Wafer high-speed rotation vacuum adsorption spindle

Abstract

A kind of wafer high-speed rotation vacuum suction spindle, including chuck, centering assembly, rotating spindle, sealing sleeve, rack, coupling and motor, motor and sealing sleeve are fixed on rack, rotating spindle bottom end is connected with the execution end of motor by coupling, top end passes through the fixed connection of sealing sleeve and the bottom end of centering assembly, the bottom end of chuck is fixedly connected with the top end of centering assembly, the utility model discloses a piston in centering assembly is moved by negative pressure control, so as to shrink adjusting rod to centering assembly, in the process of shrink, wafer is pulled to the center position of chuck by clamping hook, ensure the stability of wafer when high-speed rotation, simultaneously, based on the communication form of air hole I and piston cavity, the sequence of wafer first centering and then suction is formed, ensure the smooth completion of centering action and the firmness of suction.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment, specifically a high-speed rotating vacuum adsorption spindle for wafers. Background Technology

[0002] In the coating process of wafer fabrication, the wafer needs to be adsorbed onto a platform and rotated at high speed, and then the adhesive is sprayed onto the surface of the wafer to ensure the uniformity of the adhesive on the wafer surface.

[0003] The high-speed rotating vacuum adsorption spindle for wafers, disclosed in publication number CN209071304U, has the following structure: a hollow shaft with one open end connected to a wafer support platform, containing internal vents that connect to a vacuum channel. The channel is sealed with a specially designed self-resetting sealing ring to prevent atmospheric air from communicating with the vacuum channel. This structure can achieve a vacuum pressure exceeding -80 kPa at a spindle speed of 6000 rpm and an acceleration of 40,000 rpm.

[0004] Although the aforementioned existing technology has achieved the adsorption effect on wafers, in actual production activities, it cannot guarantee that the center of the wafer will fall precisely into the center of the platform, causing the wafer to fall off due to eccentricity during high-speed rotation. Utility Model Content

[0005] The purpose of this invention is to provide a high-speed rotating vacuum adsorption spindle for wafers to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A high-speed rotating vacuum adsorption spindle for wafers includes a suction cup, a centering assembly, a rotating spindle, a sealing bushing, a frame, a coupling, and a motor. The motor and the sealing bushing are fixed on the frame. The bottom end of the rotating spindle is connected to the actuator end of the motor through the coupling, and the top end passes through the sealing bushing and is fixedly connected to the outer shell of the centering assembly, which serves as a support. The top end of the outer shell is fixedly connected to the bottom end of the suction cup. The outer casing is provided with at least three piston centering assemblies in a circumferential array. The actuator of the piston centering assembly extends to the outside of the outer casing to center the wafer.

[0007] Furthermore, the piston centering assembly includes a piston, an adjusting rod, and a spring. The housing also has the same number of piston chambers as the piston centering assembly, and the piston chambers are arranged in a circumferential array in the housing. The piston is fitted into the piston chamber, and an adjusting rod is rotatably mounted on the piston at the end away from the central axis of the housing. The end of the adjusting rod is provided with a hook. One end of the spring is connected to the piston, and the other end is connected to the end of the piston chamber away from the central axis of the housing.

[0008] Furthermore, the piston chamber has a through hole at the end away from the central axis, a rotating groove is provided on the inner circular surface of the through hole, the adjusting rod has a protruding key, the adjusting rod is fitted with the through hole with clearance, and the protruding key is fitted in the rotating groove.

[0009] Furthermore, the outer casing has multiple air passages consisting of a main air passage and an auxiliary air passage. The starting end of all air passages is connected to the air hole I at the bottom of the outer casing. The end of the main air passage is connected to the end of all piston chambers near the central axis. The end of the auxiliary air passage is connected to the middle of all piston chambers. The top of the outer casing is provided with an air hole II, which connects the top of the outer casing to the middle of each piston chamber. The connection point between the air hole II and the piston chamber and the connection point between the auxiliary air passage and the piston chamber do not coincide.

[0010] Furthermore, the piston is provided with an air hole III, one end of which is connected to the auxiliary air passage and the other end is connected to an air hole II.

[0011] Furthermore, the rotating spindle has an annular groove at the sealing sleeve and a negative pressure hole I at the top end. One end of the negative pressure hole I is connected to the air hole I, and the other end is connected to the annular groove.

[0012] Furthermore, the sealing bushing includes a sealing ring, a negative pressure hole II, and a bushing body. The bushing body is fixed on the frame and has a negative pressure hole II. One end of the negative pressure hole II is connected to a negative pressure device, and the other end is connected to an annular groove. There are at least two sealing rings, which are respectively set on the upper side and the lower side of the annular groove.

[0013] Furthermore, the top surface of the suction cup is uniformly provided with grooves to increase the adsorption area, and the suction cup is provided with air holes IV, which connect the grooves and air holes II.

[0014] Compared with the prior art, the beneficial effects of this utility model are: This invention uses negative pressure to control the movement of the piston in the centering assembly, thereby retracting the adjusting rod towards the centering assembly. During the retraction process, the wafer is pulled towards the center of the suction cup through the hook, ensuring the stability of the wafer during high-speed rotation. At the same time, based on the connection between the vent I and the piston chamber, the wafer is first centered and then adsorbed, ensuring the smooth completion of the centering action and the firmness of the adsorption. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic cross-sectional view of the three-dimensional structure of this utility model; Figure 3 This utility model Figure 2 A partial view of section A in the middle; Figure 4 This is a schematic diagram of the housing of the centering component of this utility model; Figure 5 This is a schematic diagram of the piston and adjusting rod of this utility model; Figure 6 This is a schematic diagram of the suction cup of this utility model; Figure 7 This is a schematic diagram of the rotating spindle of this utility model; Figure 8 This is a cross-sectional schematic diagram of the rotating spindle of this utility model; In the diagram: 1. Suction cup, 11. Air hole IV, 2. Centering assembly, 21. Air hole I, 211. Piston, 22. Piston chamber, 221. Adjusting rod, 23. Housing, 24. Through hole, 25. Rotary groove, 26. Air hole II, 27. Main air passage, 28. Auxiliary air passage, 231. Spring, 2112. Air hole III, 222. Hook, 223. Protruding key, 3. Rotary spindle, 31. Negative pressure hole I, 32. Annular groove, 4. Sealing bushing, 41. Sealing ring, 42. Negative pressure hole II, 43. Bushing body, 5. Frame, 6. Coupling, 7. Motor. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Example: Please see Figures 1 to 8 This utility model provides a technical solution: A high-speed rotating vacuum adsorption spindle for wafers includes a suction cup 1, a centering assembly 2, a rotating spindle 3, a sealing sleeve 4, a frame 5, a coupling 6, and a motor 7. The motor 7 and the sealing sleeve 4 are fixed on the frame 5. The bottom end of the rotating spindle 3 is connected to the actuator end of the motor 7 through the coupling 6, and the top end passes through the sealing sleeve 4 and is fixedly connected to the outer shell 23, which serves as a support part in the centering assembly 2. The motor 7 drives the rotating spindle 3 to rotate at high speed, and the sealing sleeve 4 provides support for the rotation of the spindle 3. The top end of the outer shell 23 is fixedly connected to the bottom end of the suction cup 1. At least three piston centering assemblies are arranged in a circumferential array in the outer shell 23, and the actuator ends of the piston centering assemblies extend to the outside of the outer shell 23 to center the wafer.

[0018] In a preferred embodiment, the piston centering assembly includes a piston 211, an adjusting rod 221, and a spring 231. The housing 23 also has the same number of piston chambers 22 as the piston centering assembly, and the piston chambers 22 are arranged in a circumferential array within the housing 23. The piston 211 is fitted into the piston chamber 22 and moves linearly within it. An adjusting rod 221 is rotatably mounted on the end of the piston 211 away from the central axis of the housing 23. The movement of the piston 211 drives the adjusting rod 221 to move simultaneously. The part is equipped with a hook 222. The hook 222 locks the edge of the wafer as it follows the linear movement of the adjusting rod 221. The positioning action of the wafer is realized by the linear movement of several hooks 222 in the circumferential array. One end of the spring 231 is connected to the piston 211 and the other end is connected to the end of the piston cavity 22 away from the central axis of the outer shell 23. When there is no negative pressure inside the outer shell 23, the spring 231 pulls the piston 211 to move away from the central axis of the outer shell 23, so that the adjusting rod 221 is in the state of the longest outward extension.

[0019] In a preferred embodiment, the tension of the spring 231 is less than the pressure exerted by atmospheric pressure on the piston 211 under negative pressure.

[0020] In a preferred embodiment, the piston chamber 22 has a through hole 24 at the end away from the central axis, and a rotating groove 25 is provided on the inner circular surface of the through hole 24. The adjusting rod 221 is provided with a protruding key 223. The adjusting rod 221 is fitted into the through hole 24 with clearance, and the protruding key 223 is fitted into the rotating groove 25. The cooperation between the protruding key 223 and the rotating groove 25 causes the adjusting rod 221 to rotate circumferentially during the axial linear movement, causing the hook 222 to deflect, so that the hook 222 disengages from the wafer after the wafer is positioned.

[0021] In a preferred embodiment, the outer casing 23 has multiple air passages consisting of a main air passage 27 and auxiliary air passages 28. The number of auxiliary air passages 28 is the same as the number of piston chambers 22. The starting ends of all air passages are connected to the air hole I 21 at the bottom of the outer casing 23. The end of the main air passage 27 is connected to the ends of all piston chambers 22 near the central axis. When the main air passage 27 is under negative pressure, the piston 211 moves linearly towards the central axis under atmospheric pressure. The end of the auxiliary air passage 28 is connected to the ends of all piston chambers 22. In the middle of cavity 22, the top of outer shell 23 is provided with air hole II 26. Air hole II 26 connects the top of outer shell 23 with the middle of each piston cavity 22. The connection point between air hole II 26 and piston cavity 22 and the connection point between auxiliary air passage 28 and piston cavity 22 do not coincide. After piston 211 reaches the designated position, air hole III 2112 on piston connects air hole II 26 and air hole I 21. When piston 211 has not reached the designated position, air hole II 26 and air hole I 21 are blocked by piston.

[0022] In a preferred embodiment, the piston 211 is provided with a vent Ⅲ 2112, one end of which is connected to the auxiliary air passage 28 and the other end is connected to a vent Ⅱ 26.

[0023] In a preferred embodiment, the rotating spindle 3 has an annular groove 32 at the sealing sleeve 4 and a negative pressure hole I 31 at the top. One end of the negative pressure hole I 31 is connected to the air hole I 21 and the other end is connected to the annular groove 32, so that the negative pressure state can be conducted from the annular groove 32 to the negative pressure hole I 31, and then further conducted to all the air passages of the outer shell 23.

[0024] In a preferred embodiment, the sealing bushing 4 includes a sealing ring 41, a negative pressure hole II 42, and a bushing body 43. The bushing body 43 is fixed on the frame 5 and provides support for the rotating spindle 3, ensuring the stability of the rotating spindle 3 during rotation. The bushing body 43 is provided with a negative pressure hole II 42, one end of which is connected to a negative pressure device and the other end is connected to an annular groove 32. There are at least two sealing rings 41, which are respectively set on the upper side and the lower side of the annular groove 32. The sealing rings 41 ensure the sealing effect between the rotating spindle 3 and the bushing body 43 in the contact gap, ensuring that the negative pressure condition can be transmitted through the negative pressure hole II 42 to the negative pressure hole I 31 through the annular groove 32.

[0025] In a preferred embodiment, the top surface of the suction cup 1 is uniformly provided with grooves to increase the adsorption area, and the suction cup 1 is provided with air holes IV11, which connect the grooves and air holes II26.

[0026] The working principle of this utility model is as follows: An external device places the wafer onto the chuck 1. At this point, it is only roughly centered and cannot guarantee that the wafer's circle is precisely aligned with the circle of the chuck 1. Therefore, the wafer is still eccentric. When the external negative pressure device is activated, negative pressure is generated inside the negative pressure hole II 42 of the connected sealing sleeve 4. Negative pressure is also generated inside the annular groove 32 and negative pressure hole I 31, which are connected to negative pressure hole II 42. Simultaneously, the negative pressure is transmitted to the vent I 21, which is connected to negative pressure hole I 31. Vent I 21 has two outlets, namely the end and middle of the piston chamber 22. Since the spring 231 is in a contracted state at this time, the piston 211 blocks the outlet of vent I 21 in the middle of the piston cylinder 22. Vent III 2112 is not connected to vent I 21, and the negative pressure here does not continue to be transmitted. Therefore, the negative pressure is only transmitted to the piston chamber 22. At the end, under the action of external air pressure, piston 211 drives adjusting rod 221 to move towards the central axis of housing 23. Therefore, multiple adjusting rods 221 move towards the center at the same time, reducing the inner circle formed by hook 222, so that the center of the wafer moves towards the center of suction cup 1, achieving centering. At the same time, during the movement, adjusting rod 221 rotates. When piston 211 moves to the limit position, hook 222 will disengage from the wafer due to rotation and move to the bottom of the wafer. At this time, vent Ⅲ 2112 follows the movement of piston 211 and connects vent Ⅰ 21 and vent Ⅱ 26. The negative pressure state of vent Ⅰ 21 is transmitted through vent Ⅲ 2112 and vent Ⅱ 26 to vent Ⅳ 11 and the groove pattern on the surface of suction cup 1. Suction cup 1 achieves adsorption of wafer. Motor 7 starts to drive rotating spindle 3, centering component 2, and suction cup 1 to rotate, and starts applying adhesive. After the adhesive is applied, the motor 7 stops, the negative pressure equipment stops working, the negative pressure at each position is released, the piston 211 returns to its initial position under the pulling force of the spring 231, and at the same time drives the adjusting rod 221 back to its initial position, waiting for the next working process.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-speed rotating vacuum adsorption spindle for wafers, comprising a suction cup (1), a centering assembly (2), a rotating spindle (3), a sealing bushing (4), a frame (5), a coupling (6), and a motor (7), wherein the motor (7) and the sealing bushing (4) are fixed on the frame (5), the bottom end of the rotating spindle (3) is connected to the actuating end of the motor (7) via the coupling (6), and the top end passes through the sealing bushing (4) and is fixedly connected to the outer shell (23) of the centering assembly (2) which serves as a support, wherein the top end of the outer shell (23) is fixedly connected to the bottom end of the suction cup (1), characterized in that: The outer casing (23) is provided with at least three piston centering components in a circumferential array. The execution end of the piston centering components extends to the outside of the outer casing (23) to center the wafer.

2. The wafer high-speed rotating vacuum adsorption spindle according to claim 1, characterized in that: The piston centering assembly includes a piston (211), an adjusting rod (221), and a spring (231). The outer shell (23) also has piston chambers (22) in the same number as the piston centering assembly, and the piston chambers (22) are arranged in a circumferential array in the outer shell (23). The piston (211) is fitted in the piston chamber (22), and the adjusting rod (221) is rotatably mounted on the end of the piston (211) away from the central axis of the outer shell (23). The end of the adjusting rod (221) is provided with a hook (222). One end of the spring (231) is connected to the piston (211), and the other end is connected to the end of the piston chamber (22) away from the central axis of the outer shell (23).

3. The wafer high-speed rotating vacuum adsorption spindle according to claim 2, characterized in that: The piston chamber (22) has a through hole (24) at the end away from the central axis. The inner circular surface of the through hole (24) has a rotating groove (25). The adjusting rod (221) has a protruding key (223). The adjusting rod (221) is fitted with the through hole (24) with clearance. The protruding key (223) is fitted in the rotating groove (25).

4. The wafer high-speed rotating vacuum adsorption spindle according to claim 3, characterized in that: The outer shell (23) has multiple air passages consisting of a main air passage (27) and an auxiliary air passage (28). The starting end of all air passages is connected to the air hole I (21) at the bottom of the outer shell (23). The end of the main air passage (27) is connected to the end of all piston chambers (22) near the central axis. The end of the auxiliary air passage (28) is connected to the middle of all piston chambers (22). The top of the outer shell (23) is provided with an air hole II (26). The air hole II (26) connects the top of the outer shell (23) with the middle of each piston chamber (22). The connection point between the air hole II (26) and the piston chamber (22) and the connection point between the auxiliary air passage (28) and the piston chamber (22) do not coincide.

5. A wafer high-speed rotating vacuum adsorption spindle according to claim 4, characterized in that: The piston (211) is provided with an air hole III (2112), one end of which is connected to the auxiliary air passage (28) and the other end is connected to the air hole II (26).

6. The wafer high-speed rotating vacuum adsorption spindle according to claim 5, characterized in that: The rotating spindle (3) has an annular groove (32) at the sealing sleeve (4) and a negative pressure hole I (31) at the top. One end of the negative pressure hole I (31) is connected to the air hole I (21) and the other end is connected to the annular groove (32).

7. A wafer high-speed rotating vacuum adsorption spindle according to claim 6, characterized in that: The sealing bushing (4) includes a sealing ring (41), a negative pressure hole II (42) and a bushing body (43). The bushing body (43) is fixed on the frame (5). The bushing body (43) is provided with a negative pressure hole II (42). One end of the negative pressure hole II (42) is connected to a negative pressure device and the other end is connected to an annular groove (32). There are at least two sealing rings (41), which are respectively set on the upper side and the lower side of the annular groove (32).

8. A wafer high-speed rotating vacuum adsorption spindle according to claim 7, characterized in that: The suction cup (1) has uniformly grooved patterns on its top surface to increase the adsorption area. The suction cup (1) has air holes IV (11), which connect the grooved patterns with air holes II (26).

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