HBPOP package structure with evaporative cooling function

Abstract

This utility model discloses an HBPOP packaging structure with evaporative cooling function, comprising: a first interconnect layer; a second interconnect layer including a cover plate, a substrate, and a capillary bag, wherein the cover plate is mounted on the side of the substrate facing away from the first interconnect layer; a mounting groove is provided on the side of the substrate facing the cover plate; the capillary bag is placed in the mounting groove, and the capillary bag includes a lower heat dissipation capillary film, an upper heat dissipation capillary film, and an annular middle heat dissipation capillary film surrounding the evaporation chamber, the lower heat dissipation capillary film is disposed near the bottom of the mounting groove, the upper heat dissipation capillary film is attached to the cover plate, and a coolant covering the lower heat dissipation capillary film is provided in the evaporation chamber; a chip is located between the first interconnect layer and the second interconnect layer; and a packaging layer is filled between the first interconnect layer and the second interconnect layer. This invention improves the heat transfer effect of the second interconnect layer by setting coolant and a capillary film within the second interconnect layer, enabling the heat generated by the chip to be quickly and efficiently transferred to the heat sink through the second interconnect layer.

Description

Technical Field

[0001] This utility model relates to the field of electronic device cooling technology, and in particular to an HBPOP packaging structure with evaporative cooling function. Background Technology

[0002] With the rapid development of the semiconductor industry, electronic products are becoming increasingly miniaturized and denser. Communication products need to meet high bandwidth performance. HBPOP (High Bandwidth Package-on-Package) stacking structure is widely used in the semiconductor industry. HBPOP is an innovative form of POP (Package-on-Package) technology, designed for high-density integration of logic chips (such as processors) and memory chips. It is suitable for mobile devices, smart homes and industrial automation. Compared with traditional packaging, its core features are high-density interconnection and space optimization.

[0003] Thermal management is a key challenge for the continuous optimization of HBPOP. While the stacking structure of HBPOP improves integration, it also introduces significant thermal challenges, requiring proactive optimization of thermal design to ensure performance and reliability. Figure 1 An existing HBPOP packaging structure includes a first interconnect layer 10A, a second interconnect layer 20A, a chip 30A, and a packaging layer 40A. The chip 30A is located between and electrically connected to the first interconnect layer 10A and the second interconnect layer 20A. The packaging layer 40A fills the first interconnect layer 10A and the second interconnect layer 20A and packages the chip 30A. The first interconnect layer 10A is used to connect to a carrier (e.g., a PCB board), and the second interconnect layer 20A is used to directly contact a heat sink so that the heat generated by the chip can be transferred to the heat sink through the second interconnect layer 20A. However, the heat dissipation effect of the second interconnect layer 20A in the existing HBPOP packaging structure is not very good, with a large thermal resistance, which makes it impossible to quickly and efficiently transfer the heat generated by the chip to the heat sink, resulting in a high system temperature rise. Utility Model Content

[0004] This invention provides an HBPOP packaging structure with evaporative cooling function. By setting a coolant and a capillary membrane in the second interconnect layer, the heat transfer effect of the second interconnect layer can be improved by utilizing the synergy of the coolant and the capillary membrane. This allows the heat generated by the chip to be quickly and efficiently transferred to the heat sink through the second interconnect layer, greatly reducing the temperature rise of the system.

[0005] To achieve the above objectives, this utility model provides an HBPOP packaging structure, comprising: First interconnect layer; A second interconnect layer is located on one side of the first interconnect layer. The second interconnect layer includes a cover plate, a substrate, and a capillary bag. The cover plate is installed on the side of the substrate facing away from the first interconnect layer. The side of the substrate facing the cover plate has a mounting groove. The capillary bag is placed in the mounting groove. The capillary bag includes a lower heat dissipation capillary membrane, an upper heat dissipation capillary membrane, and an annular intermediate heat dissipation capillary membrane connecting the lower heat dissipation capillary membrane and the upper heat dissipation capillary membrane. The lower heat dissipation capillary membrane, the upper heat dissipation capillary membrane, and the intermediate heat dissipation capillary membrane form an evaporation chamber, and each of them has a plurality of microchannels composed of capillaries inside. The lower heat dissipation capillary membrane is disposed near the bottom of the mounting groove, and the upper heat dissipation capillary membrane is attached to the cover plate. The evaporation chamber contains a coolant covering the lower heat dissipation capillary membrane. The chip is located between the first interconnect layer and the second interconnect layer, and is electrically connected to the first interconnect layer and the second interconnect layer; An encapsulation layer is filled between the first interconnect layer and the second interconnect layer, and encapsulates the chip.

[0006] In one embodiment of this application, the upper heat dissipation capillary membrane, the lower heat dissipation capillary membrane, and the middle heat dissipation capillary membrane are carbon nanotube membranes, sintered copper particle membranes, or copper oxide nanoparticle membranes.

[0007] In one embodiment of this application, both the mounting groove and the capillary bag are square.

[0008] In one embodiment of this application, the lower heat dissipation capillary membrane and the middle heat dissipation capillary membrane are respectively attached to the bottom of the mounting groove and the wall of the mounting groove.

[0009] In one embodiment of this application, the upper heat dissipation capillary membrane is fixed to the cover plate by a plurality of support columns. One end of the support column is fixed to the bottom of the mounting groove, and the other end passes through the lower heat dissipation capillary membrane and presses against the upper heat dissipation capillary membrane.

[0010] In one embodiment of this application, the upper heat dissipation capillary membrane is attached to the cover plate by a heat dissipation adhesive.

[0011] In one embodiment of this application, the second interconnect layer further includes a plurality of heat dissipation pins, one end of each heat dissipation pin is fixed to the bottom of the mounting groove, and the other end passes through the corresponding perforation of the lower heat dissipation capillary membrane and extends into or through the coolant.

[0012] In one embodiment of this application, the coolant height is 20%-80% of the evaporation chamber height.

[0013] In one embodiment of this application, the substrate and the cover plate are connected by adhesive bonding, welding or high-temperature bonding.

[0014] In one embodiment of this application, the coolant is deionized water or HFE-7100.

[0015] This invention provides a capillary bag and coolant within the second interconnect layer very close to the chip. Due to the efficient heat dissipation effect of the capillary bag, the HBPOP packaging structure of this invention has the following beneficial effects: 1. Capillary bags have excellent heat exchange performance and a large heat dissipation area, which can quickly remove the heat generated by the high heat flux density of the chip, meet the requirements of efficient thermal management under long-term operation of the chip in the HBPOP packaging structure. Moreover, the capillary bags combined with coolant can achieve rapid heat dissipation of local hot spots on the chip, reduce temperature difference, and improve the uniformity of chip surface temperature. 2. Compared with the poor heat transfer performance of the second interconnect layer in the existing HBPOP packaging structure, the second interconnect layer of this utility model has a high heat transfer performance due to the presence of capillary bags and coolant inside. Under the synergistic effect of the coolant and capillary bags, the second interconnect layer can quickly and efficiently transfer the heat generated by the chip to the heat sink, thereby reducing the resistance of the second interconnect layer to heat transfer to the heat sink and significantly improving the heat dissipation efficiency of the entire packaging structure. 3. Because this utility model sets up capillary bags and coolant in the second interconnect layer to improve heat dissipation, it does not increase the volume of the entire HBPOP package structure, thus meeting the dual requirements of system miniaturization and efficient heat dissipation, and is suitable for high-performance, space-constrained mobile devices.

[0016] Other beneficial effects of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0017] Figure 1 This is a simplified cross-sectional view of an existing HBPOP package structure with evaporative cooling function; Figure 2 This is a simplified cross-sectional view of an HBPOP package structure with evaporative cooling function as shown in some embodiments of this application. Figure 1 ; Figure 3 This is a schematic diagram of the three-dimensional structure of the substrate shown in some embodiments of this application; Figure 4 This is a three-dimensional structural schematic diagram of the capillary membrane shown in some embodiments of this application; Figure 5 This is a simplified cross-sectional view of an HBPOP package structure with evaporative cooling function as shown in some embodiments of this application. Figure 2 .

[0018] [Explanation of Labels in the Attached Image] Figure 1 middle: 10A, First interconnect layer; 20A, Second interconnect layer; 30A, Chip; 40A, Packaging layer; Figures 2-5 middle: 10. First interconnect layer; 20. Second interconnect layer; 21. Substrate; 211. Mounting slot; 22. Cover plate; 23. Capillary bag; 231. Lower heat dissipation capillary film; 232. Upper heat dissipation capillary film; 233. Middle heat dissipation capillary film; 234. Evaporation chamber; 235. Pillar perforation; 236. Block perforation; 24. Coolant; 25. Support pillar; 26. Heat dissipation pin block; 27. Thermal adhesive; 30. Chip; 40. Encapsulation layer; 50. First solder ball; 60. Second solder ball. Detailed Implementation

[0019] To make the technical problems, solutions, and advantages of this utility model clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Please see Figures 2 to 5 The present invention provides an HBPOP packaging structure with evaporative cooling function, comprising a first interconnect layer 10, a second interconnect layer 20, a chip 30, and a packaging layer 40.

[0023] like Figure 2 As shown, the second interconnect layer 20 is located on one side of the first interconnect layer 10. The second interconnect layer 20 includes a cover plate 22, a substrate 21, and a capillary bag 23. The cover plate 22 is installed on the side of the substrate 21 facing away from the first interconnect layer 10. The side of the substrate 21 facing the cover plate 22 is provided with a mounting groove 211. The capillary bag 23 is placed in the mounting groove 211. The capillary bag 23 includes a lower heat dissipation capillary membrane 231, an upper heat dissipation capillary membrane 232, and an annular intermediate heat dissipation capillary membrane 233 connecting the lower heat dissipation capillary membrane 231 and the upper heat dissipation capillary membrane 232. The lower heat dissipation capillary membrane 231, the upper heat dissipation capillary membrane 232, and the intermediate heat dissipation capillary membrane 233 form an evaporation chamber 234, and the lower heat dissipation capillary membrane 233... The membrane 231, the upper heat dissipation capillary membrane 232, and the middle heat dissipation capillary membrane 233 all have a number of microchannels composed of capillaries. The lower heat dissipation capillary membrane 231 is set near the bottom of the mounting groove 211. The upper heat dissipation capillary membrane 232 is attached to the cover plate 22. The evaporation chamber 234 is provided with a coolant 24 covering the lower heat dissipation capillary membrane 231. The lower heat dissipation capillary membrane 231 can generate capillary force under the wetting of the coolant 24. The chip 30 is located between the first interconnect layer 10 and the second interconnect layer 20 and is electrically connected to the first interconnect layer 10 and the second interconnect layer 20. The encapsulation layer 40 fills the space between the first interconnect layer 10 and the second interconnect layer 20 and encapsulates the chip 30 to protect the chip 30.

[0024] When the lower heat dissipation capillary membrane 231 is immersed in the coolant 24, the coolant 24 enters the capillaries of the lower heat dissipation capillary membrane 231. When the chip 30 is working, the high temperature generated by the chip 30 drives the coolant 24 in the evaporation chamber 234 and the coolant 24 in the capillaries of the lower heat dissipation capillary membrane 231 to vaporize, causing the coolant 24 level to drop. As the coolant 24 level drops, the surface tension of the capillaries in the lower heat dissipation capillary membrane 231 changes. This change generates a driving force that drives the gas in the capillaries to flow towards the middle heat dissipation capillary membrane 233 and the upper heat dissipation capillary membrane 232. Under the action of this driving force, the gas flows along the microchannels of the lower heat dissipation capillary membrane 231 into the microchannels of the middle heat dissipation capillary membrane 233, and then from the microchannels of the middle heat dissipation capillary membrane 233 into the microchannels of the upper heat dissipation capillary membrane 232. Since the upper heat dissipation capillary membrane 232 is attached to the heat dissipation capillary membrane 231, the gas flows into the microchannels of the middle heat dissipation capillary membrane 233 and then from the microchannels of the middle heat dissipation capillary membrane 233 into the microchannels of the upper heat dissipation capillary membrane 232. The heat sink is in direct contact with the cover plate 22, so the upper heat dissipation capillary membrane 232 can transfer the heat carried by the gas to the heat sink through the cover plate 22, thereby cooling the gas. The gas is cooled and liquefied to form coolant 24, which accumulates in the microchannels of the upper heat dissipation capillary membrane 232. When the coolant 24 in the upper heat dissipation capillary membrane 232 accumulates to a certain amount and overflows into the middle heat dissipation capillary membrane 233, the coolant 24 will overcome the gas resistance under its own gravity and return to the lower heat dissipation capillary membrane 231 through the microchannels of the middle heat dissipation capillary membrane 233. Then, it will continue to evaporate at high temperature to form gas that flows into the microchannels of the upper heat dissipation capillary membrane 232. Driven by the capillary force of the lower heat dissipation capillary membrane 231, it will pass through the microchannels of the middle heat dissipation capillary membrane 233 and flow into the microchannels of the upper heat dissipation capillary membrane 232. This cycle repeats until the chip 30 stops working and generates high temperature. Due to the microchannels in the upper heat dissipation capillary membrane 232, the contact area between the second interconnect layer 20 and the gas is greatly increased, which helps the second interconnect layer 20 to quickly transfer the heat of the gas to the heat sink, achieving the beneficial effect of rapid heat dissipation.

[0025] This invention provides a capillary bag 23 and a coolant 24 within the second interconnect layer 20 very close to the chip 30. Due to the efficient heat dissipation effect of the capillary bag 23, the HBPOP package structure 40 of this invention has the following beneficial effects: 1. The capillary bag 23 has excellent heat exchange performance and a large heat dissipation specific area, which can quickly remove the heat generated by the high heat flux density of the chip 30, meet the requirements of efficient thermal management of the chip 30 under long-term operation in the HBPOP package structure 40, and the capillary bag 23 combined with the coolant 24 can realize rapid heat dissipation of local hot spots of the chip 30, reduce the temperature difference, and improve the uniformity of the surface temperature of the chip 30. 2. Compared with the poor heat transfer performance of the second interconnect layer 20 in the existing HBPOP packaging structure, the second interconnect layer 20 of this utility model has a high-efficiency heat transfer performance due to the presence of capillary bags 23 and coolant 24. Under the synergistic effect of coolant 24 and capillary bags 23, the second interconnect layer 20 can quickly and efficiently transfer the heat generated by the chip 30 to the heat sink, reducing the resistance of the second interconnect layer 20 to heat transfer to the heat sink and greatly improving the heat dissipation efficiency of the entire packaging structure. 3. Because the present invention provides a capillary bag 23 and a coolant 24 in the second interconnect layer 20 to improve heat dissipation, the volume of the entire HBPOP package structure 40 is not increased, which meets the dual requirements of system miniaturization and efficient heat dissipation, and is suitable for high-performance, space-constrained mobile devices.

[0026] In this application, the first interconnect layer 10 may be a silicon substrate or an organic substrate with wiring, and the upper heat dissipation capillary film 232, the lower heat dissipation capillary film 231 and the middle heat dissipation capillary film 233 may be carbon nanotube film, sintered copper particle film, copper oxide nanoparticle film, etc.

[0027] The substrate 21 and the cover plate 22 can be connected by adhesive bonding, welding, or high-temperature bonding. These connection methods not only ensure the sealing between the substrate 21 and the cover plate 22, but also make the entire first interconnect layer 10 small in size, which is suitable for heat dissipation of the HBPOP package structure 40, which is developing towards miniaturization. The mounting groove 211 can be processed by etching or laser cutting.

[0028] In one embodiment of this application, such as Figure 3 and Figure 4 As shown, the mounting groove 211 is square, and correspondingly, the capillary bag 23 is also square to match the mounting groove 211. Therefore, the lower heat dissipation capillary membrane 231 and the middle heat dissipation capillary membrane 233 of the capillary bag 23 are respectively attached to the bottom of the mounting groove 211 and the groove wall of the mounting groove 211.

[0029] In one embodiment of this application, such as Figure 2 As shown, the upper heat dissipation capillary membrane 232 is fixed to the cover plate 22 by several support columns 25. One end of each support column 25 is fixed to the bottom of the mounting groove 211, and the other end passes through the lower heat dissipation capillary membrane 231 and presses against the upper heat dissipation capillary membrane 232, so that the upper heat dissipation capillary membrane 232 is tightly attached to the cover plate 22. Therefore, as shown... Figure 4As shown, the lower heat dissipation capillary membrane 231 has corresponding column perforations 235 on each support column 25. When assembling the second interconnect layer 20, first align the perforations of the capillary bag 23 with the support columns 25, and then slowly place the capillary bag 23 into the mounting groove 211. In this way, the support columns 25 can pass through the column perforations 235 and enter the evaporation chamber 234 of the capillary bag 23. After placement, the cover plate 22 is sealed on the substrate 21. The cover plate 22 will press on each support column 25, so that each support column 25 presses the upper heat dissipation capillary membrane 232 tightly onto the cover plate 22. Then, the substrate 21 and the cover plate 22 are connected by welding or high-temperature bonding. If the substrate 21 and the cover plate 22 are connected by glue, glue is applied to the edge of the cover plate 22 before the cover plate 22 is sealed on the substrate 21. After the cover plate 22 is sealed on the substrate 21, the cover plate 22 and the substrate 21 can be connected by glue. The support column 25 is preferably made of a material with good heat dissipation, such as silicon or silicon carbide. The shape of the support column 25 is not limited, and its cross-section can be square, circular, triangular, rhomboid, or other shapes. The support column 25 can be formed externally first and then fixed to the bottom of the mounting groove 211 by high-temperature bonding. Alternatively, the support column 25 can be directly machined on the substrate 21 by etching.

[0030] In this embodiment, such as Figure 3 As shown, there are five support pillars 25. Four support pillars 25 are set at the four corners of the upper heat dissipation capillary membrane 232 to press the four corners of the upper heat dissipation capillary membrane 232 onto the cover plate 22. The other support pillar 25 is set at the middle part of the upper heat dissipation capillary membrane 232 to press the middle part of the upper heat dissipation capillary membrane 232 onto the cover plate 22. By pressing the upper heat dissipation capillary membrane 232 at the four corners and the middle part by the five support pillars 25, the upper heat dissipation capillary membrane 232 can be flatly attached to the cover plate 22.

[0031] In other feasible embodiments, such as Figure 5 As shown, the upper heat-dissipating capillary membrane 232 can also be fixed to the cover plate 22 not by the support pillar 25, but by the thermal adhesive 27, thus fixing the upper heat-dissipating capillary membrane 232 to the cover plate 22. Therefore, when assembling the second interconnect layer 20, the upper heat-dissipating capillary membrane 232 of the capillary bag 23 is first fixed to the cover plate 22 by the thermal adhesive 27, then the capillary bag 23 is driven into the mounting groove 211 by the cover plate 22, and finally the cover plate 22 is fixed to the substrate 21, thus realizing the assembly of the second interconnect layer 20. The fixing of the cover plate 22 to the substrate 21 adopts the method of the above embodiment, and will not be described in detail here.

[0032] In one embodiment of this application, such as Figures 2 to 4As shown, the second interconnect layer 20 also includes a plurality of heat dissipation pins 26. One end of each heat dissipation pin 26 is fixed to the bottom of the mounting groove 211, and the other end passes through the corresponding perforation 236 of the lower heat dissipation capillary membrane 231 and extends into or through the coolant 24. The heat dissipation pins 26 are used to increase the area of ​​the second interconnect layer 20 for transferring heat from the chip 30, accelerate the evaporation of the coolant 24, and improve the heat dissipation rate of the chip 30. During the process of placing the capillary bag 23 into the mounting groove 211, the perforation 236 of the capillary bag 23 is first aligned with the heat dissipation pins 26, and then the capillary bag 23 is slowly placed into the mounting groove 211, so that the heat dissipation pins 26 can pass through the perforation 236 and extend into the evaporation chamber 234, realizing the contact between the heat dissipation pins 26 and the coolant 24 in the evaporation chamber 234.

[0033] The heat dissipation pin 26 is preferably made of a material with good heat dissipation, such as silicon or silicon carbide. The shape of the heat dissipation pin 26 is not limited and can be square, round, triangular, rhomboid, or other shapes. The heat dissipation pin 26 can be externally machined and then fixed to the bottom of the mounting groove 211 by high-temperature bonding, or the heat dissipation pin 26 can be directly machined on the substrate 21 by etching.

[0034] The coolant 24 can be a liquid with high heat transfer and easy boiling, such as deionized water or HFE-7100. The height of the liquid should not fill the evaporation chamber 234, but should be 20%-80% of the height of the evaporation chamber 234.

[0035] In one embodiment of this application, the chip 30 is electrically connected to the first interconnect layer 10 by being directly flip-chip mounted on the first interconnect layer 10.

[0036] In one embodiment of this application, such as Figure 2 As shown, the HBPOP package structure 40 also includes a first solder ball 50 connected between the first interconnect layer 10 and the second interconnect layer 20. The first solder ball 50 is covered within the package layer 40. The first interconnect layer 10 and the second interconnect layer 20 are separated by the first solder ball 50, and the chip 30 is electrically connected to the second interconnect layer 20 through the first solder ball 50.

[0037] Furthermore, the first solder ball 50 is selected from solder balls or copper core balls and is arranged in a matrix around the periphery of the chip 30.

[0038] In one embodiment of this application, such as Figure 2 As shown, the HBPOP package structure 40 also includes a second solder ball 60 disposed on the side of the first interconnect layer 10 away from the second interconnect layer 20. The second solder ball 60 is used to solder the second interconnect layer 20 to the carrier (e.g., PCB board) so that the second interconnect layer 20 is electrically connected to the carrier through the second solder ball 60.

[0039] Furthermore, the second solder ball 60 is selected from solder balls or copper core balls and is arranged in a matrix on the first interconnect layer 10.

[0040] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. An HBPOP packaging structure with evaporative cooling function, characterized in that, include: First interconnect layer; A second interconnect layer is located on one side of the first interconnect layer. The second interconnect layer includes a cover plate, a substrate, and a capillary bag. The cover plate is installed on the side of the substrate facing away from the first interconnect layer. The side of the substrate facing the cover plate has a mounting groove. The capillary bag is placed in the mounting groove. The capillary bag includes a lower heat dissipation capillary membrane, an upper heat dissipation capillary membrane, and an annular intermediate heat dissipation capillary membrane connecting the lower heat dissipation capillary membrane and the upper heat dissipation capillary membrane. The lower heat dissipation capillary membrane, the upper heat dissipation capillary membrane, and the intermediate heat dissipation capillary membrane form an evaporation chamber, and each of them has a plurality of microchannels composed of capillaries inside. The lower heat dissipation capillary membrane is disposed near the bottom of the mounting groove, and the upper heat dissipation capillary membrane is attached to the cover plate. The evaporation chamber contains a coolant covering the lower heat dissipation capillary membrane. The chip is located between the first interconnect layer and the second interconnect layer, and is electrically connected to the first interconnect layer and the second interconnect layer; An encapsulation layer is filled between the first interconnect layer and the second interconnect layer, and encapsulates the chip.

2. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The upper heat dissipation capillary membrane, the lower heat dissipation capillary membrane, and the middle heat dissipation capillary membrane are structured as carbon nanotube membranes, sintered copper particle membranes, or copper oxide nanoparticle membranes.

3. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, Both the mounting groove and the capillary bag are square.

4. The HBPOP packaging structure with evaporative cooling function according to claim 3, characterized in that, The lower heat dissipation capillary membrane and the middle heat dissipation capillary membrane are respectively attached to the bottom of the mounting groove and the wall of the mounting groove.

5. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The upper heat dissipation capillary membrane is fixed to the cover plate by several support columns. One end of the support column is fixed to the bottom of the mounting groove, and the other end passes through the lower heat dissipation capillary membrane and presses against the upper heat dissipation capillary membrane.

6. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The heat-dissipating capillary membrane is attached to the cover plate by heat-dissipating adhesive.

7. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The second interconnect layer also includes a plurality of heat dissipation pins. One end of each heat dissipation pin is fixed to the bottom of the mounting groove, and the other end passes through the corresponding perforation of the lower heat dissipation capillary membrane and extends into or through the coolant.

8. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The coolant level is 20%-80% of the height of the evaporation chamber.

9. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The substrate and the cover plate are connected by adhesive, welding or high-temperature bonding.

10. The HBPOP packaging structure with evaporative cooling function according to claim 1, characterized in that, The coolant is deionized water or HFE-7100.

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