A vacuum cold plate suitable for micro-warped wafers

Abstract

The utility model discloses a vacuum cold plate suitable for micro warping wafer, including vacuum cold plate subassembly, the vacuum cold plate subassembly includes vacuum cold plate main part, the vacuum cold plate main part upper surface from inside to outside has successively set up first vacuum groove, second vacuum groove and third vacuum groove, the vacuum cold plate main part is set up respectively with first vacuum groove, second vacuum groove and third vacuum groove communication's first air pipe, second air pipe and third air pipe, the vacuum cold plate main part is located first air pipe, second air pipe and third air pipe respectively install first air pipe joint, second air pipe joint and third air pipe joint, the vacuum cold plate main part bottom is set up with water channel, the utility model discloses, vacuum cold plate device can realize the uniform adsorption of wafer, improve the wafer cooling of micro warping, because the uneven contact with the disc surface leads to the poor process effect, through the different several circle size different vacuum port, to adapt to the wafer of different size.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically a vacuum cold plate suitable for micro-warped wafers. Background Technology

[0002] The wafer fabrication process is complex and precise, and generally includes processes such as lithography, etching, diffusion, ion implantation, and thin film deposition. Many of these processes are high-temperature processes. After undergoing high-temperature processes, wafers generally need to be rapidly cooled to room temperature or the wafer material temperature required by the process before subsequent processes can be carried out.

[0003] A wafer cold disk assembly and cooling device, disclosed in publication number CN216624218U, relates to the field of wafer processing technology. The wafer cold disk assembly includes a cold disk and an alumina film covering a support surface. The cold disk has a support surface for placing the wafer. The alumina film on the support surface prevents the high-temperature wafer from directly contacting the cold disk and adhering to aluminum ions generated by the cold disk. It also prevents aluminum ions adhering to the wafer from affecting the cooling effect. Therefore, using a cold disk with an alumina film avoids wafer contamination by aluminum ions, which could affect subsequent production processes. Thus, the wafer cold disk assembly and cooling device provided by this invention ensures the cooling effect and quality of the wafer.

[0004] While existing technologies can cool wafers, they are not suitable for cooling micro-warped wafers. Therefore, we propose a vacuum cooling disk suitable for micro-warped wafers. Utility Model Content

[0005] The purpose of this invention is to provide a vacuum cold plate suitable for micro-warped wafers, in order to solve the problems in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a vacuum cold disk suitable for micro-warped wafers, comprising a vacuum cold disk assembly, the vacuum cold disk assembly comprising a vacuum cold disk body, wherein a first vacuum groove, a second vacuum groove, and a third vacuum groove are sequentially formed on the upper surface of the vacuum cold disk body from the inside to the outside; a first gas pipe, a second gas pipe, and a third gas pipe are respectively formed on the vacuum cold disk body and communicate with the first vacuum groove, the second vacuum groove, and the third vacuum groove; a first gas pipe connector, a second gas pipe connector, and a third gas pipe connector are respectively installed on the vacuum cold disk body at the first gas pipe, the second gas pipe, and the third gas pipe; a water channel is formed at the bottom of the vacuum cold disk body, a cover plate is installed on the vacuum cold disk body at the water channel, and a cooling water inlet and a cooling water outlet communicating with the water channel are installed on the vacuum cold disk body.

[0007] Preferably, there are two of each of the first, second, and third tracheal connectors, with the two first tracheal connectors, the two second tracheal connectors, and the two third tracheal connectors arranged symmetrically.

[0008] Preferably, multiple limiting guide posts are installed at equal intervals on the outer side of the top of the vacuum cold plate body.

[0009] Preferably, it also includes a lifting mechanism, which includes a lifting plate, on which multiple pins are installed, and the vacuum cold plate body has through holes for the pins to pass through.

[0010] Preferably, the lifting mechanism includes a base plate and a lead screw mounting seat. A back plate is mounted on the base plate, a lead screw mounting seat is mounted on one side of the back plate, a lead screw is mounted on the lead screw mounting seat, a lifting block is slidably mounted on the other side of the back plate, a lead screw adapter plate is mounted on the lifting block, and a nut that mates with the lead screw is mounted on the lead screw. The lifting plate is mounted on the lifting block. A driven synchronous pulley is mounted on the bottom end of the lead screw, a motor is mounted on the base plate, a driving synchronous pulley is mounted on the output shaft of the motor, and a synchronous belt is installed between the driving synchronous pulley and the driven synchronous pulley.

[0011] Preferably, the back plate is equipped with a photoelectric sensor, and the adapter plate is equipped with a sensing element that cooperates with the photoelectric sensor; the back plate is equipped with a linear guide rail, and the lifting block is equipped with a slider that cooperates with the linear guide rail.

[0012] The lifting plate is provided with a pipeline, and the lifting plate is equipped with an adsorption gas pipe connector connected to the pipeline. The PIN column has a hollow structure, and an adsorption head is installed at the top of the PIN column.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. The vacuum cold disk body features evenly distributed vacuum ports. Vacuum reaches the disk surface through air channels around its perimeter, ensuring more uniform wafer adsorption and reducing potential gaps between the wafer and the disk surface. Each ring of air channels on the disk surface has a deep cut, with the side vacuum ports extending into the disk surface and connecting to these cuts. Every two symmetrical air channel openings lead to the same path (e.g., when adsorbing 8-inch wafers, all air channels are open; when adsorbing 6-inch wafers, the outermost ring of air channels is closed, and the others are open; when adsorbing 4-inch wafers, the outermost two rings of air channels are closed, and the others are open). This allows for switching between vacuum adsorption of wafers of different sizes. Integrated cooling water channels beneath the vacuum cold disk, through machined grooves and friction-welded sealing covers, allow cooling water to flow evenly beneath the cold disk without affecting the vacuum effect.

[0015] 2. The vacuum cooling plate device can achieve uniform adsorption of wafers, improving the process effect caused by uneven contact with the plate surface when cooling slightly warped wafers. It can adapt to wafers of different sizes by using several vacuum ports of different sizes. This structure integrates multiple functions through a single cold plate, including multi-size wafer compatibility, wafer cooling, vacuum adsorption, space saving and easy installation. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a utility model Figure 1 A structural diagram from another perspective;

[0019] Figure 3 This is a schematic diagram of the structure of the main body of the vacuum cold plate of this utility model;

[0020] Figure 4 This is a top view of the present invention;

[0021] Figure 5 This is a cross-sectional view of the present invention;

[0022] Figure 6 This is a structural schematic diagram of the lifting mechanism of this utility model;

[0023] Figure 7 This is a structural schematic diagram of the lifting mechanism of this utility model from the bottom view.

[0024] In the diagram: 1. Vacuum cold plate assembly; 2. Lifting mechanism; 101. Vacuum cold plate body; 102. Third air pipe connector; 103. Cooling water inlet; 104. Cooling water outlet; 105. First air pipe connector; 106. Second air pipe connector; 107. First vacuum tank; 108. Second vacuum tank; 109. Third vacuum tank; 110. Limiting guide post; 111. Cover plate; 112. Water channel; 201. Base plate; 202. Screw mounting seat; 203. Nut; 204. Back plate; 205. Screw adapter plate; 206. Motor; 207. Lifting plate; 208. PIN post; 209. Active synchronous pulley; 210. Synchronous belt; 211. Driven synchronous pulley; 212. Lifting block; 213. Linear guide rail; 214. Adsorption air pipe connector; 215. Adsorption head. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0026] Please see Figure 1-7 In this embodiment of the present invention, a vacuum cooling disk suitable for micro-warped wafers includes a vacuum cooling disk assembly 1. The vacuum cooling disk assembly 1 includes a vacuum cooling disk body 101. A first vacuum groove 107, a second vacuum groove 108, and a third vacuum groove 109 are sequentially formed on the upper surface of the vacuum cooling disk body 101 from the inside to the outside. A first gas pipe, a second gas pipe, and a third gas pipe are respectively formed on the vacuum cooling disk body 101 and communicate with the first vacuum groove 107, the second vacuum groove 108, and the third vacuum groove 109. A first gas pipe connector 1 is respectively installed on the vacuum cooling disk body 101 at the first gas pipe, the second gas pipe, and the third gas pipe. 05. Second air pipe connector 106 and third air pipe connector 102; The bottom of the vacuum cold plate body 101 is provided with a water channel 112, and a cover plate 111 is installed on the vacuum cold plate body 101 at the water channel 112. The vacuum cold plate body 101 is provided with a cooling water inlet 103 and a cooling water outlet 104 communicating with the water channel 112. Multiple limiting guide posts 110 are installed at equal intervals on the outer side of the top of the vacuum cold plate body 101. Vacuum ports are evenly distributed on the vacuum cold plate body, and the vacuum reaches the plate surface through the air channels around the vacuum plate surface, while more evenly adsorbing the wafer and reducing the possible gaps between the wafer and the plate surface. The vacuum cold plate features evenly distributed vacuum ports. Vacuum reaches the plate surface through air channels within the plate. Each ring of air channels on the plate surface has a deep cut, and the side vacuum ports extend into the plate surface, connecting to the cuts in the air channels. Furthermore, every two symmetrical air channel openings lead to the same path (e.g., when adsorbing 8-inch wafers, all air channels are open; when adsorbing 6-inch wafers, the outermost ring of air channels is closed, and the others are open; when adsorbing 4-inch wafers, the outermost two rings of air channels are closed, and the others are open). This allows for switching between vacuum adsorption of wafers of different sizes. The integrated cooling water channels beneath the vacuum cold plate, through machining grooves and friction welding of sealing covers, allow cooling water to flow evenly beneath the cold plate without affecting the vacuum effect.

[0027] Two of each of the first tracheal connector 105, the second tracheal connector 106, and the third tracheal connector 102 are provided. The two first tracheal connectors 105 are symmetrically arranged, the two second tracheal connectors 106 are symmetrically arranged, and the two third tracheal connectors 102 are symmetrically arranged.

[0028] It also includes a lifting mechanism 2, which includes a lifting plate 207, on which a plurality of pin posts 208 are mounted. The vacuum cold plate body 101 has through holes for the pin posts 208 to pass through. The lifting mechanism 2 includes a base plate 201 and a lead screw mounting seat 202. The base plate 201 is equipped with a back plate 204. The lead screw mounting seat 202 is installed on one side of the back plate 204, and a lead screw is installed on the lead screw mounting seat 202. A lifting block 212 is slidably installed on the other side of the back plate 204. A lead screw adapter plate 205 is installed on the lifting block 212, and a nut 203 that mates with the lead screw is installed on the lead screw. The lifting plate 207 is mounted on the lifting block 212. The lead screw base... The base plate 201 is equipped with a driven synchronous pulley 211, the output shaft of the motor 206 is equipped with a driving synchronous pulley 209, and a synchronous belt 210 is installed between the driving synchronous pulley 209 and the driven synchronous pulley 211; the back plate 204 is equipped with a photoelectric sensor, and the adapter plate is equipped with a sensing plate that cooperates with the photoelectric sensor; the back plate 204 is equipped with a linear guide rail 213, the lifting block 212 is equipped with a slider that cooperates with the linear guide rail 213, the lifting plate 207 has a pipeline, the lifting plate 207 is equipped with an adsorption gas pipe connector 214 connected to the pipeline, the PIN column 208 has a hollow structure, and an adsorption head 215 is installed at the top of the PIN column 208.

[0029] The working principle of this invention is as follows: The vacuum cold disk body has uniformly distributed vacuum ports. Vacuum reaches the disk surface through air channels around the perimeter, simultaneously achieving more uniform wafer adsorption and reducing potential gaps between the wafer and the disk surface. Each ring of air channels on the disk surface has a deep cut, with the side vacuum ports extending into the disk surface and connecting to the cuts in the air channels. Furthermore, every two symmetrical air channel openings lead to the same path (e.g., when adsorbing 8-inch wafers, all air channels are open; when adsorbing 6-inch wafers, the outermost ring of air channels is closed, and the others are open; when adsorbing 4-inch wafers, the outermost two rings of air channels are closed, and the others are open). This allows for switching between vacuum adsorption of wafers of different sizes. The integrated cooling water channel beneath the vacuum cold disk, through machining grooves and friction welding of a sealing cover, allows cooling water to flow evenly beneath the cold disk without affecting the vacuum effect.

[0030] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vacuum cold disk suitable for micro-warped wafers, comprising a vacuum cold disk assembly (1), characterized in that: The vacuum cooling plate assembly (1) includes a vacuum cooling plate body (101). A first vacuum groove (107), a second vacuum groove (108), and a third vacuum groove (109) are sequentially formed on the upper surface of the vacuum cooling plate body (101) from the inside out. The vacuum cooling plate body (101) is provided with a first air pipe, a second air pipe, and a third air pipe that communicate with the first vacuum groove (107), the second vacuum groove (108), and the third vacuum groove (109), respectively. The vacuum cooling plate body (101) is located at the first air pipe, the second air pipe, and the third air pipe, respectively. The vacuum cold plate body (101) is equipped with a first air pipe connector (105), a second air pipe connector (106), and a third air pipe connector (102); a water channel (112) is opened at the bottom of the vacuum cold plate body (101), a cover plate (111) is installed at the water channel (112) on the vacuum cold plate body (101), a cooling water inlet (103) and a cooling water outlet (104) connected to the water channel (112) are installed on the vacuum cold plate body (101); a plurality of limiting guide posts (110) are installed at equal intervals on the outer side of the top of the vacuum cold plate body (101).

2. The vacuum cooling disk suitable for micro-warped wafers according to claim 1, characterized in that: Two of each of the first tracheal connector (105), the second tracheal connector (106), and the third tracheal connector (102) are provided. The two first tracheal connectors (105) are symmetrically arranged, the two second tracheal connectors (106) are symmetrically arranged, and the two third tracheal connectors (102) are symmetrically arranged.

3. A vacuum cooling disk suitable for micro-warped wafers according to claim 1, characterized in that: It also includes a lifting mechanism (2), which includes a lifting plate (207), the lifting plate (207) is equipped with a plurality of pin pillars (208), and the vacuum cold plate body (101) has through holes for the pin pillars (208) to pass through.

4. A vacuum cooling disk suitable for micro-warped wafers according to claim 3, characterized in that: The lifting mechanism (2) includes a base plate (201) and a lead screw mounting seat (202). A back plate (204) is mounted on the base plate (201). A lead screw mounting seat (202) is mounted on one side of the back plate (204), and a lead screw is mounted on the lead screw mounting seat (202). A lifting block (212) is slidably mounted on the other side of the back plate (204). A lead screw adapter plate (205) is mounted on the lifting block (212). 205) A nut (203) is installed to cooperate with the lead screw; the lifting plate (207) is installed on the lifting block (212); a driven synchronous pulley (211) is installed at the bottom end of the lead screw; a motor (206) is installed on the base plate (201); a driving synchronous pulley (209) is installed on the output shaft of the motor (206); and a synchronous belt (210) is installed between the driving synchronous pulley (209) and the driven synchronous pulley (211).

5. A vacuum cooling disk suitable for micro-warped wafers according to claim 4, characterized in that: The back plate (204) is equipped with a photoelectric sensor, and the adapter plate is equipped with a sensing plate that cooperates with the photoelectric sensor; the back plate (204) is equipped with a linear guide rail (213), and the lifting block (212) is equipped with a slider that cooperates with the linear guide rail (213).

6. A vacuum cooling disk suitable for micro-warped wafers according to claim 5, characterized in that: The lifting plate (207) is provided with a pipeline, and the lifting plate (207) is equipped with an adsorption gas pipe connector (214) connected to the pipeline. The PIN column (208) is a hollow structure, and an adsorption head (215) is installed at the top of the PIN column (208).

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