Vacuum table

Abstract

A vacuum machine is disclosed, which includes a vacuum platform, a carrier disposed on the vacuum platform and including a plurality of vacuum holes, a positioning mechanism disposed on the vacuum platform and including a plurality of retractable pins configured to be retractably moved to be exposed from the carrier, and a vacuum mechanism exposed by the vacuum holes, wherein the positioning mechanism is coupled with the vacuum mechanism and configured to be moved in response to the vacuum mechanism being turned on. The above technical solution provides a vacuum platform with a carrier, which can be used to achieve semi-automatic operation of tape adhesion of a strip-shaped substrate.

Description

Technical Field

[0001] This application relates to the field of manufacturing equipment technology, and more specifically, to a vacuum machine. Background Technology

[0002] The strip placement machine on the production line is currently shared with the wafer products. Figures 1A to 1D This illustrates several stages in the prior art for adhering dicing tape to a strip substrate. For example... Figure 1A As shown, a temporary dummy frame 21 with cutting and releasing tape is placed on machine 10; as Figure 1B As shown, the strip substrate 30 is placed above the temporary frame 21; as Figure 1C As shown, the temporary dummy cover 22 is placed on the temporary frame 21; as Figure 1D As shown, roller 50 is used to roll over the strip substrate 30; then, temporary cover film 22 can be removed and tape released, resulting in tape and strip substrate adhered together and cut.

[0003] However, the machine 10 currently used for strip substrates is shared with the wafer products, and the tape cutting is done manually by placing it on the target position 62 on the vacuum platform (e.g., Figure 2A As shown), and manually pressed with rollers. Without special markings or grooves on the machine tool 10, skewness often occurs, which may cause the strip substrate 30 to shift (e.g., ...). Figure 2B As shown), rotation (as shown) Figure 2C (As shown), or air bubbles are generated on the adhesive surface, which is not conducive to the subsequent cutting process.

[0004] On the other hand, since the current equipment 10 is designed for wafer-level products, if strip-shaped substrates are placed on it, the vacuum holes on the surface of the equipment will not be able to hold the substrates. Furthermore, strip-shaped substrates sometimes... Figure 3A The double-molded strip substrate 30 shown requires a grooved surface to hold this type of substrate. However, the existing wafer-level product mounting platform 10 lacks grooves and cannot accommodate the double-molded strip substrate 30. This is because... Figure 3B Vacuum will be exposed in areas 71 and 72 of the dashed box, causing vacuum abnormalities and preventing the double-sided molded strip substrate 30 from being held in place. If a separate machine for the strip substrate is purchased to achieve automated operation, the purchase cost will be expensive and the economic cost will be high. Utility Model Content

[0005] To address the above issues, this application proposes a vacuum machine that can at least be used to place strip-shaped substrates and achieve semi-automatic operation for tape adhesion.

[0006] The technical solution of this application is implemented as follows: According to one aspect of this application, a vacuum machine is provided, the vacuum machine comprising: a vacuum platform; a stage disposed on the vacuum platform and including a plurality of vacuum holes; a positioning mechanism disposed on the vacuum platform and including a plurality of retractable ejector pins configured to retractably move and protrude from the stage; and a vacuum mechanism exposed by the vacuum holes, wherein the positioning mechanism is interconnected with the vacuum mechanism and configured to move in response to the vacuum mechanism activating a vacuum.

[0007] In some embodiments, a plurality of the retractable ejector pins are symmetrically arranged with respect to the center point of the vacuum platform.

[0008] In some embodiments, the stage is positioned above the center point of the vacuum platform.

[0009] In some embodiments, the stage is symmetrically arranged with respect to the center point of the vacuum platform.

[0010] In some embodiments, the vacuum platform further includes rollers configured to reciprocate within the boundary region of the vacuum platform.

[0011] In some embodiments, the area of ​​the stage is smaller than the area of ​​the vacuum platform.

[0012] In some embodiments, the stage and the vacuum platform have different top views.

[0013] In some embodiments, the stage protrudes above the vacuum platform.

[0014] In some embodiments, the positioning mechanism is configured to move a plurality of retractable ejector pins into the stage in response to the vacuum mechanism activating a vacuum.

[0015] In some embodiments, a plurality of the vacuum holes are arranged along the edge of the stage.

[0016] The above-mentioned technical solution of this application provides a vacuum platform with a stage for placing strip substrates, which can achieve semi-automatic operation of substrate adhesive tape application, instead of the existing manual application; and by setting a positioning mechanism, the strip substrates can be accurately positioned without deviation, so that no air bubbles are generated when applying the adhesive tape. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figures 1A to 1D This illustrates several stages in the prior art for adhering diced tape to a strip substrate.

[0019] Figures 2A to 2C Schematic diagrams are shown for several cases in the prior art where a circular machine is used to place a strip substrate.

[0020] Figure 3A A schematic diagram of a vertical cross-section of a double-sided molded strip substrate is shown.

[0021] Figure 3B This diagram shows a top plan view of a prior art method for placing a double-sided molded strip substrate using a circular machine.

[0022] Figure 4A This is a top plan view of a vacuum machine according to an embodiment of this application.

[0023] Figure 4B This is a schematic diagram of the vertical cross-section of a vacuum machine (with a retractable ejector pin located inside the stage) according to an embodiment of this application.

[0024] Figure 4C A schematic diagram of the vertical cross-section of the retractable ejector pin when it protrudes from the stage is shown.

[0025] Figures 5A to 5E A schematic diagram illustrates multiple stages of applying adhesive tape to a strip substrate using a vacuum machine according to an embodiment of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0027] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the present invention. These are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the present invention. Such repetition is merely for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0028] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] As can be seen from past problems, there is a need for a machine tool that can position strip-shaped substrate products on a machine. Embodiments of this application provide a vacuum machine tool. Figure 4A This is a top plan view of a vacuum machine according to an embodiment of this application. Figure 4B This is a schematic diagram of the vertical cross-section of a vacuum machine according to an embodiment of this application.

[0030] Combination Figure 4A and Figure 4B As shown, the vacuum equipment may include a vacuum platform 110 and a stage 120 disposed on the vacuum platform 110. The stage 120 can be used to place a substrate (e.g., a strip substrate). The stage 120 may include a plurality of vacuum holes 122. The vacuum holes 122 pass through the stage 120. The vacuum holes 122 can expose the vacuum mechanism 162 below them. In this way, when the strip substrate is placed on the stage 120, the strip substrate can be vacuum-adsorbed by the vacuum mechanism 162 and the vacuum holes 122.

[0031] A positioning mechanism 130 is disposed on the vacuum platform 110, and the positioning mechanism 130 may include a plurality of retractable ejector pins 131. The positioning mechanism 130 may be interconnected with the vacuum mechanism 162 such that the positioning mechanism 130 can move in response to the vacuum mechanism 162 activating a vacuum. In some embodiments, the retractable ejector pins 131 are vertically retractable ejector pins. Furthermore, the retractable ejector pins 131 may be configured to retractably move through the stage 120 to protrude.

[0032] Figure 4CA vertical cross-sectional view of the retractable ejector pins 131 protruding from the stage 120 is shown. When the vacuum mechanism 162 is not activated, the plurality of retractable ejector pins 131 of the positioning mechanism 130 can be configured to move upward along the Z direction and protrude from the upper surface of the stage 120, as shown below. Figure 4C As shown. At this time, the strip substrate can be placed on the stage 120. The strip substrate may have a mating structure (e.g., positioning holes) that mates with a plurality of retractable ejector pins 131, so as to position the strip substrate by aligning the plurality of retractable ejector pins 131 with the mating structure of the strip substrate.

[0033] The technical solution of this application provides a vacuum platform 110 with a stage 120 for placing strip substrates, which can achieve semi-automatic operation of substrate adhesive tape application instead of the existing manual application; and by setting a positioning mechanism 130, the strip substrates can be placed without offset, so that no air bubbles are generated when the tape is applied to the substrate; thus reducing economic costs, for example, saving more than 97% of the cost compared to the existing separate purchase of equipment.

[0034] In some embodiments, in response to the vacuum mechanism 162 activating a vacuum, the plurality of retractable ejector pins 131 of the positioning mechanism 130 can also be configured to move downward along the Z direction until they retract below the upper surface of the stage 120 and are embedded within the stage 120, such as... Figure 4B As shown. The position of the retractable ejector pin 131 embedded within the stage 120 can be referred to as the home position. Thus, when the vacuum is activated, the retractable ejector pin 131 automatically retracts. At this time, an operation of applying adhesive tape (e.g., cutting tape) to the strip substrate can be performed, and the vacuum hole 122 can vacuum-adhere the positioned strip substrate to prevent it from moving during tape application. If the retractable ejector pin 131 is not retracted when the vacuum is activated, the exposed retractable ejector pin 131 may be pressed down during roller pressing during tape application, causing the tape to tear.

[0035] In some embodiments, the retractable positioning pin 131 is configured to protrude through the stage 120 independently of the vacuum mechanism 162. In some embodiments, the upward movement of the retractable pin 131 can be controlled independently when the vacuum mechanism 162 is not activated. For example, the upward movement of the retractable pin 131 protruding from the stage 120 can be controlled independently when the vacuum mechanism 162 is not activated and before the strip substrate is placed.

[0036] In some embodiments, an alerting device (not shown) may be provided. When the vacuum mechanism 162 activates the vacuum, the alerting device is used to indicate whether the retractable ejector pin 131 has been correctly retracted to the predetermined source position within the stage 120. By providing the alerting device, an alarm can be sounded when the retractable ejector pin 131 has not been correctly retracted to the source position, effectively preventing the retractable ejector pin 131 from snagging the tape during tape adhesion.

[0037] Figures 5A to 5E A schematic diagram illustrating multiple stages of applying adhesive tape to a strip substrate using a vacuum machine according to an embodiment of this application is shown. First, see... Figure 5A As shown, the stage 120 is mounted on the vacuum platform 110. At this time, the retractable ejector pin 131 is inside the stage 120, therefore Figure 5A The retractable ejector pin 131 is not shown in the figure.

[0038] Then see Figure 5B As shown, the retractable ejector pin 131 is raised and moved to protrude from the platform 120. See also Figure 5C As shown, the strip substrate 300 is placed on the stage 120. The strip substrate 300 may have a mating structure (e.g., positioning holes) that mates with a plurality of retractable ejector pins 131, and the strip substrate 300 is accurately positioned by aligning the plurality of retractable ejector pins 131 with the mating structure of the strip substrate 300.

[0039] See Figure 5D As shown, the vacuum mechanism 162 is activated to vacuum-adsorb the strip substrate 300. Furthermore, in response to the activation of the vacuum mechanism 162, multiple retractable ejector pins 131 can be lowered and moved back into the stage 120. See then... Figure 5E The vacuum machine can be used to apply adhesive tape 350 to the strip substrate 300. In some embodiments, the vacuum machine may further include rollers 150, which can be configured to reciprocate within the boundary region of the vacuum platform 110. The boundary region of the vacuum platform 110 refers to the area within the boundary of the upper surface of the vacuum platform 110 used to place the stage 120. The rollers 150 can roll the adhesive tape 350 on the strip substrate 300 to ensure that the adhesive tape 350 adheres tightly to the strip substrate 300 and avoids the formation of air bubbles.

[0040] Return to reference Figures 4A to 4CAs shown, in some embodiments, the positioning mechanism 130 can be interconnected with the vacuum mechanism 162 via a vacuum switch 165. The vacuum switch 165 can be connected to the retractable ejector pin 131 of the positioning mechanism 130 and also to a vacuum valve 168 connected to the vacuum mechanism 162. The vacuum switch 165 can be used to control the upward or downward movement of the retractable ejector pin 131. The vacuum switch 165 can also be used to control the opening and closing of the vacuum valve 168 to control whether the vacuum mechanism 162 is in operation. In this embodiment, the movement of the retractable ejector pin 131 when the vacuum mechanism 162 is in operation is achieved through the vacuum switch 165. It should be understood that in other embodiments, the interconnection between the vacuum switch 165 and the vacuum mechanism 162 can be implemented in any other applicable manner.

[0041] In some embodiments, the stage 120 may protrude above the vacuum platform 110 in the Z direction. In one example, the stage 120 has a thickness of 3 mm in the Z direction and protrudes 3 mm above the vacuum platform 110 in the Z direction.

[0042] In some embodiments, the upper surface of the stage 120 may have a groove (not shown). The groove can be used to accommodate a single-sided molding structure of a double-sided molded strip substrate, so that the stage 120 can be used to support the double-sided molded strip substrate and perform tape application operations on it.

[0043] See Figure 4A As shown, the stage 120 and the vacuum platform 110 can have different top-view shapes. In some embodiments, the vacuum platform 110 can be a platform for wafers, and therefore the vacuum platform 110 can have a circular top-view shape. The stage 120 can be for placing strip-shaped substrates, and therefore the stage 120 can have a rectangular top-view shape. The stage 120 and the vacuum platform 110 can be detachably connected. The area of ​​the stage 120 is smaller than the area of ​​the vacuum platform 110; for example, the area of ​​the rectangular shape of the stage 120 is smaller than the area of ​​the circular shape of the vacuum platform 110. The stage 120 can be located inside the circular boundary of the vacuum platform 110.

[0044] In some embodiments, the stage 120 is disposed above the center point of the vacuum platform 110. The stage 120 may be symmetrically disposed with respect to the center point of the vacuum platform 110. That is, the stage 120 is centrally disposed on the vacuum platform 110. The center point of the stage 120 may be substantially aligned with the center point of the vacuum platform 110 along the Z direction.

[0045] In some embodiments, a plurality of retractable ejector pins 131 are symmetrically arranged with respect to the center point of the vacuum platform 110. A plurality of vacuum holes 122 are arranged along the edge of the stage 120. In this embodiment where the stage 120 has a rectangular shape, the plurality of vacuum holes 122 may be arranged in two rows along the two long sides of the stage 120. In this embodiment, six vacuum holes 122 per row are shown as an example, but other suitable numbers of vacuum holes 122 per row may be used.

[0046] In some embodiments, a plurality of retractable ejector pins 131 are symmetrically arranged with respect to the center point of the vacuum platform 110. In this embodiment, four retractable ejector pins 131 are provided, and the four retractable ejector pins 131 are symmetrically arranged in the corner areas of the stage 120. The retractable ejector pin 131 being located in the corner area of ​​the stage 120 means that the distance between the retractable ejector pin 131 and an adjacent corner is closer than the distance between each vacuum hole 122 and that corner. By providing a retractable ejector pin 131 in each corner area, the strip substrate can be centrally fixed on the vacuum platform 110, ensuring that the installation of the strip substrate will not result in offset or rotation.

[0047] In summary, the technical solution of this application provides a vacuum machine for placing strip-shaped substrates, wherein the stage 120 can protrude from other positions on the vacuum platform 110; in addition, a retractable ejector pin 131 is provided to correspond and cooperate with the positioning hole on the strip-shaped substrate, and the retractable ejector pin 131 can be connected to the vacuum mechanism 162. When the vacuum mechanism 162 is turned on, the retractable ejector pin 131 can automatically retract to avoid the roller pressing on the retractable ejector pin 131 during pressing, which would cause the tape above to break.

[0048] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A vacuum machine, characterized in that, include: Vacuum platform; A stage is disposed on the vacuum platform and includes multiple vacuum holes; A positioning mechanism is provided on the vacuum platform and includes a plurality of retractable ejector pins configured to retractably move and protrude from the stage. as well as A vacuum mechanism, exposed by the vacuum port, wherein the positioning mechanism is interconnected with the vacuum mechanism and configured to move in response to the vacuum mechanism activating a vacuum.

2. The vacuum machine according to claim 1, characterized in that, Multiple retractable ejector pins are symmetrically arranged relative to the center point of the vacuum platform.

3. The vacuum machine according to claim 1, characterized in that, The stage is positioned above the center point of the vacuum platform.

4. The vacuum machine according to claim 3, characterized in that, The stage is symmetrically arranged with respect to the center point of the vacuum platform.

5. The vacuum machine according to claim 1, characterized in that, Also includes: A roller configured to reciprocate within the boundary region of the vacuum platform.

6. The vacuum machine according to claim 1, characterized in that, The area of ​​the stage is smaller than the area of ​​the vacuum platform.

7. The vacuum machine according to claim 1, characterized in that, The stage and the vacuum platform have different top views.

8. The vacuum machine according to claim 1, characterized in that, The stage protrudes above the vacuum platform.

9. The vacuum machine according to claim 1, characterized in that, The positioning mechanism is configured to move a plurality of retractable ejector pins into the stage in response to the vacuum mechanism activating a vacuum.

10. The vacuum machine according to claim 1, characterized in that, Multiple vacuum holes are arranged along the edge of the stage.

Images