic 34, and the top of the piezoelectric ceramic 34 is precisely engaged in the groove; This groove-locking connection ensures that when the piezoelectric ceramic 34 undergoes expansion and contraction deformation under power, it can stably transmit the lifting force to the metal pad 35 and the partition support 32, thereby pushing the corresponding area of ​​the support platform 31 to rise and fall. At the same time, the metal pad 35 helps to enhance contact stability and provide heat dissipation. Meanwhile, positioning pins 36 are fixedly connected to the four corners of the bottom of the support platform 31; the top of the base 1 is provided with positioning grooves 37 that cooperate with the positioning pins 36; in the assembled state, the positioning pins 36 are inserted into the positioning grooves 37. This pin-groove positioning structure strictly limits the horizontal displacement of the support platform 31 and ensures the stability of the position during the lifting and adjustment process; the side of the partition support 32 is also provided with through holes 33, which are used to conveniently arrange the cables of the piezoelectric ceramic 34, ensuring the neatness and maintainability of the installation.

[0026] As a preferred embodiment, please refer to Figure 1 and Figure 2 The testing mechanism 4 also includes a threaded knob 44. The adjustment disc 41 is fixed to the top of the bracket 2 by the threaded knob 44, and the threaded knob 44 passes through the adjustment disc 41 and is threadedly connected to the top of the bracket 2. As another preferred embodiment, in order to reduce the interference of vibration on the detection accuracy, a rubber pad 43 is provided between the adjustment plate 41 and the bracket 2, and the rubber pad 43 is provided around the connection of the threaded knob 44.

[0027] Working principle: When making horizontal adjustment, the test mechanism 4 is started and the three laser rangefinders 42 installed on the adjustment plate 41 start to work, respectively detecting the vertical distance from the probe to the top surface of the support platform 31. The system determines whether the support platform 31 is in a horizontal state by comparing the distance readings of the three laser rangefinders 42. If a tilt is detected in the support platform 31, the control system applies current to the piezoelectric ceramic 34 in the corresponding area based on the feedback data. After being energized, the piezoelectric ceramic 34 undergoes expansion and contraction deformation. The deformation, through the metal pad 35 and the partition support 32, pushes the corresponding area of ​​the support platform 31 to rise and fall. During the adjustment process, the positioning pin 36 at the bottom of the support platform 31 and the positioning groove 37 at the top of the base 1 always cooperate, limiting the horizontal displacement of the support platform 31 and ensuring that only the lifting movement is performed. The groove at the bottom of the metal pad 35 and the engagement at the top of the piezoelectric ceramic 34 ensure the stable transmission of the lifting force. The laser rangefinder 42 continuously monitors the top height of the platform 31 until the readings of the three laser rangefinders 42 are consistent, indicating that the platform 31 has achieved a horizontal state. At this point, the control system stops adjusting, and the piezoelectric ceramic 34 maintains its current deformation state, stabilizing the platform 31 in the adjusted horizontal position. Throughout the process, the rubber pad 43 reduces the vibration transmission between the bracket 2 and the adjustment disk 41, ensuring the detection stability of the laser rangefinder 42. The cable of the piezoelectric ceramic 34 can be arranged through the through hole 33 on the partition support 32. By rotating the threaded knob 44, the installation height of the adjustment disk 41 can be finely adjusted to calibrate the detection benchmark of the laser rangefinder 42.

Claims

1. A semiconductor equipment wafer carrier stage horizontal adjustment device, comprising: The base (1), adjustment mechanism (3), bracket (2) and testing mechanism (4) are fixedly connected to the top of the base (1); The adjustment mechanism (3) is characterized in that it includes a support platform (31), a partition support (32) fixedly connected to the bottom of the support platform (31), a metal pad (35) fixedly connected to the bottom of the partition support (32), and a piezoelectric ceramic (34). The piezoelectric ceramic (34) is installed on the top of the base (1), and the top of the piezoelectric ceramic (34) abuts against the bottom of the metal pad (35). The testing mechanism (4) is installed on the top of the bracket (2). The testing mechanism (4) includes an adjustment plate (41) and a laser rangefinder (42). Multiple laser rangefinders (42) are installed in a ring at equal intervals on the adjustment plate (41), and the probes of the laser rangefinders (42) penetrate the adjustment plate (41) and face the top surface of the support platform (31).

2. The semiconductor equipment wafer carrier leveling device according to claim 1, characterized in that, The bottom of the metal pad (35) has a groove that matches the top profile of the piezoelectric ceramic (34), and the top of the piezoelectric ceramic (34) is engaged in the groove.

3. The semiconductor equipment wafer carrier leveling device according to claim 1, characterized in that, Two metal gaskets (35) are fixedly connected to the bottom of each partition support (32).

4. The semiconductor equipment wafer carrier leveling device according to claim 1, characterized in that, The side of the partition support (32) is provided with a through hole (33) for arranging the piezoelectric ceramic (34) cable.

5. The semiconductor equipment wafer carrier leveling device according to claim 1, characterized in that, The four corners of the bottom of the support platform (31) are fixedly connected with positioning pins (36), and the top of the base (1) is provided with positioning grooves (37) that cooperate with the positioning pins (36).

6. The semiconductor equipment wafer carrier leveling device according to claim 1, characterized in that, The testing mechanism (4) also includes a threaded knob (44), the adjustment disc (41) is fixed to the top of the bracket (2) by the threaded knob (44), the threaded knob (44) passes through the adjustment disc (41) and is threadedly connected to the top of the bracket (2).

7. The semiconductor equipment wafer carrier leveling device according to claim 6, characterized in that, A rubber pad (43) is provided at the connection between the adjustment plate (41) and the bracket (2) around the threaded knob (44).

8. The semiconductor equipment wafer carrier stage horizontal adjustment device according to claim 1, characterized in that, The base (1) has a four-sided preset groove on its top, and the piezoelectric ceramics (34) are respectively installed in the four-sided preset groove.

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