power module

Abstract

Disclosed is a power module including an insulating substrate, a heat dissipation part integrally provided on the insulating substrate, and a sealing part sealing a part of the heat dissipation part and the insulating substrate, wherein the heat dissipation part integrally formed with the insulating substrate reduces thermal resistance, thereby enhancing heat dissipation performance and simplifying components and structure of the power module.

Description

Technical Field

[0001] This disclosure relates to a power module, and more specifically, to a power module capable of improving heat dissipation performance by reducing thermal resistance. Background Technology

[0002] Power semiconductor devices are semiconductor devices composed of power switching devices and integrated circuits (ICs), and they play a role in converting, distributing, and managing the power supplied to electronic devices.

[0003] Compared to conventional semiconductor devices, power semiconductor devices require higher voltages and higher reliability. Specifically, the demand for power semiconductor devices has increased due to the development of hybrid and electric vehicles. Power conversion modules used in hybrid and electric vehicles can consist of power semiconductor devices used to convert direct current (DC) to alternating current (AC) or vice versa.

[0004] Power modules are achieved through key technologies such as module integration design techniques for power semiconductor devices and packaging materials, manufacturing process techniques, characteristic testing, and reliability assessment techniques. Specifically, power modules used in eco-friendly vehicles such as hybrid and electric vehicles require high reliability because they operate in harsh environments such as high temperatures and vibrations.

[0005] The background technology of this disclosure is disclosed in Korean Patent Registration No. 10-2277800 (registered on July 16, 2021, entitled "Integrated Power Module with Heat Sink and Manufacturing Method Thereof"). Utility Model Content

[0006] The various implementations are for power modules whose heat dissipation performance can be improved by reducing thermal resistance.

[0007] A power module according to an embodiment of the present disclosure may include: an insulating substrate; a heat dissipation portion integrally disposed on the insulating substrate; and a sealing portion sealing a portion of the heat dissipation portion and the insulating substrate.

[0008] The heat dissipation portion may include: a first heat dissipation portion integrally disposed on a first surface of the insulating substrate; and a second heat dissipation portion integrally disposed on a second surface of the insulating substrate, the second surface facing a direction opposite to the first surface; and the sealing portion sealing the entire insulating substrate and the entire first heat dissipation portion and sealing a portion of the second heat dissipation portion.

[0009] The volume of the first heat dissipation part and the volume of the second heat dissipation part may be different.

[0010] The volume of the first heat dissipation part and the volume of the second heat dissipation part can be the same.

[0011] The second heat dissipation portion may include: a first heat dissipation body portion that contacts the second surface but not the sealing portion; a second heat dissipation body portion that extends from the first heat dissipation body portion and is capable of contacting the second surface and the sealing portion; and one or more heat sink portions that extend from the first heat dissipation body portion in a direction parallel to a first direction and are configured to be spaced apart from each other in a direction parallel to a second direction, wherein the second direction intersects the first direction.

[0012] The first heat dissipation body portion may be disposed on the first portion of the second heat dissipation portion, and the second heat dissipation body portion may be disposed on the second portion of the second heat dissipation portion, wherein the second portion is the portion of the second heat dissipation portion other than the first portion, and the height of the second heat dissipation body portion parallel to the first direction may be the same as the height of the heat sink portion parallel to the first direction.

[0013] The thickness of the first heat dissipation portion parallel to the first direction and the thickness of the first heat dissipation body portion parallel to the first direction may be different from each other.

[0014] The thickness of the first heat dissipation portion parallel to the first direction may be greater than the thickness of the first heat dissipation body portion parallel to the first direction.

[0015] The second heat dissipation body portion may include an exposed surface that does not contact the sealing portion, and the outer surface of the sealing portion adjacent to the exposed surface and the exposed surface may be configured to form the same plane.

[0016] The insulating substrate and the heat dissipation portion are configured as a plurality of insulating substrates and a plurality of heat dissipation portions spaced apart from each other along a direction parallel to the first direction, and the plurality of heat dissipation portions are configured to face opposite directions.

[0017] This disclosure reduces the thermal resistance of the power module by providing an integrally formed heat dissipation portion on an insulating substrate, thereby improving the heat dissipation performance of the power module and simplifying the components constituting the power module and the structure of the power module. Attached Figure Description

[0018] Figure 1 This is a perspective view of a power module according to a first embodiment of the present disclosure, viewed from one direction.

[0019] Figure 2 yes Figure 1 A three-dimensional view of the power module as seen from another direction.

[0020] Figure 3 It is along Figure 1 The cross-sectional view taken from line III-III in the diagram.

[0021] Figure 4 This is a perspective view of the power module according to the second embodiment of this disclosure, viewed from one direction.

[0022] Figure 5 yes Figure 4 A three-dimensional view of the power module as seen from another direction.

[0023] Figure 6 It is along Figure 4 The cross-sectional view taken from line VI-VI in the diagram. Detailed Implementation

[0024] In the following description, embodiments of the power module according to this disclosure will be described with reference to the accompanying drawings. In this process, for clarity and convenience, the thickness of lines and the dimensions of components in the drawings may be exaggerated. Furthermore, the terminology described below is defined in consideration of the functions described in this disclosure, and these terms may be changed according to the intentions or customizations of the user or operator. Therefore, the definitions of these terms should be based on the entire contents of this specification.

[0025] Figure 1 This is a perspective view of a power module according to a first embodiment of the present disclosure, viewed from one direction. Figure 2 yes Figure 1 A 3D view of the power module as seen from another direction. Figure 3 It is along Figure 1 The cross-sectional view taken from line III-III in the diagram.

[0026] See Figures 1 to 3 According to the first embodiment of the present disclosure, the power module 1 includes an insulating substrate 110, a heat dissipation portion 120, and a sealing portion 130, which will be described in more detail below.

[0027] The insulating substrate 110 may include a direct-bonded copper (DBC) substrate. The insulating substrate 110 has highly conductive metal (such as copper (Cu)) layers formed on both sides of a ceramic substrate, and may include at least one or more laminated structures. Conductive patterns may be formed on the surface of the insulating substrate 110.

[0028] The insulating substrate 110 includes a first surface 110a (based on...) Figure 3 The upper surface (at that time) and the second surface 110b (based on the direction opposite to that of the first surface 110a) are configured to face the opposite direction. Figure 3 (At this time, the lower surface).

[0029] The power module 1 according to this embodiment also includes a chip 11 and a clip 13. The chip 11 can be exemplified as a semiconductor device. The chip 11 can be formed in a structure in which a plurality of semiconductor devices are connected in parallel with metal interconnects formed on a predetermined substrate. The chip 11 is electrically connected to an insulating substrate 110.

[0030] Clip 13 can be used to electrically connect chip 11 to adjacent chips 11. When multiple chips 11 are arranged in parallel, clip 13 can engage with each of at least two or more chips 11 arranged in parallel.

[0031] An adhesive layer 12 is provided between the clip 13 and the chip 11. The adhesive layer 12 may include a thermal adhesive or a thermal interface material (TIM).

[0032] A heat dissipation portion 120 is integrally formed on the insulating substrate 110. The heat dissipation portion 120 is in direct contact with the insulating substrate 110. The heat dissipation portion 120 can dissipate the heat transferred from the insulating substrate 110 to the outside of the power module 1 to cool the insulating substrate 110. The heat dissipation portion 120 may include a copper (Cu) material with high thermal conductivity.

[0033] The heat dissipation section 120 includes a first heat dissipation section 121 and a second heat dissipation section 122.

[0034] The first heat dissipation portion 121 may have a flat plate shape. The cross-sectional shape of the first heat dissipation portion 121 may be circular, elliptical, or a polygon with corners (such as a square).

[0035] The first heat dissipation portion 121 is disposed on the first surface 110a of the insulating substrate 110. Specifically, the first heat dissipation portion 121 is integrally disposed on the first surface 110a of the insulating substrate 110. The surface of the first heat dissipation portion 121 facing the first surface 110a of the insulating substrate 110 (based on...) Figure 3 The lower surface can directly contact the first surface 110a of the insulating substrate 110.

[0036] Chip 11 is mounted on the first heat dissipation portion 121. Specifically, chip 11 is mounted on the other surface of the first heat dissipation portion 121 (based on...). Figure 3 (At the time, it is on the upper surface). The adhesive layer 12 is disposed between the first heat dissipation portion 121 and the chip 11. The adhesive layer 12 may include a thermal adhesive or TIM.

[0037] The second heat dissipation portion 122 is spaced apart from the first heat dissipation portion 121 in a direction parallel to the first direction. The second heat dissipation portion 122 is disposed on the second surface 110b of the insulating substrate 110. Specifically, the second heat dissipation portion 122 is integrally disposed on the second surface 110b of the insulating substrate 110. The surface of the second heat dissipation portion 122 facing the second surface 110b of the insulating substrate 110 (based on...) Figure 3 The upper surface (at that time) is in direct contact with the second surface 110b of the insulating substrate 110.

[0038] The cross-sectional shape of the second heat dissipation portion 122 can be circular, elliptical, or a polygon with corners (such as a square). In the following, an embodiment in which the cross-section of the second heat dissipation portion 122 is quadrilateral will be described.

[0039] The second heat dissipation section 122 includes a first section 122a and a second section 122b.

[0040] The first part 122a may represent the central part of the second heat dissipation part 122, and the second part 122b may represent the edge of the second heat dissipation part 122 other than the first part 122a.

[0041] The first heat dissipation portion 121 and the second heat dissipation portion 122 may have different volumes. Specifically, the amount of copper (Cu) constituting the first heat dissipation portion 121 and the amount of copper (Cu) constituting the second heat dissipation portion 122 may be different from each other. Therefore, the first heat dissipation portion 121 and the second heat dissipation portion 122 may have different weights.

[0042] In another embodiment, the first heat dissipation portion 121 and the second heat dissipation portion 122 may have the same volume. Specifically, the amount of copper (Cu) constituting the first heat dissipation portion 121 and the amount of copper (Cu) constituting the second heat dissipation portion 122 may be the same. Therefore, the first heat dissipation portion 121 and the second heat dissipation portion 122 may have the same weight.

[0043] The first heat dissipation portion 121 and the second heat dissipation portion 122 have different volumes or the same volume, such that the stress on the insulating substrate 110 due to the thermal expansion of the first heat dissipation portion 121 and the second heat dissipation portion 122 in the direction parallel to the first direction and / or in the direction parallel to the second direction can be minimized.

[0044] The sealing portion 130 is arranged to protect the chip 11 from heat, shock, and contamination, and may seal a portion of the heat dissipation portion 120 and the insulating substrate 110. The sealing portion 130 may seal the entire insulating substrate 110. The sealing portion 130 may include epoxy molding compound (EMC). (See reference...) Figure 3The top and side surfaces of the insulating substrate 110 are completely surrounded by the sealing portion 130, while the bottom surface is completely covered by the top surface of the second heat dissipation portion 122, and the side surfaces of the second heat dissipation portion 122 are surrounded by the sealing portion 130. Therefore, the insulating substrate 110 is completely surrounded by the sealing portion 130. In other words, the sealing portion 130 seals the entire insulating substrate 110.

[0045] The sealing portion 130 seals the insulating substrate 110 and the first heat dissipation portion 121. Therefore, the insulating substrate 110 and the first heat dissipation portion 121 are not exposed. The first heat dissipation portion 121 is fixed to the insulating substrate 110 by the sealing portion 130, and contact is maintained between the insulating substrate 110 and the first heat dissipation portion 121. The chip 11 and the clip 13 are also sealed by the sealing portion 130 to prevent exposure.

[0046] The sealing portion 130 can seal a portion of the second heat dissipation portion 122. Therefore, the remaining portion of the second heat dissipation portion 122 that is not sealed by the sealing portion 130 can be exposed.

[0047] The second heat dissipation portion 122 according to this embodiment includes a first heat dissipation body portion 1221, a second heat dissipation body portion 1222, and a heat sink portion 1223.

[0048] A first heat dissipation body portion 1221 is disposed on a first portion 122a of a second heat dissipation portion 122. The first heat dissipation body portion 1221 is in contact with a second surface 110b of an insulating substrate 110. The surface of the first heat dissipation body portion 1221 facing the second surface 110b of the insulating substrate 110 (based on...) Figure 3 The upper surface (at that time) is in direct contact with the second surface 110b of the insulating substrate 110.

[0049] The first heat dissipation body portion 1221 does not contact the sealing portion 130. Specifically, because the first heat dissipation body portion 1221 is not sealed by the sealing portion 130, the first heat dissipation body portion 1221 is exposed.

[0050] The second heat dissipation body portion 1222 extends from the first heat dissipation body portion 1221. The second heat dissipation body portion 1222 is disposed on the second portion 122b of the second heat dissipation portion 122. A portion of the second heat dissipation body portion 1222 can contact the sealing portion 130. Specifically, the second heat dissipation body portion 1222 is configured to face its outer surface in a direction parallel to the second direction (based on...). Figure 3 The left surface can be sealed by the sealing part 130 through contact with the sealing part 130.

[0051] The second heat dissipation body portion 1222 has an exposed surface 1222a that is not in contact with the sealing portion 130 and is not sealed by the sealing portion 130. The exposed surface 1222a is arranged to face a direction parallel to the first direction. The exposed surface 1222a may be a plane.

[0052] An O-ring or metal gasket is installed on the exposed surface 1222a, and an O-ring or metal gasket is sandwiched between the housing portion (not shown) that houses the power module 1 and the exposed surface 1222a, thereby enabling an airtight seal between the space between the second heat dissipation body portion 1222 and the housing portion.

[0053] The outer surface 130a of the sealing portion 130 adjacent to the exposed surface 1222a and the exposed surface 1222a are configured to form the same plane. In detail, the exposed surface 1222a of the second heat dissipation body portion 1222 and the outer surface 130a of the sealing portion 130 may have the same height.

[0054] Heat sink portions 1223 extend from the first heat sink body portion 1221 in a direction parallel to a first direction, and the plurality of heat sink portions 1223 are arranged to be spaced apart from each other in a direction parallel to a second direction. Cooling paths 1224 are formed between the plurality of heat sink portions 1223. Cooling fluid can flow through the cooling paths 1224.

[0055] The height of the second heat sink body 1222 parallel to the first direction can be the same as the height of the heat sink 1223 parallel to the first direction.

[0056] The heat sink portion 1223, parallel to the second heat sink body portion 1222, is spaced apart from the second heat sink body portion 1222. Therefore, a cooling path 1224 can be formed between the second heat sink body portion 1222 and the heat sink portion 1223. Cooling fluid can flow through the cooling path 1224.

[0057] The thickness T1 of the first heat dissipation portion 121 parallel to the first direction and the thickness T2 of the first heat dissipation body portion 1221 parallel to the first direction can be different from each other.

[0058] The thickness T1 of the first heat dissipation portion 121 and the thickness T2 of the first heat dissipation body portion 1221 are different from each other, so that the stress on the insulating substrate 110 caused by the thermal expansion of the first heat dissipation portion 121 and the second heat dissipation portion 122 in the direction parallel to the first direction and / or in the direction parallel to the second direction can be minimized.

[0059] In another embodiment, the thickness T1 of the first heat dissipation portion 121 parallel to the first direction may be greater than the thickness T2 of the first heat dissipation body portion 1221 parallel to the first direction.

[0060] The thickness T1 of the first heat dissipation portion 121 is the same as the thickness T2 of the first heat dissipation body portion 1221, so that the stress on the insulating substrate 110 due to the thermal expansion of the first heat dissipation portion 121 and the second heat dissipation portion 122 in the direction parallel to the first direction and / or in the direction parallel to the second direction can be minimized.

[0061] Figure 4 This is a perspective view of the power module according to the second embodiment of the present disclosure, viewed from one direction. Figure 5 yes Figure 4 A 3D view of the power module as seen from another direction. Figure 6 It is along Figure 4 The cross-sectional view taken from line VI-VI in the diagram.

[0062] See Figures 4 to 6 According to the second embodiment of this disclosure, the power module 2 includes an insulating substrate 210, a heat dissipation portion 220, and a sealing portion 230.

[0063] The insulating substrate 210 may include a DBC (direct bonded copper) substrate. The insulating substrate 210 has highly conductive metal (such as copper) layers formed on both sides of a ceramic substrate, and may include at least one or more laminated structures. Conductive patterns can be formed on the surface of the insulating substrate 210.

[0064] Multiple insulating substrates 210 can be provided. At least one pair of insulating substrates 210 can be provided to be spaced apart from each other along a direction parallel to the first direction.

[0065] The insulating substrate 210 includes a first surface 210a and a second surface 210b configured to face the direction opposite to the first surface 210a.

[0066] The power module 2 according to this embodiment also includes a chip 21. The chip 21 can be exemplified as a semiconductor device. The chip 21 can be formed in a structure in which a plurality of semiconductors are connected in parallel with metal interconnects formed on a predetermined substrate. The chip 21 is electrically connected to an insulating substrate 210.

[0067] Multiple heat dissipation sections 220 can be provided. At least one pair of heat dissipation sections 220 can be spaced apart from each other along a direction parallel to the first direction and can be configured to face opposite directions.

[0068] The heat dissipation portion 220 is integrally disposed on the insulating substrate 210. The heat dissipation portion 220 is in direct contact with the insulating substrate 210. The heat dissipation portion 220 dissipates the heat transferred from the insulating substrate 210 to the outside of the power module 2 to cool the insulating substrate 210. The heat dissipation portion 220 may include a copper (Cu) material with high thermal conductivity.

[0069] The heat dissipation section 220 includes a first heat dissipation section 221 and a second heat dissipation section 222.

[0070] The first heat dissipation part 221 may have the shape of a flat plate. The cross-sectional shape of the first heat dissipation part 221 may be circular, elliptical, or a polygon with corners (such as a square).

[0071] The first heat dissipation portion 221 is disposed on the first surface 210a of the insulating substrate 210. Specifically, the first heat dissipation portion 221 is integrally disposed on the first surface 210a of the insulating substrate 210. The surface of the first heat dissipation portion 221 facing the first surface 210a of the insulating substrate 210 can directly contact the first surface 210a of the insulating substrate 210.

[0072] Chip 21 is mounted on a first heat dissipation portion 221. Specifically, chip 11 is mounted on one of a pair of first heat dissipation portions 221 spaced apart from each other along a direction parallel to a first direction. An adhesive layer 22 is provided between the first heat dissipation portion 221 and the chip 21. The adhesive layer 22 may include a thermal adhesive or a thermal interface material (TIM).

[0073] The power module 2 according to this embodiment also includes a spacer 23. The spacer 23 is disposed between a first heat dissipation portion 221 without chip 21 and chip 21 in a pair of first heat dissipation portions 221 arranged to be spaced apart from each other in a direction parallel to the first direction, and can be used to isolate chip 21.

[0074] An adhesive layer 22 is disposed between the spacer 23 and the first heat dissipation portion 221 where no chip 21 is mounted. The adhesive layer 22 may include a thermal adhesive or a thermally conductive adhesive (TIM).

[0075] The second heat dissipation portion 222 is spaced apart from the first heat dissipation portion 221 in a direction parallel to the first direction. The second heat dissipation portion 222 is disposed on the second surface 210b of the insulating substrate 210. Specifically, the second heat dissipation portion 222 is integrally disposed on the second surface 210b of the insulating substrate 210. The surface of the second heat dissipation portion 222 facing the second surface 210b of the insulating substrate 210 is in direct contact with the second surface 210b of the insulating substrate 210.

[0076] The cross-sectional shape of the second heat dissipation portion 222 can be circular, elliptical, or a polygon with corners (such as a square). In the following, an embodiment in which the cross-section of the second heat dissipation portion 222 is quadrilateral will be described.

[0077] The second heat dissipation section 222 includes a first part 222a and a second part 222b.

[0078] The first part 222a may refer to the central part of the second heat dissipation part 222, and the second part 222b may represent the edge of the second heat dissipation part 222 other than the first part 222a.

[0079] The first heat dissipation portion 221 and the second heat dissipation portion 222 can have different volumes. Specifically, the amount of copper (Cu) constituting the first heat dissipation portion 221 and the amount of copper (Cu) constituting the second heat dissipation portion 222 can be different from each other. Therefore, the first heat dissipation portion 221 and the second heat dissipation portion 222 can have different weights.

[0080] In another embodiment, the first heat dissipation portion 221 and the second heat dissipation portion 222 may have the same volume. Specifically, the amount of copper (Cu) constituting the first heat dissipation portion 221 and the amount of copper (Cu) constituting the second heat dissipation portion 222 may be the same. Therefore, the first heat dissipation portion 221 and the second heat dissipation portion 222 may have the same weight.

[0081] The first heat dissipation portion 221 and the second heat dissipation portion 222 have different volumes or the same volume, such that the stress on the insulating substrate 210 due to the thermal expansion of the first heat dissipation portion 221 and the second heat dissipation portion 222 in the direction parallel to the first direction and / or in the direction parallel to the second direction can be minimized.

[0082] The sealing portion 230 is arranged to protect the chip 21 from heat, shock, and contamination, and can seal a portion of the heat dissipation portion 220 and the insulating substrate 210. The sealing portion 230 can seal the entire insulating substrate 210. The sealing portion 230 may include EMC (epoxy molding compound). Reference Figure 6 The first surface 210a and side surfaces of the insulating substrate 210 are completely surrounded by the sealing portion 230, while the second surface 210b is completely covered by the surface of the second heat dissipation portion 222 facing the insulating substrate 210. The side surfaces of the second heat dissipation portion 222 are also surrounded by the sealing portion 230. Therefore, the insulating substrate 210 is completely surrounded by the sealing portion 230. In other words, the sealing portion 230 seals the entire insulating substrate 210.

[0083] The sealing portion 230 seals the insulating substrate 210 and the first heat dissipation portion 221. Therefore, the insulating substrate 210 and the first heat dissipation portion 221 are not exposed. The first heat dissipation portion 221 is fixed to the insulating substrate 210 by the sealing portion 230, and contact is maintained between the insulating substrate 210 and the first heat dissipation portion 221. The chip 21 and the spacer 23 are also sealed by the sealing portion 230 and are not exposed.

[0084] The sealing portion 230 can seal a part of the second heat dissipation portion 222. Therefore, the remaining part of the second heat dissipation portion 222 that is not sealed by the sealing portion 230 can be exposed.

[0085] The second heat dissipation portion 222 according to this embodiment includes a first heat dissipation body portion 2221, a second heat dissipation body portion 2222, and a heat sink portion 2223.

[0086] The first heat dissipation body portion 2221 is disposed on the first portion 222a of the second heat dissipation portion 222. The first heat dissipation body portion 2221 is in contact with the second surface 210b of the insulating substrate 210. The surface of the first heat dissipation body portion 2221 facing the second surface 210b of the insulating substrate 210 is in direct contact with the second surface 210b of the insulating substrate 210.

[0087] The first heat dissipation body portion 2221 does not contact the sealing portion 230. In detail, because the first heat dissipation body portion 2221 is not sealed by the sealing portion 230, the first heat dissipation body portion 2221 is exposed.

[0088] The second heat dissipation body portion 2222 extends from the first heat dissipation body portion 2221. The second heat dissipation portion 2222 is disposed on the second portion 222b of the second heat dissipation portion 222. A portion of the second heat dissipation body portion 2222 may contact the sealing portion 230. Specifically, the outer surface of the second heat dissipation body portion 2222, which is disposed facing a direction parallel to the second direction, can be sealed by the sealing portion 230 through contact with the sealing portion 230.

[0089] The second heat dissipation body portion 2222 includes an exposed surface 2222a that does not contact the sealing portion 230 and is not sealed by the sealing portion 230. The exposed surface 2222a is configured to face a direction parallel to the first direction. The exposed surface 2222a may be a plane.

[0090] An O-ring or metal gasket is installed on the exposed surface 2222a, and an O-ring or metal gasket is sandwiched between the housing portion (not shown) that houses the power module 2 and the exposed surface 2222a, thereby enabling an airtight seal between the space between the second heat dissipation body portion 2222 and the housing portion.

[0091] The outer surface 230a of the sealing portion 230 adjacent to the exposed surface 2222a and the exposed surface 2222a are configured to form the same plane. In detail, the exposed surface 2222a of the second heat dissipation body portion 2222 and the outer surface 230a of the sealing portion 230 may have the same height.

[0092] Heat sink portions 2223 extend from the first heat sink body portion 2221 in a direction parallel to a first direction, and the plurality of heat sink portions 1223 are arranged to be spaced apart from each other in a direction parallel to a second direction. Cooling paths 2224 are formed between the plurality of heat sink portions 2223. Cooling fluid can flow through the cooling paths 2224.

[0093] The height of the second heat sink body part 2222 parallel to the first direction and the height of the heat sink part 2223 parallel to the first direction can be the same.

[0094] A heat sink portion 2223, parallel to the second heat sink body portion 2222, is arranged at intervals with the second heat sink body portion 2222. Therefore, a cooling path 2224 can be formed between the second heat sink body portion 2222 and the heat sink portion 2223. Cooling fluid can flow through the cooling path 2224.

[0095] The thickness T1 of the first heat dissipation portion 221 parallel to the first direction and the thickness T2 of the first heat dissipation body portion 2221 parallel to the first direction can be different from each other.

[0096] The thickness T1 of the first heat dissipation portion 221 and the thickness T2 of the first heat dissipation body portion 2221 are different from each other, so that the stress acting on the insulating substrate 210 in the direction parallel to the first direction and / or in the direction parallel to the second direction due to the thermal expansion of the first heat dissipation portion 221 and the second heat dissipation portion 222 can be minimized.

[0097] In another embodiment, the thickness T1 of the first heat dissipation portion 221 parallel to the first direction may be thicker than the thickness T2 of the first heat dissipation body portion 2221 parallel to the first direction.

[0098] The thickness T1 of the first heat dissipation portion 221 is the same as the thickness T2 of the first heat dissipation body portion 2221, so that the stress on the insulating substrate 210 due to the thermal expansion of the first heat dissipation portion 221 and the second heat dissipation portion 222 in the direction parallel to the first direction and / or in the direction parallel to the second direction can be minimized.

[0099] According to embodiments of the present disclosure, power modules 1 and 2 can reduce thermal resistance by having heat dissipation portions 120 and 220 integrally disposed on insulating substrates 110 and 210, thereby improving heat dissipation performance and simplifying components and structures.

[0100] Although this disclosure has been described with reference to embodiments shown in the accompanying drawings, the embodiments of this disclosure are for illustrative purposes only, and those skilled in the art will understand that various modifications and other equivalent embodiments are possible.

Claims

1. A power module, characterized in that, The power module includes: Insulating substrate; The heat dissipation component is integrally disposed on the insulating substrate; and A sealing portion that seals a part of the heat dissipation portion and the insulating substrate.

2. The power module according to claim 1, characterized in that, The heat dissipation component includes: The first heat dissipation portion is integrally disposed on the first surface of the insulating substrate; and The second heat dissipation portion is integrally disposed on the second surface of the insulating substrate, the second surface facing the opposite direction to the first surface; The sealing portion seals the entire insulating substrate and the entire first heat dissipation portion, and also seals a portion of the second heat dissipation portion.

3. The power module according to claim 2, characterized in that, The volume of the first heat dissipation part is different from the volume of the second heat dissipation part.

4. The power module according to claim 2, characterized in that, The volume of the first heat dissipation part is the same as the volume of the second heat dissipation part.

5. The power module according to claim 2, characterized in that, The second heat dissipation section includes: The first heat dissipation body part contacts the second surface but does not contact the sealing part; A second heat dissipation body portion extends from the first heat dissipation body portion and is capable of contacting the second surface and the sealing portion; and One or more heat sink portions extend from the first heat sink body portion in a direction parallel to a first direction and are configured to be spaced apart from each other in a direction parallel to a second direction, wherein the second direction intersects the first direction.

6. The power module according to claim 5, Its features are, The first heat dissipation body portion is disposed on the first portion of the second heat dissipation portion. The second heat dissipation body is disposed on the second part of the second heat dissipation portion, wherein the second part is the portion of the second heat dissipation portion excluding the first part, and Wherein, the height of the second heat dissipation body portion parallel to the first direction is the same as the height of the heat dissipation fin portion parallel to the first direction.

7. The power module according to claim 5, characterized in that, The thickness of the first heat dissipation portion parallel to the first direction and the thickness of the first heat dissipation body portion parallel to the first direction are different from each other.

8. The power module according to claim 5, characterized in that, The thickness of the first heat dissipation portion parallel to the first direction is greater than the thickness of the first heat dissipation body portion parallel to the first direction.

9. The power module according to claim 5, Its features are, The second heat dissipation body portion includes an exposed surface that does not contact the sealing portion, and Wherein, the outer surface of the sealing portion adjacent to the exposed surface and the exposed surface are configured to form the same plane.

10. The power module according to claim 1, Its features are, The insulating substrate and the heat dissipation portion are configured as a plurality of insulating substrates and a plurality of heat dissipation portions spaced apart from each other along a direction parallel to the first direction, and The plurality of heat dissipation components are configured to face opposite directions.

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