Quadrant mechanism and detection device

Abstract

The utility model belongs to battery piece detection technical field especially relates to four quarter turntable mechanism and detection equipment, wherein one kind four quarter turntable mechanism, include: turntable main part, a plurality of detection support is uniformly distributed on the turntable main part, one center plate is correspondingly detachably arranged at the center line of one detection support, every detection support is provided with two first air flow channel respectively, every center plate is provided with two second air flow channel respectively, first air flow channel and second air flow channel are communicated with negative pressure air pump respectively, wherein, first air flow channel and second air flow channel are suitable for independent control and separate adsorption silicon wafer, when the turntable main part rotates, can carry and transport four silicon wafers. Detection support is integrally arranged, and center plate is splitly arranged, so that four quarter turntable mechanism can separate adsorption four silicon wafers, and the silicon wafers do not affect each other, and the number of silicon wafers is not limited when adsorbing, and the flexibility is high.

Description

Technical Field

[0001] This utility model belongs to the field of battery cell testing technology, and particularly relates to a four-part turntable mechanism and testing equipment. Background Technology

[0002] In the manufacturing process of photovoltaic cells, silicon wafers need to be tested for IV (current-voltage) characteristics and EL (electroluminescence) defects to determine whether their performance and quality are up to standard. Current technologies often employ a dual-wafer transfer turntable structure, which can only transport two silicon wafers to the testing station at a time, resulting in low efficiency and difficulty in meeting the ever-increasing production demands.

[0003] Meanwhile, existing rotary adsorption systems are usually integrated designs, which cannot independently adsorb multiple silicon wafers. This means that in actual production, a full load of silicon wafers (such as two or four wafers) must be placed for stable operation. This makes it difficult to flexibly adapt to the testing needs of some silicon wafers (such as one, two, or three wafers), reducing the applicability and efficiency of the equipment.

[0004] Therefore, there is an urgent need to develop a four-part turntable mechanism and detection equipment that can simultaneously improve transmission efficiency and enhance adsorption flexibility to solve the above-mentioned technical problems.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute information related to the technology. Utility Model Content

[0006] This disclosure provides at least one four-part turntable mechanism and testing equipment.

[0007] In a first aspect, embodiments of this disclosure provide a four-part turntable mechanism, comprising: Turntable body; A plurality of the aforementioned detection supports are circumferentially distributed on the turntable body; Several center plates are provided, with one center plate being detachably mounted at the center line of a test bracket, so that at least four silicon wafer placement positions are formed on each test bracket. Each of the aforementioned detection brackets is provided with two first airflow channels; Each of the central plates is provided with two second airflow channels, and the first airflow channel and the second airflow channel are respectively connected to the negative pressure air pump; The first airflow channel and the second airflow channel are adapted to be independently controlled and separately adsorb silicon wafers; The turntable can move and transfer four silicon wafers when it rotates.

[0008] In one optional embodiment, the detection bracket has a receiving opening, and at least one first suction cup holder is symmetrically arranged on the inner sidewall of the receiving opening. The first suction cup holder is adapted to adsorb silicon wafers under negative pressure.

[0009] In one alternative embodiment, the first airflow channel extends along the edge of the detection bracket toward the first suction cup holder, and the first suction cup holder communicates with the first airflow channel to adsorb the silicon wafer under negative pressure.

[0010] In one optional embodiment, at least one second suction cup holder is provided on each side of the center plate, with one second suction cup holder corresponding to one first suction cup holder.

[0011] In one alternative implementation, a second suction cup holder corresponds to a second airflow channel.

[0012] In one optional embodiment, a plurality of suction cups are evenly distributed on the first suction cup holder and the second suction cup holder, the suction cups are arranged facing upwards and are respectively connected to the first airflow channel or the second airflow channel.

[0013] In one alternative embodiment, the detection bracket is provided with scale lines near the first suction cup holder for aligning with the edge of the silicon wafer during placement to achieve precise positioning.

[0014] In one alternative embodiment, the center plate is provided with scale lines near the second suction cup holder for aligning with the edge of the silicon wafer during placement to achieve precise positioning.

[0015] Secondly, this disclosure also provides a silicon wafer inspection device, including an AOI inspection module and an IV / EL inspection module. Each module is connected in series with the four-part turntable mechanism via a transmission track to form a four-part test pipeline.

[0016] The beneficial effects of this invention are as follows: It provides a four-part turntable mechanism with several detection supports evenly distributed around the circumference of the turntable body. Each detection support has at least four silicon wafer placement positions, enabling the simultaneous transport and transfer of four silicon wafers to the detection station in a single rotation. Compared to the traditional dual-wafer transfer structure, the detection efficiency is significantly improved. Furthermore, through independent control and separate adsorption design of the first and second airflow channels, each silicon wafer placement position can be operated independently without interference between wafers. Even with only one, two, or three silicon wafers, the device can operate stably, greatly enhancing its adsorption flexibility and applicability. Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this utility model, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A perspective view of the four-part turntable mechanism provided in an embodiment of this disclosure; Figure 2 This is a front view of the four-part turntable mechanism provided in an embodiment of this disclosure.

[0020] Figure 3 Provided for the embodiments of this disclosure Figure 2 A magnified view of part A in the image.

[0021] In the picture: 1. Turntable body; 2. Detection bracket; 20. Receiving port; 21. Center plate; 22. First suction cup frame; 23. First airflow channel; 24. Second suction cup frame; 25. Second airflow channel; 26. Suction cup; 27. Scale line. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0024] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0025] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0026] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0027] Research has found that In the manufacturing process of photovoltaic cells, silicon wafers need to be tested for IV (current-voltage) characteristics and EL (electroluminescence) defects to determine whether their performance and quality are up to standard. Current technologies often employ a dual-wafer transfer turntable structure, which can only transport two silicon wafers to the testing station at a time, resulting in low efficiency and difficulty in meeting the ever-increasing production demands.

[0028] Meanwhile, existing rotary adsorption systems are usually integrated designs, which cannot independently adsorb multiple silicon wafers. This means that in actual production, a full load of silicon wafers (such as two or four wafers) must be placed for stable operation. This makes it difficult to flexibly adapt to the testing needs of some silicon wafers (such as one, two, or three wafers), reducing the applicability and efficiency of the equipment.

[0029] Therefore, there is an urgent need to develop a four-part turntable mechanism and detection equipment that can simultaneously improve transmission efficiency and enhance adsorption flexibility to solve the above-mentioned technical problems.

[0030] The defects in the above solutions and the reasons for their occurrence are the results of the inventors' practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventors' contributions to this disclosure.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0033] like Figure 1 As shown, at least one embodiment provides a four-part turntable mechanism, including: a turntable body 1 with several detection brackets 2 evenly distributed around its circumference; the turntable body 1 is connected to the output shaft of a drive motor (not shown in the figure) through a central mounting hole, and can perform intermittent rotational motion under the precise control of the motor. Four identical detection brackets 2 are evenly distributed along the circumference of the turntable body 1. This embodiment uses four brackets as an example; in practical applications, the number can be adjusted according to the process cycle and equipment layout, for example, six or eight, but each bracket must be capable of simultaneously carrying multiple (at least four) silicon wafers. Each detection bracket 2 has at least four silicon wafer placement positions; wherein, when the turntable body 1 rotates, it can transport and transfer four silicon wafers. Each detection bracket 2, as the core component carrying the silicon wafers, is roughly a rectangular plate structure, made of high-strength, low-density aluminum alloy material precision machined by CNC to ensure its structural rigidity and lightweight. The detection brackets 2 are fixedly connected to the turntable body 1 by bolt fastening.

[0034] Reference Appendix Figure 1 In the middle of each testing bracket 2, a rectangular receiving opening 20 is provided. The function of the receiving opening 20 is to provide space for the subsequent installation of the center plate 21, avoiding interference when handling silicon wafers. On the inner sidewalls of the two long sides of the receiving opening 20, a first suction cup holder 22 is symmetrically fixed. The first suction cup holder 22 is elongated and has vacuum channels machined inside. On the upper surface of each first suction cup holder 22, multiple suction cups 26 are evenly distributed. The suction cups 26 are made of soft, wear-resistant silicone material with good airtightness. Their openings face upwards, and they are used to directly contact and adsorb the back of the silicon wafer. The adsorption force is gentle and will not damage the surface of the silicon wafer.

[0035] like Figure 1 As shown, the detection bracket 2 is provided with two first airflow channels 23, which extend along the edge of the detection bracket 2 towards the first suction cup frame 22, and the first suction cup frame 22 is connected to the first airflow channels 23. In order to provide negative pressure to the first suction cup frame 22, two independent first airflow channels 23 are machined inside the detection bracket 2. The first airflow channels 23 start from the air source interface at the edge of the detection bracket 2, extend along the internal structure of the bracket, and finally connect to the vacuum channels inside the two first suction cup frames 22 respectively. The negative pressure generated by an external vacuum generator (such as a vacuum pump) is connected to these air source interfaces through a rotary joint (not shown in the figure), thereby providing power for the adsorption system.

[0036] Continue to refer to the appendix Figure 1 A central plate 21 is detachably mounted on the detection bracket 2, and the central plate 21 is detachably fixed to the receiving opening 20 of the detection bracket 2 by screws. At least one second suction cup holder 24 is provided on each side of the central plate 21, with one second suction cup holder 24 corresponding to one first suction cup holder 22. Two second airflow channels 25 are provided on the central plate 21, and the second suction cup holders 24 communicate with the second airflow channels 25. The central plate 21 and the detection bracket 2 are designed separately, which reduces the processing difficulty of the detection bracket 2. One second suction cup holder 24 is provided on each of the two edges of the central plate 21. The structure of the second suction cup holder 24 is similar to that of the first suction cup holder 22, and it also has several suction cups 26 evenly distributed on it. One second suction cup holder 24 and one first suction cup holder 22 correspond to each other in position, each forming a silicon wafer placement area. Furthermore, in order to supply air to the second suction cup holders 24, two second airflow channels 25 are independently processed inside the central plate 21. The second airflow channel 25 is connected to the second suction cup holder 24 and is connected to the corresponding air path on the detection bracket 2 through a sealing ring. In this way, the negative pressure adsorption system for the four silicon wafer placement positions (formed by the combination of two first suction cup holders 22 and two second suction cup holders 24) is completely independent in terms of air path. Each airflow channel (the first airflow channel 23 and the second airflow channel 25) is connected to a negative pressure air pump and can be independently controlled to achieve separate adsorption. The control system can individually control the adsorption switch at each position. This means that during production, if there is no silicon wafer at a certain placement position, only the vacuum valve of that path needs to be closed, without affecting the adsorption force of the other three positions. This effectively solves the problem of poor flexibility in adsorption systems in the prior art and achieves extremely high operational flexibility. like Figure 1The detection bracket 2 has graduation lines 27 near the first suction cup holder 22 to assist in the placement and alignment of the silicon wafer. The center plate 21 has graduation lines 27 near the second suction cup holder 24 to assist in the placement and alignment of the silicon wafer. Fine graduation lines 27 are laser-engraved on the surface of the detection bracket 2 next to each first suction cup holder 22 and on the surface of the center plate 21 next to each second suction cup holder 24. The positions of these graduation lines 27 are precisely pre-calibrated according to the size and grid position of the standard silicon wafer. When placing the silicon wafer, the loading robot or operator only needs to align the edge of the silicon wafer with the corresponding graduation line 27 to ensure that the silicon wafer is placed in the theoretical center position, and the grid lines on its surface perfectly avoid the landing point of the test pin, greatly improving the ease of operation and alignment accuracy.

[0037] Reference Appendix Figure 1 The detection bracket 2 features a hollowed-out triangular structure to reduce overall weight and rotational inertia. To further optimize performance, multiple hollowed-out triangular structures are also designed in non-critical stress areas of each detection bracket 2. These triangular structures follow stress distribution principles, minimizing excess material while ensuring structural strength. This not only reduces the weight of the detection bracket 2 itself, but more importantly, significantly reduces the overall rotational inertia of the turntable (especially the outer rotating edge), making the motor more energy-efficient, faster, and smoother when driving the turntable for high-speed start-stop and positioning, while reducing vibration and wear.

[0038] At least one embodiment provides a silicon wafer inspection device, including an AOI inspection module and an IV / EL inspection module. Each module is connected in series with the four-part turntable mechanism via a transmission track to form a four-part test pipeline.

[0039] The working process and principle of a four-part turntable mechanism are as follows: Loading: The turntable body 1 stops rotating, and one of the inspection brackets 2 stops precisely at the loading station. The loading robot (or conveyor belt) places up to four silicon wafers sequentially into the four positions of the inspection bracket 2 and positions them precisely using the scale line 27.

[0040] Adsorption and fixation: The vacuum system is activated, and four independent gas paths adsorb the silicon wafers at the workstations where they are placed, according to the actual incoming material conditions, thus firmly fixing the silicon wafers in place.

[0041] Rotation and Testing: The drive motor rotates the turntable body 1 by a certain angle (e.g., 90°), transporting the testing bracket 2 carrying the silicon wafer to the testing station. The testing module is pressed down, and the ejector pin contacts the back electrode of the silicon wafer, completing the electrical performance test.

[0042] Sorting and unloading: The turntable continues to rotate. Based on the test results, qualified silicon wafers are transported to the unloading station and received by downstream equipment; fragments or microcracks that are judged to be unqualified are transported to the waste bin station and removed manually or by a specialized agency. This cycle is repeated to achieve an efficient, continuous, and automated testing process.

[0043] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0044] In the description of this utility model, terms such as “first,” “second,” and other numerical terms used herein do not imply any order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0045] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A quarter-turntable mechanism, characterized in that, include: Turntable body (1); A plurality of the detection brackets (2) are evenly distributed circumferentially on the turntable body (1); Several center plates (21), one center plate (21) is detachably disposed at the center line of a test bracket (2) so that at least 4 silicon wafer placement positions are formed on each test bracket (2); Each of the aforementioned detection brackets (2) is provided with two first airflow channels (23); Each of the central plates (21) is provided with two second airflow channels (25), and the first airflow channel (23) and the second airflow channel (25) are respectively connected to the negative pressure air pump; The first airflow channel (23) and the second airflow channel (25) are adapted to be independently controlled and separately adsorb silicon wafers; The turntable body (1) can move and transfer four silicon wafers when it rotates.

2. The quarter-turntable mechanism as described in claim 1, characterized in that, The detection bracket (2) has an opening (20), and at least one first suction cup (22) is symmetrically arranged on the inner side wall of the opening (20). The first suction cup (22) is suitable for negative pressure adsorption of silicon wafers.

3. The quarter-turntable mechanism as described in claim 2, characterized in that, The first airflow channel (23) extends along the edge of the detection bracket (2) toward the first suction cup bracket (22), and the first suction cup bracket (22) is connected to the first airflow channel (23) to adsorb the silicon wafer under negative pressure.

4. The quarter-turntable mechanism as described in claim 1, characterized in that, At least one second suction cup frame (24) is provided on both sides of the center plate (21), and one second suction cup frame (24) corresponds to one first suction cup frame (22).

5. The quarter-turntable mechanism as described in claim 4, characterized in that, A second suction cup holder (24) is connected to a second airflow channel (25).

6. The quarter-turntable mechanism as described in claim 3 or 5, characterized in that, The first suction cup holder (22) and the second suction cup holder (24) are each provided with a number of suction cups (26), which are arranged facing upwards and are respectively connected to the first airflow channel (23) or the second airflow channel (25).

7. The quarter-turntable mechanism as described in claim 1, characterized in that, The detection bracket (2) has a scale line (27) near the first suction cup bracket (22) for aligning with the edge of the silicon wafer when placing it to achieve precise positioning.

8. The quarter-turntable mechanism as described in claim 4, characterized in that, The center plate (21) is provided with a scale line (27) near the second suction cup holder (24) for aligning with the edge of the silicon wafer when placing it to achieve precise positioning.

9. A silicon wafer inspection device, characterized in that, It includes a four-part turntable mechanism as described in any one of claims 1-8; and an AOI detection module and an IV / EL detection module, each module being connected in series with the four-part turntable mechanism via a transmission track to form a four-part test pipeline.

Images