Wafer fixing device

Abstract

The application discloses a wafer fixing device for fixing common wafers or iron ring wafers, wherein the iron ring wafer comprises an iron ring piece and a wafer piece connected with the iron ring piece. The wafer fixing device comprises a mounting seat, a suction disc and an iron ring fixing assembly. The suction disc is arranged on the mounting seat and used for carrying and adsorbing the common wafer or the wafer piece. The iron ring fixing assembly is arranged on the mounting seat and located at the periphery of the suction disc, and the iron ring fixing assembly is provided with an adsorption hole and used for carrying and adsorbing the iron ring piece. The iron ring fixing assembly is arranged at the periphery of the suction disc and provided with the adsorption hole and used for carrying and adsorbing the iron ring piece, and the suction disc can adsorb the wafer piece or the common wafer, so that the wafer fixing device can be compatible with the adsorption and fixation of the iron ring wafer and avoid the separation of the iron ring piece and the wafer piece in the iron ring wafer, and can also be compatible with the adsorption and fixation of the common wafer.

Description

Technical Field

[0001] This application relates to the field of wafer production auxiliary equipment technology, specifically to a wafer fixing device. Background Technology

[0002] Due to process and usage requirements, semiconductor wafers have various types, thicknesses, and forms of wafer fixing devices. In some testing and manufacturing processes, a single machine is often required to be compatible with multiple wafer types. For example, common ordinary wafers and iron ring wafers often have special requirements for wafer fixing devices due to differences in manufacturing and testing processes. For instance, iron ring wafers have two parts: an iron ring and a wafer. The conditions for adsorption and fixing of these two parts by the wafer fixing device differ. If the wafer fixing device only has one type of adsorption and fixing method, compatibility issues will arise. For example, while ordinary wafer fixing devices can adsorb and fix ordinary wafers, for iron ring wafers, which are connected to the wafer and iron ring through a blue film, the adsorption force of ordinary wafer fixing devices can only act on the wafer, while the iron ring is suspended, which can easily lead to separation between the iron ring and the wafer. This is especially true when using a pin to lift the iron ring wafer, where separation is more likely to occur. Utility Model Content

[0003] This application provides a wafer fixing device to improve the problem that wafer fixing devices are not compatible with ordinary wafers and iron ring wafer fixing.

[0004] In a first aspect, embodiments of this application provide a wafer fixing device for fixing a conventional wafer or a metal ring wafer, wherein the metal ring wafer includes a metal ring plate and a wafer plate connected to the metal ring plate, and the wafer fixing device includes: Mounting base; A suction cup, disposed on the mounting base, is used to hold and adsorb the ordinary wafer or the wafer piece; and An iron ring fixing assembly is provided on the mounting base and located around the suction cup. The iron ring fixing assembly has an adsorption hole for supporting and adsorbing the iron ring piece.

[0005] In some embodiments of this application, the iron ring fixing assembly includes two iron ring fixing plates, which are arranged opposite to each other to define two oppositely arranged notches. The suction cup is located between the two iron ring fixing plates, and the iron ring fixing plates have a plurality of suction holes.

[0006] In some embodiments of this application, the edge of the iron ring fixing plate is provided with a first limiting plate to restrict the movement of the iron ring wafer in the horizontal direction.

[0007] In some embodiments of this application, the wafer fixing device further includes a lifting drive mechanism, which is disposed on the mounting base. A portion of the lifting end of the lifting drive mechanism is connected to the iron ring fixing assembly, and another portion is disposed opposite to the edge of the ordinary wafer or the wafer wafer.

[0008] In some embodiments of this application, the lifting drive mechanism includes a displacement cylinder, a drive plate, and a plurality of support members. The displacement cylinder is fixed to the mounting base and the drive end of the displacement cylinder is connected to the drive plate. The plurality of support members are spaced apart along the circumferential edge of the drive plate, and the end of the support member away from the drive plate is connected to the iron ring fixing assembly.

[0009] In some embodiments of this application, the suction cup has a plurality of clearance holes spaced apart along its circumferential edge; the lifting drive mechanism also includes a plurality of pins disposed on the drive plate, each pin being aligned with one of the clearance holes.

[0010] In some embodiments of this application, the ejector pin includes a pin body and a second limiting plate. Along the radial direction of the suction cup, the second limiting plate is disposed on the side of the pin body away from the suction cup, and the second limiting plate protrudes from the top surface of the ejector pin.

[0011] In some embodiments of this application, the wafer fixing device includes a quick-release base, which is disposed between the mounting base and the suction cup. The quick-release base has an adsorption connection hole, which is aligned with the adsorption micropore of the suction cup for connecting an external negative pressure device.

[0012] In some embodiments of this application, the quick-release base includes a fixing plate and an adapter plate. The fixing plate is disposed on the mounting base and has a mounting through hole. The adapter plate is disposed in the mounting through hole and has the adsorption connection hole for connecting the negative pressure device.

[0013] In some embodiments of this application, the wafer fixing device further includes a plurality of pitch adjustment mechanisms, which are spaced apart along the circumferential edge of the chuck to adjust the pitch angle of the iron ring wafer or the ordinary wafer.

[0014] Therefore, the embodiments of this application, by placing the iron ring fixing component on the periphery of the suction cup and opening the suction hole, are used to carry and adsorb the iron ring piece. The suction cup can also adsorb wafers or ordinary wafers, so that the wafer fixing device can be compatible with the adsorption and fixing of iron ring wafers, avoiding the separation of iron ring pieces and wafers in iron ring wafers, and can also be compatible with the adsorption and fixing of ordinary wafers. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a wafer fixing device provided in an embodiment of this application; Figure 2 for Figure 1 An explosion diagram; Figure 3 This is a schematic diagram of the structure of an iron ring fixing assembly in a wafer fixing device provided in an embodiment of this application; Figure 4 This is a first-view structural schematic diagram of a lifting drive mechanism in a wafer fixing device provided in an embodiment of this application; Figure 5 This is a second-view structural schematic diagram of a lifting drive mechanism in a wafer fixing device provided in an embodiment of this application; Figure 6 This is a schematic diagram of the pitch adjustment mechanism in a wafer fixing device provided in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 1. Iron ring wafer; 2. Wafer fixing device; 21. Mounting base; 22. Suction cup; 221. Clearance hole; 23. Iron ring fixing assembly; 231. Iron ring fixing plate; 2311. Suction hole; 2312. Notch; 232. First limiting plate; 24. Lifting drive mechanism; 241. Displacement cylinder; 242. Drive plate; 243. Support component; 244. Ejector pin; 2441. Pin body; 2442. Second limiting plate; 25. Quick release base; 251. Fixing plate; 252. Adapter plate; 26. Pitch adjustment mechanism; 261. Top block; 262. Electrically controlled lifting component; 27. Power monitor. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0020] Please see Figure 1 and Figure 2 This application provides a wafer fixing device 2 for fixing a standard wafer or a ring-attached wafer 1. A standard wafer refers to a wafer without an attached iron ring. A ring-attached wafer 1 includes an iron ring and a wafer connected to the iron ring. In the following description, for the sake of brevity, when only the name "wafer" appears, it refers to both standard wafers and ring-attached wafers 1. The wafer fixing device 2 includes a mounting base 21, a suction cup 22, and a ring-attached assembly 23. The suction cup 22 is disposed on the mounting base 21 and is used to support and adsorb the standard wafer or wafer. The ring-attached assembly 23 is disposed on the mounting base 21 and located around the suction cup 22. The ring-attached assembly 23 has an adsorption hole 2311 for supporting and adsorbing the ring.

[0021] The technical solution provided in this application involves placing the iron ring fixing component 23 around the suction cup 22 and opening an adsorption hole 2311 for supporting and adsorbing the iron ring piece. The suction cup 22 can also adsorb wafers or ordinary wafers, so that the wafer fixing device 2 can be compatible with the adsorption and fixing of the iron ring wafer 1, avoiding the separation of the iron ring piece and the wafer in the iron ring wafer 1, and can also be compatible with the adsorption and fixing of ordinary wafers.

[0022] In some embodiments, see Figure 3The iron ring fixing assembly 23 includes two iron ring fixing plates 251231, which are arranged opposite each other to define two oppositely arranged notches 2312. These notches 2312 are mainly used to facilitate the picking and placing of wafers. When a robotic arm picks up a wafer and places it on or removes it from the suction cup 22, the notches 2312 provide space for the robotic arm, preventing interference between the robotic arm and the iron ring fixing plates 251231. The suction cup 22 is located between the two iron ring fixing plates 251231 so that ordinary wafers can be placed directly on the suction cup 22 without interference from the iron ring fixing plates 251231. The bearing surface of the iron ring plate and the bearing surface of the suction cup 22 for supporting the wafer are on the same horizontal plane. The iron ring fixing plate 251231 has multiple suction holes 2311. When the wafer is placed on the suction cup 22, the iron ring plate can be placed on the iron ring fixing plate 251231 at the same time. And through the suction holes 2311, an external negative pressure device is connected to form an adsorption and fixing effect on the iron ring plate. The suction cup 22 also applies an adsorption force to the wafer, thus completing the overall fixing of the iron ring wafer 1.

[0023] Furthermore, the edge of the iron ring fixing plate 251231 is provided with a first limiting plate 232, which stands on the bearing surface of the iron ring fixing plate 251231 and is used to restrict the horizontal movement of the iron ring wafer 1. When the iron ring wafer 1 is placed on the suction cup 22, the edge of the iron ring wafer 1 will be limited by the first limiting plate 232, preventing the iron ring wafer 1 from sliding off the suction cup 22 or moving significantly on the suction cup 22.

[0024] In some embodiments, see Figure 4 and Figure 5 The wafer fixing device 2 also includes a lifting drive mechanism 24. The lifting drive mechanism 24 is located on the mounting base 21. A portion of the lifting end of the lifting drive mechanism 24 is connected to the iron ring fixing assembly 23, and the other portion is positioned opposite the edge of the ordinary wafer or wafer. The portion of the lifting end connected to the iron ring fixing assembly 23 is mainly used to drive the iron ring fixing assembly 23 to move up and down, while the portion of the lifting end positioned opposite the ordinary wafer or wafer is mainly used to lift the ordinary wafer or the iron ring wafer 1.

[0025] Furthermore, the lifting drive mechanism 24 includes a displacement cylinder 241, a drive plate 242, and multiple support members 243. The displacement cylinder 241 is fixed to the mounting base 21, and its drive end is connected to the drive plate 242, thereby driving the drive plate 242 to rise and fall. The displacement cylinder 241 itself has the function of calculating the displacement amount, so that the rising and falling of the drive plate 242 can be precisely controlled. Multiple support members 243 are spaced apart along the circumferential edge of the drive plate 242, so that the drive plate 242 can drive the support members 243 to rise and fall precisely, thereby achieving precise lifting and falling control of the iron ring wafer 1. The end of the support member 243 away from the drive plate 242 is connected to the iron ring fixing assembly 23, and the multiple support members 243 are spaced apart, which helps to improve the lifting and falling stability of the iron ring fixing plate 251231. By using the lifting drive mechanism 24 to raise and lower the iron ring fixing assembly 23 and the ejector pin 244, the height of the iron ring fixing assembly 23 can be adjusted according to the position and moving distance of the robotic arm or other wafer transport equipment, ensuring that the wafer can be accurately placed on the iron ring fixing assembly 23. It should be noted that the ejector pin 244 will be described in detail in subsequent embodiments.

[0026] Furthermore, the circumferential edge of the suction cup 22 is provided with a plurality of clearance holes 221. The lifting drive mechanism 24 also includes a plurality of ejector pins 244 disposed on the drive plate 242, each ejector pin 244 being aligned with an clearance hole 221, so that the ejector pin 244 can protrude out of the bearing surface of the suction cup 22 or retract to the bearing surface or below the bearing surface as the drive plate 242 is lifted or lowered.

[0027] In some embodiments, the ejector pin 244 includes a pin body 2441 and a second limiting plate 2442. Along the radial direction of the suction cup 22, the second limiting plate 2442 is disposed on the side of the pin body 2441 away from the suction cup 22, and protrudes from the top surface of the ejector pin 244. By utilizing the second limiting plate 2442, the edge of the ordinary wafer can be located within the space defined by the multiple second limiting plates 2442, thereby restricting the movement of the ordinary wafer in the horizontal plane and preventing the ordinary wafer from falling during lifting.

[0028] In some embodiments, the wafer holding device 2 includes a quick-release base 25. The quick-release base 25 is disposed between the mounting base 21 and the suction cup 22. The quick-release base 25 has an adsorption connection hole that aligns with the adsorption micropores (not shown) of the suction cup 22 for connecting an external negative pressure device. Exemplarily, a conduit for outputting negative pressure from the negative pressure device is connected to the adsorption connection hole of the quick-release base 25, thereby providing adsorption force to the adsorption micropores, and thus enabling the suction cup 22 to adsorb the wafer.

[0029] Furthermore, the quick-release base 25 includes a fixing plate 251 and an adapter plate 252. The fixing plate 251 is disposed on the mounting base 21 and has a mounting through hole, while the adapter plate 252 is disposed in the mounting through hole and has an adsorption connection hole for connecting the negative pressure device. The negative pressure device is connected to the pipe for outputting negative pressure through the mounting hole on the fixing plate 251, and the micro-hole of the suction cup 22 obtains negative pressure through the adsorption connection hole of the adapter plate 252 without connecting the suction cup 22 to the pipe. The adapter plate 252 serves as an adapter, facilitating the disassembly of the suction cup 22.

[0030] In some embodiments, see Figure 6 The wafer fixing device 2 also includes multiple pitch adjustment mechanisms 26, which are spaced apart along the circumferential edge of the chuck 22 to adjust the pitch angle of the iron ring wafer 1 or a regular wafer. The multiple pitch adjustment mechanisms 26 are integrally formed and connected to the fixing plate 251, located on the outer edge of the fixing plate 251. When the wafer needs angle adjustment, fine-tuning can be performed using the pitch adjustment mechanisms 26.

[0031] Furthermore, the pitch adjustment mechanism 26 includes a top block 261 and an electrically controlled lifting component 262. The top block 261 is located at the lifting end of the electrically controlled lifting component 262, which is fixed to the fixing plate 251. The electrically controlled lifting component 262 can be one of a cylinder, a hydraulic cylinder, or an electric push rod. The input end of the electrically controlled lifting component 262 is controlled by an external PLC controller. By controlling the lifting end of the electrically controlled lifting component 262, the top block 261 is moved up or down, thereby moving the top block 261 closer to or further away from the wafer, thus achieving fine adjustment of the wafer's pitch angle.

[0032] In some embodiments, the wafer fixing device 2 further includes a power monitor 27, which is fixed to the mounting base 21 and is used to monitor the power of the laser equipment used for wafer exposure, so as to avoid the laser equipment power being too high or too low, resulting in over-exposure or under-exposure of the wafer.

[0033] In some embodiments, both the mounting base 21 and the fixing plate 251 are provided with multiple weight-reducing holes to reduce the overall weight of the entire device.

[0034] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0035] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0036] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0037] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0038] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer fixing device, characterized in that, For fixing a conventional wafer or a metal ring wafer, wherein the metal ring wafer includes a metal ring plate and a wafer plate connected to the metal ring plate, and the wafer fixing device includes: Mounting base; A suction cup, disposed on the mounting base, is used to hold and adsorb the ordinary wafer or the wafer piece; and An iron ring fixing assembly is provided on the mounting base and located around the suction cup. The iron ring fixing assembly has an adsorption hole for supporting and adsorbing the iron ring piece.

2. The wafer fixing device according to claim 1, characterized in that, The iron ring fixing assembly includes two iron ring fixing plates, which are arranged opposite to each other to define two oppositely arranged notches. The suction cup is located between the two iron ring fixing plates, and the iron ring fixing plates have a plurality of suction holes.

3. The wafer fixing device according to claim 2, characterized in that, The edge of the iron ring fixing plate is provided with a first limiting plate, which is used to restrict the movement of the iron ring wafer in the horizontal direction.

4. The wafer fixing device according to claim 1, characterized in that, The wafer fixing device also includes a lifting drive mechanism, which is located on the mounting base. A portion of the lifting end of the lifting drive mechanism is connected to the iron ring fixing assembly, and the other portion is positioned opposite to the edge of the ordinary wafer or the wafer wafer.

5. The wafer fixing device according to claim 4, characterized in that, The lifting drive mechanism includes a displacement cylinder, a drive plate, and multiple support members. The displacement cylinder is fixed to the mounting base and the drive end of the displacement cylinder is connected to the drive plate. The multiple support members are spaced apart along the circumferential edge of the drive plate, and the end of the support member away from the drive plate is connected to the iron ring fixing assembly.

6. The wafer fixing device according to claim 5, characterized in that, The suction cup has multiple clearance holes spaced apart along its circumferential edge; the lifting drive mechanism also includes multiple pins on the drive plate, each pin being aligned with one of the clearance holes.

7. The wafer fixing device according to claim 6, characterized in that, The ejector pin includes a pin body and a second limiting plate. Along the radial direction of the suction cup, the second limiting plate is located on the side of the pin body away from the suction cup, and the second limiting plate protrudes from the top surface of the ejector pin.

8. The wafer fixing device according to claim 1, characterized in that, The wafer fixing device includes a quick-release base, which is located between the mounting base and the suction cup. The quick-release base has an adsorption connection hole, which is aligned with the adsorption micropore of the suction cup for connecting an external negative pressure device.

9. The wafer fixing device according to claim 8, characterized in that, The quick-release base includes a fixing plate and an adapter plate. The fixing plate is disposed on the mounting base and has a mounting through hole. The adapter plate is disposed in the mounting through hole and has the adsorption connection hole for connecting the negative pressure device.

10. The wafer fixing device according to claim 1, characterized in that, The wafer fixing device also includes multiple pitch adjustment mechanisms, which are spaced apart along the circumferential edge of the chuck to adjust the pitch angle of the iron ring wafer or the ordinary wafer.

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